IMAPS Home | Join/Renew | Industry Guide | Edit Member Record
January 30, 2007

Button Early Exhibits Deadline Tomorrow, January 31, for IMAPS 2007 - 40th Anniversary Symposium (read more...)

Button Device Packaging Conference Hotel/Registration/Exhibit Deadlines Next Friday, February 9 (read more...)

Button Global Business Council Spring Conference Deadlines Next Friday (read more...)

Button Hotel/Registration Deadline Next Friday for the 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Tomorrow - Orange Chapter Dinner Meeting Featuring Presentation on Polished Polyimide Substrate (read more...)

Bullet French Chapter 2nd European ATW on Micropackaging and Thermal Management Begins Tomorrow (read more...)

Bullet Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs (read more...)

Bullet Phoenix Chapter Lunch Meeting Featuring Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing (read more...)

Bullet Indiana Chapter February 8 Tour of Marian, Inc. and Dinner Meeting (read more...)

Bullet United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007 (read more...)

Bullet Call for Papers - International Conference on Electronics Packaging (ICEP) 2007 (read more...)

Bullet SoCal’07 Symposium and Exhibition - Abstract Deadline Tomorrow, January 31 (read more...)

IMAPS Events (view full Web Calendar)

Early Exhibits Deadline Tomorrow, January 31, for IMAPS 2007 - 40th Anniversary Symposium   ^ Top
IMAPS 2007 is being held November 11-15, 2007, at the San Jose McEnery Convention Center in San Jose, California. The early booth reservation deadline is Wednesady, January 31, 2007, after which all fees will increase significantly. Reserve your booth before the deadline and save -

135 booths have already been reserved and the hall is selling fast. And with the enhanced benefits available, the hall is sure to be bursting at the seams!

The Annual IMAPS Symposium attracts 3,000 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

Exhibitor Benefits at IMAPS 2007
Included with your IMAPS 2007 Exhibition Space are the following benefits which add unpresidented value to your Booth Space Reservation. Not only is your Booth Rental Fee the very lowest in the industry, but you will also receive at no additional charge…

· One Full Symposium Registration.

· Complimentary Exhibit Hall Passes & Contest: Invite your customers and colleagues to IMAPS 2007 and you are entered into a contest to win a free-of-charge 10’x10’ booth at IMAPS 2008 in Providence, RI, for the exhibiting company with the most passes turned into IMAPS.

· Descriptive paragraph and contact information in the IMAPS 2007 Final Program.

The IMAPS 2007 post-show attendee list.

· Unlimited listings in the Products and Services section of the Final Program. Listings are also published in 2008 issues of Advancing Microelectronics.

· 365-Day Web Listing: Your company name, information and links to your company’s web site giving you the benefit of a virtual trade show.

A 12 month long marketing campaign that will include: conference brochures, e-mail broadcasts, direct mail, web banners and advertisements, both in print and electronically.

· Direct mail and telemarketing campaigns.

· E-mail Campaigns to more than 20,000 featuring exhibiting companies.

· Press releases, news items and your logo in the IMAPS Corporate Bulletin (sent to 20,000+ twice monthly).

Media press releases, press conferences, and pre-show activities.

· A show logo that you can place on your web site to promote your presence at the shows.

· An 8' high backdrape, 7" x 44" sign including company name and booth number and 33" high draped side rails.

Admission to the Welcome Reception where you can network with prospects, customers and old friends.

· Priority on-site booth selection in San Jose for your reservation for IMAPS 2008, Providence, RI.

Device Packaging Conference Hotel/Registration/Exhibit Deadlines Next Friday, February 9    ^ Top
3rd International Conference and Exhibition on Device Packaging

Doubletree Hotel
Scottsdale, Arizona USA
March 19-22, 2007

The Device Packaging Conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase. The conference aims to provide a focused forum to hear and discuss the latest technological developments in 5 topics areas related to microelectronics packaging: FlipChip/CSP; 3D Packaging; Optoelectronics; MEMS; and Biomedical. Technical presentations in these 5 topical areas will range from early stage design work and R&D, to systems manufacturing and production operations.

The professional development courses which are offered, as well as the vendor exhibition and technology showcase, are also focused on the microelectronics and packaging aspects of these 5 topical areas and should provide a very valuable added resource to people attending the conference. The Global Business Council (GBC) will be offering a stellar Spring Conference, March 18th & 19th which will focus on the business side of these technologies. There will also be several networking receptions and gatherings throughout the week, including the opening receptions, meals and other social events.

Global Business Council Spring Conference Deadlines Next Friday   ^ Top
The Global Business Council (GBC) is holding its Spring 2007 Conference in sunny Scottsdale, AZ, on March 18 & 19, 2007. This GBC Conference immediately precedes the IMAPS Device Packaging Conference, at the same location. Invited speakers from industry leaders and well-known market research companies, will share with you where they see the opportunities and challenges in the microelectronics markets. Several networking events are planned to allow full interaction with your industry peers.

The hotel cut-off and early registration deadline are next Friday, February 9, 2007. Hote rooms will be released at that time and rooms/pricing will not be guaranteed. All registration fees will increase as well. For details about the GBC 2007 Spring Conference, visit

Hotel/Registration Deadlines Next Friday for the 2nd ATW on Extreme Cold (Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments)   ^ Top
The 2nd Advanced Technology Workshop (ATW) on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments will be held February 27 through March 1, 2007, at the Embassy Suites Hotel in Arcadia, California (near Pasadena). For more information about Extreme Cold, to view the technical program and abstracts or to register on-line, visit The early registration deadline and hotel cut-off is February 9, 2007.

The objective of this Advanced Technology Workshop (ATW) is to have a unique technical forum that brings together industrialists, scientists, engineers, space agencies and academia who have been working in the area of advanced electronic package reliability and electronic device reliability in extreme cold to hot temperature environments. Studies in extreme thermal and radiation environments are extended beyond nominal operating temperature regimes and radiation levels. Validation of the electronic packages assembled with various electronic parts over a wide temperature range to infuse into future space missions is of significant value for space applications. The other goal of this ATW is to expedite the infusion of cutting-edge technology into present and future NASA projects, missions, and science instruments. This ATW is partially providing the mechanism to create an international network of electronics developers and systems designers by bringing together representatives from academia and the space agencies. This Workshop covers active and passive devices, circuits/systems, advanced packaging, instruments, and reliability under extreme cold to hot temperatures and radiation environments. This is the second workshop in a series that is being organized in the USA since there is a significant interest for NASA and other space agencies in missions to Mars, the Moon, Deep Space Missions and beyond.

Chapter Activities (events listed in chronological order)

Tomorrow - Orange Chapter Dinner Meeting Featuring Presentation on Polished Polyimide Substrate    ^ Top

Date/Time: Dinner & Presentation
6pm, Wednesday, January 31
Location: Embassy Suites, Anaheim Ca. (Glassel & 91)
Cost: $20 - members & guests
$8 - students
RSVP: Bill Gaines, (626)812-2199,

Polished Polyimide Substrate
John Farah, PhD 
OptiCOMP Networks, Inc

OptiCOMP Networks, Inc. has developed a polished polyimide substrate, which can be used both as a wafer and for electronic packaging applications. It combines the advantages of a low dielectric constant flexible substrate with the flatness and smoothness of a wafer. It can replace a silicon wafer in some applications. It can be metallized by plating and used to package silicon layers and multi-chip modules (MCMs) in high-density high-speed interconnects. It has dimensions similar to a silicon wafer and can be processed using thin film technology and semiconductor processing equipment to create optical and electrical circuits with micron size features. The substrate is made of pure (unfilled) organic opaque brown polyimide insulator with a mirror surface finish. The polyimide wafer is not solvent-based spin-on polyimide films and is different from Kapton sheet. The process used for fabricating the polyimide wafer yields a semi-crystalline polyimide boule or “ingot”, which is sliced and polished to yield bulk disks, which have superior physical and chemical properties to substrates made of laminated Kapton sheets. The polyimide is isotropic and retains most of its physical properties over the entire temperature range and is about ten times less water absorbent than Kapton.

Dr. John Farah at 508 431 2268 or e-mail:

French Chapter 2nd European ATW on Micropackaging and Thermal Management Begins Tomorrow    ^ Top
After the real success of the first issue, last year, the 2nd European ATW on Micropackaging and Thermal Management will be held, January 31 and February 1st, in La Rochelle on the French Atlantic coast.

The aim of the workshop will be to help exchange of information between scientists and engineers involved in the field of thermal management, for high integration levels. Due to the rising speed and miniaturization the mastering of thermal effects is and will keep being a technological key for the future packaging solutions.
After a welcome session, including two keynote addresses, the technical program will gather 21 papers in five sessions:

Session 1: Materials
Session 2: Applications
Session 3: Thermal modelling and reliability
Session 4: Advanced cooling solutions
Session 5: Test and Measurement Methods

The international dimension of the event is attested by half of the presentations from five different countries, including Belgium (4), Germany (2), United States (2), Spain (1) and Sweden (1). The language will be English.

The workshop site will be: “Hotel Mercure Oceanide” on Vieux Port Sud (Old harbour). It is organized on a global fees basis for registration, hotel (2 nights) and meals (2 dinners, 2 lunches). On Wednesday evening the participants are invited to the “Corderie Royale”, a historic manufacturer of naval ropes; after the visit the dinner will be served on site.

The registration deadline was January 26. You must now register on-site.

For registration, information or questions:
Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs    ^ Top

Date: Wednesday, February 7, 2007
Time: 11:45 AM – 1:15 PM
Location: Ramada Inn
1217 Wildwood Avenue
Sunnyvale, CA 94089
(408) 245-5330
Agenda: 11:30 AM – 12 PM -- Registration, Networking, Social
11:30 AM – 12:15 PM -- Buffet Luncheon
12:00 PM – 1:00 PM -- Speaker Presentation

Luncheon Fee
Members/Invited $15.00.  
Students (with ID) $5.00

Prices include lunch and program.  Please email Roger Underwood, to reserve your space today!  Registrations will be confirmed via email.  We accept cash and checks at the door.

Packaging Requirements to meet Future Directions and Needs
by Mr. Sunil Patel, Packaging Technologist
Seagate Technologies

Recent years have seen growing demands of data storage in digital electronic industry and this trend will continue further during the first decade of 21st century. Hard disk drives will remain the primary choice of storage devices in all segments of PC market and in many non-PC emerging markets. Form factor and capacity are the distinguishing critical features of storage devices for emerging mobile market segment. Small form factor requirements of hard disk drive pose many challenges to semiconductor devices at both component level as well as system/board level. Microelectronic packaging technology has evolved since past few decades and continues to make advanced development to meet current and future requirements. This talk will discuss the trends and role of packaging in hard disk drive applications. Various packaging options for key electronic components are discussed. Concept of system level solution is introduced to meet next generation consumer application requirements.

Mr. Sunil Patel is a Packaging Technologist at Seagate Technology where he is responsible to coordinate cross-functional development of ASIC packaging and addressing key issues for various phases of manufacturing and productization of disc drives. Prior to joining Seagate, Mr. Patel played a key role in defining ASIC package and board level assembly solutions at a small start-up company, providing solutions for storage area network demands. He has also worked at LSI Logic where he built a highly motivated team to develop and qualify industry’s first laminate flip-chip package. Mr.Patel and his team played a key role in establishing industry infrastructure by establishing a robust flip-chip assembly process at major semiconductor package and assembly sub-contractor facilities.

Mr. Patel has worked at Digital Equipment & Eastman Kodak, working on thin film deposition process as well as packaging development and also contributed to industry consortiums like MCC and Sematech.

Phoenix Chapter Lunch Meeting Featuring a Presentation By IMAPS President-Elect on Enabling High Density SiP Manufacturing    ^ Top
Please join the IMAPS Phoenix Chapter on Wednesday, February 7, 2007, for a discussion on:
Enabling High Density SiP Manufacturing - The use of Jetting Technology to minimize substrate area for underfill. The presentation will be given by Steve Adamson, IMAPS President-Elect, and Marketing Manager, Asymtek.

Date: Wednesday, February 7, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa, AZ 85202
Luncheon and presentation - $10.00
!!! Special - No Charge for pre-registered attendees !!! 

Vendor display tables available for $15.00

RSVP: RSVP by Feb 5th to: 

Consumer electronic devices have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs that put tremendous pressure on the use of the substrate area. Flip chip and micro-BGA devices are being used as on flex circuits and substrates for these markets. Underfilling these devices presents some fundamental problems for needle dispensing that Jet dispensing can eliminate. This presentation will review the merits of jetting verses needle dispensing.  It will be shown how with jetting it has been possible to save board space while improving throughput in real life applications. 

Steve will also take a few minutes to discuss recent developments in IMAPS and share with you the IMAPS executive council vision for the future.  He will also be looking for feedback on how to improve IMAPS.

Indiana Chapter February 8 Tour of Marian, Inc. and Dinner Meeting    ^ Top

Date: Thursday, February 8, 2007
Schedule: Tour Starts - 2:00
Social Hour - 4:00
Dinner - 5:00
Meeting - 6:00

Marian, Inc. Tour
Indianapolis, IN

Dinner & Meeting to follow at
The Rathskeller
Indianapolis, IN

IMAPS Members - $20.00
Non-Members - $22.00
Students - $5.00
RSVP: Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00pm on Tuesday, February 6, 2007.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email

Bill Witchger

President of Marian, Inc.


Marian converts soft materials into flexible component parts for assembly in consumer, industrial and scientific products.

Marian, Inc. was founded by Hugh Knoll, Sr. in 1954 as "Marian Rubber Products Company," a regional distributor of industrial rubber products. Our original building on East Market Street in downtown Indianapolis was 8000 square feet and it served primarily as a warehouse and distribution center. The key to our initial success was the commitment to satisfying customer needs displayed by Mr. Knoll.

After Mr. Knoll's untimely death in 1971, Eugene S. Witchger, a friend of the Knoll family, purchased the company. Mr. Witchger had recently taken early retirement from his long time position as Vice President of Schwitzer Corporation. Under Eugene's leadership, dedication, and customer focus, the fledgling company of 15 employees began to grow after early setbacks.

With the addition of Witchger's son William (Bill) in 1973, the company began to expand in fabrication and manufacturing capabilities. For example, by installing a lathe slitter in 1974, we became one of the first custom slitters of electrical and industrial pressure-sensitive tapes in the Midwest. The Witchgers' successful innovations, inherent attention to cost reduction, and constant focus on our customers has enabled Marian to continually expand fabrication and manufacturing techniques.

United Kingdom Chapter Unveils Speaker Program for its Annual Conference - MicroTech 2007    ^ Top
IMAPS UK has announced the speaker program for its MicroTech 2007 conference and exhibition. Starting on March 6th, the two-day conference will focus on advanced microelectronics interconnections, allowing delegates to explore the future challenges and technologies of the industry.

Speakers will include Indro Mukerjee, CEO of C-MAC MicroTechnology, who will be speaking on the panel at the Market Watch session, discussing the issue: "Is the supply chain broken?". Indro will outline the current challenges facing the UK engineering industry to recruit and retain skilled engineering students. With reference to recent research from C-MAC on the state of the UK engineering skills gap, he will articulate the role that academics, industry bodies, and companies should play in inspiring the next generation of British engineers.

Additional speakers on the panel will be Chris Bailey from the University of Greenwich, Dr. Kathryn Walsh from Director of the Electronics Enabled Products KTN,  Mike Trenchard from the Components Obsolescence Group and Aubrey Dunford from AFDEC.

David Lowrie, Conference Chairman of IMAPS UK, commented: "The IMAPS UK annual conference is now in its 35th year, and provides a fantastic platform for discussing all facets of the electronic industry's supply chain. In particular, the current skills crisis we are facing is at the top of the agenda and I am confident that this year's event will stimulate inspiring discussions about what the industry can do to reverse the current trend."

Indro Mukerjee commented: "As the head of a company with a long and proud British engineering and manufacturing heritage, I am extremely concerned about the future of British engineering if the apparent decline of engineering studies is not combated. It is imperative that the industry and academia recognises that a collaborative effort is required to shape the future of UK engineering, and the IMAPS conference will provide an  invaluable contribution in bringing this issue to the forefront of the industry ."

MicroTech is taking place at the Hellidon Lakes Conference Centre, Daventry, Northamptonshire on 6th & 7th March 2007.

For further information, or if you would like to attend the event, please contact:
Sylvia Outteridge
+44 (0)1522 575 212

Call for Papers - International Conference on Electronics Packaging (ICEP) 2007    ^ Top
Sponsored by:
IEEE CPMT Society Japan

Supported by

April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan

Technical Topics for Conference Papers:

Advanced Packaging, Area Array Packages, Board EMC Evaluation, Built-up Substrates, Bump Formation, Environmental Aspects, EPD/EAD Technology, Flip Chip Technology, High Speed Board Design, Interconnections, LCD Module Packaging, Lead Free Soldering, Manufacturing, Materials, MCM, MEMS Packages, Nano Technology,
Optoelectronics, Reliability and Testing, Stacked Structure, Substrate/Interposer, System in Package, Thermal Management, Thin Film Technologies, Trend and Education, Underfilling, VLSI Packaging, Wafer Level Packaging, etc.

Abstract and Paper Submission:

Abstracts were due Wednesday, November 15, 2006.

Formal paper manuscript should be sent by February 1, 2007.

Registration Fees:

Speaker 40,000 yen. (Including Reception and Proceedings)

Organizing Committee:

General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)

Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: or

SoCal’07 Symposium and Exhibition - Abstract Deadline Tomorrow, January 31    ^ Top
SoCal’07 Technical Symposium and Tabletop Exhibition, sponsored by IMAPS Southern California Chapters, will be held on May 16, 2007 at the Anaheim Hills Golf Course.  The Exhibition and Technical Program Committee are inviting exhibitors and papers.  We will be having a Golf Tournament in the morning, with papers presented from 10am until 5 pm

Technical Topics are but not limited to the following:

    • Advanced Materials and Processing
    • Nano Technology
    • MEMS
    • Surface Mount Technology
    • Homeland Security Technology
    • Advanced Microelectronics and Electronics Packaging
    • Components
    • Space and Military Electronics
    • Quality and Reliability
    • Thick and Thin Film Materials
    • Optoelectronics
    • Thermal Management
    • Lead Free Solder

Submission Deadlines:

    • 300 words Abstract and Bio Submission by January 31, 2007
    • Final Paper Manuscript Submission by February 29, 2007

Please submit papers and inquiries to exhibit to

General Chair
Bill Gaines, Northrop Grumman
Email:, Tel. (626) 812-2199


2nd ATW on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments
February 27-March 1, 2007
Arcadia, CA

Global Business Council Spring Conference
March 18-19, 2007
Scottsdale, AZ

3rd International Conference and Exhibition on Device Packaging
March 19-22, 2007
Scottsdale, AZ

*Exhibitors contact

ATW on Automotive Packaging
April 9-12, 2007
Dearborn, MI

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007)
April 23-26, 2007
Denver, CO

*Exhibitors contact

Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications (MASH)
May 8-10, 2007
Baltimore, MD

*Exhibitors contact

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-17, 2007
San Jose, CA

^ Top

National Training Center For Microelectronics



View the Electronic Bulletin Archives