Micross

2018 Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Handlery Hotel, San Diego, California
January 23-24, 2018


General Co-Chair:
Susan Bagen,
MST
General Co-Chair:
Kedar Shah,
Verily Life Sciences

Organizing Committee:
Steve Annas, Samtec | Matt Apanius, SMART Microsystems | Caroline Bjune, Draper |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Vern Stygar, Asahi Glass Company


EARLY REGISTRATION DEADLINE: JANUARY 5, 2018

Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information


Thank you to our Premier Sponsors:

Premier Sponsor - SMART Microsystems
Premier Sponsor - Micro Systems Technologies (MST)
Corporate Sponsor - Kyocera America
Corporate Sponsor - ISI additional sponsorships available

 

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.

 



 

TUESDAY, JANUARY 23


7:00am-6:30pm

Registration Open

10:00am-6:30pm

Exhibits Open (when not in session)

Thank you to our sponsors and exhibitors:

Interconnect Systems, Inc.

SMART Microsystems Ltd

Kyocera International, Inc.

Micro Systems Technologies Management AG

NTK Technologies

Semi Dice, Inc.

CMS Circuit Solutions, Inc.

Samtec, Inc.

Quik-Pak, a division of Promex Industries

Cicor Group

 


7:00am-8:00am

Breakfast


8:00am-8:15am

Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


8:15am-9:00am

KEYNOTE PRESENTATION:
Medical Imaging and Diagnostic: Current Status and Future Trends

Abstract: Medical imaging continues to play a significant role in healthcare. Technological advancements have led to transformations in the industry that in turn have led to medical imaging devices that are more accurate, smaller, less expensive and capable of imaging smaller structures and lesions. These advancements have led to the use of imaging devices for screening, diagnosis, staging, procedure guidance and monitoring. Future advancements in technology promise continued transformation of imaging modalities.

In this presentation we will focus on medical imaging devices and related applications, and touch upon the brief history of imaging, the current status and future trends. Other technologies that could impact imaging in the future will be discussed. Significant emphasis will be put on Ultrasound as an important imaging modality, and potential “stethoscope of the future”.

Mr. Shalabh Chandra, CEO, Gyan Business Advisors
Mr. Shalabh Chandra is a healthcare executive with experience in Medical Devices, primarily Medical Imaging. Currently, he is the CEO of Gyan Business Advisors, a company that provides consulting services from Leadership, Strategy/Business Development to Commercialization including Product Development and Sourcing/Manufacturing. In his most recent role, Mr. Chandra worked as the SVP at Analogic and ran their Global Ultrasound Business in Peabody, Massachusetts. Prior to that, he established Analogic’s Asia Operation out of Shanghai, China. Before coming to Analogic, he worked for Philips where he started as a Clinical Scientist. His last role with Philips was GM of the Global MRI Patient Monitoring business in Orlando, Florida. He started his career working in a hospital setting as a research engineer at the Cleveland Clinic in Cleveland, Ohio. His experience covers many imaging modalities including CT, MRI, Mammography and Ultrasound. He was one of the inventors of Cardiac CT at Philips. Mr. Chandra received his BS in electrical engineering from IIT Kanpur, India, his MS in Biomedical Engineering from Ohio State, and an MBA from Wharton, UPenn. He has multiple patents and publications.


SESSION 1

APPLICATIONS, WEARABLES AND DIAGNOSTICS
Session Chair: Vern Stygar, AGC

 

9:00am-9:30am

Nanotechnology for a Genomic Revolution
Shane Bowen, Illumina

9:30am-10:00am

Microfluidics and Nanopatterning Capabilities for Biomedical Devices
Yu-Hwa, University of California, San Diego


10:00am-10:30am

Coffee Break in the Foyer/Palm Area with Exhibitors.


10:30am-11:00am

Molecular Cloning Involving the AAV CXCL12 Gene
Kripa Raj Ahuja, UNC Chapel Hill

11:00am-11:30am

Microelectronic Sensor Systems for Improving Patient Outcomes
Barbara Morrison Wilford, Lorain County Community College

11:30am-12:00pm

BioMEMS: How Emerging Paradigms in Microelectronics can be Harnessed to Address Fundamental Challenges in Biosensing
Joshua Windmiller, Biolinq Inc.


12:00pm-1:30pm

Lunch in the Terrace Room.


1:30pm-2:15pm

KEYNOTE PRESENTATION:
Scaling Down: FDA Regulation of Microelectronic Medical Devices

Abstract: Innovations in medical technology require new approaches to medical device regulation, while still ensuring safety and effectiveness. In the last several years, the Center for Devices and Radiological Health have implemented new program to encourage novel approaches to medical technology regulation. This presentation will overview basic medical device regulation, and highlight several recent initiatives, with an emphasis on implications for microelectronics.

Cristin Welle, Ph.D. Assistant Professor Boettcher Investigator University of Colorado, Denver Departments of Neurosurgery and Bioengineering
Dr. Welle is an Assistant Professor in University of Colorado Departments of Neurosurgery and Bioengineering faculty, and her lab investigates circuit-level structure and function in the context of translational neurotechnology. Using chronic in vivo electrophysiology, in vivo multiphoton imaging and advanced histological techniques, her lab examines the electrode/tissue interface of high-density recording electrodes for brain-computer interface systems. Prior to her time at the University of Colorado, she spent 5 years as the principal investigator of the Neural Implant Lab in the Division of Biomedical Physics, Center for Devices and Radiological Health, Food and Drug Administration, exploring safety and performance of invasive neural recording electrodes used in neuroprosthetic systems and novel electrode technology for the detection of traumatic brain injury. A neurophysiologist by training, she received her PhD in Neuroscience from the University of Pennsylvania in 2010.


SESSION 2

IMPLANTABLES
Session Chair: Caroline Bjune, Draper Laboratory

 

2:15pm-2:45pm

Miniaturizing Implantable Medical Devices Through Custom Integrated Circuit Design 
Andrew Kelly, Cactus Semiconductor

2:45pm-3:15pm

Biodegradable Packaging for Solid Thin Film Batteries for Transient Medical Applications 
Messaoud Bedjaoui, CEA-LETI


3:15pm-4:00pm

Coffee Break in the Foyer/Palm Area with Exhibitors.


4:00pm-4:30pm

Miniaturized Hermetic Modules for Medical Implants  
Eckardt Bihler, Dyconex AG

4:30pm-5:00pm

Durable Conducting Polymer Electrode Materials on Flex Circuits for Neuromodulation
Jeff Hendricks, Heraeus Medical Components

5:00pm-5:30pm

Pb-free Solders, Creep, and Body Temperature 
Guna Selvaduray, San Jose State University


5:30pm-6:30pm

Happy Hour & Networking in the Foyer/Palm Area with Exhibitors.


 

 



 

WEDNESDAY, JANUARY 24


7:00am-5:00pm

Registration Open

10:00am-4:00pm

Exhibits Open (when not in session)


7:00am-8:00am

Breakfast


8:00am-8:15am

Opening Remarks: General Co-Chairs –
Susan Bagen, MST; and Kedar Shah, Verily Life Sciences


8:15am-9:00am

KEYNOTE PRESENTATION:
Body Area Sensing: from Wearables to Implants

Abstract: Rapid advances in wireless communications, sensing technologies, and materials are opening new and hitherto unexplored opportunities in body area sensing. Next-generation wireless devices are envisioned that operate either upon or inside the human body to unobtrusively provide round-the-clock health status information. Example applications include, but are not limited to, healthcare, sports, military, consumer electronics, etc. In this presentation, we will review transformational wireless technologies for body area sensing, addressing their potential and challenges raised. Particular focus will be on a novel class of flexible E-textile electronics, as well as game-changing wireless implants that sense deep-brain neuropotentials without batteries. Other technologies required to make these wearable and implanted devices a reality will also be discussed, including antennas, power harvesting, in-vitro / in-vivo testing, patient safety, etc.

Asimina Kiourti, Assistant Professor ElectroScience Laboratory, Dept. of Electrical and Computer Engineering The Ohio State University
Asimina Kiourti joined The Ohio State University (OSU) as an Assistant Professor of Electrical and Computer Engineering in Fall 2016. From 2013 to 2016 she served as a Post-Doctoral Researcher and then a Senior Research Associate at the OSU ElectroScience Laboratory. Prior to that, she received the Ph.D. degree in Electrical and Computer Engineering from the National Technical University of Athens, Greece (2013) and the M.Sc. degree from University College London, UK (2009). Prof. Kiourti’s research interests include: wearable and implantable sensors, antennas and electromagnetics for body area applications, and flexible textile-based electronics. Her publication record includes 7 book chapters, 4 patents/disclosures, 33 journal papers, and over 80 conference papers. She has received more than 40 awards and scholarships, among which, the IEEE EMB-S "BRAIN Young Investigator Award" (2014), the Chorafas Foundation "Outstanding Ph.D. Dissertation Award" (2013), the IEEE MTT-S "Graduate Fellowship for Medical Applications" (2012), and the IEEE AP-S "Doctoral Research Award" (2011). Prof. Kiourti's research has gained international reputation and has recently been featured by TechCrunch, Gizmodo, Times of India, Australia Network News, and the ALN Magazine, among others.

SESSION 3

NEURO-IMPLANTS
Session Chair: Rick Elbert, Cicor Advanced Microelectronics & Substrates Division

 

9:00am-9:30am

Implant Packaging for Next-Generation Neurotechnology  
Jack Judy, University of Florida

9:30am-10:00am

Technical Specificities and Challenges of Neurological Active Implants  
Claude Clement, Wyss Center for Bio and Neuroengineering


10:00am-10:30am

Coffee Break in the Foyer/Palm Area with Exhibitors.


10:30am-11:00am

Glass-based Hermetic Micro-packaging Platform for Untethered, Implantable, Wireless Neural Systems 
David Borton, Brown University, Brown Institute for Brain Science (BIBS)

11:00am-11:30am

Package Architecture and Component Design for an Implantable, Designed-for-Human-Use Peripheral Nerve Stimulation and Recording System for Advanced Prosthetics 
Caroline Bjune, Draper

11:30am-12:00pm

Advancing Brain Research with Implantable MEMS Optoelectrodes  
Komal Kampasi, Lawrence Livermore National Laboratory


12:00pm-1:30pm

Lunch in the Terrace Room and Networking in the Foyer/Palm Area with Exhibitors.


1:30pm-2:15pm

KEYNOTE PRESENTATION:
The Needs and Challenges Facing All Aspects of Medical Applications & Packaging

When faced with medical device and component needs and challenges, most packaging engineers thrive in defining innovations, workarounds, and solutions addressing those needs and challenges. However, advanced biomedical devices require extensive interdisciplinary development efforts from technologists and medical professionals as well as extensive testing and certification. Various new, exciting, and novel applications of MEMS & sensor technologies are central to the medical industry, from improving & innovating large medical equipment and portable medical instrumentation to enabling medical wearables and point of care devices. Areas of medical device packaging technology development and pathfinding need to include: heterogeneous device technologies, biocompatible materials, elimination of cytotoxicity, miniaturization schemes, robust interconnects (at device, package, module, & system levels), and the incorporation of microfluidics and optics. This presentation will focus on specific needs and challenges within upcoming medical applications and medical device packaging.

Steven Groothuis, Chief Technology Officer, Samtec Microelectronics
Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics in Colorado Springs and maintains the package technology & strategic roadmaps for Samtec’s microelectronic packaging products. He is involved in Integrated Circuit, MEMS, sensor, optical, and photonics package technology path finding. He is a strategist, technologist, and internal technology advisor. He has dealt with products in the autonomous vehicles, biomedical, optical/photonics, MEMS/Sensors, and microelectronics arenas. Prior to joining Samtec, he was a Distinguished Member of Technical Staff at Micron Technology providing technology advancements on the advanced Hybrid Memory Cube package development, technology path finding, and wafer- and package-related simulations. Mr. Groothuis also worked at ANSYS as a Multiphysics Industry Specialist on various MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and served as TI’s Advanced Semiconductor Packaging Lab Manager. Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from University of Texas at Dallas. He has coauthored over 50 technical papers, holds eleven US patents, and has been a worldwide technical instructor on IC and MEMS technologies.


SESSION 4

MINIATURIZATION AND RELIABILITY
Session Chair:

 

2:15pm-2:45pm

TITLE SOON
Asahi Glass Company

2:45pm-3:15pm

Through Glass Via Technology for Medical Applications
Samuel Rogers, Samtec Microelectronics

3:15pm-3:45pm

Hermetic and Additive Free Glass Bonding Technique for Medical Applications
Heidi Lundén, Primoceler Oy

3:45pm-4:30pm

Coffee Break in the Foyer/Palm Area with Exhibitors.

4:30pm-5:00pm

Moisture Absorbers for Implantable Devices
Michael Previti, Alpha Advanced Materials

5:00pm-5:30pm

Accelerated Testing and Predicted Useful Lifetime of Medical Electronics
Ephraim Suhir, Portland State University; Technical University, Vienna; ERS Co.

5:30pm-6:00pm

Digital Holographic Microscopy: How Real-Time Imaging of 3D Topography is Revolutionizing Microelectronics Testing
Julia Brueckner, Quantum Analytics


6:00pm

Closing Remarks


 

REGISTER ONLINE

 


Speaker Dates/Information:

  • Abstract Deadline Extended to: NOVEMBER 17, 2017
  • Speaker Email Notification: November 20, 2017
  • Early Registration Deadline: January 5, 2018
  • Speaker 2-3 sentence biography due not later than: January 10, 2018
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 24, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Registration Information: (Early Registration Deadline: January 5, 2018) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 1/5/18
Advance/Onsite Fee
After 1/5/18
IMAPS Member
$550
$650
Non-Member
$650
$750
Speaker
$300
$350
Session Chair
$300
$350
Student
$100
$150
Chapter Officer
$400
$500
Premier Event Sponsorship
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge, 1 full session badge, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $400/person)
$1500
$1500
Tabletop Exhibit
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)
$800
$900
     

Register Online



Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108

Courtesy rate for IMAPS Guests: $109/night + taxes and fees

How to Book:
Guests must call 800-676-6567 and request the group rate of $109+tax for the International Microelectronics Assembly and Packaging Society. There is no online booking link for this hotel.

Note: This is not a block, but a courtesy rate. It is subject to availability of rooms, so guests are encouraged to book as soon as possible to get the rate. There is no pre-determined cutoff date.

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems