KESTER

Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Handlery Hotel, San Diego, California
January 31 - February 1, 2017


General Co-Chair:
Tim LeClair
Cerapax
General Co-Chair:
Vern Stygar
Asahi Glass Company
General Co-Chair:
Matt Nowak
Qualcomm


Organizing Committee:
Susan Bagen, MST | Caroline Bjune, Draper | Farhad Kiaei, HD Microsystems | Urmi Ray, Qualcomm | Kedar Shah, Verily Life Sciences


Abstract Period Closed - PROGRAM BEFORE DECEMBER 10

Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information


Thank you to our Premier Sponsors/Exhibitors:

Premier Sponsor - Micro Systems Technologies (MST)
Corporate Sponsor - Kyocera America
Corporate Sponsor - SemiDice Inc.
Corporate Sponsor - NGK NTK
Corporate Sponsor - CMS Circuit Solutions
 
2 spots still available
 

 

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 31 and February 1, 2017. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.

Sessions are being planned now to include presentations on:

Implantable Devices

Diagnostic and In Vivo

Portable & Wearable

Technology

- Pacemakers & Defibrillators
- Neurostimulators
- Deep Brain Stimulation
- Drug Delivery
- Cochlear Implants
- Retinal/Ophthalmic
- Electroceuticals & Injectables

- Interventional Catheters
- Pillcams
- Ultrasound & Imaging
- Lab-on-Chip
- Micro Reactors
- Surgical Devices

- Remote Diagnostics
- Defibrillators
- Point of Care
- Patient Monitoring
- Ambulatory Care
- Hearing Aids
- Neurostimulators
- Prosthetics

- Biosensors & MEMS
- Batteries & Energy Harvesting
- Biocompatible Materials
- Encapsulation/Hermeticity
- HDI Flex & Packaging
- Wireless Communications
Reliability

 


Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

 

Priced at $500 for IMAPS members, $600 for non-members, and $250 for speakers, attendance will be limited to maintain a workshop atmosphere. Workshop will feature panel discussions for increased open engagement and networking. Limited tabletop space available for event SPONSORS ONLY. For questions, email bschieman@imaps.org.


Speaker Dates/Information:

  • Abstract Deadline: October 14, 2016
  • Speaker Email Notification: December 5, 2016
  • Early Registration Deadline: January 6, 2017
  • Hotel Cut-off: January 6, 2017
  • Speaker 2-3 sentence biography due not later than: January 15, 2017
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: February 1, 2017
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Registration Information: (Early Registration Deadline: January 6, 2017)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 1/6/17
Advance/Onsite Fee
After 1/6/17
IMAPS Member
$500
$600
Non-Member
$600
$700
Speaker
$250
$300
Session Chair
$250
$300
Student
$100
$150
Chapter Officer
$300
$400
Premier Event Sponsorship
(includes: 1 tabletop exhibit w/ 1 booth badge, 1 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages)
$1500
$1500

Register Online



Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108

Courtesy rate for IMAPS Guests: $109/night + taxes and fees

How to Book:
Guests must call 800-676-6567 and request the group rate of $109+tax for the International Microelectronics Assembly and Packaging Society. There is no online booking link for this hotel.

Note: This is not a block, but a courtesy rate. It is subject to availability of rooms, so guests are encouraged to book as soon as possible to get the rate. There is no pre-determined cutoff date.

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems