Advanced Technology Workshop on Thermal Management - Program and Registration Now Available ^
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/thermal. The hotel cut-off and early registration deadline are August 24, 2007.
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.
View the complete Advance Program and register on-line at www.imaps.org/thermal.
Advanced Technology Workshop on Integrated/Embedded Passives - Program and Registration Now Available ^
Integrated/Embedded Passives 2007 is being held November 15-16, at the San Jose Convention/Fairmont Hotel in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/passives. The hotel cut-off and early registration deadline are October 10, 2007.
The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered. Passive technologies are essential for implementing smaller, cheaper and faster products.
This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace. Sessions will address the following topical areas: Materials, Processing, Applications, Design and Market Trends
View the complete Advance Program and register on-line at www.imaps.org/passives.
ICEPT 2007 Begins Nex Week - 8th International Conference on Electronics Packaging Technology - August 14th – 17th, 2007, Shanghai, China ^
Since 1994, ICEPT has been held for seven times in Beijing, Shanghai and Shenzhen of China, respectively. Since 2005 ICEPT has been held once a year due to rapid development of electronics packaging. As the only international electronics packaging technology conference organized and supported by authoritative academic organizations and leading industries, each ICEPT has attracted hundreds of participants from colleges, research institutes, packaging testing manufacturers, packaging testing equipment factories, packaging materials factories including distinguished experts, scholars and enterprises. The conference highly focuses on semiconductor packaging design, semiconductor packaging manufacturing, semiconductor packaging testing, LED packaging, MEMS packaging, system packaging and assembly, etc. The conference, which is domestically the highest-level and the most large-scale event for electronics packaging and testing technology, has become an important communication platform for advanced packaging technology. The 8th ICEPT will be held from August 14-17, 2007, in Shanghai, which is the biggest base of the Chinese microelectronics industry and the financial hub. We sincerely invite your participation.
1）Registration time for training course: In the afternoon of August 13th, 2007 (Monday)
2）Training course-attending time: August 14th, 2007 (Tuesday)
1）Conference-attending registration: August 14th, 2007 (Tuesday)
2）Conference time: August 15th-17th, 2007 (Wednesday to Friday)
Sofitel Jin Jiang Oriental Hotel, 889 South Yang Gao Road, Pudong New Area, Shanghai, China
Conference Website: http://www.icept.org
Conference Scale: 400-500 participants
- Advanced Packaging & System Packaging: BGA, CSP, flip chip, WLP, nano-packaging, Cu/low-K packaging, 3D packaging, SiP and other advanced packaging and integration technologies.
- High Density Substrate & SMT: HDI, PCB, high performance multi-layer substrate, embedded substrate, micro via, microjoin, stencil print, reflow, and other novel assembly technologies that improve substrate density and performance.
- Packaging Design & Modeling: novel designs for various packaging/assembly, modeling, simulation and characterization solutions for electrical, thermal, optical & mechanical properties, multi-function & multi-scale modeling, simulation, validation methods and software technologies.
- Packaging Materials & Processes: interconnection and encapsulation materials including bonding wires, solder balls, solder pastes, conductive pastes, underfillings, plastic packaging materials, adhesives, thin-films, dielectric materials, substrate materials, frame materials, green electronic materials and other novel materials that enhance the packaging properties and reduce the cost，and various packaging and assembly processes.
- Advanced Manufacturing Technology: photolithography, laser processing, novel packaging/assembly technologies, advanced methods/softwares for modeling and monitoring of process effectiveness and cost analysis, and related manufacturing equipments.
- Emerging Technologies: sensors, actuators, MEMS, NEMS and MOEMS, optoelectronics & LED packaging, LCD, solid state lighting, passive and RF devices, power & HV devices, nanodevices based on nanowire, nanotubes and polymers, etc.
- Quality & Reliability: Quality monitoring and evaluation for packaging/assembly, advanced methods/technologies/tools for rapid reliability data collection and analysis system, reliability modeling & prediction, reliability issues in emerging technologies, testing equipments for quality control and reliability.
Symposium, short course, academic communication, exhibition of new product & technology
Who Should Attend
Attendees of this conference in the past have been engineers, research scientists, equipment and material vendors, representatives from various packaging companies of packaging technology for IC, MEMS, Optoelectronics, LEDs, LCD, Magnetic Head, Sensors and PCB packaging and assembly. Due to the booming growth of the electronic/optoelectronic and emerging MEMS packaging industry in mainland China (including more than 300 IC packaging companies and several hundred LED packaging companies), this conference will provide a perfect platform for the exchange of information, research and industry development, and recruitment of young engineers.
For more information, please go to our website of http://www.icept.org.
Arizona Chapter Lunch Meeting on The Role of Intermetallic Compound Formation on Package Reliability ^
Please join the IMAPS Arizona Chapter for a discussion on: The Role of Intermetallic Compound Formation on Package Reliability. Lead free solders including SAC and AuSn will be presented by Jonathan Harris, PhD, President of CMC Interconnect Technologies.
||Thursday, 23 Aug 2007
||Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
||Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
||Luncheon and presentation - $10.00
Vendor display tables available for $15.00
Special - No Charge for pre-registered attendees. (Vendor Tables available for $15)
RSVP by 20 Aug 2007 on-line at http://www.imaps.org/chapters/freepass.asp or by email - firstname.lastname@example.org.
French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007 ^
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.
As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.
The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.
In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations.
In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”.
In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers).
Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.
The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93
Or visit the chapter web site, www.imapsfrance.org.
MicroTech 2008 Call for Papers ^
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK. Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.
The special topic of MicroTech 2008 is “Chip to System … Interconnect & Packaging ”. IMAPS UK are looking for visionary technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.
This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs. The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.
We are inviting Key technical papers covering:
- Emerging Applications
- Future Interconnections
- Developing Technologies
- System Integration
- Advanced Substrates
- Nano-Tech Integration
Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.
Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB.
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582