Arizona Chapter Lunch Meeting This Thursday on The Role of Intermetallic Compound Formation on Package Reliability ^
Please join the IMAPS Arizona Chapter for a discussion on: The Role of Intermetallic Compound Formation on Package Reliability. Lead free solders including SAC and AuSn will be presented by Jonathan Harris, PhD, President of CMC Interconnect Technologies.
||Thursday, 23 Aug 2007
||Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
||Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
||Luncheon and presentation - $10.00
Vendor display tables available for $15.00
RSVP by email - firstname.lastname@example.org.
Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits ^
||September 13, 2007
||Registration/Networking: 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
||Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Members: $30.00 if Pre-Registered September 6, 2007
$35.00 After September 6, 2007
Non-Members: $35.00 if Pre-Registered by September 6, 2007
$40.00 After September 6, 2007
Phone: Steve Lehnert (631) 345-3100
There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.
by Dr. Martin Moskovits
Chief Technology Officer API Nanotronics
Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.
French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007 ^
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.
As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.
The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.
In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations.
In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”.
In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers).
Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.
The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93
Or visit the chapter web site, www.imapsfrance.org.
News From IMAPS New England Chapter ^
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Micro Electronics and Fiber Optic Manufacturing". For details please see the meeting notice at http://www.imapsne.org/meeting.html.
The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA. Call for technical papers are available at http://www.imapsne.org/docs/Call_2008.doc.
Please visit the IMAPS New England Chapter Website for announcements of future events www.imapsne.org.
MicroTech 2008 Call for Papers ^
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK. Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.
The special topic of MicroTech 2008 is “Chip to System … Interconnect & Packaging ”. IMAPS UK are looking for visionary technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.
This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs. The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.
We are inviting Key technical papers covering:
- Emerging Applications
- Future Interconnections
- Developing Technologies
- System Integration
- Advanced Substrates
- Nano-Tech Integration
Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.
Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB.
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582
Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium ^
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.