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July 18, 2007

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Button Thermal Management Workshop - Student Abstract and Stipend Competition - Deadline On Monday! (read more...)

Button Advanced Technology Workshop on Thermal Management - Abstract Deadline Next Monday, July 23 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet 8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China  (read more...)

Bullet Arizona Chapter Lunch Meeting on The Role of Intermetallic Compound Formation on Package Reliability (read more...)

Bullet French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

Bullet MicroTech 2008 Call for Papers (read more...)

Bullet Two Weeks Remain For The Society Elections - Cast Your Vote Before It's Too Late! (read more...)

IMAPS Events (view full Web Calendar)

Thermal Management Workshop - Student Abstract and Stipend Competition - Deadline On Monday!    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. Information on this workshop can be found at

Celsia Technologies, IMAPS and The Microelectronics Foundation, Electronics Cooling Solutions, and DS&A LLC are offering a limited number of stipends for university students to attend the 2007 Advanced Technology Workshop on Thermal Management. The stipends will be in the form of a cash grant to be used towards the cost associated with attending the workshop. The amount of the grant will depend upon the number of winning submissions chosen by the ATW organizing committee, but will not be less than $500 per student. Applicants must be pursuing a college degree (B.S., M.S., or Ph.D.) in Science or Engineering. To compete for the stipend, candidate should submit an extended abstract with references of no more than five (5) pages on a topic of relevance to workshop attendees. Topics of relevance follow the paper solicitation topics for the workshop and are shown below. Winning submissions will be required to present their research at the workshop in September 2007.


Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 23, 2007. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, August 24, 2007. A post-conference CD will be distributed to all attendees containing the full presentation material as supplied by authors.

Abstracts must be submitted on-line at
E-mail or phone Jackki Morris-Joyner with questions: or 305-382-8433.

Advanced Technology Workshop on Thermal Management - Abstract Deadline Next Monday, July 23    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The call for abstracts is now available on-line at Abstracts must be submitted before July 23, 2007.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop (ATW) on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS ATWs that are held each year. The 2006 Workshop featured 41 presentations, five of which were competition-selected graduate student papers.

Chapter Activities (events listed in chronological order)

8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China   ^ Top
Since 1994, ICEPT has been held for seven times in Beijing, Shanghai and Shenzhen of China, respectively. Since 2005 ICEPT has been held once a year due to rapid development of electronics packaging. As the only international electronics packaging technology conference organized and supported by authoritative academic organizations and leading industries, each ICEPT has attracted hundreds of participants from colleges, research institutes, packaging testing manufacturers, packaging testing equipment factories, packaging materials factories including distinguished experts, scholars and enterprises. The conference highly focuses on semiconductor packaging design, semiconductor packaging manufacturing, semiconductor packaging testing, LED packaging, MEMS packaging, system packaging and assembly, etc. The conference, which is domestically the highest-level and the most large-scale event for electronics packaging and testing technology, has become an important communication platform for advanced packaging technology. The 8th ICEPT will be held from August 14-17, 2007, in Shanghai, which is the biggest base of the Chinese microelectronics industry and the financial hub. We sincerely invite your participation.

Conference Information

Training course:
1)Registration time for training course: In the afternoon of August 13th, 2007 (Monday)
2)Training course-attending time: August 14th, 2007 (Tuesday)

1)Conference-attending registration: August 14th, 2007 (Tuesday)
2)Conference time: August 15th-17th, 2007 (Wednesday to Friday)

: Sofitel Jin Jiang Oriental Hotel, 889 South Yang Gao Road, Pudong New Area, Shanghai, China

Conference Website:
Conference Scale:
400-500 participants

Conference Content:

  1. Advanced Packaging & System Packaging: BGA, CSP, flip chip, WLP, nano-packaging, Cu/low-K packaging, 3D packaging, SiP and other advanced packaging and integration technologies.  
  2. High Density Substrate & SMT: HDI, PCB, high performance multi-layer substrate, embedded substrate, micro via, microjoin, stencil print, reflow, and other novel assembly technologies that improve substrate density and performance.
  3. Packaging Design & Modeling: novel designs for various packaging/assembly, modeling, simulation and characterization solutions for electrical, thermal, optical & mechanical properties, multi-function & multi-scale modeling, simulation, validation methods and software technologies.
  4. Packaging Materials & Processes: interconnection and encapsulation materials including bonding wires, solder balls, solder pastes, conductive pastes, underfillings, plastic packaging materials, adhesives, thin-films, dielectric materials, substrate materials, frame materials, green electronic materials and other novel materials that enhance the packaging properties and reduce the cost,and various packaging and assembly processes.
  5. Advanced Manufacturing Technology: photolithography, laser processing, novel packaging/assembly technologies, advanced methods/softwares for modeling and monitoring of process effectiveness and cost analysis, and related manufacturing equipments.
  6. Emerging Technologies: sensors, actuators, MEMS, NEMS and MOEMS, optoelectronics & LED packaging, LCD, solid state lighting, passive and RF devices, power & HV devices, nanodevices based on nanowire, nanotubes and polymers, etc.
  7. Quality & Reliability: Quality monitoring and evaluation for packaging/assembly, advanced methods/technologies/tools for rapid reliability data collection and analysis system, reliability modeling & prediction, reliability issues in emerging technologies, testing equipments for quality control and reliability.

Conference Sections
Symposium, short course, academic communication, exhibition of new product & technology

Who Should Attend
Attendees of this conference in the past have been engineers, research scientists, equipment and material vendors, representatives from various packaging companies of packaging technology for IC, MEMS, Optoelectronics, LEDs, LCD, Magnetic Head, Sensors and PCB packaging and assembly. Due to the booming growth of the electronic/optoelectronic and emerging MEMS packaging industry in mainland China (including more than 300 IC packaging companies and several hundred LED packaging companies), this conference will provide a perfect platform for the exchange of information, research and industry development, and recruitment of young engineers.

For more information, please go to our website of

Arizona Chapter Lunch Meeting on The Role of Intermetallic Compound Formation on Package Reliability   ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: The Role of Intermetallic Compound Formation on Package Reliability. Lead free solders including SAC and AuSn will be presented by Jonathan Harris, PhD, President of CMC Interconnect Technologies.

Date: Thursday, 23 Aug 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $15.00

Special - No Charge for pre-registered attendees. (Vendor Tables available for $15)

RSVP by 20 Aug 2007 on-line at or by email -

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organise the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organised in five sessions including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK.
Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK are looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

  1. Emerging Applications
  2. Future Interconnections
  3. Developing Technologies
  4. System Integration
  5. Advanced Substrates
  6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   

Membership Information

Two Weeks Remain For The Society Elections - Cast Your Vote Before It's Too Late!    ^ Top
The society elections are only open to IMAPS Individual, Affiliate and Corporate Members. Voting concludes on Tuesday, July 31, 2007 at Noon EDT. Do your part to help shape the future of the Society - Don’t forget to vote on-line at!

The following National Offices are up for election this year: President-Elect, Vice President of Membership, Treasurer, Regional Director - Northwest and Regional Director - Southeast. In addition, modifications to the Society bylaws have been approved by the Executive Council and are being proposed to the membership for a review and vote.

Delip "Doug" Bokil
Namark Associates

APS Experience:
- Member since 1974
- Awarded "Fellow of the Society", [1997]
- Editor-in-Chief, Journal of Microelectronics and Electronic Packaging [2004 - 2006]
- NE Chapter: Secretary, Treasurer, Vice-President and President [1987 and 1988]
- NE Regional Director - two terms - four years
- Secretary ISHM Executive Council
- Along with Roger Cadenhead, instrumental in expanding ISHM's focus and ISHM subsequently became IMAPS - International Microelectronics and Packaging Society
- Technical Chair: IMAPS 1987 [Atlanta] and 1994[Boston]
- General Chair, IMAPS International Symposium, Boston, 2003
- Session Chair for Fuel Cells Technology and Packaging, IMAPS-NE 33rd. Annual Symposium [2006]
- Technical Chair, IMAPS-NE 34th. Symposium & Expo [2007]

Work Experience:
- Worked for: Sprague Electric, RCA, Analog Devices, Film Microelectronics, Motorola-Codex, Computer Products, Universal Power Devices (China), Cabletron and Environmental Systems Products.
- As a test engineer, process engineer, Senior Member Technical Staff, Principal Engineer, Manufacturing Eng Mgr, Director, VP , Part-Owner [FMI], Consultant
-At locations in the USA, Philippines, Taiwan, China, Japan, UK, Portugal, Italy and India
- Dealing with design, manufacture and test of electronic components and assemblies, military electronics, thick and thin films, microelectronic packages, Multi-Chip Modules and environmental sensors.
- Currently working as a consultant for my own company Namark Associates [registered in Winchester, MA]

Other Volunteer Work:
- Co-founded the Winchester (MA) Soccer Club and worked with virtually every youth age group during my 10+ years as a coach.
- Designed web-site for Winchester Seniors Association [2005]

Master of Science, Management, NORTHEASTERN UNIVERSITY, Boston, MA
Bachelor of Technology Electronics and Communications, INDIAN INSTITUTE OF TECHNOLOGY, Kharagpur, India

Entrepreneurial Training Program, The Enterprise Center, Woburn, MA
Certified Quality Engineer, ASQC, Andover, MA
Technology Manager's Program, Babson College, Wellesley, MA

[a] COMPUTER: WindowsXP, MSWord, MSProject, Excel, PowerPoint, Access, MathCad, RelCalc, StatGraphics, Visio
[b] DESIGN and MANUFACTURING: DFMA, DFT, FMECA, Microelectronics Assembly and Packaging
[c] QUALITY and RELIABILITY: Six Sigma methodology, SPC, and MTBF Analysis

"Application of Sensors in Automotive Emissions Testing" presented at IMAPS-2003.
"Product of the Year" award from Electronics Products magazine.
"Best Paper of the Session" award from ISHM.
"FIM plates temper converter heat" EE Times
Two patents for a thick-film high voltage transformer and an infrared glass sealing process.


US Citizen
Married with two sons

Rajen Chanchani, Ph.D.
Sandia National Laboratories

Rajen Chanchani is currently a Principal Member of Technical Staff at Sandia National Laboratories, Albuquerque. He received Ph.D. and M.S. in Materials Science & Engineering from the University of Florida and received B. Tech. in Metallurgical Engineering from the Indian Institute of Technology, India. Rajen has an extensive experience in micro-systems packaging, chip-scale-packaging, multi-chip modules, thin and thick-film hybrid circuits, flip-chip, MEMS packaging, surface mount technologies and thermo-mechanical modeling & simulation.

Rajen is an IMAPS Fellow, IEEE Fellow and winner of 2004 IMAPS William D. Ashman Award for his work on new advanced packaging technologies. Rajen is recipient of the Best Conference Paper Award at the 1994 International Society of Hybrid Microelectronics Annual Conference in Boston and Micro-system 2005 in Munich, Germany. Rajen has several patents and published over 80 papers at IMAPS, IEEE, and AIME sponsored conferences, publications and books. In addition, Rajen has taught several short courses on advanced packaging topics at various conferences.

Rajen has been actively involved in IMAPS for last 16 years as presenter at conferences, program committee member, William D. Ashman Award Search Committee member and organizer of IMAPS conferences. He was the Technical Chair of 2006 IMAPS Symposium in San Diego, General Chair (2002) and Program Chair (1994-95) for IMAPS-sponsored Advance Packaging Materials Conference in Ojai, Ca and Atlanta, GA.

Rajen has 25 years of experience in microelectronic assembly and packaging. At Sandia National Labs, Rajen has been managing packaging-related projects for the defense and non-defense applications since 1990. The projects include the development of mini Ball Grid Array - a chip-scale package, high density interconnection substrates, multi-chip modules, photonic & MEMS modules and thermo-mechanical modeling. Prior to Sandia National Labs, Rajen worked at AT&T Bell Laboratories in Allentown, PA in thin and thick film hybrid integrated circuit and multi-chip module technologies and at AVX Corp. in Myrtle Beach, SC.

Rajen’s track record with IMAPS activities, his work experience and enthusiasm for the advancement of packaging technologies will be a valuable asset for IMAPS leadership.

Vice President of Membership:

Michael O’Neill
Heraeus Inc. - Thick Film Division
Michael P. O’Neill is the current Vice President of Membership of IMAPS. Mike has been actively involved with IMAPS for 15 years and has worked in the electronics materials business over 20 years in various technical and business positions.

During his current term as Vice President of Membership Mike has been a catalyst for ideas and change that have propelled our society forward. Mike has been focused on increasing the value for membership through leadership in the following areas: repositioning the society based on the 4-tiers model, update of the IMAPS website and Advancing Microelectronics magazine, expanding IMAPS sponsorship program, creation of a truly global GBC program, initiation of quarterly local chapter leadership conference calls, creation of upgraded keynote program at the annual symposium, and other initiatives. More recently Mike is involved with providing leadership to developing a forward looking approach to applying e-Learning and e-Communities to further broaden IMAPS’ reach.

Mike was the Chairman of the Global Business Council Steering Committee from 2003-2005 and presided over the revitalization and globalization of this key business initiative. Mike led the introduction of a successful business program to the international symposium. He has been a member of the MMRC (now GBC) Steering Committee since 1998.

Currently, Mike is the Western Sales Manager for Heraeus Inc., Thick Film Division. Mike recently held the positions of Global Business Segment Manager, LTCC Products, and Director of Marketing and Sales for Heraeus Circuit Materials Division. Mike worked for the DuPont Company in Sales, Technical Service and R&D. He also was a leader and facilitator in an initiative to introduce organizational effectiveness and teamwork to the Electronics Business Unit.
Mike has published numerous papers addressing LTCC technology and is a member of the Advisory Board of Passive Components Magazine. He intends to apply his broad experience to help enhance the value of IMAPS for all members.

Bill Kidder
Process Technology Engineering

Bill has been involved in hybrid microelectronics for 27 years, working with design, manufacturing, and quality to develop and produce performance based products for applications ranging from lawn mowers, utility meters, electric power tools, and a variety of sensors and modules for the OEM automotives and some aerospace devices.

Bill has had the opportunity to have worked across a broad range of applications; this exposure held his interest as it allowed him to work along side some of the best and brightest engineers in these fields.

Bill’s career has taken many turns after completing his bachelor’s at WIU, and taking the steps to earn a masters degree at Iowa by attending night school. What he learned as he charted his course over a wide variety of disciplines involving design as well as product development, improving yields, throughput, and meeting quality metrics that positively impact the bottom line… the opportunity to work on the commercialization of many new products and to be a contributing member on several US patent application filings is what excites him.

Bill’s most rewarding moments have been helping young engineers find that missing element to complete the successful launch of their latest design or first patent filing. It’s a feeling of accomplishment he has enjoyed.

Bill’s involvement with ISHM began with his first post out of graduate school in 1980, then at Allen-Bradley, his membership was that of an eager newbie trying to grasp the basic principles from those around him so he could carry his own weight and contribute.

Today, Bill realizes that his contacts and professional progress seems to mirror his membership in IMAPS. When he was involved and actively engaged, things moved forward faster, easier, and meaningful contributes resulted. Serving as the Chicago/Milwaukee Chapter Treasurer for the past 5 years has given Bill great pleasure and satisfaction; it has ensured that he is always close to the action.

David Virissimo
Semiconductor Packaging Materials
Western Regional Sales Manager for Semiconductor Packaging Materials, A New York Based Manufacturer of Electronic Component Interconnect Solutions. David is located in San Diego California. David has most recently served 2 terms as the Southwest Regional Director for IMAPS. David has been Chairperson, Vice Chair/Programs Chair and Treasurer of the Local IMAPS San Diego Chapters. He is still an active member of the San Diego Chapters Board with the duties of Newsletter Circulation. David has been involved with the SoCal Symposiums as Chairperson for the SoCal 2000 and exhibits Co-Chair in 2003. David has also been involved with the National Symposium on 3 occasions. Most recent, David served as Co-Chair of Marketing for the IMAPS 2006 in San Diego. In the 1998 National Symposium held in San Diego, he was the Co-Chair for Exhibits. David served as Co-Chair for the 10th Annual Sidney J. Stein Education Foundation Golf Tournament held in Long Beach during the IMAPS 2004 National Symposium.
Regional Director - Northwest:
John Zhang, Ph.D.
Finisar Corporation

Dr. Zhang obtained his Bachelor of Science degree in Mechanical Engineering from Qinghua University in Beijing, China and earned his Ph.D. in Materials Science from Cambridge University in England in 1990. Since 1995, he has worked for microelectronics and fiber optics companies in both Southern California and Silicon Valley.

Dr. Zhang worked for TRW Space & Electronics, Redondo Beach, CA, producing communication satellites. Afterwards, he moved on to JDS Uniphase, San Jose, CA, producing pump lasers used in fiber optics communication systems. After that, he worked for M/A-Com, a unit of Tyco Electronics, producing military electronics components and subsystems. Currently he is with Finisar corp, an optical transceiver company. He specializes in device packaging and hermetic sealing. He is an expert on small volume epoxy dispensing and outgassing issues. He is well versed in all backend processes such as epoxy attach, wire bonding, soldering and laser welding. He is a strong advocate for Six Sigma process control and domestic automated assembly operations.

Dr. Zhang is an avid soccer player. One of his most satisfying project is to help organize Chinese Session with invited speakers only (Chinese translated to English) for the IMAPS 40 year anniversary symposium this coming November in San Jose. An effort within IMAPS to help bridge the culture differences and expand IMAPS reach into China.

Regional Director - Southeast:
Kinzy Jones, Ph.D.
Kinzy is a Principal Staff Scientist in the Motorola iDEN Mechanical Design Center and a staff member of the Seamless Mobility Team. He received his Ph.D. from the University of California at Berkeley in Material Science and Engineering in 1999. His current focus is improving the understanding of the mechanical reliability of electronic packages through mathematical modeling and experimental verification. Previously, he had developed six sigma statistical methods for improving process development of advanced interconnect technologies. Other areas of research includes thermodynamic and kinetic modeling of Pb-free solders, developing novel micro heat transfer devices such as chip scale heat pipes and development of low temperature co-fire ceramic multi-chip modules with increased mechanical reliability. He has published over 35 papers in journals and technical meetings. He is a member of IMAPS, ASME and IEEE and was a member of the TMS Young Leaders program.


Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
3/16/2008 - 3/17/2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
3/17/2008 - 3/20/2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact

^ Top

National Training Center For Microelectronics



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