Thermal Management Workshop - Student Abstract and Stipend Competition ^
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. Information on this workshop can be found at www.imaps.org/thermal.
Celsia Technologies, IMAPS and The Microelectronics Foundation, Electronics Cooling Solutions, and DS&A LLC are offering a limited number of stipends for university students to attend the 2007 Advanced Technology Workshop on Thermal Management. The stipends will be in the form of a cash grant to be used towards the cost associated with attending the workshop. The amount of the grant will depend upon the number of winning submissions chosen by the ATW organizing committee, but will not be less than $500 per student. Applicants must be pursuing a college degree (B.S., M.S., or Ph.D.) in Science or Engineering. To compete for the stipend, candidate should submit an extended abstract with references of no more than five (5) pages on a topic of relevance to workshop attendees. Topics of relevance follow the paper solicitation topics for the workshop and are shown below. Winning submissions will be required to present their research at the workshop in September 2007.
PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 23, 2007. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, August 24, 2007. A post-conference CD will be distributed to all attendees containing the full presentation material as supplied by authors.
Abstracts must be submitted on-line at www.imaps.org/abstracts.htm.
E-mail or phone Jackki Morris-Joyner with questions: email@example.com or 305-382-8433.
Advanced Technology Workshop on Thermal Management - Abstract Deadline Extended Until July 23 ^
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The call for abstracts is now available on-line at www.imaps.org/thermal. Abstracts must be submitted before July 23, 2007.
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.
This Advanced Technology Workshop (ATW) on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS ATWs that are held each year. The 2006 Workshop featured 41 presentations, five of which were competition-selected graduate student papers.
IMAPS to Present Technical Session at SEMICON West 2007 ^
Steve Adamson of Asymtek and IMAPS President-Elect has been asked to Chair an IMAPS Technical Session at SEMICON West. The IMAPS Session will take place on July 18, 2007, from 3:00 – 5:00 in the afternoon and will feature the cutting edge technology that IMAPS delivers worldwide. The IMAPS Session will take place in the Mosconi Center – West Hall. Visit the SEMICON West website for more details on this IMAPS Session.
“Semi and IMAPS are exploring ways in which the two organizations can work cooperatively. We have started this process by putting together a group of five well regarded experts in the field of microelectronics and electronic packaging for this special session at Semicon West in San Francisco. The abstracts we’ve received indicate that the IMAPS session at SEMICON West will be of the highest caliber”, Adamson said.
The following speakers have already committed papers to the IMAPS session:
Novel Method of BGA Coplanarity Reduction at the Ball Attach Process
Rick Lathrop, Heraeus;
Lithography-Grade Controlled Expansion Substrates for Wafer Level Packaging
Greg Rudd, SpectraMat
IC packaging technologies - What's New? What's Next?
Joe Fjelstad, Siliconpipe
Title -- TBD
Michael Todd, Henkel.
This session at Semicon West will reflect the quality of papers that will be presented at the 40th IMAPS International Symposium on Microelectronics in San Jose, from November 11th – 15th.
Please show your support for this select group of speakers and IMAPS by attending this special session at Semicon West.
Orange Chapter Dinner Meeting Tonight, June 28 ^
The Orange Chapter Dinner Meeting on June 28 will feature a presentation on "Bumped Flex Circuit Technology" by Peter Hudson, Ph.D., NanoSolutions.
Dinner & Presentation
6pm, Thursday, 28 June
$20, members & guests, $8 students
Embassy Suits, Anaheim Ca. (Glassel & 91)
3100 E Frontera, Anaheim - (714) 632-1221
RSVP to: Bill Gaines, (626)812-2199, firstname.lastname@example.org
Precision bumped flex circuits are a product of electroforming technology developed over many years of creating solutions for high-density, high-speed, rugged interconnect requirements of Hughes’ aircraft, satellite, and missile products.
The unique, 3-D precision features of the circuits enable interesting new options for emerging and future interconnect requirements. The technology has recently been extended into lower cost automotive, telecommunication, and medical applications, and we believe the best fit of the technology will continue to be situations where the precision features provide solutions to challenging speed, density and assembly requirements.
This presentation serves as an overview of the basic technology and highlights some existing classes of product applications in low profile, high-density interconnect, low cost PC-based MEMs integration, and medical devices on flex. We hope that this material will introduce the IMAPS members to Precision Bumped Flex Circuit, and open the technology as a potential solution for new, challenging interconnect applications.
Dr. Pete Hudson has over 30 years experience in the Integrated Circuit and Packaging Technology Industry. In previous occupations he was the Army Very High Speed Integrated Circuit (VHSIC) Program Manager and the Manager of GM's technology development of Bumped Flex for Power Train Controller applications. He is currently the leader of the NanoSolutions Flex Circuit Unit.
8th International Conference on Electronics Packaging Technology (ICEPT 2007) - August 14th – 17th, 2007, Shanghai, China ^
Since 1994, ICEPT has been held for seven times in Beijing, Shanghai and Shenzhen of China, respectively. Since 2005 ICEPT has been held once a year due to rapid development of electronics packaging. As the only international electronics packaging technology conference organized and supported by authoritative academic organizations and leading industries, each ICEPT has attracted hundreds of participants from colleges, research institutes, packaging testing manufacturers, packaging testing equipment factories, packaging materials factories including distinguished experts, scholars and enterprises. The conference highly focuses on semiconductor packaging design, semiconductor packaging manufacturing, semiconductor packaging testing, LED packaging, MEMS packaging, system packaging and assembly, etc. The conference, which is domestically the highest-level and the most large-scale event for electronics packaging and testing technology, has become an important communication platform for advanced packaging technology. The 8th ICEPT will be held from August 14-17, 2007, in Shanghai, which is the biggest base of the Chinese microelectronics industry and the financial hub. We sincerely invite your participation.
1）Registration time for training course: In the afternoon of August 13th, 2007 (Monday)
2）Training course-attending time: August 14th, 2007 (Tuesday)
1）Conference-attending registration: August 14th, 2007 (Tuesday)
2）Conference time: August 15th-17th, 2007 (Wednesday to Friday)
Sofitel Jin Jiang Oriental Hotel, 889 South Yang Gao Road, Pudong New Area, Shanghai, China
Conference Website: http://www.icept.org
Conference Scale: 400-500 participants
- Advanced Packaging & System Packaging: BGA, CSP, flip chip, WLP, nano-packaging, Cu/low-K packaging, 3D packaging, SiP and other advanced packaging and integration technologies.
- High Density Substrate & SMT: HDI, PCB, high performance multi-layer substrate, embedded substrate, micro via, microjoin, stencil print, reflow, and other novel assembly technologies that improve substrate density and performance.
- Packaging Design & Modeling: novel designs for various packaging/assembly, modeling, simulation and characterization solutions for electrical, thermal, optical & mechanical properties, multi-function & multi-scale modeling, simulation, validation methods and software technologies.
- Packaging Materials & Processes: interconnection and encapsulation materials including bonding wires, solder balls, solder pastes, conductive pastes, underfillings, plastic packaging materials, adhesives, thin-films, dielectric materials, substrate materials, frame materials, green electronic materials and other novel materials that enhance the packaging properties and reduce the cost，and various packaging and assembly processes.
- Advanced Manufacturing Technology: photolithography, laser processing, novel packaging/assembly technologies, advanced methods/softwares for modeling and monitoring of process effectiveness and cost analysis, and related manufacturing equipments.
- Emerging Technologies: sensors, actuators, MEMS, NEMS and MOEMS, optoelectronics & LED packaging, LCD, solid state lighting, passive and RF devices, power & HV devices, nanodevices based on nanowire, nanotubes and polymers, etc.
- Quality & Reliability: Quality monitoring and evaluation for packaging/assembly, advanced methods/technologies/tools for rapid reliability data collection and analysis system, reliability modeling & prediction, reliability issues in emerging technologies, testing equipments for quality control and reliability.
Symposium, short course, academic communication, exhibition of new product & technology
Who Should Attend
Attendees of this conference in the past have been engineers, research scientists, equipment and material vendors, representatives from various packaging companies of packaging technology for IC, MEMS, Optoelectronics, LEDs, LCD, Magnetic Head, Sensors and PCB packaging and assembly. Due to the booming growth of the electronic/optoelectronic and emerging MEMS packaging industry in mainland China (including more than 300 IC packaging companies and several hundred LED packaging companies), this conference will provide a perfect platform for the exchange of information, research and industry development, and recruitment of young engineers.
For more information, please go to our website of http://www.icept.org.
French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007 ^
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.
As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.
The “Centre Pierre Baudis” premises allow us to organise the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organised in five sessions including a total of 34 papers.
In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations.
In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”.
In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers).
Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.
The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93
Or visit the chapter web site, www.imapsfrance.org.
MicroTech 2008 Call for Papers ^
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK. Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.
The special topic of MicroTech 2008 is “Chip to System … Interconnect & Packaging ”. IMAPS UK are looking for visionary technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.
This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs. The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.
We are inviting Key technical papers covering:
- Emerging Applications
- Future Interconnections
- Developing Technologies
- System Integration
- Advanced Substrates
- Nano-Tech Integration
Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.
Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB.
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582