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January 23, 2007

Button Device Packaging Conference Featuring Tracks on FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical (read more...)

Button Program and Registration Now Available for the 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Metro Chapter Dinner Meeting January 24 with Daniel Baldwin Presenting Flip Chip Technology: What, Why, How (read more...)

Bullet New England Chapter Technical Meeting January 24 on Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity (read more...)

Bullet French Chapter Announces 2nd European ATW on Micropackaging and Thermal Management (read more...)

Bullet Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs (read more...)

Bullet Phoenix Chapter Lunch Meeting Featuring Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing (read more...)

Bullet United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 (read more...)

Bullet Call for Papers - International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet SoCal’07 Symposium and Exhibition will be held May 16, 2007 (read more...)

IMAPS Events (view full Web Calendar)

Device Packaging Conference Featuring Tracks on FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical    ^ Top
3rd International Conference and Exhibition on Device Packaging

Doubletree Hotel
Scottsdale, Arizona USA
March 19-22, 2007

The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topics areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations.

The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.

Program and Registration Now Available for the 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments)   ^ Top
The 2nd Advanced Technology Workshop (ATW) on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments will be held February 27 through March 1, 2007, at the Embassy Suites Hotel in Arcadia, California (near Pasadena). For more information about Extreme Cold, to view the technical program and abstracts or to register on-line, visit The early registration deadline and hotel cut-off is February 9, 2007.

The objective of this Advanced Technology Workshop (ATW) is to have a unique technical forum that brings together industrialists, scientists, engineers, space agencies and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold to hot temperature environments. Studies in extreme thermal and radiation environments are extended beyond nominal operating temperature regimes and radiation levels. Validation of the electronic packages assembled with various electronic parts over a wide temperature range to infuse into future space missions is of significant value for space applications. The other goal of this ATW is to expedite the infusion of cutting-edge technology into present and future NASA projects, missions, and science instruments. This ATW is partially providing the mechanism to create an international network of electronics developers and systems designers by bringing together representatives from academia and the space agencies. This Workshop covers active and passive devices, circuits/systems, advanced packaging, instruments, and reliability under extreme cold to hot temperatures and radiation environments. This is the second workshop in a series that is being organized in the USA since there is a significant interest for NASA and other space agencies in missions to Mars, the Moon, Deep Space Missions and beyond.

Chapter Activities (events listed in chronological order)

Metro Chapter Dinner Meeting January 24 with Daniel Baldwin Presenting Flip Chip Technology: What, Why, How    ^ Top

Wednesday January 24, 2007
Registration/Networking: 5:30-6:30
Dinner Buffet  6:30-7:15
Technical Presentation 7:15-8:00


Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500


Members: $30.00 if Pre-Registered by January 23, 2007
$35.00 At the door

Non-Members: $35.00 if Pre-Registered by January 23, 2007
$40.00 At the door


Phone: Steve Lehnert  (631) 345-3100    

Flip Chip Technology: What, Why, How

This presentation will give a detailed overview of Flip Chip die attach. It will discuss the various interconnection methods utilized including wafer bumping and adhesives. The paper will cover the driving forces behind Flip Chip as well as the advantages and disadvantages. Several examples will be shown and discussed, including RFID and Medical Applications. Some of the history of Flip Chip technology will also be presented.

Daniel F. Baldwin

Founder of ENGENT (Enabling Next Generation Technologies)
Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing.

New England Chapter Technical Meeting January 24 on Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity    ^ Top
Location: Marlborough Marriott (Formerly the Radisson)
Route 495 to Exit 24B. 
Take first right off exit just before gas station. 
75 Felton Street, Marlborough, MA 508-480-0015
(times approximate)

5:30 p.m.       Registration, Socializing, Networking & Cash Bar

6:30 p.m.       Dinner

7:30 p.m.       Presentation by Jonathan Margalit, Ph.D / H.C. Starck Inc

"Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity"

ABSTRACT: With the increasing performance and the miniaturization of electronic devices there is a growing need for advanced thermal management materials and components.  Efficient heat dissipation is required to maintain device reliability, durability and performance consistency.  This presentation reviews the thermal modeling and experimental data of a patent-pending, refractory metal (Mo) based, passive cooling element, containing Cu-filled through holes.  An additional and unique feature of the product described is the ability to design the size, location, density and pattern of the through-holes.  This allows the advantage of a targeted channeling of heat away from hot spots, i.e., localized areas with significantly higher heat loads.

Jonathan Margalit, Ph.D. in Material Science from the Technical University of Aachen, Germany (thermal expansion of Al-silicate based ceramics).  National Service Manager for a semiconductor x-ray analysis tool manufacturer.  With H.C. Starck since 2000 in various positions (Marketing, Product Management), currently responsible for new business development for thermal management related applications, including HB-LEDs, hybrid vehicle power converters, and power semiconductors. 

Click for PDF Form

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

  Non-Member    Member   Retired Member Student
Meeting Only N/C N/C N/C N/C
Dinner $25.00   $25.00   $25.00   $5.00  

At-door registration is an additional $5.00.

Dinner Choices 1) Chicken Saltimbocca, 2) Grilled Vegetarian Wellington.

Send Registrations to: Susan Munyon

96 Grant Way, Lancaster, MA 01523-3112

978-466-1877 phone/fax

Click for PDF Form

Contact Mark A. Occhionero with questions:
IMAPS New England Chapter President
Ceramics Process Systems
(508) 222 0614 x 42

French Chapter Announces 2nd European ATW on Micropackaging and Thermal Management    ^ Top
After the real success of the first issue, last year, the 2nd European ATW on Micropackaging and Thermal Management will be held, January 31 and February 1st, in La Rochelle on the French Atlantic coast.

The aim of the workshop will be to help exchange of information between scientists and engineers involved in the field of thermal management, for high integration levels. Due to the rising speed and miniaturization the mastering of thermal effects is and will keep being a technological key for the future packaging solutions.
After a welcome session, including two keynote addresses, the technical program will gather 21 papers in five sessions:

Session 1: Materials
Session 2: Applications
Session 3: Thermal modelling and reliability
Session 4: Advanced cooling solutions
Session 5: Test and Measurement Methods

The international dimension of the event is attested by half of the presentations from five different countries, including Belgium (4), Germany (2), United States (2), Spain (1) and Sweden (1). The language will be English.

The workshop site will be: “Hotel Mercure Oceanide” on Vieux Port Sud (Old harbour). It is organized on a global fees basis for registration, hotel (2 nights) and meals (2 dinners, 2 lunches). It will start on Tuesday January 30 by a welcome dinner. On Wednesday evening the participants are invited to the “Corderie Royale”, a historic manufacturer of naval ropes; after the visit the dinner will be served on site.

After January 12, the fees increased to:
€ 750 for members and € 850 for non members.

Speakers and chairs benefit of a special rate of € 480.

The registration deadline will be January 26.

The ATW is open to table top exhibits, strictly limited to organisations involved in the field of thermal management. It will be charged € 300 VAT included for 1 table, two chairs and a poster panel. For the foreign exhibitors (No VA tax) it will be charged € 250,84. Up to twenty table tops may be accepted on a “first registered, first served” basis.

For registration, information or questions:
Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs    ^ Top

Date: Wednesday, February 7, 2007
Time: 11:45 AM – 1:15 PM
Location: Ramada Inn
1217 Wildwood Avenue
Sunnyvale, CA 94089
(408) 245-5330
Agenda: 11:30 AM – 12 PM -- Registration, Networking, Social
11:30 AM – 12:15 PM -- Buffet Luncheon
12:00 PM – 1:00 PM -- Speaker Presentation

Luncheon Fee
Members/Invited $15.00.  
Students (with ID) $5.00

Prices include lunch and program.  Please email Roger Underwood, to reserve your space today!  Registrations will be confirmed via email.  We accept cash and checks at the door.

Packaging Requirements to meet Future Directions and Needs
Mr. Sunil Patel, Packaging Technologist
Seagate Technologies

Recent years have seen growing demands of data storage in digital electronic industry and this trend will continue further during the first decade of 21st century. Hard disk drives will remain the primary choice of storage devices in all segments of PC market and in many non-PC emerging markets. Form factor and capacity are the distinguishing critical features of storage devices for emerging mobile market segment. Small form factor requirements of hard disk drive pose many challenges to semiconductor devices at both component level as well as system/board level. Microelectronic packaging technology has evolved since past few decades and continues to make advanced development to meet current and future requirements. This talk will discuss the trends and role of packaging in hard disk drive applications. Various packaging options for key electronic components are discussed. Concept of system level solution is introduced to meet next generation consumer application requirements.

Mr. Sunil Patel is a Packaging Technologist at Seagate Technology where he is responsible to coordinate cross-functional development of ASIC packaging and addressing key issues for various phases of manufacturing and productization of disc drives. Prior to joining Seagate, Mr. Patel played a key role in defining ASIC package and board level assembly solutions at a small start-up company, providing solutions for storage area network demands. He has also worked at LSI Logic where he built a highly motivated team to develop and qualify industry’s first laminate flip-chip package. Mr.Patel and his team played a key role in establishing industry infrastructure by establishing a robust flip-chip assembly process at major semiconductor package and assembly sub-contractor facilities.

Mr. Patel has worked at Digital Equipment & Eastman Kodak, working on thin film deposition process as well as packaging development and also contributed to industry consortiums like MCC and Sematech.

Phoenix Chapter Lunch Meeting Featuring a Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing    ^ Top
Please join the IMAPS Phoenix Chapter on Wednesday, February 7, 2007, for a discussion on:
Enabling High Density SiP Manufacturing - The use of Jetting Technology to minimize substrate area for underfill. The presentation will be given by Steve Adamson, IMAPS President-Elect, and Marketing Manager, Asymtek.

Date: Wednesday, February 7, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa, AZ 85202
Luncheon and presentation - $10.00
!!! Special - No Charge for pre-registered attendees !!! 

Vendor display tables available for $15.00

RSVP: RSVP by Feb 5th to: 

Consumer electronic devices have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs that put tremendous pressure on the use of the substrate area. Flip chip and micro-BGA devices are being used as on flex circuits and substrates for these markets. Underfilling these devices presents some fundamental problems for needle dispensing that Jet dispensing can eliminate. This presentation will review the merits of jetting verses needle dispensing.  It will be shown how with jetting it has been possible to save board space while improving throughput in real life applications. 

Steve will also take a few minutes to discuss recent developments in IMAPS and share with you the IMAPS executive council vision for the future.  He will also be looking for feedback on how to improve IMAPS.

United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007    ^ Top
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on the 6th March, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.

Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.

Additional speakers on the panel will be Chris Bailey from the University of Greenwich, Dr. Kathryn Walsh from Director of the Electronics Enabled Products KTN,  Mike Trenchard from the Components Obsolescence Group and Aubrey Dunford from AFDEC.

David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."

Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an  invaluable contribution in bringing this issue to the forefront of the industry ."

MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.

For further information, or if you would like to attend the event, please contact:
Sylvia Outteridge
+44 (0)1522 575 212

Call for Papers - International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IEEE CPMT Society Japan

Supported by

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology,
Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Abstract and Paper Submission:

Abstracts were due Wednesday, November 15, 2006.

Formal paper manuscript should be sent by February 1, 2007.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: or

SoCal’07 Symposium and Exhibition will be held May 16, 2007    ^ Top
SoCal’07 Technical Symposium and Tabletop Exhibition, sponsored by IMAPS Southern California Chapters, will be held on May 16, 2007 at the Anaheim Hills Golf Course.  The Exhibition and Technical Program Committee are inviting exhibitors and papers.  We will be having a Golf Tournament in the morning, with papers presented from 10am until 5 pm

Technical Topics are but not limited to the following:

    • Advanced Materials and Processing
    • Nano Technology
    • MEMS
    • Surface Mount Technology
    • Homeland Security Technology
    • Advanced Microelectronics and Electronics Packaging
    • Components
    • Space and Military Electronics
    • Quality and Reliability
    • Thick and Thin Film Materials
    • Optoelectronics
    • Thermal Management
    • Lead Free Solder

Submission Deadlines:

    • 300 words Abstract and Bio Submission by January 31, 2007
    • Final Paper Manuscript Submission by February 29, 2007

Please submit papers and inquiries to exhibit to

General Chair
Bill Gaines, Northrop Grumman
Email:, Tel. (626) 812-2199


2nd ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
February 27-March 1, 2007
Arcadia, CA

Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics



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