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January 17, 2007


   IMAPS EVENTS
Button Early Exhibits Deadline Approaching for IMAPS 2007 - 40th Anniversary Symposium (read more...)

Button Military, Aerospace, Space and Homeland Security Abstract Deadline This Friday, January 19 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet San Diego Chapter January 23 Dinner Meeting Featuring Update of RoHS Directives and Laws (read more...)

Bullet Metro Chapter Dinner Meeting January 24 with Daniel Baldwin Presenting Flip Chip Technology: What, Why, How (read more...)

Bullet New England Chapter Technical Meeting January 24 on Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity (read more...)

Bullet French Chapter Announces 2nd European ATW on Micropackaging and Thermal Management (read more...)

Bullet Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs (read more...)

Bullet Phoenix Chapter Lunch Meeting Featuring Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing (read more...)

Bullet Call for Papers - International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet SoCal’07 Symposium and Exhibition will be held May 16, 2007 (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS Launches Its New Website - An Invaluable On-line Resource Featuring Industry News, Emerging Technical Information and Many Other New Features (read more...)

IMAPS Events (view full Web Calendar)

Early Exhibits Deadline Approaching for IMAPS 2007 - 40th Anniversary Symposium -    ^ Top
IMAPS 2007 is being held November 11-15, 2007, at the San Jose McEnery Convention Center in San Jose, California. The early booth reservation deadline is January 31, 2007, after which all fees will increase significantly. Reserve your booth before the deadline and save - http://www.imaps40th.org.

120 booths have already been reserved and the hall is selling fast. And with the enhanced benefits available, the hall is sure to be bursting at the seams!

The Annual IMAPS Symposium attracts 3,000 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

Exhibitor Benefits at IMAPS 2007
Included with your IMAPS 2007 Exhibition Space are the following benefits which add unpresidented value to your Booth Space Reservation. Not only is your Booth Rental Fee the very lowest in the industry, but you will also receive at no additional charge…

· One Full Symposium Registration.

· Complimentary Exhibit Hall Passes & Contest: Invite your customers and colleagues to IMAPS 2007 and you are entered into a contest to win a free-of-charge 10’x10’ booth at IMAPS 2008 in Providence, RI, for the exhibiting company with the most passes turned into IMAPS.

· Descriptive paragraph and contact information in the IMAPS 2007 Final Program.

·
The IMAPS 2007 post-show attendee list.

· Unlimited listings in the Products and Services section of the Final Program. Listings are also published in 2008 issues of Advancing Microelectronics.

· 365-Day Web Listing: Your company name, information and links to your company’s web site giving you the benefit of a virtual trade show.

·
A 12 month long marketing campaign that will include: conference brochures, e-mail broadcasts, direct mail, web banners and advertisements, both in print and electronically.

· Direct mail and telemarketing campaigns.

· E-mail Campaigns to more than 20,000 featuring exhibiting companies.

· Press releases, news items and your logo in the IMAPS Corporate Bulletin (sent to 20,000+ twice monthly).

·
Media press releases, press conferences, and pre-show activities.

· A show logo that you can place on your web site to promote your presence at the shows.

· An 8' high backdrape, 7" x 44" sign including company name and booth number and 33" high draped side rails.

·
Admission to the Welcome Reception where you can network with prospects, customers and old friends.

· Priority on-site booth selection in San Jose for your reservation for IMAPS 2008, Providence, RI.

Military, Aerospace, Space and Homeland Security Abstract Deadline This Friday, January 19    ^ Top
The Topical Workshop and Tabletop Exhibit on Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications will be held May 8 - 10, 2007, at the Radisson Plaza Lord Baltimore Hotel, 20 W. Baltimore Street, Baltimore, MD 21201. For more information, visit www.imaps.org/mash. Abstracts will be accepted until Friday, January 19, 2007.

In our current environment where the focus is on military activities and homeland security, extensive work is being done to advance high reliability electronics packaging.  The technical program will expand upon the previous workshops and will focus on the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on materials and processing issues at the component level as well as the connected issues at the design and applications level.

An outstanding program is planned with internationally recognized authorities from industry and academia. Those wishing to present papers may submit a 200 word or less abstract electronically by January 19, 2007; using the on-line submittal form at: www.imaps.org/abstracts.htm.

Chapter Activities (events listed in chronological order)

San Diego Chapter January 23 Dinner Meeting Featuring Update of RoHS Directives and Laws    ^ Top
The San Diego Chapter of IMAPS invites you to attend the January 23rd Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner talk by Mike Dolbow, CEO of A Total Green Planet Solution, will be on topics related to RoHS. Social hour is at 5:30 p.m., with dinner at 6:30 and the talk at 7:15. The cost is $7 (RSVP’d Students), $15 (RSVP’d Members) or $20 (Others). For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or dvirissimo@sempck.com.

Topics:
Update of RoHS directives & laws
How to implement RoHS into process engineering, inspection
Fitting RoHS into present manufacturing structure physically
EPA Prop 65
E-Waste Laws

Bio:
CEO of A Total Green Planet Solution (www.atotalgps.com)
20+ years in Electronics Manufacturing Industry
BSEE, Portland State University
AA Computer Science, UCSM
OSHA Chemical and Safety Inspector (Chemical Associates Certification)
Process Certification and Defect Recognition - Hybrids, Microcircuits and
RF/MMIC Modules (IBM Certification)
8+ years Manufacturing Engineer
CQE (Certified Quality Engineer - American Society for Quality)
Lead Free High Reliability Soldering Course (Omni Certified)
Wire Bonding Certification / Ball / Wedge (IBM Certification)
Metallurgy Technologist Certification level 2 (IMA Certification)
Master Level ESD auditing and training certification (General Instruments)
Material handling for Medical Electronics (FDA Certification - Medication
Delivery Devices)
23 other certifications in different aspects of process engineering.

Metro Chapter Dinner Meeting January 24 with Daniel Baldwin Presenting Flip Chip Technology: What, Why, How    ^ Top
When:

Wednesday January 24, 2007
Registration/Networking: 5:30-6:30
Dinner Buffet  6:30-7:15
Technical Presentation 7:15-8:00

Where:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Price:

Members: $30.00 if Pre-Registered by January 23, 2007
$35.00 At the door

Non-Members: $35.00 if Pre-Registered by January 23, 2007
$40.00 At the door

Pre-Registration:

Email: slehnert@mdipower.com
Phone: Steve Lehnert  (631) 345-3100    

Flip Chip Technology: What, Why, How

This presentation will give a detailed overview of Flip Chip die attach. It will discuss the various interconnection methods utilized including wafer bumping and adhesives. The paper will cover the driving forces behind Flip Chip as well as the advantages and disadvantages. Several examples will be shown and discussed, including RFID and Medical Applications. Some of the history of Flip Chip technology will also be presented.

by
Daniel F. Baldwin

Founder of ENGENT (Enabling Next Generation Technologies)
Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing.

New England Chapter Technical Meeting January 24 on Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity    ^ Top
Location: Marlborough Marriott (Formerly the Radisson)
Route 495 to Exit 24B. 
Take first right off exit just before gas station. 
75 Felton Street, Marlborough, MA 508-480-0015
Schedule:
(times approximate)

5:30 p.m.       Registration, Socializing, Networking & Cash Bar

6:30 p.m.       Dinner

7:30 p.m.       Presentation by Jonathan Margalit, Ph.D / H.C. Starck Inc

"Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity"

ABSTRACT: With the increasing performance and the miniaturization of electronic devices there is a growing need for advanced thermal management materials and components.  Efficient heat dissipation is required to maintain device reliability, durability and performance consistency.  This presentation reviews the thermal modeling and experimental data of a patent-pending, refractory metal (Mo) based, passive cooling element, containing Cu-filled through holes.  An additional and unique feature of the product described is the ability to design the size, location, density and pattern of the through-holes.  This allows the advantage of a targeted channeling of heat away from hot spots, i.e., localized areas with significantly higher heat loads.

Jonathan Margalit, Ph.D. in Material Science from the Technical University of Aachen, Germany (thermal expansion of Al-silicate based ceramics).  National Service Manager for a semiconductor x-ray analysis tool manufacturer.  With H.C. Starck since 2000 in various positions (Marketing, Product Management), currently responsible for new business development for thermal management related applications, including HB-LEDs, hybrid vehicle power converters, and power semiconductors. 

Click for PDF Form

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

  Non-Member    Member   Retired Member Student
Meeting Only N/C N/C N/C N/C
Dinner $25.00   $25.00   $25.00   $5.00  

Dinner Choices 1) Chicken Saltimbocca, 2) Grilled Vegetarian Wellington.

Pre-registration must be received by Monday January 22nd!!

Send Registrations to: Susan Munyon

96 Grant Way, Lancaster, MA 01523-3112

e-mail SusanMunyon@comcast.net
978-466-1877 phone/fax

www.imapsne.org/meeting.html

At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, January 22nd or the Chapter is billed for your meal.

Click for PDF Form

Contact Mark A. Occhionero with questions:
marko@alsic.com
IMAPS New England Chapter President www.imapsne.org
Ceramics Process Systems www.alsic.com
(508) 222 0614 x 42

French Chapter Announces 2nd European ATW on Micropackaging and Thermal Management    ^ Top
After the real success of the first issue, last year, the 2nd European ATW on Micropackaging and Thermal Management will be held, January 31 and February 1st, in La Rochelle on the French Atlantic coast.

The aim of the workshop will be to help exchange of information between scientists and engineers involved in the field of thermal management, for high integration levels. Due to the rising speed and miniaturization the mastering of thermal effects is and will keep being a technological key for the future packaging solutions.
 
After a welcome session, including two keynote addresses, the technical program will gather 21 papers in five sessions:

Session 1: Materials
Session 2: Applications
Session 3: Thermal modelling and reliability
Session 4: Advanced cooling solutions
Session 5: Test and Measurement Methods

The international dimension of the event is attested by half of the presentations from five different countries, including Belgium (4), Germany (2), United States (2), Spain (1) and Sweden (1). The language will be English.

The workshop site will be: “Hotel Mercure Oceanide” on Vieux Port Sud (Old harbour). It is organized on a global fees basis for registration, hotel (2 nights) and meals (2 dinners, 2 lunches). It will start on Tuesday January 30 by a welcome dinner. On Wednesday evening the participants are invited to the “Corderie Royale”, a historic manufacturer of naval ropes; after the visit the dinner will be served on site.

After January 12, the fees increased to:
€ 750 for members and € 850 for non members.

Speakers and chairs benefit of a special rate of € 480.

The registration deadline will be January 26.

The ATW is open to table top exhibits, strictly limited to organisations involved in the field of thermal management. It will be charged € 300 VAT included for 1 table, two chairs and a poster panel. For the foreign exhibitors (No VA tax) it will be charged € 250,84. Up to twenty table tops may be accepted on a “first registered, first served” basis.

For registration, information or questions:
Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site, www.imapsfrance.org.

Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs    ^ Top

Date: Wednesday, February 7, 2007
Time: 11:45 AM – 1:15 PM
Location: Ramada Inn
1217 Wildwood Avenue
Sunnyvale, CA 94089
(408) 245-5330
Agenda: 11:30 AM – 12 PM -- Registration, Networking, Social
11:30 AM – 12:15 PM -- Buffet Luncheon
12:00 PM – 1:00 PM -- Speaker Presentation
Fees:

Luncheon Fee
Members/Invited $15.00.  
Students (with ID) $5.00

Prices include lunch and program.  Please email Roger Underwood, runderwood@cctlaser.com to reserve your space today!  Registrations will be confirmed via email.  We accept cash and checks at the door.

Packaging Requirements to meet Future Directions and Needs
by
Mr. Sunil Patel, Packaging Technologist
Seagate Technologies

Recent years have seen growing demands of data storage in digital electronic industry and this trend will continue further during the first decade of 21st century. Hard disk drives will remain the primary choice of storage devices in all segments of PC market and in many non-PC emerging markets. Form factor and capacity are the distinguishing critical features of storage devices for emerging mobile market segment. Small form factor requirements of hard disk drive pose many challenges to semiconductor devices at both component level as well as system/board level. Microelectronic packaging technology has evolved since past few decades and continues to make advanced development to meet current and future requirements. This talk will discuss the trends and role of packaging in hard disk drive applications. Various packaging options for key electronic components are discussed. Concept of system level solution is introduced to meet next generation consumer application requirements.

Mr. Sunil Patel is a Packaging Technologist at Seagate Technology where he is responsible to coordinate cross-functional development of ASIC packaging and addressing key issues for various phases of manufacturing and productization of disc drives. Prior to joining Seagate, Mr. Patel played a key role in defining ASIC package and board level assembly solutions at a small start-up company, providing solutions for storage area network demands. He has also worked at LSI Logic where he built a highly motivated team to develop and qualify industry’s first laminate flip-chip package. Mr.Patel and his team played a key role in establishing industry infrastructure by establishing a robust flip-chip assembly process at major semiconductor package and assembly sub-contractor facilities.

Mr. Patel has worked at Digital Equipment & Eastman Kodak, working on thin film deposition process as well as packaging development and also contributed to industry consortiums like MCC and Sematech.

Phoenix Chapter Lunch Meeting Featuring a Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing    ^ Top
Please join the IMAPS Phoenix Chapter on Wednesday, February 7, 2007, for a discussion on:
Enabling High Density SiP Manufacturing - The use of Jetting Technology to minimize substrate area for underfill. The presentation will be given by Steve Adamson, IMAPS President-Elect, and Marketing Manager, Asymtek.

Date: Wednesday, February 7, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa, AZ 85202
Cost:
Luncheon and presentation - $10.00
!!! Special - No Charge for pre-registered attendees !!! 

Vendor display tables available for $15.00

RSVP: RSVP by Feb 5th to: greg.clemons@intel.com 

Consumer electronic devices have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs that put tremendous pressure on the use of the substrate area. Flip chip and micro-BGA devices are being used as on flex circuits and substrates for these markets. Underfilling these devices presents some fundamental problems for needle dispensing that Jet dispensing can eliminate. This presentation will review the merits of jetting verses needle dispensing.  It will be shown how with jetting it has been possible to save board space while improving throughput in real life applications. 

Steve will also take a few minutes to discuss recent developments in IMAPS and share with you the IMAPS executive council vision for the future.  He will also be looking for feedback on how to improve IMAPS.

Call for Papers - International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IMAPS Japan / JIEP
IEEE CPMT Society Japan

Supported by
IMAPS Asia-ALC

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology,
Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Abstract and Paper Submission:

Abstracts were due Wednesday, November 15, 2006.

Formal paper manuscript should be sent by February 1, 2007.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Contact:
Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: imaps-j@jiep.or.jp or icep@jiep.or.jp
URL: http://www.jiep.or.jp/icep/

SoCal’07 Symposium and Exhibition will be held May 16, 2007    ^ Top
SoCal’07 Technical Symposium and Tabletop Exhibition, sponsored by IMAPS Southern California Chapters, will be held on May 16, 2007 at the Anaheim Hills Golf Course.  The Exhibition and Technical Program Committee are inviting exhibitors and papers.  We will be having a Golf Tournament in the morning, with papers presented from 10am until 5 pm

Technical Topics are but not limited to the following:

    • Advanced Materials and Processing
    • Nano Technology
    • MEMS
    • Surface Mount Technology
    • Homeland Security Technology
    • Advanced Microelectronics and Electronics Packaging
    • Components
    • Space and Military Electronics
    • Quality and Reliability
    • Thick and Thin Film Materials
    • Optoelectronics
    • Thermal Management
    • Lead Free Solder

Submission Deadlines:

    • 300 words Abstract and Bio Submission by January 31, 2007
    • Final Paper Manuscript Submission by February 29, 2007

Please submit papers and inquiries to exhibit to

General Chair
Bill Gaines, Northrop Grumman
Email: William.gaines@ngc.com, Tel. (626) 812-2199

 

Products and Publications

IMAPS Launches Its New Website - An Invaluable On-line Resource Featuring Industry News, Emerging Technical Information and Many Other New Features    ^ Top
You may have already noticed that IMAPS has released a new website at www.imaps.org. Over the past 6 months, the IMAPS Publications Committee has worked with the staff, executive leadership and members to enhance the on-line offerings available to IMAPS members.

The new IMAPS website delivers information to you in-line with the Society's supply chain business model that was developed in 2006. Bringing together the entire microelectronics supply chain, this model addresses the business and technical needs of the entire supply chains of several key industries that IMAPS represents - Military, Automotive, Biomedical, Energy and Consumer Electronics, to name only a few.

In addition to a much cleaner page design and more user-friendly navigation menus, the site offers several new features.

  • A new Industry News section distributes real-time news feeds from several global sources along the industry lines that IMAPS is involved with. This information will keep you informed of all the current events at every level of these important industries.
  • Under the new Technology menu, you will have access to information on the Industry Initiatives that IMAPS is leading - with work now under way exploring LTCC Standards, a 3D Consortium, among others.
  • The Industry Guide is easier than ever to use! Now you can search the member database, corporate member list, keyword search companies, and locate providers of products and services that you are seeking, all from the homepage.
  • Stay connected with the activities in your community. Take advantage of the improved Chapters section of the website and link directly to your chapters' website(s), and search for local meetings and technical presentations.
  • And many other new features!

We will be adding more features over the coming weeks to further enhance your IMAPS experience. The site will become the portal for all of your microelectronics and electronic packaging needs.

We have listened to the feedback and requests of the members and other users and encourage you to continue to provide input on what you would like to see at IMAPS.ORG, and what you need to meet all of your industry needs. Please send your questions, comments and requests to Brian Schieman, bschieman@imaps.org.

2nd ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
February 27-March 1, 2007
Arcadia, CA

Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact abell@imaps.org

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact abell@imaps.org

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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