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February 13, 2007

Button Global Business Council's Spring 2007 Program (read more...)

Button Device Packaging Conference Hotel/Registration/Exhibit Deadlines Extended Until This Friday, February 16 (read more...)

Button The 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) in Two Weeks (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet New England Chapter Technical Meeting – Next Tuesday, February 20, 2007 (read more...)

Bullet Tri-Valley Chapter Dinner Meeting Next Tuesday Featuring Presentation by IMAPS President-Elect, Steve Adamson, Asymtek, and Two Technical Presentations on Implantable Medical Devices (read more...)

Bullet San Diego Chapter February 27 Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions (read more...)

Bullet United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet Metro Chapter to Offer Two Courses This May - Hybrid Pre Cap Visual Inspection; and Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules (read more...)

Bullet French Chapter SIP-SOC Technical Meeting, CAEN, May 24 (read more...)

SOCIETY AWARDS 2007 (read more...)

IMAPS Events (view full Web Calendar)

Global Business Council's Spring 2007 Program   ^ Top
The Global Business Council (GBC) is holding its Spring 2007 Conference in sunny Scottsdale, AZ, on March 18 & 19, 2007. Learn what is in store for our industries in the near future. GBC has analysts and forecasters representing Prismark Partners, DuPont Electronic Technologies, Amkor Technologies, IC Insights and Medtronic. For complete Conference information, visit and register On-Line. The early registration deadline and hotel cut-off has been extended until this Friday, March 16, 2007.

This GBC Conference immediately precedes the IMAPS Device Packaging Conference, at the same location. Invited speakers from industry leaders and well-known market research companies, will share with you where they see the opportunities and challenges in the microelectronics markets. Several networking events are planned to allow full interaction with your industry peers.

Device Packaging Conference Hotel/Registration/Exhibit Deadlines Extended Until This Friday, February 16    ^ Top
3rd International Conference and Exhibition on Device Packaging

Doubletree Hotel
Scottsdale, Arizona USA
March 19-22, 2007

The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topics areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations.

The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.

The 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) in Two Weeks   ^ Top
The 2nd Advanced Technology Workshop (ATW) on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments will be held February 27 through March 1, 2007, at the Embassy Suites Hotel in Arcadia, California (near Pasadena). For more information about Extreme Cold, to view the technical program and abstracts or to register on-line, visit

The objective of this Advanced Technology Workshop (ATW) is to have a unique technical forum that brings together industrialists, scientists, engineers, space agencies and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold to hot temperature environments. Studies in extreme thermal and radiation environments are extended beyond nominal operating temperature regimes and radiation levels. Validation of the electronic packages assembled with various electronic parts over a wide temperature range to infuse into future space missions is of significant value for space applications. The other goal of this ATW is to expedite the infusion of cutting-edge technology into present and future NASA projects, missions, and science instruments. This ATW is partially providing the mechanism to create an international network of electronics developers and systems designers by bringing together representatives from academia and the space agencies. This Workshop covers active and passive devices, circuits/systems, advanced packaging, instruments, and reliability under extreme cold to hot temperatures and radiation environments. This is the second workshop in a series that is being organized in the USA since there is a significant interest for NASA and other space agencies in missions to Mars, the Moon, Deep Space Missions and beyond.

Chapter Activities (events listed in chronological order)

New England Chapter Technical Meeting – Next Tuesday, February 20 2007    ^ Top

LOCATION: Marlborough Marriott
(Formerly the Radisson)
Marlborough, MA 508-480-0015
Route 495 to Exit 24B. Take first right off exit. 75 Felton Street (just before Shell station),
(Times are approximate)
5:30 p.m. Registration, Socializing, Networking & Cash Bar
6:30 p.m. Dinner
7:30 p.m. Presentation by Joe Belmonte - Speedline Technologies - Franklin, MA

Can High Volume Electronics Manufacturing Technology be used in a High Volume Fuel Cell Manufacturing Process?

During the last several years there has been and continues to be an enormous investment by both governments and industry in the development and manufacture of fuel cells. There are several technical challenges to developing cost effective fuel cells. One of the key areas to reduce fuel cell cost is the manufacturing cost. At Speedline Technologies, we have completed a fuel cell manufacturing process development project using electronics manufacturing industry screen-printing and reflow soldering technologies. Our research indicated that high volume electronics manufacturing technology could be used to develop and implement high volume fuel cell manufacturing. This presentation will focus on the results obtained from this study.

Joe Belmonte is the Advanced Process Development Manager at Speedline Technologies focusing on state of the art process development and training program. Joe has over 30 years of electronic process development experience and holds leadership position at various industry groups, such as SMTA, iNEMI, and IPC.

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.




Retired Member


Meeting Only











$ 30.00

$ 25.00

$ 20.00

$ 5.00


Dinner Choices: 1) Baked Boston Scrod with Cracker Topping, 2) Chicken Marsala


Pre-registration must be received by Monday February 19th! Send Registrations to:
Susan Munyon
96 Grant Way
Lancaster, MA 01523-3112
978-466-1877 phone/fax

Printable PDF Meeting Notice

SEND NO MONEY! But BRING checks payable to “IMAPS New England” At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, February 19th or the Chapter is billed for your meal.

Tri-Valley Chapter Dinner Meeting Next Tuesday Featuring Presentation by IMAPS President-Elect, Steve Adamson, Asymtek, and Two Technical Presentations on Implantable Medical Devices    ^ Top
Tuesday February 20, 2007, the Tri-Valley Chapter of IMAPS will hold a dinner meeting at the Holiday Inn in Woodland Hills, CA. Steve Adamson, Market Manager, Asymtek, and IMAPS President Elect for 2007, will be introduced and address the meeting. The meeting will start at 6:00 PM. This is a special night with speakers discussing their areas of the implantable medical electronic devices.

Mr. Paul Meadows, Senior Principal  Engineer at Advanced Bionics, will speak about the development and packaging of spinal cord and nerve stimulator medical implants that have made his company a leader in this field.

Dr. Nick Talbot, Director of Engineering, and Boozarjomehr (Boozer) Faraji, Microelectronics Reliability and Packaging Principal Engineer of the Second Sight company, will speak about their product developments in the field of sight restoration.

The meeting will commence with dinner at 6:00 PM and end at 9:30 PM

Members $20     
Students $10    
Non-Members $30                  

Send checks to
Tri-Valley IMAPS
21146 Ventura Blvd. S. 202,
Woodland Hills, CA 91364

Meal Choice:     Chicken      or          Beef     
*******Please select with your reservation*******

No Host Bar at 6:00 PM Dinner 6:30

The Holiday Inn is between Canoga and DeSoto Avenues on Ventura Blvd. just south of the 101 Frwy in Woodland Hills. Ph: 818 883-6110

Please let us know ASAP, the room is adequate but if the response is good a larger room is available at this time. So please don't wait to make a reservation this is going to be an interesting evening.

Email to: Larry Driscoll at: or call 818 704-9087 to reserve a place. Guests are welcome.

San Diego Chapter February 27 Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions    ^ Top
The San Diego Chapter of IMAPS invites you to attend its February 27 Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner talk by Elizabeth Kolawa of the Jet Propulsion Laboratory, will be on electronics in extreme environments of NASA missions.

Social hour is at 5:30 p.m., with dinner at 6:30 and the talk at 7:15. The cost is $7(RSVP’d Students), $15(RSVP’d Members) or $20(Others). For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or

During the next 20 years, NASA is challenged to develop the necessary technologies to support missions to extremely diverse environments. In one extreme, Venus Surface Exploration missions require systems that are able to survive and operate in high temperature (486 C) and high pressure (90 bar) environment. Survivability in extreme high temperatures and high pressures is also required for deep atmospheric multi-probes to Giant planets. On the other extreme, Comet Nucleus Sample Return, Titan, Europa and Moon exploration will require systems able to survive in extremely cold environments in the -140 to –230 C temperature range. In addition, Europa mission presents a challenge of surviving in extremely cold temperatures (-160 C) and high radiation environment. Missions to Mars present the challenge of surviving extreme temperature cycling (-120 to +20 C).

Challenges for development of integrated circuits for these robotic systems deal with the reliable operation of these systems under extreme planetary environments. These challenges are compounded by a complementary set of packaging and assembly issues that address the reliability of the system from the mechanical point of view. Without exception, integrated electronics developed for space systems will have to use existing commercial device and VLSI manufacturing technologies. Because of the severe difference between the extreme environment of the solar system planets and earth, IC designers of space systems have to examine the performance of all the devices in the extreme environment conditions and define a new set of design rules and models that predicts the performance and life cycle of these technologies.

Elizabeth Kolawa has about twenty years of technical experience in the research and development of advanced electronic devices, electronic packaging, thin film materials, miniaturization and integration of electronic systems and sensor technologies. She is currently focused on the development of materials and electronics for operation and survivability in extreme environments of NASA planetary missions. Three years ago, together with her co-workers, she started Technologies for Extreme Environments Consortium that includes 11 universities, industrial members and FFRDCs. The goal of the consortium is to coordinate and focus technology development in the area of low, high, and radiation tolerant electronics and packaging toward NASA needs. For the last four years she is also leading the development of integrated electronics and packaging technologies that are able to survive in the extreme environment of Mars. She is an author of over 130 papers and has ten patents.

Elizabeth Kolawa is presently a Manager of Extreme Environments and Space Avionics Technology Office in the Space Exploration Technology Program at the Jet Propulsion Laboratory.

United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007    ^ Top
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.

Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.

Additional speakers on the panel will be Chris Bailey from the University of Greenwich; Dr. Kathryn Walsh, Director of the Electronics Enabled Products, KTN; Mike Trenchard, from the Components Obsolescence Group; and Aubrey Dunford from AFDEC.

David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."

Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an  invaluable contribution in bringing this issue to the forefront of the industry ."

MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.

For further information, or if you would like to attend the event, please contact:
Sylvia Outteridge
+44 (0)1522 575 212

International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IEEE CPMT Society Japan

Supported by

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology, Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: or

Metro Chapter to Offer Two Courses This May - Hybrid Pre Cap Visual Inspection; and Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules    ^ Top
The Metro Chapter of IMAPS is pleased to offer the following courses.

Hybrid Pre Cap Visual Inspection (1 Day)


May 21, 2007

Time: 8:00 AM-4:30 PM

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500


$350.00 - 1-5 attendees
$300.00 - 5+ attendees

Includes Continental Breakfast and Lunch. Space is limited so reserve early


For reservations or additional information, Contact:
Steve Lehnert
(631) 345-3100

Please make checks payable to Metro IMAPS

Mail To:
Steve Lehnert
C/O Modular Devices
One Roned Road
Shirley, NY 11967

Hybrids/MCMs/RF Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec documents in conjunction with industry accepted best commercial practices.  Over 200 color photographs of actual production defects are reviewed and discussed in detail.  The students are exposed to a variety of defects and how the defects relate to the materials and process flow.  Inspection checklists are used to simply the criteria and focus on the major problem areas. 

  • Understand what to look for as part of a pre cap visual inspection
  • Learn how to interpret and apply traditional Mil Spec visual inspection guidelines

The course is intended for quality assurance personnel, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.

Course Outline:

Hybrid  Materials and Processing Overview
  • Review of Terminology

General Inspection Guidelines and Procedures

Visual Inspection Requirements Flowdown

  • MIL-PRF-38534
  • MIL-STD-883    

Pre Cap Visual Inspection Criteria

  • Defects related to wafer fab, saw and break, probe test etc.
  • Thick Film/Thin film substrate defects e.g cracks, chipouts
  • Laser Trim defects
  • Epoxy die attach, fillet criteria, typical problems encountered
  • Eutectic solder attach
  • Epoxy attach of chip capacitors and chip resistors                    
  • Wirebond defects (e.g.  Excessive squash out, heel cracks, misplaced bonds etc.)

Foreign Material Identification and Contamination Control

Rework and Repair Limitations

External Visual Inspection

Summary and Course Critique

Process Certification and Defect Recognition - Hybrids, Microcircuits and RF/MMIC Modules


May 22-25, 2007

Time: 8:00 AM-4:30 PM - May 22-24
8:00 AM-1:00 PM - May 25

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500


$1750.00 - 1-5 attendees
$1500.00 - 5+ attendees

Includes Continental Breakfast, Lunch and Comprehensive Student Workbook (250 pages). Space is limited so reserve early


For reservations or additional information, Contact:
Steve Lehnert
(631) 345-3100

Please make checks payable to Metro IMAPS

Mail To:
Steve Lehnert
C/O Modular Devices
One Roned Road
Shirley, NY 11967

How You Will Benefit:

After completing this course you will:

  • Advance your understanding of the basic materials and processing steps used in the assembly of Hybrids, Microcircuits and RF/MMIC Modules.
  • Know what you’re looking at and what constitutes a “reject” in the production flow along with the technical rationale to support the decision.
  • Be able to explain to others visual defects that result from the basic manufacturing processes: i.e. wirebond, component attach, thick and thin film processing etc.
  • Learn how to interpret and apply the visual inspection criteria contained in the "Workmanship Standards for Hybrids, Microcircuits and RF/MMIC Modules” 2002 Edition*

Who Should Attend:

This course is a must for process engineers, design engineers, manufacturing engineers and senior technicians. Inspectors and experienced operators looking to broaden their knowledge base and understanding of visual inspection criteria would also benefit.  The course is also suited for newly assigned engineers and QA personnel looking to learn the basic terminology and key concepts vital to the manufacturing floor. Trained instructors with years of industry experience deliver the material in a straightforward and easy to understand format.

About this Course:

Most companies struggle to introduce new lines and waste countless manhours and resources resolving old problems on the manufacturing floor. Much of this waste is directly tied to the knowledge and training level of the responsible individuals.  This course is designed teach the fundamental materials and processes used in microelectronics manufacturing and develop an understanding of the relevant visual inspection criteria.  “Knowing what to do” is the first step towards lower costs, improved quality and faster throughput. Multimedia powerpoint presentations and video clips introduce the basics in a classroom setting.

Seminar Instructor:

Thomas J Green has over twenty five years of experience in the microelectronics industry at Lockheed Martin Astro Space and USAF Rome Laboratories and as an Adjunct Professor at the National Training Center for Microelectronics.  During that time period he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits (Hybrids, MCMs and RF modules) for military and commercial communication satellites. Tom has demonstrated expertise in wirebonding, component attach, and seam sealing processes. He has conducted and analyzed numerous statistically designed experiments, which increased first past yield, reduced costs and improved product quality. At Rome Labs he worked as a senior reliability engineer and analyzed component failures from AF avionic equipment along with providing technical support for a variety of Mil specs and standards (e.g. MIL-PRF-38534 and MIL-STD-883). Tom is an active member of the IMAPS (International Microelectronics and Packaging Society) at both the regional and national levels and serves on the IMAPS National Technical Program Committee. Tom has a Masters degree in Industrial Engineering and a B.S. in Metallurgy and Material Science from Lehigh University.  He's published numerous technical papers and in recent years has completed many successful in plant consulting projects.

Course Outline:


Introduction to Manufacturing Processes

  • Terminology and product definitions
  • Hybrids…MCMs…RF/MMIC Modules

Manufacturing Assembly Process Overview

  • Basic manufacturing process flows

Visual Inspection Source Requirements

Semiconductor Processing Overview

GaAs MMIC wafer Fab overview

  • Wafer saw and probing

Foreign material identification and control

  • What is acceptable?

Cleanroom Requirements and Industry Protocols

Commercial vs Military Visual Inspection Requirements

Incoming High Power wafer/chip inspection

Workmanship Standards* Semiconductor Fab related defects (Incoming Visual Inspection)

High Powered Inspection

  • Monolithic silicon die
  • Air bridges, mask defects, voids, metal defects
  • Probe defects, scribing defects,  edge cracks and chipouts

Thick Film Processes  

  • Substrate fabrication and materials overview
  • Screen printing machine variables and controls

The drying and firing process

  • Thickness measuring techniques
  • Cofired ceramics LTCC

Thin Film Processes

  • Sputtering vs vapor deposition
  • Photolithography, coat and etch

Plating operations

  • Electrolytic vs   electroless plating

Laser trimming processes

  • Thick and thin film resistors

Review of Workmanship Standards*Substrate Related Defects

  • Cracks and Chip outs
  • Scratches, voids and other defects
  • Defects related to laser trimming
  • Plating defects and metal lift

Processing fundamentals for Component Attach           

  • Automated handling and assembly of bare die

Material properties overview

Fluid Dispensing

  • Critical processing parameters


Die and substrate attach

Solder attach of GaAs chips

Overview of Common Cleaning Processes

  • Wet chemicals, Plasma cleaning

Review of Workmanship Standards* related to component attach

  • Looking for the proper fillet
  • Component to pad alignment issues
  • Epoxy bleed and runout
  • Flux contamination
  • Excessive solder
  • F/M resulting from the cure process and their effect on wirebonding

Wirebonding Process Overview

  • Ultrasonic/thermosonic bonding
  • Thermocompression bonding
  • Ribbon bonding

Material properties of bonding wire

Wire bonding tools

Factor that affect the wirebond process

Wire bonding reliability and yield problems

Review of Workmanship Standards* Interconnects (Pre Cap Visual Inspection)

  • Overdeformed bonds
  • Underdeformed bonds
  • Bond placement issues

Intermetallic growth and what to look for

  • Defective bond pad metal and platings
  • Misplaced bonds
  • Lifted bonds

Hermetic Packaging Process Overview

  • Seam sealing, Laser welding, Solder sealing
  • Gross and fine leak testing
  • Optical Leak testing techniques

Review of Workmanship Standards* (External Visual Inspection)

  • Cracked seals
  • Poor  welds    
  • Plastic delamination
  • Marking Defects

Course Summary

Student Examination, Test and Review

French Chapter SIP-SOC Technical Meeting, CAEN, May 24    ^ Top
For its 2006 regional meeting, IMAPS France organised, last May in Grenoble, an international workshop on the packaging solutions for system integration. The compared benefits and limitations of System In a Package (SIP) and System On a Chip (SOC) were emphasised and the main semiconductor manufacturers in Europe presented roadmaps for the implementation of their preferred solutions.

The success of the 2006 event incited IMAPS France to keep the same topic, for the 2007 meeting, with an application oriented approach. The workshop will be held, on May 24, in Caen in the frame of a partnership with NXP the former semiconductor branch of Philips.

After the registration of the participants, in the NXP facilities, our partners will present the company and their own SIP/SOC strategy. Then, several industrial actors will disclose their experience returns and the resulting impact on the development of new products, in different market areas including medical, automotive, smart card and wireless systems. They will explain as well how those technologies help to fit in with emerging social needs as assistance, security or identification.

In addition, demonstrations of CAD tools, a poster session and, in the afternoon, the visit of several laboratories or industrial sites will be proposed to the participants according to one’s preference.

For registration or information:

Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

Membership Tips

SOCIETY AWARDS 2007    ^ Top
Every year IMAPS members are asked to point out the Society’s members who have done such notable work that they deserve the distinction of one of our awards to publicly acknowledge their accomplishments.  We have many deserving members, who have given their time, energy, and expertise to ensure our industry has a robust future; you can make sure they are recognized by nominating them for one of our prestigious awards – but it must start with YOU!  The opportunity is here to let that special member know that you value their dedication and that his/her hard work has not gone unnoticed.  The Society Award nominations are now open.

The 2007 Awards Nominating Committee is actively seeking nominations for these awards: the Daniel D. Hughes, Jr. Memorial Award; the William D. Ashman Achievement Award; the John A. Wagnon Technical Achievement Award; the Outstanding Educator Award; the Sidney J. Stein International Award; the Corporate Recognition Award; and the Fellow of the Society Award.  The Lifetime Achievement Award is also an individual award, but will be awarded only occasionally when a deserving individual is identified and nominated.

Visit for details and to nominate that special member.


2nd ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
February 27-March 1, 2007
Arcadia, CA

Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics



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