Micross

2018 Advanced Technology Workshop on
Advanced Packaging for Medical Microelectronics

Handlery Hotel, San Diego, California
January 23-24, 2018


General Co-Chair:
Susan Bagen,
MST
General Co-Chair:
Kedar Shah,
Verily Life Sciences

Organizing Committee:
Steve Annas, Samtec | Matt Apanius, SMART Microsystems | Caroline Bjune, Draper |
Rick Elbert, Cicor | Tim LeClair, Cerapax | Vern Stygar, Asahi Glass Company


Abstracts Due: OCTOBER 31, 2017

SUBMIT ABSTRACTS

Hotel & Registration Details | Exhibitors/Sponsors | Speaker Information


Thank you to our Premier Sponsors:

Premier Sponsor - SMART Microsystems
Premier Sponsor - Micro Systems Technologies (MST)
Corporate Sponsor - Kyocera America
additional sponsorships available    

 

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 23-24, 2018. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This two-day event will draw invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.

Sessions are being planned now to include presentations on:

Implantable Devices

Diagnostic and In Vivo

Portable & Wearable

Technology

- Pacemakers & Defibrillators
- Neurostimulators
- Deep Brain Stimulation
- Drug Delivery
- Cochlear Implants
- Retinal/Ophthalmic
- Electroceuticals & Injectables

- Interventional Catheters
- Pillcams
- Ultrasound & Imaging
- Lab-on-Chip
- Micro Reactors
- Surgical Devices

- Remote Diagnostics
- Defibrillators
- Point of Care
- Patient Monitoring
- Ambulatory Care
- Hearing Aids
- Neurostimulators
- Prosthetics

- Biosensors & MEMS
- Batteries & Energy Harvesting
- Biocompatible Materials
- Encapsulation/Hermeticity
- HDI Flex & Packaging
- Wireless Communications
Reliability

 

SUBMISSION:
Those wishing to present at the Workshop must submit a 500+ word abstract electronically no later than OCTOBER 31, 2017
, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required.

Please contact Brian Schieman by email at bschieman@imaps.org if you have questions.

 

Priced at $550 for IMAPS members, $650 for non-members, and $300 for speakers, attendance will be limited to maintain a workshop atmosphere. Workshop will feature panel discussions for increased open engagement and networking. Limited tabletop space available for event SPONSORS and exhibiting companies. For questions, email bschieman@imaps.org.


Speaker Dates/Information:

  • Abstract Deadline: October 31, 2017
  • Speaker Email Notification: November 20, 2017
  • Early Registration Deadline: January 5, 2018
  • Speaker 2-3 sentence biography due not later than: January 10, 2018
  • Powerpoint/Presentation file for Workshop DOWNLOAD due not later than: January 24, 2018
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop/usb or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Registration Information: (Early Registration Deadline: January 5, 2018)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 1/5/18
Advance/Onsite Fee
After 1/5/18
IMAPS Member
$550
$650
Non-Member
$650
$750
Speaker
$300
$350
Session Chair
$300
$350
Student
$100
$150
Chapter Officer
$400
$500
Premier Event Sponsorship
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge, 1 full session badge, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages and printed program. Additional discounted full badges available to sponsors at $400/person)
$1500
$1500
Tabletop Exhibit
(Includes: 1 tabletop exhibit w/ 1 booth personnel badge. Full session badges NOT included - discounted full badges available to exhibitors at $400/person)
$800
$900
     

Register Online Soon



Hotel Reservations

Reservations must be made directly with the:

Handlery Hotel
950 Hotel Circle N.
San Diego, CA 92108

Courtesy rate for IMAPS Guests: $109/night + taxes and fees

How to Book:
Guests must call 800-676-6567 and request the group rate of $109+tax for the International Microelectronics Assembly and Packaging Society. There is no online booking link for this hotel.

Note: This is not a block, but a courtesy rate. It is subject to availability of rooms, so guests are encouraged to book as soon as possible to get the rate. There is no pre-determined cutoff date.

 

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems