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February 27, 2007

Button Global Business Council's Spring 2007 Conference Featuring Industry Experts and a Report from Wall Street (read more...)

Button Device Packaging Conference Professional Development Courses - Space is Limited (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Today -- San Diego Chapter Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions (read more...)

Bullet United Kingdom Chapter's Annual Conference, MicroTech 2007, Begins Next Week (read more...)

Bullet Indiana Chapter Tour of Diversified Systems and Dinner Meeting on March 8 (read more...)

Bullet Chicago/Milwaukee Chapter Meeting on Tuesday, March 20, Featuring Presentation on Fine Pitch Circuitry on Three Dimensional Substrates (read more...)

Bullet Metro Chapter Meeting March 28 Featuring Presentation on Static and Dynamic Characterization of MEMS using White Light Interferometric Microscopes (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet Garden State Chapter Spring Symposium on May 15 (read more...)

Bullet French Chapter SIP-SOC Technical Meeting, CAEN, May 24 (read more...)

SOCIETY AWARDS 2007 (read more...)

IMAPS Events (view full Web Calendar)

Global Business Council's Spring 2007 Conference Featuring Industry Experts and a Report from Wall Street   ^ Top
The Global Business Council’s Spring 2007 Conference will present industry experts discussing the state of the industry along with a report from Wall Street.

DuPont, Amkor, and Pacific Growth Equities are a few of the companies that have committed to present their experiences in today’s semiconductor market.

Please visit for full program details and to register to attend.

Device Packaging Conference Professional Development Courses - Space is Limited    ^ Top
3rd International Conference and Exhibition on Device Packaging

Doubletree Hotel
Scottsdale, Arizona USA
March 19-22, 2007

In addition to the keynote speakers, technical sessions, and vendor exhibition and technology showcase, the Device Packaging Conference will feature 6 state-of-the-art Professional Development Courses (PDCs).

Monday, March 19
Professional Development Courses (1/2 Day)
8:00 am - Noon
Area Array Microelectronics Package Reliability

Instructor: Amaneh Tasooji, Arizona State
Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts

Instructor: Thomas Green, TJ Green
Associates LLC
Advanced Thermal Management and Packaging Materials

Instructor: Carl Zweben, Advanced
Thermal Materials Consultant
Monday, March 19
Professional Development Courses (1/2 Day)
1:00 pm - 5:00 pm
Reliability Methodologies for Fiber Optic Components

Instructor: David Maack, JDS Uniphase
Fundamentals of Packaging of MEMS and Related Microsystems and Nanomanufacturing

Instructor: Ajay Malshe, University of
Drop Test Simulation and It’s Application to IC Package Design for Handheld Consumer Electronics

Instructor: Kinzy Jones, Jr., Design
Validation Technologies


Chapter Activities (events listed in chronological order)

Today -- San Diego Chapter Dinner Meeting Featuring Presentation on Electronics in Extreme Environments of NASA Missions    ^ Top
The San Diego Chapter of IMAPS invites you to attend its February 27 Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner talk by Elizabeth Kolawa of the Jet Propulsion Laboratory, will be on electronics in extreme environments of NASA missions.

Social hour is at 5:30 p.m., with dinner at 6:30 and the talk at 7:15. The cost is $7(RSVP’d Students), $15(RSVP’d Members) or $20(Others). For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or

During the next 20 years, NASA is challenged to develop the necessary technologies to support missions to extremely diverse environments. In one extreme, Venus Surface Exploration missions require systems that are able to survive and operate in high temperature (486 C) and high pressure (90 bar) environment. Survivability in extreme high temperatures and high pressures is also required for deep atmospheric multi-probes to Giant planets. On the other extreme, Comet Nucleus Sample Return, Titan, Europa and Moon exploration will require systems able to survive in extremely cold environments in the -140 to –230 C temperature range. In addition, Europa mission presents a challenge of surviving in extremely cold temperatures (-160 C) and high radiation environment. Missions to Mars present the challenge of surviving extreme temperature cycling (-120 to +20 C).

Challenges for development of integrated circuits for these robotic systems deal with the reliable operation of these systems under extreme planetary environments. These challenges are compounded by a complementary set of packaging and assembly issues that address the reliability of the system from the mechanical point of view. Without exception, integrated electronics developed for space systems will have to use existing commercial device and VLSI manufacturing technologies. Because of the severe difference between the extreme environment of the solar system planets and earth, IC designers of space systems have to examine the performance of all the devices in the extreme environment conditions and define a new set of design rules and models that predicts the performance and life cycle of these technologies.

Elizabeth Kolawa has about twenty years of technical experience in the research and development of advanced electronic devices, electronic packaging, thin film materials, miniaturization and integration of electronic systems and sensor technologies. She is currently focused on the development of materials and electronics for operation and survivability in extreme environments of NASA planetary missions. Three years ago, together with her co-workers, she started Technologies for Extreme Environments Consortium that includes 11 universities, industrial members and FFRDCs. The goal of the consortium is to coordinate and focus technology development in the area of low, high, and radiation tolerant electronics and packaging toward NASA needs. For the last four years she is also leading the development of integrated electronics and packaging technologies that are able to survive in the extreme environment of Mars. She is an author of over 130 papers and has ten patents.

Elizabeth Kolawa is presently a Manager of Extreme Environments and Space Avionics Technology Office in the Space Exploration Technology Program at the Jet Propulsion Laboratory.

United Kingdom Chapter's Annual Conference, MicroTech 2007, Begins Next Week    ^ Top
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.

Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.

Additional speakers on the panel will be Chris Bailey from the University of Greenwich; Dr. Kathryn Walsh, Director of the Electronics Enabled Products, KTN; Mike Trenchard, from the Components Obsolescence Group; and Aubrey Dunford from AFDEC.

David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."

Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an  invaluable contribution in bringing this issue to the forefront of the industry ."

MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.

For further information, or if you would like to attend the event, please contact:
Sylvia Outteridge
+44 (0)1522 575 212

Indiana Chapter Tour of Diversified Systems and Dinner Meeting on March 8    ^ Top
Diversified Systems

Indianapolis, IN
Date:  Thursday, March 8, 2007

Tour Starts 3:00

Dinner & Meeting to follow at
Diversified Systems’ Dining Room

Dinner 5:00
Meeting 6:00

Cost: IMAPS Members $10.00
Non-Members $12.00
Students $ 5.00
Reservations:  Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00pm on Tuesday, March 6, 2007. Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email
Tour By :  Nick Mates, Business Development Marketing Specialist

Diversified Systems - The industry leader. Fabrication and assembly of printed circuit boards all under one roof. Totally integrated. That means a lot. dsi has worked like no other company in the industry to build a streamlined, cost-effective operation.

dsi leads with production quality and speed. dsi has been providing high-quality bare printed circuit boards and contract electronic manufacturing support to our customers for over three decades.

Diversified Systems, inc. has been offering comprehensive engineering solutions for 30 years. Located in Indianapolis, Indiana dsi has emerged as one of the largest and most technically capable board shops in the heart of the Midwest, as well as a contract assembler with the very latest equipment and a competent staff.

dsi services the Automotive, Medical, Telecommunications, Military/Aerospace and General Industrial arenas. We provide everything from bare boards to fully-tested complete box build units. We supply many Fortune 500 companies using engineering innovations such as our Rapid Prototype Division (RPT), which provides production quality bare boards in as little as 24 hours and assembled boards in 3 to 5 days. We specialize in prototype volume (5 and 10 units) to medium volume quantities of 1000 to 2000 units per month.

Why dsi ?
All services under one roof - dsi's fabrication and assembly operations employ approximately 450 people in a state-of-the-art facility in Indianapolis, Indiana. This modern 250,000 square foot facility sits on a 25 acre campus.

Experienced - With 30 years of experience in board fabrication and assembly, dsi has the stability and know-how to meet all your electronic needs.

Dedicated team and engineering expertise - Dedicated project and account management and product support engineering resources (component, manufacturing, quality and test engineering staff) are assigned to specific projects and customers to provide the most comprehensive care for your project.

Quality - dsi has been recognized as a leader in the industries we serve because of our corporate commitment to holding specific quality registrations for these industries:

ISO 9001:2000 Registration FDA/GMP
ISO/TS 16949:2002 Registration MIL PRF-31032/1 QPL Listed
Automotive Underhood UL
TL 9000 Registration IPC

Technology - dsi continues to provide the very latest technology solutions to its customers. In both the PCB fabrication and assembly areas, dsi is continually investing in new equipment and trained staff. From a new flying probe ICT tester to the new alternative finishes line to state-of-the-art X-ray inspection equipment, dsi is investing in the future.

Chicago/Milwaukee Chapter Meeting on Tuesday, March 20, Featuring Presentation on Fine Pitch Circuitry on Three Dimensional Substrates    ^ Top
Location:  Silver Stallion Restaurant and Meeting Facility
1275 Lee Street
Des Plaines, IL 60018
Time:  Networking at 5:30
Dinner at 6:00
Presentation at 7:00
Investment: $20.00 Members
$25.00 Non-members
$10.00 Students/Retirees
$5.00 Displaced members
Reservations:  Mark Naretto at (815) 235-6935 or e-mail to:
Speaker:  Victor Zaderej - Molex
Title:  Fine Pitch Circuitry on Three Dimensional Substrates

Molded Interconnect Devices (MIDs) have been manufactured and used by many of industries most recognizable names such as IBM, Ford, Motorola, and Nokia for over twenty years. Applications have included electromagnetic filters, the internal elements of cell phones, various antennas, sensor housings, automotive switches and lighting devices.

To date, the circuitry on these applications has been rather simple because of limitations of the manufacturing techniques. Lines and spaces of 0.3 mm or larger have been common; but as the electronics industry matures, the need for finer pitch capability grows dramatically. The imaging systems used today are capable of creating lines and spaces down to 0.1 mm in very dense patterns.

With advances in laser and computer processing, it is now possible to do three-dimensional layout of circuitry as well as the application of patterns directly onto three-dimensional substrates with two process steps. The two steps are laser mark and plate, whereas in the past seven steps were required.

This manufacturing technique opens the door to the opinion of mounting fine pitch devises much as processors, sensors, ASICs, memory, etc. directly to three dimensional surfaces whereas in the past it was only possible to use larger scale devices.

Potential applications that could change the way electronic packaging is done include the ability to add components, antennas, and shielding directly on the inside surfaces of decorative or functional housings, sensors that can be fit into unusual locations, and the combining of mechanical and electrical functions into one highly integrated “backbone” for a variety of electronic devices.

These modern design tools and materials will be a driver in how future electromechanical packages will be designed. They will provide engineers with new ways to reduce the cost, weight, and size of the ever more complex products that consumers demand.

Speaker’s Biography:
Vic graduated from MIT with a SB and SM in Mechanical Engineering in 1982. After graduation he worked for IBM in Boca Raton Florida where he was the lead engineer on the PS/2 Model 50 computer, one of the first all plated plastic computers. In 1989, he began his career in the Molded Interconnect Device industry with Mintpac Technologies, a GE Plastics and Circuitwise joint venture. In 1999, Vic and a business partner started a company called 3Di which has since become part of Molex and which specializes in the area of selectively plating plastic devices. Vic has 29 patents in the MID industry.

Metro Chapter Meeting March 28 Featuring Presentation on Static and Dynamic Characterization of MEMS using White Light Interferometric Microscopes    ^ Top


March 28, 2007
Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM


Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500


$30.00 if Pre-Registered by March 26, 2007

$35.00 After March 26, 2007

$35.00 if Pre-Registered by March 26, 2007

$40.00 After March 26, 2007

There are a limited number of vendor tables available for this meeting at a cost of $200.00. Please contact Steve Lehnert if you are interested.

Pre Registration:

Phone: Steve Lehnert  (631) 345-3100

Featuring a Technical Presentation on Static and Dynamic Characterization of MEMS using White Light Interferometric Microscopes

Optical profiling (white light interferometry) has long been a primary metrology tool for 3D MEMS characterization from Research & Development to production in field such as Tribology, Data Storage and Semiconductor.  Surface roughness and step heights, either from etching or deposition have long been verified using Interferometric Microscopes.  This measurement technique has seen a very rapid increase in use in the field of MEMS over the past 5 years.

Initial implementation in the MEMS field was in the static realm where complete devices were measured in a single, large field of view.  The results of interest being feature heights, surface roughness, form and feature thickness.  White light interferometery became the perfect solution for rapid, accurate, 3D visualization of single and multiple devices. 

The addition of a stroboscopic light source enabled characterization of MEMS devices under actual operating conditions.  Developers could now investigate in-plane and out-of-plane movement for such psychical parameters as amplitude of movement, resonance frequency, switching time and surface distortion. 

Finally, the addition of a microscope objective (Through Transmissive Media- TTM) to observe packaged parts allowed investigation in sealed environments; such as, vacuum.  Thus, allowing static and dynamic measurement on devices that historically had proven difficult if not impossible previously.

White Light Interferometeric Microscopes have become an important the tool for 3D MEMS characterization.   The microscopes are simple to use, very repeatable and extremely flexible, thus allowing use in production environments.

Wayne Mozer has been employed at Veeco Instruments for the past 10 years.  Current responsibilities are as Product Specialist.  Wayne has a long experience in application development having being employed as an Application Scientist for more than 20 years.

International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IEEE CPMT Society Japan

Supported by

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology, Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: or

Garden State Chapter Spring Symposium on May 15    ^ Top

Date: May 15, 2007
Time: 1:00 P.M.

Lucent Technologies, Murray Hill, NJ
600 Mountain Avenue
Murray Hill, NJ 07974


Exhibit - $175.00 (before May 1, 2007 - $150.00)

Attendee - $20.00 member, $30.00 non-member

Prices include breaks and dinner reception

Session 1:  Flip Chip Packaging

Session 1 continues the trend for the Garden State IMAPS symposium by focusing on Flip Chip Packaging advances and techniques.  The Flip Chip industry is still expanding due to the increased demands for higher performance interconnects between the silicon die and the chip carrier.  Presentations will cover process enhancements, materials and reliability.

Session 2:  Advanced Packaging

Session 2 will explore some of the most advanced electronic packaging being developed in our industry.  Pressures for high performance, as well as integration, is driving some novel uses of materials and packaging techniques.  Presentations will cover embedded active and passive devices, high speed connectors, organic optical wave guides and various strictures, materials and process.

Visit for more information.

French Chapter SIP-SOC Technical Meeting, CAEN, May 24    ^ Top
For its 2006 regional meeting, IMAPS France organised, last May in Grenoble, an international workshop on the packaging solutions for system integration. The compared benefits and limitations of System In a Package (SIP) and System On a Chip (SOC) were emphasised and the main semiconductor manufacturers in Europe presented roadmaps for the implementation of their preferred solutions.

The success of the 2006 event incited IMAPS France to keep the same topic, for the 2007 meeting, with an application oriented approach. The workshop will be held, on May 24, in Caen in the frame of a partnership with NXP the former semiconductor branch of Philips.

After the registration of the participants, in the NXP facilities, our partners will present the company and their own SIP/SOC strategy. Then, several industrial actors will disclose their experience returns and the resulting impact on the development of new products, in different market areas including medical, automotive, smart card and wireless systems. They will explain as well how those technologies help to fit in with emerging social needs as assistance, security or identification.

In addition, demonstrations of CAD tools, a poster session and, in the afternoon, the visit of several laboratories or industrial sites will be proposed to the participants according to one’s preference.

For registration or information:

Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

Membership Tips

SOCIETY AWARDS 2007    ^ Top
Every year IMAPS members are asked to point out the Society’s members who have done such notable work that they deserve the distinction of one of our awards to publicly acknowledge their accomplishments.  We have many deserving members, who have given their time, energy, and expertise to ensure our industry has a robust future; you can make sure they are recognized by nominating them for one of our prestigious awards – but it must start with YOU!  The opportunity is here to let that special member know that you value their dedication and that his/her hard work has not gone unnoticed.  The Society Award nominations are now open.

The 2007 Awards Nominating Committee is actively seeking nominations for these awards: the Daniel D. Hughes, Jr. Memorial Award; the William D. Ashman Achievement Award; the John A. Wagnon Technical Achievement Award; the Outstanding Educator Award; the Sidney J. Stein International Award; the Corporate Recognition Award; and the Fellow of the Society Award.  The Lifetime Achievement Award is also an individual award, but will be awarded only occasionally when a deserving individual is identified and nominated.

Visit for details and to nominate that special member.


Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics



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