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December 5, 2007

AI Technology

   IMAPS EVENTS
Button Deadline Extended Until December 14 - International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) (read more...)

Button Abstracts Still Being Accepted for the International Conference and Tabletop Exhibition on Alternative Energy (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet San Diego Chapter: Making a Difference (read more...)

Bullet This Thursday, December 6- Florida Chapter Dinner Meeting with Presentation on Origami Packaging - Novel Printed Antenna Technology for Ad-hoc Sensor Applications (read more...)

Bullet Third European ATW on Micropackaging and Thermal Management, January 30-31, 2008 La Rochelle, France (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 - Abstracts Due December 25, 2007 (read more...)

   PRODUCTS AND PUBLICATIONS
Integrated/Embedded Passives 2007 Workshop CD Now Available (read more...)

IMAPS 2007 Proceedings Now Available (read more...)

IMAPS Events (view full Web Calendar)

Deadline Extended Until December 14 - International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008)    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico. HiTEC 2008 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2008 will be the forum for presenting leading high temperature electronics research results and applications requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers are being sought from, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

TO SUBMIT AN ABSTRACT:
Those wishing to present a paper at the HiTEC 2008 Conference must submit a 200-300 word abstract electronically by December 14, 2007, using the On-Line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on April 4, 2008.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Abstracts Still Being Accepted for the International Conference and Tabletop Exhibition on Alternative Energy    ^ Top
The Alternative Energy Conference will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, April 8-10, 2008. This conference is a continuation of last years first Alternative Energy Conference and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

Solar - Photovoltaics
Fuel Cells
Geothermal
BioFuels
Batteries and Hybrids
Wind
Other Approaches

Thermal and Power Management
Inverter Materials and Design
Grid and Storage Approaches
Design for Efficiency

Materials & Reliability
Qualification Approaches
Environmental Regulations
Government/State Policies and Incentives

Those wishing to present a paper at the Energy Conference, please submit a 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the energy field, application area, design, and process/material, the submission section will aid in grouping the work within these four areas.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on March 7, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Chapter Activities (events listed in chronological order)

San Diego Chapter : Making A Difference   ^ Top
Please Join the San Diego Chapters in assisting our members who were affected by the recent San Diego Fires by contributing to our SD Chapters Fire Relief Project. All contributions are 100% Tax deductible and will be disbursed in FULL. The funds will be sent directly to those Members (Current Members [Documented] of the San Diego Chapters as of 11/1/07) who incurred some loss directly related to the fires. You can contribute to the overall fund or specifically request an individual/s to which you would like your contribution to be steered.

Please join some of our initial contributors:

- Torrey Hills Technologies, LLC
- ACerS (American Ceramic Society) SD Section
- IMAPS SD Chapters
- Carl Edwards Family
- David Strobel Family
- David Virissimo Family
- Wally Johnson Family
- Murat Goksel Family

We have thus far raised over $5,000.00 for this worthy project, and is growing fast.
Add your name to our list and please let us know if you are aware of a member who should be considered for contribution.

CONTACT:
Questions or Comments:
Bill Ishii  760-522-4000

SEND TO:
Torrey Hills Technologies, LLC
Attn: San Diego Fire Relief Program
10401 Roselle Street, Suite #205
San Diego, CA 92121

**Please send by December 14, 2007, in time for the holidays**

Thank you for your donation & support to this most worthy cause.

This Thursday, December 6 - Florida Chapter Dinner Meeting with Presentation on Origami Packaging - Novel Printed Antenna Technology for Ad-hoc Sensor Applications   ^ Top

Date: December 6, 2007
Schedule: 6-7 pm Social
7pm Dinner w/presentation following
Location:

Holiday Inn Select, Orlando Airport
5750 T.G. Lee Blvd
Orlando, FL
407-851-6400

Cost:

$25, dinner includes entrée, salad, coffee/tea, and dessert

Exhibits: We are offering tabletop space for suppliers with power for $150 each while spaces last. Set up is at 5pm with the event over by 9pm.
Contact:

Tim Davis
407.341.3359
tim@jdm-associates.com

Origami Packaging – Novel Printed Antenna Technology for Ad-hoc Sensor Applications

Presented By Sergio Melais, University of South Florida

Abstract:

The work presented in this paper introduces a 3-D antenna designed and fabricated on a flexible paper thin substrate for operation at 915MHz with a frequency bandwidth ranging from 902-928 MHz. The major innovative feature introduced in this work is the use of a deposition process for printing radiating elements over a 3-D structure. For this design, the antenna selected is a printed dipole due to its simplicity and radiation characteristics (omni-directional pattern). The 3-D substrate over which this dipole is printed is the tetrahedron (pyramid with a triangle as base), a geometrical polyhedron offering symmetry and an excellent candidacy to illustrate the new paper thin antenna structural integration.

The layout of the antenna consists of a dipole printed on two sides of the tetrahedron connected to a balanced-to-unbalanced line transition on a third side. The base of the tetrahedron serves as a ground plane for the microstrip feed (coax feed). Furthermore, an L-C-L matching network is integrated to enhance the impedance match coming from the parallel plate section to the microstrip section of the line.

The tetrahedron antenna is first designed and simulated (HFSS10) on a flat configuration. Next, its dimensions are optimized and folded into a tetrahedron. The simulation results have demonstrated that a good radiator has been achieved, conserving adequate dipole characteristics. Finally, a prototype of this tetrahedron is fabricated on paper, LCP, and etched copper LCP substrates. The results support a satisfactory operation for the design.

Third European ATW on Micropackaging and Thermal Management, January 30-31, 2008 La Rochelle, France    ^ Top
The Third European ATW on Micropackaging and Thermal Management will be held, January 29-31, 2008 in La Rochelle on the French Atlantic coast. The venue for this workshop will be the Mercure Vieux Port Sud Hotel, Qual Louis Prunier, 17000 La Rochelle, France. You can book directly with the hotel at:
Tel : 33 (0) 5 46 50 61 50; Fax : 33 (0) 5 46 41 24 31; or Email : H0569@accor.com.

The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop program is now available on-line. Visit www.imapsfrance.org for more information.

Early Registration ends January 15, 2008
Final Registration ends on January 25, 2008

Registration Fees:
IMAPS MEMBER 650 €*VAT -- Before January 15
IMAPS MEMBER 750 €*VAT -- After January 15
IMAPS NON MEMBER 750 €* VAT -- Before January 15
IMAPS NON MEMBER 850 €*VAT -- After January 15
SPEAKERS/CHAIRS/TECHNICAL COMMITTEE 480 €* VAT
STUDENTS 100 € VAT (lunch excluded, no hotel)

*These prices include: Hotel for 2 nights (arrival on Tuesday), lunches and dinners for 2 days

Like it was done for the second issue, the ATW will be open to tabletop exhibits, strictly limited to organisations involved in the field of thermal management. Tabletops are limited to the first 20 participants on a first-come-first-serve basis. The tabletop reservation fees are 300 € VAT (19,60%) - an invoice will be sent. For foreign companies, VAT will not be charged. Price without VAT is 250,84 €.

As usual, the workshop is organized, at hotel “Mercure Oceanide”, on a global fees basis for registration, hotel and meals.

Visit www.imapsfrance.org for more information.

Interested to attend or exhibit?

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

International Conference on Electronics Packaging (ICEP) 2008 - Abstracts Due December 25, 2007    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Papers are being accepted in the following topical areas:
Packaging, Substrates/Materials, Design/Evaluation/Simulation, Manufacturing/Process, Interconnection, Optoelectronics, Nano Technologies, MEMS, Organic Semiconductors, Trend/Education/Environmental, and Application. Other subject matter relating to electronics packaging will also be considered.

Abstract and Paper Submission:
300 words abstract submission to the secretariat by e-mail or fax by December 25, 2007. Abstract acceptance is informed by the middle of January 2008. Formal paper manuscript should be sent by March 31, 2008.

Registration Fee:
Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:
General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/


Products and Publications

Integrated/Embedded Passives 2007 Workshop CD Now Available    ^ Top
The 2007 Advanced Technology Workshop on Integrated/Embedded Passives was held November 15-16, 2007, at the McEnery Convention Center and Fairmont Hotel in San Jose, CA. If you were not able to attend this event, you can now purchase the technical presentations cd-rom on-line.

Visit http://www.imaps.org/registration/pubs1.asp to purchase your copy today. You can also visit www.imaps.org/passives to view the technical program.

IMAPS 2007 Proceedings Now Available    ^ Top
IMAPS 40th International Symposium on Microelectronics (IMAPS 2007) was held November 11-15, 2007, at the McEnery Convention Center in San Jose, CA. The symposium was a great success featuring 14 professional development courses, 30 sessions in 6 tracks, more than 200 papers, three world-renown keynote speakers, and much more. If you were not able to attend this event, you can now purchase the proceedings on-line.

Supplies are very limited for the proceedings book (print edition). CD-Rom copies are not limited. Visit http://www.imaps.org/registration/pubs1.asp to purchase your copy today. You can also visit www.imaps40th.org to view the technical program.

 

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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