2019 Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

San Diego, California
January 22-23, 2019

General Co-Chair:
Susan Bagen,
General Co-Chair:
Kedar Shah,
Verily Life Sciences

Organizing Committee:
Steve Annas | Matt Apanius, SMART Microsystems | Caroline Bjune, Draper |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Sam Rogers, Samtec | Vern Stygar, Asahi Glass Company


Thank you to our Premier Sponsors:

Premier Sponsor - SemiDice Inc.
Premier Sponsor - CMS Circuit Solutions
Premier Sponsor - Micro Systems Technologies (MST)
Premier Sponsor - Cicor
Premier Sponsor - Hermetic Solutions Group
Premier Sponsor - Promex
Premier Sponsor - Specialty Coating Systems
Premier Sponsor - Fujikura
Premier Sponsor: SAMTEC


The International Microelectronics Assembly and Packaging Society (IMAPS) hosted an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 22-23, 2019, at the Handlery Hotel, San Diego, CA. The workshop brought together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop provided a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations.





Registration Open


Exhibits Open (when not in session)

Thank you to our sponsors and exhibitors:

BTG Labs
CMS Circuit Solutions, Inc. -- PREMIER SPONSOR
Finetech, Inc.
Fujikura Ltd. -- PREMIER SPONSOR
Hermetic Solutions Group -- PREMIER SPONSOR
Interconnect Systems, Inc.
Kyocera International, Inc.
Micro Systems Technologies Management AG -- PREMIER SPONSOR
Oneida Research Services
Promex Industries, Inc. -- PREMIER SPONSOR
Semi Dice, Inc. -- PREMIER SPONSOR
Silitronics -- PREMIER SPONSOR
Specialty Coating Systems Inc. -- PREMIER SPONSOR
UC San Diego Extension


Breakfast in Foyer


Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


Opportunities and Challenges for High-Channel-Count Connectors in Next Generation Neural Technologies

Abstract: Although potentially significant benefits for patients have successfully driven the development of higher-channel-count neural interfaces, the lack of advancement in implant-packaging technology continues to impose barriers that significantly impede their successful translation to the clinic. An analysis of implant-packaging-technology development reveals that despite advances in implant electronics, batteries, enclosures, and even high-feedthrough-density/count headers, the lack of advancement in implant connector technology has been a key limiting factor. Specifically, implant applications requiring the ability to disconnect/reconnect an interface lead from/to an implant package are limited by existing implantable connector technology to low channel counts (8 ch/lead). In contrast, implant applications that require high channel counts (>60) must currently be permanently bonded to high-feedthrough-count headers. As a consequence, changes to such implants require the entire system, including the interface itself, be fully explanted and re-implanted, which typically causes significant tissue damage. The unavailability of high-channel-count (>60) and high-channel-density connectors currently impedes the ability to demonstrate and ultimate translate high-performance neuro-technologies that need re-connectability and high channel counts (>60). This technological challenge represents a tremendous opportunity for new research concepts on advanced implant packaging technology that exploit microfabrication and microassembly processes.


Keynote - Jack Judy, University of Florida

Jack Judy - University of Florida
Dr. Jack Judy is the Director of the Nanoscience Institute for Medical and Engineering Technology (NIMET) at the University of Florida, holds the Intel Nanotechnology Chair, and is also a professor of Electrical and Computer Engineering and Biomedical Engineering. The mission of NIMET is to bridge engineering, scientific, and medical communities by revealing, enabling, focusing, and coordinating related research and educational activities. NIMET also provides world-class centralized research facilities, technical support, and equipment for the design, fabrication, and characterization of innovative micro/nanotechnologies, as well as a dedicated hands-on instructional laboratory for training students in the use of micro/nanoscale fabrication tools and techniques. Dr. Judy’s research involves the development of novel micro-electro-mechanical systems, such as microscale and nanoscale sensors, actuators, and systems, and their use in impactful engineering, scientific, biological, and medical, applications. A particular focus is in the field of neural-interface technology and systems, with applications in bi-directional prosthetic control, movement disorders, and the autonomic nervous system.

Previously, Dr. Judy was a Program Manager in the Microsystems Technology Office (MTO) of the Defense Advanced Research Projects Agency (DARPA), where he created and managed the Reliable Neural-Interface Technology Program (RE-NET) to address the fundamental, and yet at the time largely overlooked, critical reliability problem of chronic neural-recording interfaces. Without successfully developing and translating to the clinic high-performance neural-recording interfaces that function for the life of the patient, many of the widely envisioned clinical applications for brain-machine interfaces and other neural-electronic technologies will not be realized. Dr. Judy served at DARPA while on leave from his faculty position at the time in the Electrical and Biomedical Engineering Departments at UCLA, where he also served as Director of the NeuroEngineering Program, the Nanoelectronics Research Facility, and the Instructional Microfabrication Laboratory. He has received the National Science Foundation Career Award, the Okawa Foundation Award, and the Office of the Secretary of Defense Medal for Exceptional Public Service.


Session Chair: Sam Rogers, Samtec



The Next Big Thing In Small: How Interconnect Tech Advances Will Help Designers Shrink Neuro Device Packaging
Mark Russell, Bal Seal Engineering, Inc.


3D Interconnect Technologies and Integration for Multi-Electrode Arrays for In Vivo and In Vitro Medical Applications
Muhannad Bakir, Georgia Institute of Technology (Muneeb Zia, Joe Gonzalez, Georgia Institute of Technology; Bryce Chung, Samuel Sober, Emory University)


Coffee Break in the Exhibits


Technologies for Wafer-level Glass-based Packaging and Bonding
Marko Blom, Micronit Microtechnologies (Jeroen Haneveld)


Packaging of Flexible Retinal Prosthesis Devices
Hiren Thacker, Nanovision Biosciences (Yi Jing, Abraham Akinin, Brandon Bosse, Yu-hsin Liu, Sue Bauchner)


Advancement in Microelectronic Packaging for Medical Implants - Solving the Need for 'More' with 'Less' Space
Caroline Bjune, Draper Laboratory




Microscale Manipulation of Cells and their Environment for Medicine

Abstract: Microsystems have the potential to impact biology and medicine by providing new ways to manipulate cells and the microenvironment around them. Simply physically manipulating cells or their environment—using microfluidics, electric fields, or optical forces—provides new ways to separate cells and organize cellular interactions. Immune cells are of particular interest because of their central role in defending the body against foreign invaders. As a consequence, many microfluidic devices have been used to study both the basic biology of immune cells as well as to assay them for clinical use. Our lab has developed technologies on both ends of the spectrum, from cell pairing devices able to study information flow in immune cells, to electrical sorting devices for assaying immune cell function in response to disease. Microfluidics can be used to manipulate the environment around cells. For example, we have developed arrays of microfluidic perfusion culture chambers that use fluid flow to apply physical forces to endothelial cells in order to investigate the origins of atherosclerosis. Together, these systems leverage microscale physics to enable new avenues of medical investigation.


Keynote - Joel Voldman

Joel Voldman - MIT, Electrical Engineering and Computer Science
Joel Voldman is Professor and Associate Department Head in the Electrical Engineering and Computer Science Department at MIT. He received the B.S. degree in electrical engineering from the University of Massachusetts, Amherst, in 1995. He received the M.S and Ph.D. degree in electrical engineering from the Massachusetts Institute of Technology (MIT), Cambridge, in 1997 and 2001, developing bioMEMS for single-cell analysis. Following this, he was a postdoctoral associate at Harvard Medical School, where he studied developmental biology. In 2002 he returned to MIT as an Assistant Professor in the Electrical Engineering and Computer Science department at MIT. In 2004 he was awarded the NBX Career Development Chair, in 2006 promoted to Associate Professor, and in 2013 promoted to Professor in the department. In 2018 he became Associate Head of the Department. Among several awards, he has received an NSF CAREER award, an ACS Young Innovator Award, a Bose Research award, Jamieson Teaching Award, Smullin Teaching Award, Quick Faculty Research Innovation Fellowship, and awards for posters and presentations at international conferences. Prof. Voldman’s research focuses on developing microfluidic technology for biology and medicine. He has developed a host of technologies to arrange, culture, and sort diverse cell types including immune cells, endothelial cells, and stem cells.



Session Chair: Caroline Bjune, Draper Laboratory



Think Like an Innovator, Act Like an Entrepreneur
Angelique Johnson, MEMStim LLC


Accelerated Tests for Neural Implants
Jit Muthuswamy, Arizona State University (Vlad Voziyanov, Arati Sridharan)


Coffee Break in the Exhibits


Advanced Packaging and Materials for Biotech Devices
Vern Stygar, AGC; Tim LeClair, Cerapax


High-throughput Via Formation in Solid-core Glass for IC Substrates
Stephan Schmidt, LPKF Laser & Electronics


Miniature Solid State Batteries for Next-Generation Implantable and On-the-body Medical Devices
Denis Pasero, Ilika plc


Happy Hour & Networking in the Exhibits







Registration Open


Exhibits Open (when not in session)

Thank you to our sponsors and exhibitors:

BTG Labs
CMS Circuit Solutions, Inc. -- PREMIER SPONSOR
Finetech, Inc.
Fujikura Ltd. -- PREMIER SPONSOR
Hermetic Solutions Group -- PREMIER SPONSOR
Interconnect Systems, Inc.
Kyocera International, Inc.
Micro Systems Technologies Management AG -- PREMIER SPONSOR
Oneida Research Services
Promex Industries, Inc. -- PREMIER SPONSOR
Semi Dice, Inc. -- PREMIER SPONSOR
Silitronics -- PREMIER SPONSOR
Specialty Coating Systems Inc. -- PREMIER SPONSOR
UC San Diego Extension


Breakfast in Foyer


TUTORIAL: Medical Reliability
Failure-oriented-accelerated-testing (FOAT) vs. Highly-accelerated-life-testing (HALT): Making a Medical Electron Device (MED) Package into a Reliable Product
Ephraim Suhir, ERS Co.


Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


Developing Next Generation Microelectronics Packaging for Wireless Implants

Abstract: Recent advances in diagnostics and therapeutics have led to medical implant designs with new capabilities including wireless communication, bio-sensing, and miniaturized surgical implantation. However, the lack of durable micro-electronic packaging solutions has hindered many of these products from reaching the market. This is particularly true for medical devices designed for chronic in-vivo usage. Traditional rigid hermetic enclosures are bulky and unsuitable for sensor and wireless signalling. In this talk I will discuss three packaging solutions needed to move the electronics out from these traditional enclosures: miniaturized chip scale packages, high density hermetic feedthroughs, and flexible conformal barrier coatings. I will also describe new methods for verifying barrier performance by combining modeling and test data. These methods can be used to accelerate development and qualification cycles, shortening the time to bring advanced medical devices to market.

Keynote - Paul Davison, Provisio Medical

Patricia Johnson - Verily Life Sciences
Pat is currently leading efforts on new microelectronics packaging for wireless medical implants at Verily Life Sciences. She has led development of novel packaging for medical electronics for over 10 years. As Director of Pharmaceutical Systems at Proteus Digital Health, she developed an ingestible sensor for tracking oral medication adherence, and a proprietary "ChipSkin" technology for smart pacemaker leads. At Alza, a Johnson & Johnson company, Pat developed drug-device combination products for on-demand transdermal drug delivery. Prior to her work on medical devices, Pat held several technical and management positions for consumer electronics at Hewlett Packard and Agilent. As R&D Manager at Agilent she led a system design team to create some of the world's first cell phone cameras. Pat holds degrees in Materials Science (Ph.D, M.S.) and Mechanical Engineering (B.S.) from UC Berkeley.



Session Chair: Tim LeClair, Cerapax



Automated High-throughput Hermetic Failure Monitoring System for mm-sized Wireless Implantable Devices
Pyungwoo Yeon, Georgia Institute of Technology (Oliver Brand, Maysam Ghovanloo)


Film Based Moisture Absorbers for Implantable Devices
Michael Previti, Alpha Advanced Materials


Coffee Break in the Exhibits


FITEP: a Flexible Implantable Thin Electronic Package Platform for Long Term Implantation Applications, based on Polymer and Ceramic ALD Multilayers
Maaike Op de Beeck, IMEC - CMST (Rik Verplancke, David Schaubroeck, Changzheng Li, Dieter Cuypers, Maarten Cauwe, Bjorn Vandecasteele, Lothar Mader, Celine Vanhaverbeke , Johan De Baets, IMEC - CMST; John O’Callaghan, Dries Braeken, Alexandru Andrei, Andrea Firrincieli, Marco Ballini, IMEC; Aritra Kundu, Ahmed Fahmy, Erin Patrick, Nima Maghari, Rizwan Bashirullah, University of Florida)


Parylene Technology for Advanced Packaging and Protection of Medical Microelectronics
Rakesh Kumar, Specialty Coating Systems, Inc.


Trends in Long-term Encapsulation for BCI Implants
Claude Clement, Wyss Center for Bio and Neuroengineering




Measuring What You Can't See

The presentation will cover electronic or smart catheter devices including background, personal challenges, R&D, and future directions in the topic. Regardless of the specific project and application, there are many commonalities and key metrics that determine the success of a medical device. A key product metric is quality. The balance between clinical needs and technical needs is a component of quality which shall be presented.


Keynote - Paul Davison, Provisio Medical

Paul Davison - Provisio Medical
Mr. Davison joined Provisio Medical in January of 2018 as Vice President of Product Development. He has over 25 years of medical device industry experience and has been involved with the development and commercialization of 29 devices. Prior to joining Provisio, Mr. Davison was Invuity’s (IVTY) Vice President of Research and Development from November 2014 to July 2017. He was part of the executive team during the June 2015 initial public stock offering (IPO). Prior to joining Invuity, Mr. Davison was Vice President and General Manager of the Advanced Energy SBU at Conmed Corporation (CNMD). Prior to Conmed, Mr. Davison served as the Vice President of Research and Development of PEAK Surgical. He was the second employee when the company started in 2006 and helped lead the company to an acquisition by Medtronic in 2011. Prior to PEAK Surgical, Mr. Davison served as the R&D Director for Sports Medicine at ArthroCare. Prior to his seven years at ArthroCare, he held various project management and engineering roles at Medtronic and Baxter Healthcare over a ten year period.

Mr. Davison is an inventor on twelve issued US patents assigned to Baxter, Medtronic, ArthroCare and PEAK Surgical. Five of the patents are for medical devices currently on the market. Mr. Davison holds a B.S. in Manufacturing Engineering from California Polytechnic University at Pomona, and an M.S. in Engineering Management with a Mechanical Engineering stem from Santa Clara University. Mr. Davison is adjunct faculty and a Bioengineering Advisory Board Member at Santa Clara University.


Session Chair: Rick Elbert, Cicor



Fully Organic Packaging for Applications with Liquid Exposure
Susan Bagen, Micro Systems Technologies, Inc. (Eckardt Bihler, Marc Hauer)


Custom IC Design - The Missing Piece to the Medical MEMS Development Puzzle
Andrew Kelly, Cactus Semiconductor


Coffee Break in the Exhibits


Design and Manufacturing Process Tradeoffs Considerations for the Creation pf Printed Electronics and Sensors for Medical Applications
Jaye Tyler, Si-Cal Technologies (Roger Grace)


Precision Material Deposition with Aerosol Jet Technology for Medical Devices
James Feng, Optomec, Inc (Michael Renn, David Sessoms)


Novel Vertical Stack Embedding Die Technology in Flexible Printed Circuit for Electronics Miniaturization
Kazu Itoi, Fujikura America, Inc. (Shunsuke Sato, Masakazu Sato, Nobuki Ueta, Yoshio Nakao, Osamu Nakao, Fujikura Ltd.)


Closing Remarks


Speaker Dates/Information:

  • Abstract Deadline extended to: OCTOBER 31, 2018
  • Speaker Email Notification: November 9, 2018
  • Early Registration Deadline: December 21, 2018
  • Speaker 2-3 sentence biography due not later than: January 10, 2019
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 23, 2019
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&. -- KEYNOTES: 40 minutes / 5 mins for questions)

Registration Information: (Early Registration Deadline: December 21, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 12/21/18
Advance/Onsite Fee
After 12/21/18
IMAPS Member
Session Chair
Chapter Officer
Premier Event Sponsorship
(Includes: 1 tabletop exhibit IN THE SESSION ROOM w/ 2 full session/exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $300/person)
Tabletop Exhibit
(Includes: 1 tabletop exhibit OUTSIDE THE MEETING ROOM w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)

Hotel Reservations

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108



  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
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