Heraeus ELD

Advanced Technology Workshop and Tabletop Exhibits on
Microelectronic Packaging for Medical
and Hi-Rel Devices

Tuesday, May 14, 2013
Crowne Plaza Northstar
Minneapolis, MN
www.imaps.org/medical

Hotel Deadline: April 29, 2013

Early Registration Deadline Extended: May 3, 2013

Tabletop Exhibits Have SOLD OUT

General Chair:
Sean Ferrian
Vice President
Ferrian Sales & Associates

Technical Committee:

A.J. Ries
Distinguished Engineer
Medtronic CRDM Device Mechanical Technology
Guy Smith
Sr. Mechanical Engineer
Rockwell Collins, Inc.
Ron Jensen
Engineering Fellow
Honeywell International
Alexandre Val
Program Manager
3D Plus



Premier Sponsor:
Corporate Sponsor - Micro Systems Technologies (MST)

Hotel Deadline: April 29, 2013

Early Registration Deadline Extended: May 3, 2013

Tabletop Exhibits Have SOLD OUT

 

The International Microelectronics and Packaging Society (IMAPS) will hold an Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Rel Devices. The workshop will be held in Minneapolis, Minnesota at the Crowne Plaza Minneapolis Northstar Downtown.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

The short-course that was planned to precede the Workshop
on Monday afternoon has been cancelled.

Professional Development Course (PDC):
Hermetic Seal and Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates


 

Tuesday, May 14, 2013

Registration: 7:00 am – 4:00 pm
Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 8:00 am – 5:00 pm (Setup Must Be Complete by 7:45am)
Sessions, Tabletop Exhibits and Breaks all in the same room

Opening Remarks: 8:00 am – 8:15 am
General Chair: Sean Ferrian, Ferrian Sales & Associates

Session I: 3D Packaging and Technologies
Session Chair: Guy Smith, Rockwell Collins, Inc.
8:15 am - 11:30 am

Soldering Technologies Enabling Medical Device Packaging in the 3D Era 
Brook Sandy-Smith, Indium Corporation (Carol Gowans, Andy Mackie, Ron Laskey)  

A Study On Nonhermetic Micropackage For Implantable MEMS Systems
W.H.Ko, Case Western Reserve University

Amazing and Robust Silicon Capacitor Technology for Miniaturization
Catherine Bunel, IPDIA (Franck Murray)

Break: 9:45 am – 10:30 am

Biocompatible Solid State Batteries for Medical Devices
Jeff Sather, Cymbet Corporation 

Passive RFID and Packaging Technology for Wireless Sensor Applications
Aaron Reinholz, North Dakota State University (Nathan Schneck)

Lunch Break: 11:30 am - 1:00 pm

Session II: Microelectronics and Applications
Session Chair: Ron Jensen, Honeywell International
1:00 pm – 4:00 pm

Custom Integrated Circuit Design Enables Miniature Implantable Medical Devices
Andrew Kelly, Cactus Semiconductor, Inc.

A Low-Silver SAC Solder Alloy for High Reliability Applications
Brook Sandy-Smith, Indium Corporation 

Break: 2:00 pm - 2:30 pm

Advanced Organic Substrate Technologies for HiRel and Medical Applications  
Glen Thomas, Endicott Interconnect Technologies, Inc. (Susan Bagen, Frank Egitto, Rabindra Das, Dave Alcoe, Kim Blackwell, Steve Rosser)

Multilayer and Injection Molded Ceramics for High Reliability Microelectronic Packaging 
Bill Minehan, AdTech Ceramics

Wedge Bonding New Wire Alloys for Medical Electronics 
Lee Levine, Hesse Mechatronics (Joe Bubel)

Workshop Reception: 4:00 pm – 5:00 pm
Sponsored by:

Reception Sponsor - Benchmark Electronics

 

 

Premier Sponsor:
Corporate Sponsor - Micro Systems Technologies (MST)

 



Exhibitors:

The tabletop exhibition has sold out.

The tabletop exhibition will be held in the session room to maximize interaction with the attendees. Tabletop space will include 6 foot table, and 2 chairs. Basic electrical will be included if located near wall jacks. Dedicated electrical needs or other questions should be directed to the facility. 1 booth personnel badge is included as complimentary with each tabletop. Additional booth badges will be available for a fee to cover meals. The one-day exhibition will be opened:

Tuesday, May 14 - 8:00am - 5:00pm (Breaks & Reception in the Exhibit Area)
Exhibit Set-Up:  Tuesday, May 14 30 - 6:45am - 7:45am (must be done setting up before 8:00am opening)
Dismantle: Tuesday, May 14 – after 5:00pm

Exhibit Fees:


Type

Early Fee
Through 4/29/13

Advance/Onsite Fee
After 4/29/13

Tabletop Exhibit (Member)

$450

$500

Tabletop Exhibit (Non-Member)

$525

$600

Premier Sponsorship (Includes Tabletop)

$1000

$1000

Exhibiting Companies:
The following companies will be on display at the exhibition at this workshop:

AdTech Ceramics   –   Tabletop #6 – www.adtechceramics.com
Benchmark Electronics   –   Tabletop #2 - www.bench.com  (Reception Sponsor)
Conductive Containers, Inc.  –   Tabletop #9 – www.corstat.com
Endicott Interconnect Technologies   –   Tabletop #8 – www.eitny.com
Hesse Mechatronics   –   Tabletop #11 – www.hesse-mechatronics.us
Kyocera America   –   Tabletop #4 – www.kyocera.com
Micro Systems Technologies   –   Tabletop #1 – www.mst.com  (Premier Sponsor)
Micross Components   –   Tabletop #10 – www.micross.com
North Dakota State University   –   Tabletop #12 – www.ndsu.edu
SANTIER   –   Tabletop #5 – www.santier.com
Valtronic Technologies (USA), Inc.   –   Tabletop #3 - www.valtronic.com
XYZTEC   –   Tabletop #7 - www.xyztec.com

 


Speaker Dates/Information:

  • Abstracts Due: March 29, 2013
  • Speaker Notification Emails: April 23, 2013
  • Early Registration and Hotel Deadlines: April 29, 2013
  • Speaker Bios Due: May 3, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: May 14, 2013
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Registration Information: (Early Registration Deadline: April 29, 2013)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) CD-ROM of presentations; cd will contain the extended abstract and presentation as submitted by the presenter. CD will be mailed 15 business days after the event. PDC fees are separate/additional. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 4/29/13
Advance/Onsite Fee
After 4/29/13
IMAPS Member
$250
$350
Non-Member
$350
$450
Speaker
$100
$100
Chair
$0
$0
Student
$25
$50
Chapter Officer
$100
$100
Tabletop Exhibit (Member)
$450
$500
Tabletop Exhibit (Non-Member)
$525
$600
Reception Sponsorship (Limit 2)
$500
$500
Premier Sponsorship (Includes Tabletop - Limit 3)
$1000
$1000

 

 


Hotel Reservations: (Hotel Deadline: April 29, 2013)
Reservation must be made directly with the:

Crowne Plaza Northstar
618 Second Ave, South
Minneapolis, MN 55402

 

 

 

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Honeywell
  • Indium
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Natel
  • Palomar
  • Petroferm
  • Prince & Izant
  • Quik-Pak
  • Specialty Coating Systems