Honeywell

2019 Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

San Diego, California
January 22-23, 2019


General Co-Chair:
Susan Bagen,
MST
General Co-Chair:
Kedar Shah,
Verily Life Sciences

Organizing Committee:
Steve Annas, Samtec | Matt Apanius, SMART Microsystems | Caroline Bjune, Draper |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Vern Stygar, Asahi Glass Company


Abstract Deadline Extended: October 31, 2018

SUBMIT ABSTRACTS

Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information


Thank you to our Premier Sponsors:

Premier Sponsor - SemiDice Inc.
Premier Sponsor - CMS Circuit Solutions
Premier Sponsor - Micro Systems Technologies (MST)
Premier Sponsor - Cicor
6 sponsors available  

 

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 22-23, 2019, at the Handlery Hotel, San Diego, CA. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations.

This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging, including KEYNOTE PRESENTATIONS from:

Measuring What You Can't See

Keynote - Paul Davison, Provisio Medical

Paul Davison - Provisio Medical
Mr. Davison joined Provisio Medical in January of 2018 as Vice President of Product Development. He has over 25 years of medical device industry experience and has been involved with the development and commercialization of 29 devices. Prior to joining Provisio, Mr. Davison was Invuity’s (IVTY) Vice President of Research and Development from November 2014 to July 2017. He was part of the executive team during the June 2015 initial public stock offering (IPO). Prior to joining Invuity, Mr. Davison was Vice President and General Manager of the Advanced Energy SBU at Conmed Corporation (CNMD).

Prior to Conmed, Mr. Davison served as the Vice President of Research and Development of PEAK Surgical. He was the second employee when the company started in 2006 and helped lead the company to an acquisition by Medtronic in 2011. Prior to PEAK Surgical, Mr. Davison served as the R&D Director for Sports Medicine at ArthroCare. Prior to his seven years at ArthroCare, he held various project management and engineering roles at Medtronic and Baxter Healthcare over a ten year period. Mr. Davison is an inventor on twelve issued US patents assigned to Baxter, Medtronic, ArthroCare and PEAK Surgical. Five of the patents are for medical devices currently on the market.

Mr. Davison holds a B.S. in Manufacturing Engineering from California Polytechnic University at Pomona, and an M.S. in Engineering Management with a Mechanical Engineering stem from Santa Clara University. Mr. Davison is adjunct faculty and a Bioengineering Advisory Board Member at Santa Clara University.

Developing Next Generation Microelectronics Packaging for Wireless Implants

Patricia Johnson - Verily Life Sciences
Pat is currently leading efforts on new microelectronics packaging for wireless medical implants at Verily Life Sciences. She has led development of novel packaging for medical electronics for over 10 years. As Director of Pharmaceutical Systems at Proteus Digital Health, she developed an ingestible sensor for tracking oral medication adherence, and a proprietary "ChipSkin" technology for smart pacemaker leads. At Alza, a Johnson & Johnson company, Pat developed drug-device combination products for on-demand transdermal drug delivery. Prior to her work on medical devices, Pat held several technical and management positions for consumer electronics at Hewlett Packard and Agilent. As R&D Manager at Agilent she led a system design team to create some of the world's first cell phone cameras. Pat holds degrees in Materials Science (Ph.D, M.S.) and Mechanical Engineering (B.S.) from UC Berkeley.

Opportunities and Challenges for High-Channel-Count Connectors in Next Generation Neural Technologies

Jack Judy - University of Florida
BIO SOON

Microscale Manipulation of Cells and their Environment for Medicine
Microsystems have the potential to impact biology and medicine by providing new ways to manipulate cells and the microenvironment around them. Simply physically manipulating cells or their environment—using microfluidics, electric fields, or optical forces—provides new ways to separate cells and organize cellular interactions. Immune cells are of particular interest because of their central role in defending the body against foreign invaders. As a consequence, many microfluidic devices have been used to study both the basic biology of immune cells as well as to assay them for clinical use. Our lab has developed technologies on both ends of the spectrum, from cell pairing devices able to study information flow in immune cells, to electrical sorting devices for assaying immune cell function in response to disease. Microfluidics can be used to manipulate the environment around cells. For example, we have developed arrays of microfluidic perfusion culture chambers that use fluid flow to apply physical forces to endothelial cells in order to investigate the origins of atherosclerosis. Together, these systems leverage microscale physics to enable new avenues of medical investigation.

Joel Voldman - MIT, Electrical Engineering and Computer Science MIT
BIO SOON

Sessions are being planned now to include presentations on:

Implantable Devices

Diagnostic and In Vivo

Portable & Wearable

Technology

- Pacemakers & Defibrillators
- Neurostimulators
- Deep Brain Stimulation
- Drug Delivery
- Cochlear Implants
- Retinal/Ophthalmic
- Bioelectronic Medicine

- Interventional Catheters
- Pillcams
- Ultrasound & Imaging
- Lab-on-Chip
- Micro Reactors
- Surgical Devices

- Remote Diagnostics
- Defibrillators
- Point of Care
- Patient Monitoring
- Ambulatory Care
- Hearing Aids
- Neurostimulators
- Prosthetics

- High Density Connectors
- Biosensors & MEMS
- Batteries & Energy Harvesting
- Biocompatible Materials
- Encapsulation/ Hermeticity
- HDI Flex & Packaging
- Wireless Communications
- Reliability

 

SUBMISSION:
Those wishing to present at the Workshop must submit a 200+ word abstract electronically on/before OCTOBER 31, 2018,
using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required.

Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

 

Priced at $550 for IMAPS members, $650 for non-members, and $300 for speakers, attendance will be limited to maintain a workshop atmosphere. Workshop will feature panel discussions for increased open engagement and networking. 10 sponsorships with tabletops in the session room will be available this year, as well as 20 regular tabletop spaces outside the meeting room to allow for more company participation. For questions, email bschieman@imaps.org.


Speaker Dates/Information:

  • Abstract Deadline extended to: OCTOBER 31, 2018
  • Speaker Email Notification: November 9, 2018
  • Early Registration Deadline: December 21, 2018
  • Speaker 2-3 sentence biography due not later than: January 10, 2019
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 23, 2019
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&. -- KEYNOTES: 40 minutes / 5 mins for questions)


Registration Information: (Early Registration Deadline: December 21, 2018) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 12/21/18
Advance/Onsite Fee
After 12/21/18
IMAPS Member
$550
$650
Non-Member
$650
$750
Speaker
$300
$350
Session Chair
$300
$350
Student
$100
$150
Chapter Officer
$400
$500
Premier Event Sponsorship
(Includes: 1 tabletop exhibit IN THE SESSION ROOM w/ 2 full session/exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $300/person)
$1700
$1800
Tabletop Exhibit
(Includes: 1 tabletop exhibit OUTSIDE THE MEETING ROOM w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)
$800
$900
     

Register Online



Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108

Courtesy rate for IMAPS Guests: $119/night + taxes and fees

How to Book:
Guests must call 800-676-6567 and request the group rate of $119+tax for the International Microelectronics Assembly and Packaging Society. There is no online booking link for this hotel.

Note: This is not a block, but a courtesy rate. It is subject to availability of rooms, so guests are encouraged to book as soon as possible to get the rate. There is no pre-determined cutoff date.

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems