The 2nd ATW on Extreme Cold (Reliability
of Advanced Electronic Packages and Devices in Extreme Cold
Environments) Begins Next Week ^
The 2nd Advanced Technology Workshop (ATW) on Reliability of Advanced Electronic
Packages and Devices in Extreme Cold Environments will be held February 27
through March 1, 2007, at the Embassy Suites Hotel in Arcadia, California (near
Pasadena). For more information
about Extreme Cold, to view the technical program and abstracts or to register on-line, visit www.imaps.org/extremecold. On-line registration closes this Friday at 10am Eastern. You will need to wait in line to register on-site in at the Embassy Suites after Friday.
Device Packaging Conference - Exhibit Space Has Sold Out, PDCs and Sessions are Filling Up Fast ^
3rd International Conference and Exhibition on Device Packaging
Scottsdale, Arizona USA
March 19-22, 2007
The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topics areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations.
The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The exhibit hall has sold out again this year.
The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.
Automotive Microelectronics and Packaging Workshop - Hotel and Registration Deadlines In Two Weeks ^
The Advanced Technology
Workshop on Automotive Packaging will be held April 9-12, 2007,
at the Hyatt Regency in Dearborn, Michigan. For more information on
this workshop and to register on-line, visit www.imaps.org/automotive. The early registration discount and hotel deadlines are March 9, 2007. Registration rates will go up after March 9th and IMAPS cannot guarantee room availability or pricing after that date.
Sessions will be held on:
Sensor Materials and Packaging | LTCC Substrates and Packaging | Power Substrates and Packaging | Interconnects and Materials | Packaging and Assembly
The Workshop will also feature the following Invited Presentations:
San Diego Chapter February 27 Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions ^
The San Diego Chapter of IMAPS invites you to attend its February 27 Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner talk by Elizabeth Kolawa of the Jet Propulsion Laboratory, will be on electronics in extreme environments of NASA missions.
Social hour is at 5:30 p.m., with dinner at 6:30 and the talk at 7:15. The cost is $7(RSVP’d Students), $15(RSVP’d Members) or $20(Others). For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or firstname.lastname@example.org.
During the next 20 years, NASA is challenged to develop the necessary technologies to support missions to extremely diverse environments. In one extreme, Venus Surface Exploration missions require systems that are able to survive and operate in high temperature (486 C) and high pressure (90 bar) environment. Survivability in extreme high temperatures and high pressures is also required for deep atmospheric multi-probes to Giant planets. On the other extreme, Comet Nucleus Sample Return, Titan, Europa and Moon exploration will require systems able to survive in extremely cold environments in the -140 to –230 C temperature range. In addition, Europa mission presents a challenge of surviving in extremely cold temperatures (-160 C) and high radiation environment. Missions to Mars present the challenge of surviving extreme temperature cycling (-120 to +20 C).
Challenges for development of integrated circuits for these robotic systems deal with the reliable operation of these systems under extreme planetary environments. These challenges are compounded by a complementary set of packaging and assembly issues that address the reliability of the system from the mechanical point of view. Without exception, integrated electronics developed for space systems will have to use existing commercial device and VLSI manufacturing technologies. Because of the severe difference between the extreme environment of the solar system planets and earth, IC designers of space systems have to examine the performance of all the devices in the extreme environment conditions and define a new set of design rules and models that predicts the performance and life cycle of these technologies.
Elizabeth Kolawa has about twenty years of technical experience in the research and development of advanced electronic devices, electronic packaging, thin film materials, miniaturization and integration of electronic systems and sensor technologies. She is currently focused on the development of materials and electronics for operation and survivability in extreme environments of NASA planetary missions. Three years ago, together with her co-workers, she started Technologies for Extreme Environments Consortium that includes 11 universities, industrial members and FFRDCs. The goal of the consortium is to coordinate and focus technology development in the area of low, high, and radiation tolerant electronics and packaging toward NASA needs. For the last four years she is also leading the development of integrated electronics and packaging technologies that are able to survive in the extreme environment of Mars. She is an author of over 130 papers and has ten patents.
Elizabeth Kolawa is presently a Manager of Extreme Environments and Space Avionics Technology Office in the Space Exploration Technology Program at the Jet Propulsion Laboratory.
United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 ^
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.
Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.
Additional speakers on the panel will be Chris Bailey from the University of Greenwich; Dr. Kathryn Walsh, Director of the Electronics Enabled Products, KTN; Mike Trenchard, from the Components Obsolescence Group; and Aubrey Dunford from AFDEC.
David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."
Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an invaluable contribution in bringing this issue to the forefront of the industry ."
MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.
For further information, or if you would like to attend the event, please contact:
+44 (0)1522 575 212
Metro Chapter Meeting March 28 Featuring Presentation on MEMS ^
March 28, 2007
Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
$30.00 if Pre-Registered by March 26, 2007
$35.00 After March 26, 2007
$35.00 if Pre-Registered by March 26, 2007
$40.00 After March 26, 2007
Phone: Steve Lehnert (631) 345-3100
Featuring a Technical Presentation on MEMS
Details to follow
International Conference on Electronics Packaging (ICEP) 2007 ^
IMAPS Japan / JIEP
IEEE CPMT Society Japan
April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan
Technical Topics for Conference Papers:
Advanced Packaging, Area Array Packages, Board EMC Evaluation,
Built-up Substrates, Bump Formation, Environmental Aspects,
EPD/EAD Technology, Flip Chip Technology, High Speed Board Design,
Interconnections, LCD Module Packaging, Lead Free Soldering,
Manufacturing, Materials, MCM, MEMS Packages, Nano Technology, Optoelectronics, Reliability and Testing, Stacked Structure,
Substrate/Interposer, System in Package, Thermal Management,
Thin Film Technologies, Trend and Education, Underfilling,
VLSI Packaging, Wafer Level Packaging, etc.
Speaker 40,000 yen. (Including Reception and Proceedings)
General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)
Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: email@example.com or firstname.lastname@example.org
French Chapter SIP-SOC Technical Meeting, CAEN, May 24 ^
For its 2006 regional meeting, IMAPS France organised, last May in Grenoble, an international workshop on the packaging solutions for system integration. The compared benefits and limitations of System In a Package (SIP) and System On a Chip (SOC) were emphasised and the main semiconductor manufacturers in Europe presented roadmaps for the implementation of their preferred solutions.
The success of the 2006 event incited IMAPS France to keep the same topic, for the 2007 meeting, with an application oriented approach. The workshop will be held, on May 24, in Caen in the frame of a partnership with NXP the former semiconductor branch of Philips.
After the registration of the participants, in the NXP facilities, our partners will present the company and their own SIP/SOC strategy. Then, several industrial actors will disclose their experience returns and the resulting impact on the development of new products, in different market areas including medical, automotive, smart card and wireless systems. They will explain as well how those technologies help to fit in with emerging social needs as assistance, security or identification.
In addition, demonstrations of CAD tools, a poster session and, in the afternoon, the visit of several laboratories or industrial sites will be proposed to the participants according to one’s preference.
For registration or information:
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93
Or visit the chapter web site, www.imapsfrance.org