5th Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Westgate Hotel San Diego
San Diego, California
January 28-29, 2020

General Co-Chair:
Kedar Shah,
Verily Life Sciences
General Co-Chair:
Caroline Bjune,
Draper Labs.

Organizing Committee:
Matt Apanius, SMART Microsystems | Susan Bagen, MST | Claude Clement, Wyss Center for Bio and Neuroengineering |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Sam Rogers, Illumina | Vern Stygar, Asahi Glass Company

Last Call for Abstracts - Submit Immediately

Register Online | Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information

Thank you to our Premier Sponsors:

Premier Sponsor - Micro Systems Technologies (MST)
Premier Sponsor - PCB Technologies
Premier Sponsor - CMS Circuit Solutions

And thanks to our Exhibitors:

AdTech Ceramics
Cicor Group
Eurofins EAG Laboratories
Hermetic Solutions Group
Oneida Research Services, Inc.
Palomar Technologies
Promex Industries

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 28-29, 2020, at the Westgate Hotel San Diego, San Diego, CA. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations.

The following KEYNOTE PRESENTATIONS are now confirmed:

Opportunities in Biosensing with the Emergence of New Materials
For decades, biological transistors have been touted as a potential gateway between digital and biological networks. With Cardea’s creation of scaled graphene-based electronics chips, the opportunity is here now to begin directly integrating biological and digital information. We present on many solved challenges in creating biological transistors. . Cardea has taken a different approach than has been tried in the past, merging new materials with existing manufacturing processes, expanding the design space of our electronic to include active biological components, and creating a unique partnering business model to penetrate diverse markets in life science, all to bring to reality the world of digital biology.

Keynote - Ross Bundy

Ross Bundy, Co-Founder and Chief Production Officer, Cardea
Ross Bundy is the co-founder and Chief Production Officer of Cardea. In this role he is responsible for production at Cardea. With an MBA from San Diego State University, Ross has held positions in supply chain, operations, and finance from companies such as General Dynamics and UBC Financial Services. He brings precision execution and implementation to the company.

The NeuroPace Story: Transforming Epilepsy Treatment with the World’s First and Only Brain-responsive Neurostimulation System
Without the advances in microelectronics packaging over the last half-century, the active implantable medical device industry would be virtually non-existent. The NeuroPace Story is intended to highlight the contributions of your industry in this regard by describing epilepsy, the NeuroPace product development and regulatory approval experience and the impact of the RNS System on the lives of patients.

Keynote - Frank Fischer

Frank M. Fischer, Chairman of the Board, NeuroPace, Inc.
Frank Fischer has more than 40 years of senior management experience in the medical device industry. He co-founded NeuroPace in Dec 1997, led the company as its President and Chief Executive Officer from January 2000 thru July 2019, served on its Board of Directors since inception and is currently Chairman of the Board. Prior to joining NeuroPace, Mr. Fischer was President and Chief Executive Officer of Heartport, Inc., a cardiac surgery company, from May 1998 until September 1999 and served on Heartport’s Board of Directors. Previously, Mr. Fischer was President and Chief Executive Officer and a director of Ventritex, Inc., a company that pioneered implantable cardiac defibrillators, from July 1987 until the sale of the company to St. Jude Medical, Inc. in 1997. Before joining Ventritex, he held various management positions at Cordis Corporation from 1977 to 1987 in the cardiac and neurosurgical device areas, serving most recently as President of the Implantable Products Division. Currently he is a member of the Board of Directors of Nevro, Inc., the Board of Trustees of both Rensselaer Polytechnic Institute and Babson College as well as the Board of Directors of the Epilepsy Foundation of America. Mr. Fischer holds B.S.M.E. and M.S. in Management degrees from Rensselaer Polytechnic Institute.

Flexible, Thin Film Polymer Multielectrode Arrays as Neural Interfaces
Reliable chronic electrophysiological recordings remain elusive due to persistent biological failure at the electrode-tissue interface. While large scale recordings (>100 channels) have been demonstrated using microwire and silicon-based intracortical electrodes, overtime the device stiffness damages soft neural tissue, exacerbating chronic immune response and triggering glial encapsulation. The use of soft polymers in lieu of stiff metal or silicon reduces the mechanical mismatch by two orders of magnitude, however, polymer neural probe technology has lagged behind that of silicon in recording density and in integration with microelectronic circuitry. Through advances in polymer micromachining, we demonstrated multi-electrode probes and probe arrays comprising thin shanks of poly(para-chloro-xylylene) (Parylene C) integrated with as many as 512 platinum recording sites. Our technology consists of Parylene neural probe arrays with front- and back-patterned recording electrodes conforming to the anatomical structure and cytoarchitecture of targeted brain regions and approaching the electrode density achieved by state-of-the-art silicon devices. To enable high-density electrical packing, we explored integration of application specific integrated circuitry (ASIC) for on-board signal multiplexing. Using an unconventional strategy, bare probe arrays were inserted without using bulky insertion shuttles or stiffening agents. We report progress towards large-scale, high-density, conformal arrays of polymer-based neural probes for chronic large-scale recording of neural activity in behaving rats. Results show unitary activities (i.e., spikes) and local field potentials can be recorded both acutely and chronically from hippocampal CA3 and CA1 regions with signal-to-noise ratios similar to microwire recordings. Most importantly, ongoing chronic experiments indicate that stable recording of hippocampal units can be obtained >6 months after implantation.

Keynote - Frank Fischer

Ellis Meng, Professor and Chair of Biomedical Engineering, University of Southern California
Ellis Meng is an Associate Professor of biomedical and electrical engineering and chair of the Women in Science and Engineering program in the Viterbi School of Engineering. Dr. Meng directs the Biomedical Microsystems Laboratory which specializes in focuses on advancing medicine using enabling micromachining, micro- sensor and actuator, microfluidic, and microsystems technologies. She completed her graduate work in electrical engineering at the California Institute of Technology in 2003. She is a recipient of the National Science Foundation CAREER and Wallace H. Coulter Foundation Early Career Awards. Ellis was recognized as a 2009 TR35 Young Innovator Under 35 for her work in next generation drug delivery pumps. In 2012, she was names one of the Medical Device and Diagnostic Industry’s MedTech 40 under 40. Dr. Meng is a strong proponent of translation of microtechnologies in medicine; she is an inventor of novel pumping technology that is being commercialized by Fluid Synchrony LLC.

Towards Connected Healthcare Using More Reliable and Chronically Implantable Medical Devices
Advances in engineering technology are enabling the automation of medical diagnosis and treatment. Chronically implantable electronic devices are well-poised to lead the charge in automation towards connected healthcare systems. However, developing chronically reliable implantable sensors and actuators has several grand challenges that needs to be overcome to realize this vision. Engineered solutions that can address these challenges can have enormous economic and clinical implications. In this presentation, I will discuss our latest efforts to utilize nano and microscale transducers to fabricate more reliable and smart implants and biosensors. As examples, I will share our latest efforts to develop a more reliable neurostimulation microelectrodes, self-clearing implantable shunts for intraventricular hemorrhage, and glutamate biosensors to enable neurodegeneration research. These examples will highlight the challenges and the potential of using connected implantable systems in the future.

Keynote - Hugh Lee

Hyowon "Hugh" Lee, Professor, Weldon School of Biomedical Engineering, Birck Nanotechnology Center, Purdue University
Hyowon "Hugh" Lee received his M.S. and Ph.D. degrees in biomedical engineering from University of California, Los Angeles, in 2008 and 2011, respectively. Before joining Purdue, he worked as a senior engineer for St. Jude Medical’s Implantable Electronics Systems Division where he worked on manufacturing challenges associated with implantable electronic devices such as pacemakers, implantable cardioverter defibrillators, deep brain stimulators, and spinal cord stimulators. At UCLA, he trained in the areas of neuroengineering and microfabrication under Jack Judy. His current research interest centers around improving the reliability and functionality of implantable sensors and actuators. He is a co-founder of Rescue Biomedical, LLC, which focuses on closed-loop solution for automatic naloxone delivery for opioid overdose. His lab is currently supported by NIH, NSF, Indiana Clinical and Translational Science Institute, Samsung, and Eli Lilly.

This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging. Sessions are being planned now to include presentations on:

Implantable Devices

Diagnostic and In Vivo

Portable & Wearable


- Pacemakers & Defibrillators
- Neurostimulators
- Deep Brain Stimulation
- Drug Delivery, Insulin Pumps
- Cochlear Implants
- Retinal/Ophthalmic
- Bioelectronic Medicine

- Interventional Catheters
- Pillcams
- Ultrasound & Imaging
- Lab-on-Chip & Microfluidics
- Micro Reactors
- Micro-Robotics
- DNA sequencing devices

- Remote Diagnostics
- Defibrillators
- Point of Care & Monitoring
- Hearing Aids
- Prosthetics
- Micro-Needle Devices
- Wireless to Device Linking

- High Density Connectors
- Biosensors & MEMS
- Batteries & Energy Harvesting
- Biocompatible Materials
- Encapsulation/ Hermeticity
- Flex, Glass, Silicon, Fused Si
- Reliability

Those wishing to present at the Workshop must submit a 200+ word abstract electronically IMMEDIATELY
using the online submittal form at: No formal technical paper is required.

Please contact Brian Schieman by email at if you have questions.


Priced at $600 for IMAPS members, $700 for non-members, and $350 for speakers, attendance will be limited to maintain a workshop atmosphere. Workshop will feature panel discussions for increased open engagement and networking. 10 sponsorships with tabletops will be available this year - a total of 20 total tabletop spaces will be available. For questions, email

Speaker Dates/Information:

  • Abstract Deadline Extended to: NOVEMBER 7, 2019
  • Speaker Email Notification: December 3, 2019
  • Early Registration Deadline: December 20, 2019
  • Speaker 2-3 sentence biography due not later than: January 17, 2020
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 29, 2020
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&. -- KEYNOTES: 40 minutes / 5 mins for questions)

Registration Information: (Early Registration Deadline: December 20, 2019) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 1-2 weeks after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 12/20/19
Advance/Onsite Fee
After 12/20/19
IMAPS Member
Session Chair
Chapter Officer
Premier Event Sponsorship
(Includes: 1 tabletop exhibit w/ 2 full session/exhibit badges, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $300/person. PRINT AD - ½ page advertisement in our printed Final Program. File Due: on/before Friday, January 10 at Noon Eastern. The printed program is 8.5x11 inch format so either a vertical or horizontal format. Full color. We ask for a high-resolution file of any kind – jpg, tiff, pdf or other formats will work. No bleeds.)
Tabletop Exhibit
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)

Register Online

Hotel Reservations - Reservation Deadline: December 20, 2019

Reservations must be made directly with the:

Westgate Hotel San Diego
1055 Second Avenue
San Diego, CA 92101

Rate for IMAPS Guests: $209/night + taxes and fees


Phone Reservations: 1-800-524-4802 (request the group rate for IMAPS or IMAPS Medical Microelectronics 2020)




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