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November 20, 2007

AI Technology

   IMAPS EVENTS
Button November 30 Deadline -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging (read more...)

Button Abstracts Still Being Accepted for the International Conference and Tabletop Exhibition on Alternative Energy (read more...)

Button Deadline Extended to December 5 for the International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) (read more...)

Button IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) Moves to Munich, Germany in 2008! (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet New England Chapter 2008 Symposium and Expo Theme Contest - Deadline Monday, November 26 (read more...)

Bullet New England Chapter Dinner Meeting with Presentation on Nanomaterials: Revolutions Never Go As Planned (read more...)

Bullet Florida Chapter Dinner Meeting with Presentation on Origami Packaging - Novel Printed Antenna Technology for Ad-hoc Sensor Applications (read more...)

Bullet Third European ATW on Micropackaging and Thermal Management, January 29-31, 2008 La Rochelle, France (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS 2007 Proceedings Now Available (read more...)

IMAPS Events (view full Web Calendar)

November 30 Deadline -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging    ^ Top
IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging being held in Scottsdale/Fountain Hills, Arizona, from March 17-20, 2008. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types.

The format again this year will feature five workshops concentrating on:

These workshops have been at the core of previous Device Packaging Conferences and are a continuation of past successful IMAPS Advanced Technology Workshops. This format will provide a forum for the presentations of leading-edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

Those wishing to present in one of the workshops of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Wafer Level Packaging/Embedded Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2007.

Abstracts Still Being Accepted for the International Conference and Tabletop Exhibition on Alternative Energy    ^ Top
The Alternative Energy Conference will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, April 8-10, 2008. This conference is a continuation of last years first Alternative Energy Conference and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

Solar - Photovoltaics
Fuel Cells
Geothermal
BioFuels
Batteries and Hybrids
Wind
Other Approaches

Thermal and Power Management
Inverter Materials and Design
Grid and Storage Approaches
Design for Efficiency

Materials & Reliability
Qualification Approaches
Environmental Regulations
Government/State Policies and Incentives

Those wishing to present a paper at the Energy Conference, please submit a 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the energy field, application area, design, and process/material, the submission section will aid in grouping the work within these four areas.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on March 7, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Deadline Extended to December 5 for the International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008)    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico. HiTEC 2008 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2008 will be the forum for presenting leading high temperature electronics research results and applications requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers are being sought from, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

TO SUBMIT AN ABSTRACT:
Those wishing to present a paper at the HiTEC 2008 Conference must submit a 200-300 word abstract electronically by December 5, 2007, using the On-Line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on April 4, 2008.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) Moves to Munich, Germany in 2008!    ^ Top
The 4th International Conference and Tabletop Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) will be held at the Holiday Inn - City Centre in Munich, Germany, from April 21-24, 2008. CICMT is being relocated to Europe in 2008, the United States in 2009 and Asia in 2010, to truly globalize this event and draw in even more participants from these areas of the world that have already been involved with the conference, and drive the industries and technologies that it respresents.

The CICMT conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Low temperature co-fired ceramic (LTCC) multilayer, thick film hybrid, and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

CICMT 2008 is being sponsored by IMAPS, ACerS, IMAPS Germany and DKG. Visit www.cicmt.org for more information on the 2008 Conference, and to submit your abstract on-line.

Chapter Activities (events listed in chronological order)

New England Chapter 2008 Symposium and Expo Theme Contest - Deadline Monday, November 26    ^ Top
The New England Chapter 007 theme for the 34th symposium and expo was a great and fun success. You know we like to dress up and have a little fun. This year we are opening up the theme suggestion to our members for our 35th Symposium and Expo which will be held May 6th 2008 at the Holiday Inn Boxborough Woods, Boxborough, MA. Submission Deadline is November 26th. For more information, visit www.imapsne.org.

Past themes include: ‘007 Technology Shaken Not Stirred’; Texas Hold Em’; Hawaiian; and Cinco De Mayo.

  • Announcement and prizes will be given at the December 4th Technical Chapter Meeting
  • One (1) First Prize – 4 GB iPod Nano – 1000 song, video, photo capability (award winner does not need to be present at the Chapter meeting – but is strongly encouraged)
  • Ten (10) 2 GB – flash drives – issued to the first 10 contest submissions (award winner does not need to be present at the Chapter meeting – but is strongly encouraged)
  • You must be a current IMAPS Member
  • Entries will be judged on originality and feasibility of execution.  
  • Judging will be by a secret IMAPS New England Panel.  
  • Submission Deadline is November 26th
  • Members of Executive Committee are excluded from participation.

For more details and to submit your theme suggestions, visit http://www.imapsne.org/docs/08_symp_exp_theme_contest.doc. You can also send e-mail to: Contest@imapsne.org or fax to 508-222-0220 attention Mark Occhionero.

New England Chapter Dinner Meeting with Presentation on Nanomaterials: Revolutions Never Go As Planned   ^ Top

Date: Tuesday, December 4, 2007
Schedule: 5:30 p.m. Registration, Socializing, Networking & Cash Bar
6:30 p.m. Dinner
7:30 p.m. Presentation by F. Mark Modzelewski - VP Strategic Opportunities at NanoDynamics
Location:

Westford Regency Inn & Conference Center
219 Littleton Road
Westford, MA 01886
978.692.8200

Directions: I-495 to Exit 32 for Boston Road toward Westford 0.2 mi. Keep right at fork, follow signs for Rt-225/Littleton/Rt-110/Groton and merge onto Boston Rd. 0.1 mi. Turn right at Littleton Rd/Rte. 110 - 0.4 mi.

Cost:

Meeting Only: No Charge

Meeting with Dinner:
Members: $25.00
Non-Members: $30.00

Retired Members: $20.00
Student Members: $5.00

"Nanomaterials: Revolutions Never Go As Planned"

Abstract:

In 2001 over 500 nanotech start-ups launched across the world. Venture dollars were pouring into the field. The federal government made an unprecedented investment in the field to ensure US leadership.

Nothing was to be left untouched by nanotech's power: materials, manufacturing, semiconductors, medical treatments, energy, even life itself.  Time, Newsweek, Wall Street Journal, CBS, the Washington Post and other media outlets had headlines screaming that the world was about to change overnight.  The financial markets were supposed exposed to explode with the new Microsoft’s, Netscape’s and Genzyme’s. Then......silence.

Today, venture capital has all but abandoned the nano space.  No companies have successfully IPOed. There are real questions as to whether the federal government will continue the National Nanotechnology Initiative.  What happened to nanotech?  Is the field going to remain so small that no one cares? Or is it hiding below the surface about to deliver on its promise and more?

F. Mark Modzelewski is the Vice President of Strategic Opportunities at NanoDynamics Materials Company, where he develops new partnerships, collaboration, licensing and investment opportunities. He previously co-founded the Benet Group, Leonardo BioSystems, Lux Research, and the NanoBusiness Alliance. He has served as a senior executive at Opion, GolinHarris and NRW. In addition, he has consulted for companies ranging from NanoSys to Engelhard to MasterCard to Yahoo to eSpeed to Pixar to DaimlerChrysler.

Mark is a member of the Nanotechnology Technical Advisory Group to the President’s Council of Advisors on Science and Technology (PCAST). He is among the most well known figures in technology and was recognized by Forbes as a "powerbroker" and has been featured  in Time, Newsweek, US News, ABC, BBC, NY Times, Business Week, Fortune, Wall Street Journal, among  others.  Mark also appeared regularly as CNBC technology commentator and on occasion as a co-host of SquawkBox.

Before entering the private sector, Mark was an appointee in the Clinton Administration developing policy, legal and communication strategy efforts on issues ranging from Y2k preparedness, US mortgage and banking systems, the online transformation and integration of HUD and FHA programs, digital divide efforts, biotech and organic food standards, and regional economic development programs. He is a graduate of the University of Denver College of Law and Boston University.

Reservations must be received by Wednesday, November 28th

Send Registrations to: Susan Munyon
96 Grant Way, Lancaster, MA 01523-3112
e-mail SusanMunyon@comcast.net
978-466-1877 phone/fax

Bring checks payable to “IMAPS New England”

At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, December 3rd or the Chapter is billed for your meal.

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner. Dinner Choices: 1) Breast of Chicken, Apple and Brie with Boursin Sauce, 2) Baked Stuffed Fillet of Grey Sole with Lobster Sauce

For more information, visit www.imapsne.org/meeting.html.

Florida Chapter Dinner Meeting with Presentation on Origami Packaging - Novel Printed Antenna Technology for Ad-hoc Sensor Applications   ^ Top

Date: December 6, 2007
Schedule: 6-7 pm Social
7pm Dinner w/presentation following
Location:

Holiday Inn Select, Orlando Airport
5750 T.G. Lee Blvd
Orlando, FL
407-851-6400

Cost:

$25, dinner includes entrée, salad, coffee/tea, and dessert

Exhibits: We are offering tabletop space for suppliers with power for $150 each while spaces last. Set up is at 5pm with the event over by 9pm.
Contact:

Tim Davis
407.341.3359
tim@jdm-associates.com

Origami Packaging – Novel Printed Antenna Technology for Ad-hoc Sensor Applications

Presented By Sergio Melais, University of South Florida

Abstract:

The work presented in this paper introduces a 3-D antenna designed and fabricated on a flexible paper thin substrate for operation at 915MHz with a frequency bandwidth ranging from 902-928 MHz. The major innovative feature introduced in this work is the use of a deposition process for printing radiating elements over a 3-D structure. For this design, the antenna selected is a printed dipole due to its simplicity and radiation characteristics (omni-directional pattern). The 3-D substrate over which this dipole is printed is the tetrahedron (pyramid with a triangle as base), a geometrical polyhedron offering symmetry and an excellent candidacy to illustrate the new paper thin antenna structural integration.

The layout of the antenna consists of a dipole printed on two sides of the tetrahedron connected to a balanced-to-unbalanced line transition on a third side. The base of the tetrahedron serves as a ground plane for the microstrip feed (coax feed). Furthermore, an L-C-L matching network is integrated to enhance the impedance match coming from the parallel plate section to the microstrip section of the line.

The tetrahedron antenna is first designed and simulated (HFSS10) on a flat configuration. Next, its dimensions are optimized and folded into a tetrahedron. The simulation results have demonstrated that a good radiator has been achieved, conserving adequate dipole characteristics. Finally, a prototype of this tetrahedron is fabricated on paper, LCP, and etched copper LCP substrates. The results support a satisfactory operation for the design.

Third European ATW on Micropackaging and Thermal Management, January 29-31, 2008 La Rochelle, France    ^ Top
The Third European ATW on Micropackaging and Thermal Management will be held, January 29-31, 2008 in La Rochelle on the French Atlantic coast.

The aim of the workshop - now a yearly must - is to help the exchange of information between scientists and engineers who are involved in thermal management, in R&D labs or in the industry.

Like it was done for the second issue, the ATW will be open to table top exhibits, strictly limited to organisations involved in the field of thermal management.

As usual, the workshop is organized, at hotel “Mercure Oceanide”, on a global fees basis for registration, hotel and meals.

Visit www.imapsfrance.org for more information.

Interested to attend?

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Products and Publications

IMAPS 2007 Proceedings Now Available    ^ Top
IMAPS 40th International Symposium on Microelectronics (IMAPS 2007) was held November 11-15, 2007, at the McEnery Convention Center in San Jose, CA. The symposium was a great success featuring 14 professional development courses, 30 sessions in 6 tracks, more than 200 papers, three world-renown keynote speakers, and much more. If you were not able to attend this event, you can now purchase the proceedings on-line.

Supplies are very limited for the proceedings book (print edition). CD-Rom copies are not limited. Visit http://www.imaps.org/registration/pubs1.asp to purchase your copy today. You can also visit www.imaps40th.org to view the technical program.

 

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

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National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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