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August 29, 2007

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   IMAPS EVENTS
Button Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging (read more...)

Button Thermal Management Workshop Is Filling Up Fast (read more...)

Button Advanced Technology Workshop on Integrated/Embedded Passives - Program and Registration Now Available (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits (read more...)

Bullet French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

Bullet News From IMAPS New England Chapter (read more...)

Bullet Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology (read more...)

Bullet MicroTech 2008 Call for Papers (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

   PRODUCTS AND PUBLICATIONS
The Journal of Microelectronics and Electronic Packaging 2nd Quarter 2007 Edition is Available On-line (read more...)

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited (read more...)

IMAPS Events (view full Web Calendar)

Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging    ^ Top
IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging being held in Scottsdale/Fountain Hills, Arizona, from March 17-20, 2008. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types.

The format again this year will feature five workshops concentrating on:

These workshops have been at the core of previous Device Packaging Conferences and are a continuation of past successful IMAPS Advanced Technology Workshops. This format will provide a forum for the presentations of leading-edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Wafer Level Packaging/Embedded Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2007.

Those wishing to present in one of the workshops of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Thermal Management Workshop Is Filling Up Fast    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/thermal.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

View the complete Advance Program and register on-line at www.imaps.org/thermal.

Advanced Technology Workshop on Integrated/Embedded Passives - Program and Registration Now Available    ^ Top
Integrated/Embedded Passives 2007 is being held November 15-16, at the San Jose Convention/Fairmont Hotel in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/passives. The hotel cut-off and early registration deadline are October 10, 2007.

The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered. Passive technologies are essential for implementing smaller, cheaper and faster products.

This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace. Sessions will address the following topical areas: Materials, Processing, Applications, Design and Market Trends

View the complete Advance Program and register on-line at www.imaps.org/passives.


Chapter Activities (events listed in chronological order)

Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits   ^ Top

When: September 13, 2007
Schedule: Registration/Networking: 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Where: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

Members: $30.00 if Pre-Registered September 6, 2007
$35.00 After September 6, 2007

Non-Members: $35.00 if Pre-Registered by September 6, 2007
$40.00 After September 6, 2007

Pre-Registration:

Email: slehnert@mdipower.com
Phone: Steve Lehnert  (631) 345-3100
Web: www.imaps.org/chapters/metro

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Nanotechnology
by
Dr. Martin Moskovits
Chief Technology Officer API Nanotronics

Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,  www.imapsfrance.org.

News From IMAPS New England Chapter    ^ Top
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Micro Electronics and Fiber Optic Manufacturing".  For details please see the meeting notice at  http://www.imapsne.org/meeting.html.

The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA.  Call for technical papers are available at http://www.imapsne.org/docs/Call_2008.doc

Please visit the IMAPS New England Chapter Website for announcements of future events www.imapsne.org.

Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00


Special - No Charge for pre-registered attendees. (Vendor Tables available for $20)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, October 1.

RSVP by October 1, 2007, on-line at http://www.imaps.org/chapters/freepass.asp or by email - greg.clemons@intel.com. Reserve your display table at http://www.imaps.org/registration/az2007oct.htm.

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK.
Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK is looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

  1. Emerging Applications
  2. Future Interconnections
  3. Developing Technologies
  4. System Integration
  5. Advanced Substrates
  6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   
Email: office@imaps.org.uk

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.

Products and Publications

The Journal of Microelectronics and Electronic Packaging 2nd Quarter 2007 Edition is Available On-line   ^ Top
The Second Quarter 2007 issue of the Journal of Microelectronics and Electronic Packaging is available on-line.
Log-on to access the Journal.

The Journal of Microelectronics and Electronic Packaging is published quarterly and offered to all members electronically via the IMAPS Website. Print subscriptions are available for an additional rate.

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit www.imaps40th.org and follow the links for registration or visit http://www.imaps.org/registration/pubs1.asp to reserve your copy today.

 

Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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