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August 14, 2007

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   IMAPS EVENTS
Button IMAPS 2007 - 40th International Symposium on Microelectronics - Program and Registration Now Available! (read more...)

Button Thermal Management Workshop Hotel and Registration Deadlines in Two Weeks - August 24 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Arizona Chapter Lunch Meeting on The Role of Intermetallic Compound Formation on Package Reliability (read more...)

Bullet Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits (read more...)

Bullet French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

Bullet MicroTech 2008 Call for Papers (read more...)

IMAPS Events (view full Web Calendar)

IMAPS 2007 - 40th International Symposium on Microelectronics - Program and Registration Now Available!    ^ Top
Celebrating 40 Years of Excellence! We would like to invite you to 40th International Symposium on Microelectronics in San Jose, California, the heart of “Silicon Valley,” where you’ll be able to enjoy close proximity to world class wineries, over 100 restaurants in the downtown area, and unparalled cultural diversity. We have brought together a Technical Program with 30 sessions and 200 presentations addressing all aspects of microelectronics packaging - “everything in electronics between the chip and the system.” 

IMAPS 2007 will feature a State-of-the-Art Exhibition and Technology Showcase with more than 200 booths displaying new products and concepts. We will also have two Interactive Poster sessions, 18 Professional Development Courses, 3 keynote presentations, a powerful Global Business Council meeting and a significant Student Program.  New challenges and opportunities to enhance our products have been presented with globalization being realized. This has helped in bringing about a paradigm shift in time-to-value for a myriad of our electronic products. To support the globalization focus a Japanese-to-English translated session, and, for the first time, two Chinese-to-English translated sessions have been included in the program track.

One of the great aspects of attending a technical program of this nature is the ability you will have to meet and converse with folks from all over the world. IMAPS, a truly international society, will have speakers from 13 countries, and attendees from Europe, the Pacific Rim, and the Americas, providing you, the attendee, with an incredible opportunity to network.

The 40th International Symposium on Microelectronics will be held November 11-15, 2007, at the McEnery Convention Center in San Jose, California. For more information, and to register, visit www.imaps40th.org. Come celebrate the 40th Anniversary of the society!

Thermal Management Workshop Hotel and Registration Deadlines in Two Weeks - August 24    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/thermal. The hotel cut-off and early registration deadline are August 24, 2007.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

View the complete Advance Program and register on-line at www.imaps.org/thermal.


Chapter Activities (events listed in chronological order)

Arizona Chapter Lunch Meeting on The Role of Intermetallic Compound Formation on Package Reliability   ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: The Role of Intermetallic Compound Formation on Package Reliability. Lead free solders including SAC and AuSn will be presented by Jonathan Harris, PhD, President of CMC Interconnect Technologies.

Date: Thursday, 23 Aug 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $15.00


Special - No Charge for pre-registered attendees. (Vendor Tables available for $15)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, August 20.

RSVP by 20 Aug 2007 on-line at http://www.imaps.org/chapters/freepass.asp or by email - greg.clemons@intel.com. Reserve your display table at http://www.imaps.org/registration/az2007aug.htm.

Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits   ^ Top

When: September 13, 2007
Schedule: Registration/Networking: 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Where: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

Members: $30.00 if Pre-Registered September 6, 2007
$35.00 After September 6, 2007

Non-Members: $35.00 if Pre-Registered by September 6, 2007
$40.00 After September 6, 2007

Pre-Registration:

Email: slehnert@mdipower.com
Phone: Steve Lehnert  (631) 345-3100
Web: www.imaps.org/chapters/metro

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Nanotechnology
by
Dr. Martin Moskovits
Chief Technology Officer API Nanotronics

Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,  www.imapsfrance.org.

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK.
Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK are looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

  1. Emerging Applications
  2. Future Interconnections
  3. Developing Technologies
  4. System Integration
  5. Advanced Substrates
  6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   
Email: office@imaps.org.uk

Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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