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October 16, 2007

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Button IMAPS 2007 Student Program - Enhanced to Provide Technical Expertise, Industry Insight, Invaluable Networking and Maybe That First Job! (read more...)

Button Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging (read more...)

Button International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet French Chapter SIP-SOC Application Meeting Next Thursday, October 18, 2007, in Caen (read more...)

Bullet Metro Chapter November 7 Dinner Meeting Now Featuring Two Presentations (read more...)

Bullet Indiana Chapter October 25 Dinner Meeting with Tour of the Studebaker Museum  (read more...)

CD-Rom of Technical Presentations from the 2007 Thermal Management Workshop Now Available (read more...)

IMAPS Events (view full Web Calendar)

IMAPS 2007 Student Program - Enhanced to Provide Technical Expertise, Industry Insight, Invaluable Networking and Maybe That First Job!    ^ Top
The 40th International Symposium on Microelectronics will be held November 11-15, 2007, at the McEnery Convention Center in San Jose, California. For more information, and to register, visit

Students -- be sure to take advantage of valuable student programs at IMAPS 2007.  These enhanced programs have been designed to provide technical expertise, industry insight, and valuable connections.  You may even land a great internship or job!

Professional Development Course (PDC) Monitors, Sunday, November 11 and Monday, November 12
For those students that signed-up as monitors, please report to the registration area and ask for Jackki Morris-Joyner.  Monitors must arrive at the rooms 30 minutes prior to the start of the class.  Course monitors will assist instructors with the attendees, course timing, handouts, evaluations, etc.  Monitoring PDC courses provides students great technical information.  Talk with Jackki about monitoring courses in 2008.

Student Paper Competitions, through out the Symposium
Student authors will deliver presentations throughout the Symposia. Their presentations will be evaluated on technical knowledge, presentation skills, written manuscript, and audience interaction. Winning students will receive cash prizes, a certificate, and recognition in Advancing Microelectronics magazine. 

Student Booth Competition, Tuesday, November 13th, 1:30 pm – 2:30
Students will learn what other academic programs are doing at the student booths in the back of the Exhibit Hall.  Student booths will be evaluated by a panel of judges on various criteria.  Cash prizes and recognition will be awarded to the top three booths.   

Student Chapter Meeting, Tuesday, November 13th; 2:30 – 3:30
Gain more insight and share your success on increasing membership and producing better programs with other student chapter leaders.  This meeting will take place in the Hilton’s Santa Clara Rooms just before the student-industry reception.  

Student-Industry Panel and Reception; Tuesday, November 13th at 3:30 – 5:00
The Student-Industry Panel will provide students both career development and industry insight from industry professionals.  Industry leaders and professional engineers will describe and discuss how their education, interests, and career experiences led to success in their careers.  A reception will immediately follow in the Hilton’s Santa Clara Rooms.  Students will have the opportunity to talk with the industry panelists and other leaders.

Flextronics Plant Tour, Wednesday, November 14th, 9:00
Students can tour Flextronics’ San Jose location to experience a modern design and manufacturing facility.  Flextronics is a leading Electronics Manufacturing Services (EMS) provider that delivers complete design, engineering and manufacturing services to markets in automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEMs.  Flextronics designs, builds, ships, and services products in 35 countries. Students will see how this global presence vertically integrates components technologies to optimize operations and reduce time to market.  Shuttle buses will depart from the Convention Center.

Employment Center, Tuesday, November 13th - Thursday, November 15th
The Employment Center will offer job seekers valuable complimentary services.  Center volunteers will post job openings, collect resumes for these postings, and help schedule interviews at employer’s request. Job seekers can also request that their resumes be added to the on-line IMAPS Jobs Marketplace.

Tuesday, November 13th :  1:00 p.m. - 5:00 p.m.
Wednesday, November 14th :  8:30 a.m. - 5:00 p.m.
Thursday, November 15th :  9:00 a.m. - 12:00 p.m.

For more information, and to register, visit

Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging    ^ Top
IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging being held in Scottsdale/Fountain Hills, Arizona, from March 17-20, 2008. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types.

The format again this year will feature five workshops concentrating on:

These workshops have been at the core of previous Device Packaging Conferences and are a continuation of past successful IMAPS Advanced Technology Workshops. This format will provide a forum for the presentations of leading-edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Wafer Level Packaging/Embedded Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at no later than November 30, 2007.

Those wishing to present in one of the workshops of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008)    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico. HiTEC 2008 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2008 will be the forum for presenting leading high temperature electronics research results and applications requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers are being sought from, but not limited to, the following subjects:

- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal

- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
- Failure
- Experimental and
modeling results

Those wishing to present a paper at the HiTEC 2008 Conference must submit a 200-300 word abstract electronically by November 21, 2007, using the On-Line submittal form at: All abstracts submitted must represent original, previously unpublished work. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner ( or call 305-382-8433.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on April 4, 2008.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at or 202-548-8717 for information about Tabletop exhibits.

Chapter Activities (events listed in chronological order)

French Chapter SIP-SOC Application Meeting This Thursday, October 18, 2007, in Caen    ^ Top
Due to circumstances out of the control of IMAPS France, as announced before,  the SIP-SOC meeting which was first planned May 24 in Caen, will be held this Thursday, October 18.

Under the title “SIP vs SOC: An application driven perspective”, the technical day is a partnership with NXP, a top ten semiconductor company which was founded, more than 50 years ago, by Philips.

After two keynotes talks on new challenges in the market, applications, technologies and manufacturing fields, four papers will disclose advanced medical, telecom, smartcard and mobile TV industrial applications.

In the afternoon, advanced design tools will be demonstrated by leading actors in the CAD area. Finally the visit of several R&D laboratories will be proposed to the participants according to one’s preference.

For information: please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Indiana Chapter October 25 Dinner Meeting with Tour of the Studebaker Museum    ^ Top

Date: Thursday, October 25 , 2007
Schedule: Tour Starts 4:00 pm
Dinner 5:30 pm
Meeting 6:00 pm

The Studebaker Museum
South Bend, IN

Tippecanoe Place Restaurant (Dinner/Meeting)
South Bend, IN


Members: $25.00
Non-Members: $25.00
Student Members: $25.00

Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00 pm on Tuesday, October 23, 2007.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email  The price includes dinner and museum ticket. Please visit the chapter website at for more information.


The Studebaker National Museum has its roots in the Studebaker Corporation’s private collection, which originated in the 1890’s.  Studebaker operated its own museum for many years, and by 1920 their collection included: Lafayette’s and President Lincoln’s carriages, the company’s last farm wagon, the first automobile built entirely in South Bend, IN, and a large collection of World War I military vehicles. 

The collection continued to grow until Studebaker ceased production in 1966.  By that time, the collection numbered 37 vehicles, including the last Studebaker automobiles produced in South Bend and Canada.

Studebaker donated its collection to the City of South Bend in late 1966.  The collection was housed at a number of locations before its current building on Chapin Street.

The museum’s Archive Center houses an extensive collection of artifacts, manuscripts and records from the Studebaker Corporation, Packard Motor Car Company, and local South Bend industries.  The weight of the Studebaker records alone exceeds 70 tons.

The dinner and business meeting will be held at historic Tippecanoe Place Restaurant, a mansion that was originally owned by the Studebaker family. It is the premier landmark in the heart of South Bend’s historic district.

The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at for more information.

Metro Chapter November 7 Dinner Meeting Now Featuring Two Presentations    ^ Top

Date: November 7 , 2007
Schedule: Registration/Networking 5:00 pm - 6:30pm
Dinner Buffet 6:30 pm - 7:15 pm
Technical Presentation 7:15 pm - 8:00 pm
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Members: $30.00 if Pre-Registered November 5, 2007
$35.00 After November 5,2007

Non-Members: $35.00 if Pre-Registered by November 5, 2007
$40.00 After November 5, 2007

Student Members: $10.00 if Pre-Registered before November 5, 2007 $20.00 after November 5, 2007

Exhibits: There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert ( or Scott Baldassarre ( if you are interested.

Phone: Scott Baldassarre: (631) 436-7400 X 9853

Evaluation of Wire Bond Systems for Manufacturability

Presented by Student Members from Farmingdale College of the State University of NY:

Tim Resig & Christian Grigoleit
Facilitated by: Mike McKeown Orthodyne


As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.

This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.

PowerRibbon™ Bonding - An Alternative Interconnect Process for Present & Future Electronics Applications

Presented by Mike McKeown Orthodyne & Tim Resig

Large wire bonding is used in automotive electronics packaging since the mid-1970s. It is used as the interconnect of choice between the module housing as well as the power device and the electronic substrate. Large wire bonding is also the most commonly used interconnect for industrial power modules. It’s flexibility paired with benefits of being an environmentally friendly and robust process performed at room temperature made it the perfect interconnect choice for these complex applications with high reliability requirements. Electronic power steering and hybrid drives are only two of many examples in modern automotive applications which need increasingly higher current capabilities, requiring high power module packaging technology. To address these applications, manufacturers have historically increased the number of large aluminum wires per device or moved to alternative technologies. This posted a growing challenge for large wire bonding. Even though well established and accepted, in both areas, industrial and automotive power modules, the ever larger numbers of wires to be bonded virtually defect-free in a high volume environment under significant cost common for automotive applications, required a fresh review of the interconnect process and the equipment used. Where multiple wires only impact productivity, alternate technologies are less flexible or less reliable than wire bonding and can require extensive re-qualification efforts and investments in new capital equipment. Orthodyne's new PowerRibbon™ Technology was developed to meet the current and future interconnect needs of the power module market. PowerRibbon™ is a new technology designed to work in existing aluminum wire bonding applications, as well as new designs specified for PowerRibbonTM bonding. It requires little change in many of today's existing designs and utilizes the same environmentally friendly room temperature ultrasonic process as aluminum wire bonding. PowerRibbon™ combines the flexibility and robustness of the large aluminum wire bonding process with a higher productivity and in many applications an improved product performance. This paper will discuss wire and ribbon bonding design and performance aspects in present and future automotive applications.

Products and Publications

CD-Rom of Technical Presentations from the 2007 Thermal Management Workshop Now Available   ^ Top
IMAPS ATW on Thermal Management was held September 24-27, 2007, at the Holiday Inn in San Jose, CA. The workshop featured nine sessions addressing market drivers, pumped liquid cooling, system cooling, air cooling, thermal interface materials, and many other cutting-edge topics. If you were not able to attend this workshop you can purchase the CD-Rom of techincal presentations. Visit to reserve your copy today. To view the techincal program, visit


Oneida Research Services

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact

^ Top

National Training Center For Microelectronics



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