Global Business Council's Spring 2007 Program - Analysts, Forecasts and Industry Experts! ^
Business Council (GBC) is holding its Spring 2007 Conference in
sunny Scottsdale, AZ, on March 18 & 19, 2007. This GBC Conference
immediately precedes the IMAPS Device Packaging Conference, at the same
location. Invited speakers from
industry leaders and well-known market research companies, will share
with you where they see the opportunities and challenges in the microelectronics markets.
Several networking events are planned to allow
full interaction with your industry peers.
March 18, 2007
12:00 Noon – GBC Golf Tournament
(Bus leaves at 11:00 AM returns at 5:00 PM)
McCormick Ranch Golf Club -- Scottsdale, AZ
$150 per golfer
PM – Registration Opens
PM – Welcome
Reception and Dinner co-sponsored by The Microelectronics Foundation
6:30 PM - Keynote Address
Wall Street’s Perspective of the Growth in Semiconductors
Senior Research Analyst, Pacific Growth Equities
March 19, 2007
AM – Registration Opens
AM – Continental Breakfast
AM – Opening
Laurie Roth, GBC Co-Chair
State-of-the-art Technology Integration
Trends and 3-D Wafer-Level Integration
iNEMI Roadmaps - A Blueprint for Industry Collaboration
Chuck Richardson, iNEMI
9:45 AM - Break
DuPont’s Advanced Materials Pipeline for
the Device Packaging Industry
Phil Thomas, Global
Technology, DuPont Electronic Technologies
Application Specific Packaging Trends and
Lee Smith, Amkor Technologies
12:00 noon - 1:00 PM - Lunch
Semiconductor Industry Update
Brian Matas, Vice President, IC Insights
Mike Shields, Consultant
Automotive Electronics: Do you have any business being there?
Randy Frank, Randy Frank & Associates
3:15 PM - Break
Current and Future Microelectronics Packaging for
Implantable Medical Devices
Peter C. Tortorici, Ph.D.,
Medtronic Microelectronics Center
4:30 - Closing Remarks & Adjourn
For complete Conference information, visit http://www.imaps.org/programs/gbc07spring.htm and register
IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) - Program, Tabletop Exhibition and Registration ^
The 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) held 2006 in Denver was a great success and has established CICMT as the premier global forum on ceramic interconnect and ceramic microsystems. The International Microelectronics And Packaging Society (IMAPS) and the American Ceramic Society (ACerS) have jointly decided to sponsor the 3rd CICMT to further strengthen the advances in these two fast growing areas of ceramic technology. Visit www.cicmt.org for more information.
We thank our 22-member international advisory board, the Technical Co-Chairs, Michael Lanagan (Penn State University) and Andreas Roosen (University of Erlangen), session organizers / leaders, and the IMAPS and ACerS staff for their support and leadership in putting this program together.
This three day event will bring together experts from Asia, Europe, North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 60 different organizations including universities as well as industrial R&D, the conference will provide a wide spectrum of interests reflected in 60 contributed papers in 14 sessions. This year’s keynote speakers will focus on: Molecular Medical Diagnostics, Microsystems and Microfluidics and Terabit Wireless Devices.
Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To facilitate networking, these exhibits will be located in the same room used for breaks and meals. To reserve space, visit www.cicmt.org or contact Ann Bell (email@example.com; 202-548-8717).
Do not miss THE ceramic interconnect and ceramic microsystems event in Denver, April 23-26, 2007.
Christian Hoffmann and Kevin G. Ewsuk
Automotive Microelectronics and Packaging Workshop Program and Registration Now Available ^
The Advanced Technology
Workshop on Automotive Packaging will be held April 9-12, 2007,
at the Hyatt Regency in Dearborn, Michigan. For more information on
this workshop and to register on-line, visit www.imaps.org/automotive.
Sessions will be held on:
Sensor Materials and Packaging | LTCC Substrates and Packaging | Power Substrates and Packaging | Interconnects and Materials | Packaging and Assembly
The Workshop will also feature the following Invited Presentations:
February 7 - Norcal Chapter Meeting Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs ^
|| Wednesday, February 7, 2007
||11:45 AM – 1:15 PM
1217 Wildwood Avenue
Sunnyvale, CA 94089
||11:30 AM – 12 PM -- Registration, Networking, Social
11:30 AM – 12:15 PM -- Buffet Luncheon
12:00 PM – 1:00 PM -- Speaker Presentation
Students (with ID) $5.00
Prices include lunch and program. Please email Roger Underwood, firstname.lastname@example.org to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.
Packaging Requirements to meet Future Directions and Needs
by Mr. Sunil Patel, Packaging Technologist
Recent years have seen growing demands of data storage in digital electronic industry and this trend will continue further during the first decade of 21st century. Hard disk drives will remain the primary choice of storage devices in all segments of PC market and in many non-PC emerging markets. Form factor and capacity are the distinguishing critical features of storage devices for emerging mobile market segment. Small form factor requirements of hard disk drive pose many challenges to semiconductor devices at both component level as well as system/board level. Microelectronic packaging technology has evolved since past few decades and continues to make advanced development to meet current and future requirements. This talk will discuss the trends and role of packaging in hard disk drive applications. Various packaging options for key electronic components are discussed. Concept of system level solution is introduced to meet next generation consumer application requirements.
Mr. Sunil Patel is a Packaging Technologist at Seagate Technology where he is responsible for coordinating cross-functional development of ASIC packaging and addressing key issues for various phases of manufacturing and productization of disc drives. Prior to joining Seagate, Mr. Patel played a key role in defining ASIC package and board level assembly solutions at a small start-up company, providing solutions for storage area network demands. He has also worked at LSI Logic where he built a highly motivated team to develop and qualify the industry’s first laminate flip-chip package. Mr. Patel and his team played a key role in establishing industry infrastructure by establishing a robust flip-chip assembly process at major semiconductor package and assembly sub-contractor facilities.
Mr. Patel has worked at Digital Equipment & Eastman Kodak, working on thin film deposition process as well as packaging development and also contributed to industry consortiums like MCC and Sematech.
February 7 - Phoenix Chapter Lunch Meeting Featuring a Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing ^
Please join the IMAPS Phoenix Chapter on Wednesday, February 7, 2007, for a discussion on: Enabling High Density SiP Manufacturing - The use of Jetting Technology to minimize substrate area for underfill. The presentation will be given by Steve Adamson, IMAPS President-Elect, and Marketing Manager, Asymtek.
|| Wednesday, February 7, 2007
||Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
||Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa, AZ 85202
| Luncheon and presentation - $10.00
Vendor display tables available for $15.00
Consumer electronic devices have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs that put tremendous pressure on the use of the substrate area. Flip chip and micro-BGA devices are being used as on flex circuits and substrates for these markets. Underfilling these devices presents some fundamental problems for needle dispensing that Jet dispensing can eliminate. This presentation will review the merits of jetting verses needle dispensing. It will be shown how it is possible to save board space through jetting while improving throughput in real life applications.
Steve will also take a few minutes to discuss recent developments in IMAPS and share with you the IMAPS executive council vision for the future. He will also be looking for feedback on how to improve IMAPS.
Indiana Chapter Tour of Marian, Inc. and Dinner Meeting, This Thursday ^
||Thursday, February 8, 2007
||Tour Starts - 2:00
Social Hour - 4:00
Dinner - 5:00
Meeting - 6:00
Marian, Inc. Tour
Dinner & Meeting to follow at
IMAPS Members - $20.00
Non-Members - $22.00
Students - $5.00
||Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email email@example.com
President of Marian, Inc.
Marian converts soft materials into flexible component parts for assembly in consumer, industrial and scientific products.
Marian, Inc. was founded by Hugh Knoll, Sr. in 1954 as "Marian Rubber Products Company," a regional distributor of industrial rubber products. Our original building on East Market Street in downtown Indianapolis was 8000 square feet and it served primarily as a warehouse and distribution center. The key to our initial success was the commitment to satisfying customer needs displayed by Mr. Knoll.
After Mr. Knoll's untimely death in 1971, Eugene S. Witchger, a friend of the Knoll family, purchased the company. Mr. Witchger had recently taken early retirement from his long time position as Vice President of Schwitzer Corporation. Under Eugene's leadership, dedication, and customer focus, the fledgling company of 15 employees began to grow after early setbacks.
With the addition of Witchger's son William (Bill) in 1973, the company began to expand in fabrication and manufacturing capabilities. For example, by installing a lathe slitter in 1974, we became one of the first custom slitters of electrical and industrial pressure-sensitive tapes in the Midwest. The Witchgers' successful innovations, inherent attention to cost reduction, and constant focus on our customers has enabled Marian to continually expand fabrication and manufacturing techniques.
New England Chapter Technical Meeting – Tuesday, February 20 2007 ^
|| Marlborough Marriott
(Formerly the Radisson)
Marlborough, MA 508-480-0015
Route 495 to Exit 24B. Take first right off exit. 75 Felton Street (just before Shell station),
(Times are approximate)
|5:30 p.m. Registration, Socializing, Networking & Cash Bar
6:30 p.m. Dinner
7:30 p.m. Presentation by Joe Belmonte - Speedline Technologies - Franklin, MA
Can High Volume Electronics Manufacturing Technology be used in a High Volume Fuel Cell Manufacturing Process?
During the last several years there has been and continues to be an enormous investment by both governments and industry in the development and manufacture of fuel cells. There are several technical challenges to developing cost effective fuel cells. One of the key areas to reduce fuel cell cost is the manufacturing cost. At Speedline Technologies, we have completed a fuel cell manufacturing process development project using electronics manufacturing industry screen-printing and reflow soldering technologies. Our research indicated that high volume electronics manufacturing technology could be used to develop and implement high volume fuel cell manufacturing. This presentation will focus on the results obtained from this study.
Joe Belmonte is the Advanced Process Development Manager at Speedline Technologies focusing on state of the art process development and training program. Joe has over 30 years of electronic process development experience and holds leadership position at various industry groups, such as SMTA, iNEMI, and IPC.
There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.
Dinner Choices: 1) Baked Boston Scrod with Cracker Topping, 2) Chicken Marsala
Pre-registration must be received by Monday February 19th! Send Registrations to:
96 Grant Way
Lancaster, MA 01523-3112
Printable PDF Meeting Notice
SEND NO MONEY! But BRING checks payable to “IMAPS New England” At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, February 19th or the Chapter is billed for your meal.
United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 ^
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.
Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.
Additional speakers on the panel will be Chris Bailey from the University of Greenwich; Dr. Kathryn Walsh, Director of the Electronics Enabled Products, KTN; Mike Trenchard, from the Components Obsolescence Group; and Aubrey Dunford from AFDEC.
David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."
Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an invaluable contribution in bringing this issue to the forefront of the industry ."
MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.
For further information, or if you would like to attend the event, please contact:
+44 (0)1522 575 212
International Conference on Electronics Packaging (ICEP) 2007 ^
IMAPS Japan / JIEP
IEEE CPMT Society Japan
April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan
Technical Topics for Conference Papers:
Advanced Packaging, Area Array Packages, Board EMC Evaluation,
Built-up Substrates, Bump Formation, Environmental Aspects,
EPD/EAD Technology, Flip Chip Technology, High Speed Board Design,
Interconnections, LCD Module Packaging, Lead Free Soldering,
Manufacturing, Materials, MCM, MEMS Packages, Nano Technology, Optoelectronics, Reliability and Testing, Stacked Structure,
Substrate/Interposer, System in Package, Thermal Management,
Thin Film Technologies, Trend and Education, Underfilling,
VLSI Packaging, Wafer Level Packaging, etc.
Speaker 40,000 yen. (Including Reception and Proceedings)
General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)
Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: firstname.lastname@example.org or email@example.com
SoCal’07 Symposium and Exhibition ^
SoCal’07 Technical Symposium and Tabletop Exhibition, sponsored by IMAPS Southern California Chapters, will be held on May 16, 2007 at the Anaheim Hills Golf Course. The Exhibition and Technical Program Committee are inviting exhibitors and papers. We will be having a Golf Tournament in the morning, with papers presented from 10am until 5 pm
Technical Topics include but not limited to the following:
- Advanced Materials and Processing
- Nano Technology
- Surface Mount Technology
- Homeland Security Technology
- Advanced Microelectronics and Electronics Packaging
- Space and Military Electronics
- Quality and Reliability
- Thick and Thin Film Materials
- Thermal Management
- Lead Free Solder
- 300 words Abstract and Bio Submission were due January 31, 2007
- Final Paper Manuscript Submission by February 29, 2007
Please direct technical program questions and inquiries to exhibit to:
Bill Gaines, Northrop Grumman
Email: William.firstname.lastname@example.org, Tel. (626) 812-2199