Registration Deadlines and Hotel Cutoffs on Monday for
the Co-located ATWs - Workshop
on Thermal Management and Workshop on Power LEDs (read
Packaging 2006 - Call for Abstracts Deadlines Next
Week for the Six Device Packaging Workshops (read
2005 - Thanks for a Great Symposium! (read
listed in chronological order)
Texas Chapter to Co-Host Microelectronics, SMT & Business
Expo Next Tuesday, October 11 (read
Chapter – October 18, 2005 Meeting Announcement (read
Chapter October Meeting Announcement - Hail and Farewell (read
State Chapter Fall Packaging Symposium on November 2 (read
England Chapter Symposium 2006 - New Technical Chair (read
2005 Proceedings Now Available (read
Awarded Patent for AlSiC Composite with Integrated Heat Exchanger (read
Quatrix Technology Is Awarded Advanced Packaging Best Product
Semiconductor Assembly & Test Services Category (read
full Web Calendar)
Registration Deadlines and Hotel Cutoffs
on Monday for the Co-located ATWs - Workshop
on Thermal Management and Workshop on Power
workshops are fast approaching:
the ATW on Thermal Management
and the ATW on Power LEDs. And the early registration deadlines and
the hotel room cutoffs for both workshops are even closer -- registration
fees increase on Monday, October 10, and the hotel
room blocks will no longer be held. Visit the event websites below
your spot. Register for both workshops and save!
This year's Thermal Management workshop
will run October 24 - 26 at Dinah's Garden Hotel in Palo Alto,
California. Learn more about this workshop on-line
today at www.imaps.org/thermal.
The Power LEDs workshop is new this
year and will run October 26 - 28 also at Dinah's Garden Hotel
in Palo Alto, California. Learn more about this workshop
on-line today at www.imaps.org/leds.
2006 - Call for
Next Week for
the Six Device
Packaging Workshops ^
The 2nd International Conference and Exhibition on Device Packaging will be a
focused Conference dedicated to the challenges and technologies for packaging
and devices of all types. The Conference will feature a new format this
year – six Workshops concentrating on:
3D Packaging; Copper/Low-K; Flip Chip Technologies; High Frequency/Microwave;
MEMS; and Optoelectronics. These workshops are a continuation of past
successful IMAPS Topical and Advanced Technology Workshops. This new format will
provide a forum for the presentations of leading edge device packaging technologies
and an opportunity to meet and exchange ideas with leading experts in all facets
of device packaging. Abstracts must be received on/before October
to present a paper at the Device Packaging Conference in one
of the workshops outlined above must submit a 200-300
word abstract electronically no later than October 14, 2005,
using the on-line submittal form at: www.imaps.org/abstracts.htm.
This Conference is being run as a series of related workshops,
therefore no full manuscripts will be required. Please contact
Jackki Morris-Joyner by email at firstname.lastname@example.org or
by phone at 305-382-8433 if you have questions. Visit www.imaps.org/devicepackaging for
2006 will also feature one collective Exhibition and Technology
Showcase for vendors and suppliers who support the many aspects
of Device Packaging and each of the topical areas addressed during
this Conference. This venue features an ideal atmosphere to showcase
your products and services to key decision making professionals
in the industry. Full 10' by 10' exhibit spaces will be available.
To reserve booth space please fill out the on-line
submittal form before February 15, 2006 or contact Ann Bell
by email at email@example.com or
by phone at 202-548-4001.
be several professional development and networking opportunities
at Device Packaging 2006. For those wishing to broaden their
knowledge of device packaging, a selection of half-day courses
will be offered on the Monday, March 20, preceding the technical
conference. The Global
Business Council (GBC) will be offering a stellar Winter Conference focusing
on the business side of these technologies held in conjunction
with Device Packaging. There will also be several networking
receptions and gatherings throughout the week, including the
opening receptions, meals and other social events.
2005 - Thanks for a Great Symposium! ^
IMAPS 2005 had a great turnout with more than 2300 attendees.
Thank you to all the sponsors, exhibitors, attendees and volunteers
that supported IMAPS 2005!
In case you missed
it, check out www.imaps2005.org to
see what made this year's symposium so exciting, including: Kulicke & Soffa
Keynote Presentation; GBC
Marketing Forum Presentations; and IMAPS 05 Final
IMAPS 2006 is
going to be an even bigger success in San Diego next Year - October
8-12, 2006. The National Symposium Committee and Technical Committee
are working hard to deliver the strongest technical program around.
Be sure to visit www.imaps2006.org over
the coming weeks for an updated call for papers highlighting: new
focused technical sessions on Wireless RF/Telecommunications; Bio-Medical;
Military/Homeland Security; and System Level Packaging. And be
sure to keep a close eye
on the other programs in San Diego, especially the exhibition.
With nearly 100 booths already sold, IMAPS 2006 is shaping up to
be larger than ever!
listed in chronological order)
Texas Chapter to Co-Host Microelectronics,
SMT & Business Expo Next Tuesday, October 11 ^
Date: Tuesday, October 11, 2005
Location: Richardson Civic Center
The North Texas local chapters of IMAPS and SMTA will co-host an Expo with topics
covering Microelectronics, SMT and Business on Tuesday, October 11, 2005. The
event will be held at the Richardson Civic Center and includes up to 60 tabletop
vendor presentations and two concurrent technical presentations.
For more information,
please contact Harold Snyder at HaroldLSJ@aol.com or
review the flyer at the North Texas Home Page at http://www.imaps.org/chapters/northtexas.
Chapter – October 18, 2005 Meeting Announcement ^
October 18, 2005
Stallion Restaurant and Meeting Facility
1275 Lee Street
Des Plaines, IL 60016
at 5:30, Dinner at 6:00, Presentation at 7:00
Members, $25.00 Non-members, $10.00 Students/Retirees
$5.00 Displaced members
at (815) 235-6935 or e-mail to: firstname.lastname@example.org.
Gehman – Honeywell Sensing and Control
Rugged Flow Sensor for Liquid and Air Media
reports on a new rugged flow sensor for air and liquid media.
Such a sensor can be used for sensing mass flow rate of fluids
in electrically conductive and non-conductive fluids, and the
flow rate of low-to-high mass flux gases/vapors. The sensor is
based on a differential thermal anemometer that is fabricated
using MEMS technology on a solid substrate. The electrical signals
from the ruggedized version of the sensor are obtained from the
backside of the chip, avoiding front side interference with the
media. This novel through-the-chip electrical interconnect approach
overcomes the drawbacks associated with presently available flow
sensors that have wire bonds. The rugged flow sensor has the
following features: ultra sensitivity, low dead volume, minimal
priming necessary, no moving parts, biocompatible, high pressure
tolerant, wide dynamic range and a wide family of flow ranges
from 1 nL/min to 10 L/min (without bypass), up to 10 L/min using
bypass. Various sensor packages have been developed for non-isolated
sensing (fluid touches chip surface), isolated sensing (fluid
does not touch chip surface) and disposable/single-use applications.
Dick Gehman has over 20 years experience in MEMS sensor design and process
development and over 26 years experience in Microelectronics. For the
past 24 years he has been employed by Honeywell Sensing and Control in
Freeport, Illinois. He received a BS in Materials Engineering from Cornell
University in 1974 and a MS in Mechanics and Materials Science from
Rutgers University in 1979. He has published over a dozen papers and
received 7 patents and 6 corporate performance awards. He has been active
in IMAPS since 1982 serving as Chapter president and co-chairing the
Annual Chicago-Milwaukee Regionally Symposium for the last 10 years.
He was Technical Program Chair of the International Symposium in 1999
at the Chicago Hilton and Towers. His talk is entitled “MEMS
Based Rugged Flow Sensor for Liquid and Air Media” originally presented
June 2004 at Sensors Expo by his co-authors Richard Alderman and Aravind
Indiana Chapter October Meeting Announcement
- Hail and Farewell ^
Tribute to CTS Microelectronics
from Indiana IMAPS
Thursday, October 27, 2005
West Lafayette, IN
As many of you in IMAPS have already read, the CTS
Microelectronics facility in West Lafayette, IN will
be closing by year-end and has sold its inventory and
assets to American Technical Ceramics Corporation in
This is indeed a sad day for IMAPS, as CTS Microelectronics
has been manufacturing hybrid microcircuits for 40
years and has always been an enthusiastic supporter
of ISHM and IMAPS at the local and national levels.
CTS Microelectronics helped found the Indiana chapter
30 years ago, and many CTS employees have held officer
and chairperson positions and attended chapter meetings
on a regular basis.
recognition of CTS’ contributions to the
microelectronics industry and to IMAPS, the officers
of Indiana IMAPS have decided to devote the opening
meeting of their 2005-2006 schedule to an informal
tribute to CTS Microelectronics and its employees.
All current and former CTS engineers, scientists, technicians,
salesmen, supervisors and support staff are invited
to attend, along with colleagues, suppliers, customers,
and IMAPS members who would like to thank them for
their efforts and wish them well on their new journeys.
The meeting will follow its usual format of happy
hour at 5:00, steak dinner at 6:00 and chapter meeting
at 7:00. Indiana IMAPS will make a presentation recognizing
the history and accomplishments of CTS Microelectronics,
and any attendees who would like to share a few words
with the group will be invited to do so.
Meeting cost will be $18.00 for IMAPS members, $20.00
for non-members, $5.00 for students, and $10.00 for
current and former CTS employees.
Program chair Ray Fairchild is accepting reservations
now, and he can be reached at email@example.com or at 765-451-1068.
Please keep your eyes on the Indiana IMAPS website
and the regular mailed newsletter for more meeting
The meeting will be chaired by Terry Baum, a CTS employee
for 29 years, former Indiana IMAPS president, vice-president,
and secretary, and now on the technical staff of L-3
Communications Cincinnati Electronics in Mason, OH.
Chapter Fall Packaging Symposium on November 2 ^
Wednesday, November 2nd, 2005
Technical Sessions and Vendor Displays will be located at IBM Research in the
Industry Solutions Lab, Hawthorne, NY
on-line at http://www.imaps.org/registration/garden2005fall.htm.
Presentations are being solicited on the following topics:
• Chip Scale and Flip Chip Packaging • 3-D Packaging • Bumping
and Rigid PWBs: New Structures, Materials and Processes
• Folded Circuits • Micro-Via Technology •High Frequency Dielectrics
• Technology • Applications •Development
• 802.11 and Bluetooth • Broadband Systems at 10s of GBs
• Reliability, Hermeticity •High Precision Assembly •Wire bonding
to Difficult Materials
Abstracts (~250 words) to:
Tel: (732) 646-2250; Fax: (610) 770-2036; E-mail: firstname.lastname@example.org
For more information, visit: www.imaps.org/chapters/garden.
Register on-line at http://www.imaps.org/registration/garden2005fall.htm.
England Chapter Symposium 2006 -
New Technical Chair ^
The New England Chapter of IMAPS www.imapsne.org welcomes
Charles Brown as its 2006 Technical Program Chair for New England’s 33rd
Annual Symposium & Exhibition, to be held Tuesday May 16th, 2006 at the
Holiday Inn Boxborough Woods in Boxborough, MA. Charles is Manager of Manufacturing
Engineering at Vicor www.vicorpower.com.
While new to the New England Chapter, he is not new to IMAPS and the Electronics
Industry. Charles has been active over the years at both the local and National
level of IMAPS. He is a 1995 Fellow of the Society recipient and Senior Member
of IMAPS. Charles has also served on the Board of Directors for SMTA. His extensive
background in areas such as Thick Film, RF, MEMS, SMT & Hybrid Assembly
processes makes him ideally suited for this role. Please contact him at email@example.com if
interested in presenting or serving as a session chair for our 2006 Symposium.
An Adobe Acrobat
call for papers can be downloaded at the following address: http://www.imapsne.org/docs/Call_2006.pdf.
2005 Proceedings Now Available ^
Were you not able to attend IMAPS 2005?
can still get a copy of the Proceedings which contains all of the cutting-edge
papers that were presented in Philadelphia. IMAPS 2005 Proceedings are
now available for purchase on-line at: http://www.imaps.org/registration/pubs1.asp.
CD-Roms of the Proceedings are available for members and non-members. There are
still some copies of the printed Proceedings book as well. Contact Rick
Mohn, firstname.lastname@example.org or 202-548-4001,
for details. Supplies are limited.
CPS Awarded Patent for AlSiC Composite with Integrated Heat Exchanger ^
CPS Corporation offers AlSiC (Aluminum Silicon Carbide), a metal
matrix composite that provides high-performance heat spreaders,
packages, and substrates for the flip-chip IC packaging, power
control, and optoelectronic markets. CPS has recently been awarded
a patent for tubing which is integrally enveloped within AlSiC
thermal management composite materials for active cooling solutions
(USPO # 6668912 B2).
AlSiC enables a tailored
coefficient of thermal expansion (CTE), offering compatibility
with various electronic devices and assemblies.
Unlike traditional packaging materials, the isotropic CTE value
of AlSiC can be adjusted for specific applications by modifying
the Al-metal/SiC-particulate ratio. AlSiC’s CTE matching
capabilities eliminate the need for thermal interface stacking,
increasing reliability in the field. AlSiC also exhibits a high
thermal conductivity that results in extremely efficient thermal
dissipation. Coupled with its superior CTE matching, AlSiC’s
high thermal conductivity reduces thermal induced stresses that
can lead to electronic assembly failures.
The CPS AlSiC net-shape fabrication process both produces the
composite material and fabricates the product geometry, resulting
in a cost-effective product and allowing rapid prototyping for
high volume advanced thermal management solutions.
Stainless steel cooling tubes, or heat exchanger cavities, can
be captured during the fabrication process for an integrated solution.
The integration improves thermal performance, reducing thermal
resistance between cooling tube or heat exchanger cavities and
the matrix material by providing a metallic structural bond. Cooling
tubes have been integrated in CPS AlSiC structures for pieces as
small as microprocessor lids to products as large as IGBT cooler
bases. Stainless steel cooling tubes are preferred for high purity
For more information,
please visit www.alsic.com.
Technology Is Awarded Advanced Packaging Best Product In Semiconductor
Assembly & Test Services Category ^
Kulicke & Soffa Industries, Inc. recently received the 2005
Advanced Packaging Award (APA) in the category of Semiconductor
Assembly & Test Services for its new Quatrix photolithographic
package test technology. Advanced Packaging Magazine and SEMI (Semiconductor
Equipment and Materials International) sponsor the Advanced Packaging
Award (APA). A distinguished panel of industry experts chooses
the best technological advancements in 19 categories, including
semiconductor assembly and test services.
K&S’ Quatrix is a revolutionary new interconnect technology,
which offers greater electromechanical performance at lower cost-of-ownership.
This new package test technology is based upon proprietary photolithographic
technology developed exclusively by K&S.
K&S senior vice president, Package Test Business
Unit, states, “We are extremely pleased to have won the advanced
packaging award with our new Quatrix technology. And we are also
pleased to see that our first customers are getting superior performance
with higher yields, longer life and reduced maintenance in the
final test area.”
Quatrix is based on an advanced photolithographic manufacturing
technology that produces no sliding parts and has higher mechanical
precision with improved contacts, which offers high consistency
along with excellent first pass yields.
Andrei Berar, Vice President – Package Test, explains, “Our
first customers have fully tested Quatrix and they see first hand
the benefits of our photolithographic process with its very precise
and flexible geometries. Customers have come back to us showing
repeatability on the order of 3 to 4 microns.” Additionally,
Andrei states, “Plus, they have shown longer contactor life
with more than one million cycles, compared to traditional test
to further expand its Quatrix product portfolio to all of the
requirements such as testing in QFN,
BGA and LGA devices. For more information on Quatrix technology,
on Thermal Management 2005
October 24-26, 2005
Palo Alto, CA
ATW on Packaging and Assembly of Power LEDs 2005
October 26-28, 2005
Palo Alto, CA
on Fuel Cell Electronics Packaging 2006
January 24-26, 2006
Business Council 2006 Winter Meeting
March 19-20, 2006
*Co-located with the Device Packaging Conference
Conference and Exhibition on Device Packaging 2006
March 20-23, 2006
*Exhibitors contact email@example.com
*Co-located with the GBC Winter Conference
International Conference and Exhibition on Ceramic Interconnect and
Ceramic Microsystems Technologies 2006
April 25-27, 2006
*Exhibitors contact firstname.lastname@example.org
International Conference and Exhibition on High Temperature
Electronics (HiTEC 2006)
May 15-18, 2006
Santa Fe, NM
*Exhibitors contact email@example.com
2006 - 39th International Symposium on Microelectronics
October 8-12, 2006
San Diego, CA
*Exhibitors contact firstname.lastname@example.org