IMAPS EVENTS
Early Registration Deadlines and Hotel Cutoffs on Monday for the Co-located ATWs - Workshop on Thermal Management and Workshop on Power LEDs (read more...)

Device Packaging 2006 - Call for Abstracts Deadlines Next Week for the Six Device Packaging Workshops (read more...)

IMAPS 2005 - Thanks for a Great Symposium! (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
North Texas Chapter to Co-Host Microelectronics, SMT & Business Expo Next Tuesday, October 11 (read more...)

Chicago/Milwaukee Chapter – October 18, 2005 Meeting Announcement (read more...)

Indiana Chapter October Meeting Announcement - Hail and Farewell (read more...)

Garden State Chapter Fall Packaging Symposium on November 2 (read more...)

New England Chapter Symposium 2006 - New Technical Chair (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS 2005 Proceedings Now Available (read more...)

   AROUND THE INDUSTRY
CPS Awarded Patent for AlSiC Composite with Integrated Heat Exchanger (read more...)

K&S Quatrix Technology Is Awarded Advanced Packaging Best Product In Semiconductor Assembly & Test Services Category (read more...)

Early Registration Deadlines and Hotel Cutoffs on Monday for the Co-located ATWs - Workshop on Thermal Management and Workshop on Power LEDs   ^ Top
Two important workshops are fast approaching: the ATW on Thermal Management and the ATW on Power LEDs. And the early registration deadlines and the hotel room cutoffs for both workshops are even closer -- registration fees increase on Monday, October 10, and the hotel room blocks will no longer be held. Visit the event websites below to reserve your spot. Register for both workshops and save!

This year's Thermal Management workshop will run October 24 - 26 at Dinah's Garden Hotel in Palo Alto, California. Learn more about this workshop on-line today at www.imaps.org/thermal.

The Power LEDs workshop is new this year and will run October 26 - 28 also at Dinah's Garden Hotel in Palo Alto, California. Learn more about this workshop on-line today at www.imaps.org/leds.

Device Packaging 2006 - Call for Abstracts Deadlines Next Week for the Six Device Packaging Workshops   ^ Top
The 2nd International Conference and Exhibition on Device Packaging will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The Conference will feature a new format this year – six Workshops concentrating on: 3D Packaging; Copper/Low-K; Flip Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics. These workshops are a continuation of past successful IMAPS Topical and Advanced Technology Workshops. This new format will provide a forum for the presentations of leading edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging. Abstracts must be received on/before October 14, 2005.

Those wishing to present a paper at the Device Packaging Conference in one of the workshops outlined above must submit a 200-300 word abstract electronically no later than October 14, 2005, using the on-line submittal form at: www.imaps.org/abstracts.htm. This Conference is being run as a series of related workshops, therefore no full manuscripts will be required. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions. Visit www.imaps.org/devicepackaging for more details.

Device Packaging 2006 will also feature one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during this Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 10' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 15, 2006 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-4001.

There will be several professional development and networking opportunities at Device Packaging 2006. For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on the Monday, March 20, preceding the technical conference. The Global Business Council (GBC) will be offering a stellar Winter Conference focusing on the business side of these technologies held in conjunction with Device Packaging. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.

IMAPS 2005 - Thanks for a Great Symposium!   ^ Top
IMAPS 2005 had a great turnout with more than 2300 attendees. Thank you to all the sponsors, exhibitors, attendees and volunteers that supported IMAPS 2005!

In case you missed it, check out www.imaps2005.org to see what made this year's symposium so exciting, including: Kulicke & Soffa Keynote Presentation; GBC Marketing Forum Presentations; and IMAPS 05 Final Program.

IMAPS 2006 is going to be an even bigger success in San Diego next Year - October 8-12, 2006. The National Symposium Committee and Technical Committee are working hard to deliver the strongest technical program around. Be sure to visit www.imaps2006.org over the coming weeks for an updated call for papers highlighting: new focused technical sessions on Wireless RF/Telecommunications; Bio-Medical; Military/Homeland Security; and System Level Packaging. And be sure to keep a close eye on the other programs in San Diego, especially the exhibition. With nearly 100 booths already sold, IMAPS 2006 is shaping up to be larger than ever!

North Texas Chapter to Co-Host Microelectronics, SMT & Business Expo Next Tuesday, October 11    ^ Top
Date: Tuesday, October 11, 2005
Location: Richardson Civic Center

The North Texas local chapters of IMAPS and SMTA will co-host an Expo with topics covering Microelectronics, SMT and Business on Tuesday, October 11, 2005. The event will be held at the Richardson Civic Center and includes up to 60 tabletop vendor presentations and two concurrent technical presentations.

For more information, please contact Harold Snyder at HaroldLSJ@aol.com or review the flyer at the North Texas Home Page at http://www.imaps.org/chapters/northtexas.

Chicago/Milwaukee Chapter – October 18, 2005 Meeting Announcement    ^ Top

Date:	Tuesday, October 18, 2005
Location:	Silver Stallion Restaurant and Meeting Facility 1275 Lee Street Des Plaines, IL 60016
Time:	Networking at 5:30, Dinner at 6:00, Presentation at 7:00
Investment:	$20.00 Members, $25.00 Non-members, $10.00 Students/Retirees $5.00 Displaced members
Reservations:	Mark Naretto at (815) 235-6935 or e-mail to: mark.naretto@honeywell.com.
Speaker:	Richard Gehman – Honeywell Sensing and Control
Title:	MEMS Based Rugged Flow Sensor for Liquid and Air Media

The presentation reports on a new rugged flow sensor for air and liquid media. Such a sensor can be used for sensing mass flow rate of fluids in electrically conductive and non-conductive fluids, and the flow rate of low-to-high mass flux gases/vapors. The sensor is based on a differential thermal anemometer that is fabricated using MEMS technology on a solid substrate. The electrical signals from the ruggedized version of the sensor are obtained from the backside of the chip, avoiding front side interference with the media. This novel through-the-chip electrical interconnect approach overcomes the drawbacks associated with presently available flow sensors that have wire bonds. The rugged flow sensor has the following features: ultra sensitivity, low dead volume, minimal priming necessary, no moving parts, biocompatible, high pressure tolerant, wide dynamic range and a wide family of flow ranges from 1 nL/min to 10 L/min (without bypass), up to 10 L/min using bypass. Various sensor packages have been developed for non-isolated sensing (fluid touches chip surface), isolated sensing (fluid does not touch chip surface) and disposable/single-use applications.

Biography:
Dick Gehman has over 20 years experience in MEMS sensor design and process development and over 26 years experience in Microelectronics. For the past 24 years he has been employed by Honeywell Sensing and Control in Freeport, Illinois. He received a BS in Materials Engineering from Cornell University in 1974 and a MS in Mechanics and Materials Science from Rutgers University in 1979. He has published over a dozen papers and received 7 patents and 6 corporate performance awards. He has been active in IMAPS since 1982 serving as Chapter president and co-chairing the Annual Chicago-Milwaukee Regionally Symposium for the last 10 years. He was Technical Program Chair of the International Symposium in 1999 at the Chicago Hilton and Towers. His talk is entitled “MEMS Based Rugged Flow Sensor for Liquid and Air Media” originally presented June 2004 at Sensors Expo by his co-authors Richard Alderman and Aravind Padmanabhan.

Indiana Chapter October Meeting Announcement - Hail and Farewell    ^ Top
A Final Tribute to CTS Microelectronics from Indiana IMAPS

Thursday, October 27, 2005
The Trails
West Lafayette, IN

As many of you in IMAPS have already read, the CTS Microelectronics facility in West Lafayette, IN will be closing by year-end and has sold its inventory and assets to American Technical Ceramics Corporation in Jacksonville, FL.

This is indeed a sad day for IMAPS, as CTS Microelectronics has been manufacturing hybrid microcircuits for 40 years and has always been an enthusiastic supporter of ISHM and IMAPS at the local and national levels. CTS Microelectronics helped found the Indiana chapter 30 years ago, and many CTS employees have held officer and chairperson positions and attended chapter meetings on a regular basis.

In recognition of CTS’ contributions to the microelectronics industry and to IMAPS, the officers of Indiana IMAPS have decided to devote the opening meeting of their 2005-2006 schedule to an informal tribute to CTS Microelectronics and its employees. All current and former CTS engineers, scientists, technicians, salesmen, supervisors and support staff are invited to attend, along with colleagues, suppliers, customers, and IMAPS members who would like to thank them for their efforts and wish them well on their new journeys.

The meeting will follow its usual format of happy hour at 5:00, steak dinner at 6:00 and chapter meeting at 7:00. Indiana IMAPS will make a presentation recognizing the history and accomplishments of CTS Microelectronics, and any attendees who would like to share a few words with the group will be invited to do so.

Meeting cost will be $18.00 for IMAPS members, $20.00 for non-members, $5.00 for students, and $10.00 for current and former CTS employees.

Program chair Ray Fairchild is accepting reservations now, and he can be reached at m.ray.fairchild@delphi.com or at 765-451-1068.

Please keep your eyes on the Indiana IMAPS website and the regular mailed newsletter for more meeting information.

The meeting will be chaired by Terry Baum, a CTS employee for 29 years, former Indiana IMAPS president, vice-president, and secretary, and now on the technical staff of L-3 Communications Cincinnati Electronics in Mason, OH.

Garden State Chapter Fall Packaging Symposium on November 2    ^ Top
Wednesday, November 2nd, 2005
Technical Sessions and Vendor Displays will be located at IBM Research in the Industry Solutions Lab, Hawthorne, NY
Register on-line at http://www.imaps.org/registration/garden2005fall.htm.

Presentations are being solicited on the following topics:

Advanced Silicon Packaging
• Chip Scale and Flip Chip Packaging • 3-D Packaging • Bumping Technologies

Flex Circuits and Rigid PWBs: New Structures, Materials and Processes
• Folded Circuits • Micro-Via Technology •High Frequency Dielectrics

MEMS
• Technology • Applications •Development

High Frequency Electronic Packaging
• 802.11 and Bluetooth • Broadband Systems at 10s of GBs

Opto-Electronics Packaging
• Reliability, Hermeticity •High Precision Assembly •Wire bonding to Difficult Materials

Please send Abstracts (~250 words) to:

Program Chair:
David Seeger
seeger@us.ibm.com

Program Co-Chair:
Sri-Jayantha
srij@us.ibm.com

Conference Chair:
Michael Salloum
msalloum@rdcircuits.com

Vendor Registration:
Michael Salloum
Tel: (732) 646-2250; Fax: (610) 770-2036; E-mail: msalloum@rdcircuits.com
For more information, visit: www.imaps.org/chapters/garden. Register on-line at http://www.imaps.org/registration/garden2005fall.htm.

New England Chapter Symposium 2006 - New Technical Chair    ^ Top
The New England Chapter of IMAPS www.imapsne.org welcomes Charles Brown as its 2006 Technical Program Chair for New England’s 33rd Annual Symposium & Exhibition, to be held Tuesday May 16th, 2006 at the Holiday Inn Boxborough Woods in Boxborough, MA. Charles is Manager of Manufacturing Engineering at Vicor www.vicorpower.com. While new to the New England Chapter, he is not new to IMAPS and the Electronics Industry. Charles has been active over the years at both the local and National level of IMAPS. He is a 1995 Fellow of the Society recipient and Senior Member of IMAPS. Charles has also served on the Board of Directors for SMTA. His extensive background in areas such as Thick Film, RF, MEMS, SMT & Hybrid Assembly processes makes him ideally suited for this role. Please contact him at cbrown@imapsne.org if interested in presenting or serving as a session chair for our 2006 Symposium.

An Adobe Acrobat call for papers can be downloaded at the following address: http://www.imapsne.org/docs/Call_2006.pdf.

IMAPS 2005 Proceedings Now Available   ^ Top
Were you not able to attend IMAPS 2005? Don't worry, you can still get a copy of the Proceedings which contains all of the cutting-edge papers that were presented in Philadelphia. IMAPS 2005 Proceedings are now available for purchase on-line at: http://www.imaps.org/registration/pubs1.asp. CD-Roms of the Proceedings are available for members and non-members. There are still some copies of the printed Proceedings book as well. Contact Rick Mohn, rmohn@imaps.org or 202-548-4001, for details. Supplies are limited.

AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. AlSiC’s CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field. AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC’s high thermal conductivity reduces thermal induced stresses that can lead to electronic assembly failures.

The CPS AlSiC net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions.

Stainless steel cooling tubes, or heat exchanger cavities, can be captured during the fabrication process for an integrated solution. The integration improves thermal performance, reducing thermal resistance between cooling tube or heat exchanger cavities and the matrix material by providing a metallic structural bond. Cooling tubes have been integrated in CPS AlSiC structures for pieces as small as microprocessor lids to products as large as IGBT cooler bases. Stainless steel cooling tubes are preferred for high purity water systems.

For more information, please visit www.alsic.com.

K&S Quatrix Technology Is Awarded Advanced Packaging Best Product In Semiconductor Assembly & Test Services Category   ^ Top
Kulicke & Soffa Industries, Inc. recently received the 2005 Advanced Packaging Award (APA) in the category of Semiconductor Assembly & Test Services for its new Quatrix photolithographic package test technology. Advanced Packaging Magazine and SEMI (Semiconductor Equipment and Materials International) sponsor the Advanced Packaging Award (APA). A distinguished panel of industry experts chooses the best technological advancements in 19 categories, including semiconductor assembly and test services.

K&S’ Quatrix is a revolutionary new interconnect technology, which offers greater electromechanical performance at lower cost-of-ownership. This new package test technology is based upon proprietary photolithographic technology developed exclusively by K&S.

Oded Lendner, K&S senior vice president, Package Test Business Unit, states, “We are extremely pleased to have won the advanced packaging award with our new Quatrix technology. And we are also pleased to see that our first customers are getting superior performance with higher yields, longer life and reduced maintenance in the final test area.”

Quatrix is based on an advanced photolithographic manufacturing technology that produces no sliding parts and has higher mechanical precision with improved contacts, which offers high consistency along with excellent first pass yields.

Andrei Berar, Vice President – Package Test, explains, “Our first customers have fully tested Quatrix and they see first hand the benefits of our photolithographic process with its very precise and flexible geometries. Customers have come back to us showing repeatability on the order of 3 to 4 microns.” Additionally, Andrei states, “Plus, they have shown longer contactor life with more than one million cycles, compared to traditional test sockets.”

K&S plans to further expand its Quatrix product portfolio to all of the most demanding requirements such as testing in QFN, BGA and LGA devices. For more information on Quatrix technology, visit www.kns.com.