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February 21, 2007

Button The 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) Begins Next Week (read more...)

Button Device Packaging Conference - Exhibit Space Has Sold Out, PDCs and Sessions are Filling Up Fast (read more...)

Button Automotive Microelectronics and Packaging Workshop - Hotel and Registration Deadlines In Two Weeks (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet San Diego Chapter February 27 Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions (read more...)

Bullet United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 (read more...)

Bullet Metro Chapter Meeting March 28 Featuring Presentation on MEMS (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet French Chapter SIP-SOC Technical Meeting, CAEN, May 24 (read more...)

SOCIETY AWARDS 2007 (read more...)

IMAPS Events (view full Web Calendar)

The 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) Begins Next Week   ^ Top
The 2nd Advanced Technology Workshop (ATW) on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments will be held February 27 through March 1, 2007, at the Embassy Suites Hotel in Arcadia, California (near Pasadena). For more information about Extreme Cold, to view the technical program and abstracts or to register on-line, visit On-line registration closes this Friday at 10am Eastern. You will need to wait in line to register on-site in at the Embassy Suites after Friday.

Device Packaging Conference - Exhibit Space Has Sold Out, PDCs and Sessions are Filling Up Fast    ^ Top
3rd International Conference and Exhibition on Device Packaging

Doubletree Hotel
Scottsdale, Arizona USA
March 19-22, 2007

The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topics areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations.

The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The exhibit hall has sold out again this year.

The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.

Automotive Microelectronics and Packaging Workshop - Hotel and Registration Deadlines In Two Weeks   ^ Top
The Advanced Technology Workshop on Automotive Packaging will be held April 9-12, 2007, at the Hyatt Regency in Dearborn, Michigan. For more information on this workshop and to register on-line, visit The early registration discount and hotel deadlines are March 9, 2007. Registration rates will go up after March 9th and IMAPS cannot guarantee room availability or pricing after that date.

Sessions will be held on:

Sensor Materials and Packaging | LTCC Substrates and Packaging | Power Substrates and Packaging | Interconnects and Materials | Packaging and Assembly

The Workshop will also feature the following Invited Presentations:

Tuesday Lunch Speaker - 1:00 pm - 2:00 pm
Title: Trends in Automotive Technology: Combined Active & Passive Safety (CAPS)
Speaker: Mr. Rob Lyons, Robert Bosch LLC

Tuesday's Lunch Sponsored by:

Tuesday Lunch Sponsor -- Robert Bosch, LLC

Tuesday Dinner Speaker - 7:00 pm - 8:00 pm
Title: Emerging Trends in Automotive Electronics
Speaker: Dr. Robert W. Schumacher, Delphi Electronics & Safety

Wednesday Lunch Speaker - 1:00 pm - 1:45 pm
Title: Robustness Validation - Why Are We Here and What Do We Get Out of It?
Speaker: Mr. Roger Rickey, R. E. Rickey and Associates

Chapter Activities (events listed in chronological order)

San Diego Chapter February 27 Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions    ^ Top
The San Diego Chapter of IMAPS invites you to attend its February 27 Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner talk by Elizabeth Kolawa of the Jet Propulsion Laboratory, will be on electronics in extreme environments of NASA missions.

Social hour is at 5:30 p.m., with dinner at 6:30 and the talk at 7:15. The cost is $7(RSVP’d Students), $15(RSVP’d Members) or $20(Others). For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or

During the next 20 years, NASA is challenged to develop the necessary technologies to support missions to extremely diverse environments. In one extreme, Venus Surface Exploration missions require systems that are able to survive and operate in high temperature (486 C) and high pressure (90 bar) environment. Survivability in extreme high temperatures and high pressures is also required for deep atmospheric multi-probes to Giant planets. On the other extreme, Comet Nucleus Sample Return, Titan, Europa and Moon exploration will require systems able to survive in extremely cold environments in the -140 to –230 C temperature range. In addition, Europa mission presents a challenge of surviving in extremely cold temperatures (-160 C) and high radiation environment. Missions to Mars present the challenge of surviving extreme temperature cycling (-120 to +20 C).

Challenges for development of integrated circuits for these robotic systems deal with the reliable operation of these systems under extreme planetary environments. These challenges are compounded by a complementary set of packaging and assembly issues that address the reliability of the system from the mechanical point of view. Without exception, integrated electronics developed for space systems will have to use existing commercial device and VLSI manufacturing technologies. Because of the severe difference between the extreme environment of the solar system planets and earth, IC designers of space systems have to examine the performance of all the devices in the extreme environment conditions and define a new set of design rules and models that predicts the performance and life cycle of these technologies.

Elizabeth Kolawa has about twenty years of technical experience in the research and development of advanced electronic devices, electronic packaging, thin film materials, miniaturization and integration of electronic systems and sensor technologies. She is currently focused on the development of materials and electronics for operation and survivability in extreme environments of NASA planetary missions. Three years ago, together with her co-workers, she started Technologies for Extreme Environments Consortium that includes 11 universities, industrial members and FFRDCs. The goal of the consortium is to coordinate and focus technology development in the area of low, high, and radiation tolerant electronics and packaging toward NASA needs. For the last four years she is also leading the development of integrated electronics and packaging technologies that are able to survive in the extreme environment of Mars. She is an author of over 130 papers and has ten patents.

Elizabeth Kolawa is presently a Manager of Extreme Environments and Space Avionics Technology Office in the Space Exploration Technology Program at the Jet Propulsion Laboratory.

United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007    ^ Top
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.

Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.

Additional speakers on the panel will be Chris Bailey from the University of Greenwich; Dr. Kathryn Walsh, Director of the Electronics Enabled Products, KTN; Mike Trenchard, from the Components Obsolescence Group; and Aubrey Dunford from AFDEC.

David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."

Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an  invaluable contribution in bringing this issue to the forefront of the industry ."

MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.

For further information, or if you would like to attend the event, please contact:
Sylvia Outteridge
+44 (0)1522 575 212

Metro Chapter Meeting March 28 Featuring Presentation on MEMS    ^ Top


March 28, 2007
Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM


Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500


$30.00 if Pre-Registered by March 26, 2007

$35.00 After March 26, 2007

$35.00 if Pre-Registered by March 26, 2007

$40.00 After March 26, 2007

Pre Registration:

Phone: Steve Lehnert  (631) 345-3100

Featuring a Technical Presentation on MEMS
Details to follow

International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IEEE CPMT Society Japan

Supported by

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology, Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: or

French Chapter SIP-SOC Technical Meeting, CAEN, May 24    ^ Top
For its 2006 regional meeting, IMAPS France organised, last May in Grenoble, an international workshop on the packaging solutions for system integration. The compared benefits and limitations of System In a Package (SIP) and System On a Chip (SOC) were emphasised and the main semiconductor manufacturers in Europe presented roadmaps for the implementation of their preferred solutions.

The success of the 2006 event incited IMAPS France to keep the same topic, for the 2007 meeting, with an application oriented approach. The workshop will be held, on May 24, in Caen in the frame of a partnership with NXP the former semiconductor branch of Philips.

After the registration of the participants, in the NXP facilities, our partners will present the company and their own SIP/SOC strategy. Then, several industrial actors will disclose their experience returns and the resulting impact on the development of new products, in different market areas including medical, automotive, smart card and wireless systems. They will explain as well how those technologies help to fit in with emerging social needs as assistance, security or identification.

In addition, demonstrations of CAD tools, a poster session and, in the afternoon, the visit of several laboratories or industrial sites will be proposed to the participants according to one’s preference.

For registration or information:

Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

Membership Tips

SOCIETY AWARDS 2007    ^ Top
Every year IMAPS members are asked to point out the Society’s members who have done such notable work that they deserve the distinction of one of our awards to publicly acknowledge their accomplishments.  We have many deserving members, who have given their time, energy, and expertise to ensure our industry has a robust future; you can make sure they are recognized by nominating them for one of our prestigious awards – but it must start with YOU!  The opportunity is here to let that special member know that you value their dedication and that his/her hard work has not gone unnoticed.  The Society Award nominations are now open.

The 2007 Awards Nominating Committee is actively seeking nominations for these awards: the Daniel D. Hughes, Jr. Memorial Award; the William D. Ashman Achievement Award; the John A. Wagnon Technical Achievement Award; the Outstanding Educator Award; the Sidney J. Stein International Award; the Corporate Recognition Award; and the Fellow of the Society Award.  The Lifetime Achievement Award is also an individual award, but will be awarded only occasionally when a deserving individual is identified and nominated.

Visit for details and to nominate that special member.


2nd ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
February 27-March 1, 2007
Arcadia, CA

Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics



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