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October 3, 2007

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   IMAPS EVENTS
Button IMAPS 2007 - Registration/Hotel Deadline Next Wednesday, October 10 (read more...)

Button ATW on Integrated/Embedded Passives - Registration/Hotel Deadline Next Week (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Arizona Chapter Lunch Meeting This Thursday, October 4, on 3D Packaging Trends and Technology (read more...)

Bullet French Chapter SIP-SOC Application Meeting, October 18, 2007 in Caen (read more...)

Bullet Metro Chapter November 7 Dinner Meeting Now Featuring Two Presentations (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS 2007 Printed Proceedings DEADLINE Next Wednesday, October 10, 2007 - Pre-Orders Only - Supplies Limited (read more...)

The Journal of Microelectronics and Electronic Packaging 3rd Quarter 2007 Edition is Available On-line (read more...)

IMAPS Events (view full Web Calendar)

IMAPS 2007 - Registration/Hotel Deadline Next Wednesday, October 10    ^ Top
The 40th International Symposium on Microelectronics will be held November 11-15, 2007, at the McEnery Convention Center in San Jose, California. For more information, and to register, visit www.imaps40th.org.

The hotel cut-off and early registration deadlines are October 10, 2007. After October 10 IMAPS cannot guarantee hotel availability or pricing and registration/PDC fees will increase significantly.

For more information, and to register, visit www.imaps40th.org. Come celebrate the 40th Anniversary of the society!

ATW on Integrated/Embedded Passives - Registration/Hotel Deadline Next Week    ^ Top
Integrated/Embedded Passives 2007 is being held November 15-16, at the San Jose Convention/Fairmont Hotel in San Jose, California. The Advance Program and Registration is available on-line at www.imaps.org/passives.

The hotel cut-off and early registration deadline are October 10, 2007. After October 10 IMAPS cannot guarantee hotel availability or pricing and registration fees will increase significantly.

The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered. Passive technologies are essential for implementing smaller, cheaper and faster products.

This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace. Sessions will address the following topical areas: Materials, Processing, Applications, Design and Market Trends

View the complete Advance Program and register on-line at www.imaps.org/passives.

Chapter Activities (events listed in chronological order)

Arizona Chapter Lunch Meeting This Thursday, October 4, on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00

For more information, email - greg.clemons@intel.com.

French Chapter SIP-SOC Application Meeting, October 18, 2007 in Caen    ^ Top
Due to circumstances out of the control of IMAPS France, as announced before,  the SIP-SOC meeting which was first planned May 24 in Caen, will be held next October 18.

Under the title “SIP vs SOC: An application driven perspective”, the technical day is a partnership with NXP, a top ten semiconductor company which was founded, more than 50 years ago, by Philips.

After two keynotes talks on new challenges in the market, applications, technologies and manufacturing fields, four papers will disclose advanced medical, telecom, smartcard and mobile TV industrial applications.

In the afternoon, advanced design tools will be demonstrated by leading actors in the CAD area. Finally the visit of several R&D laboratories will be proposed to the participants according to one’s preference.

For information: please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Metro Chapter November 7 Dinner Meeting Now Featuring Two Presentations    ^ Top

Date: November 7 , 2007
Schedule: Registration/Networking 5:00 pm - 6:30pm
Dinner Buffet 6:30 pm - 7:15 pm
Technical Presentation 7:15 pm - 8:00 pm
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

Members: $30.00 if Pre-Registered November 5, 2007
$35.00 After November 5,2007

Non-Members: $35.00 if Pre-Registered by November 5, 2007
$40.00 After November 5, 2007

Student Members: $10.00 if Pre-Registered before November 5, 2007 $20.00 after November 5, 2007

Exhibits: There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert (slehnert@mdipower.com) or Scott Baldassarre (sbaldassarre@miteq.com) if you are interested.
Registration:

Email: sbaldassarre@miteq.com
Phone: Scott Baldassarre: (631) 436-7400 X 9853
WEB: www.imaps.org/chapters/metro

Evaluation of Wire Bond Systems for Manufacturability

Presented by Student Members from Farmingdale College of the State University of NY:

Tim Resig & Christian Grigoleit
Facilitated by: Mike McKeown Orthodyne

Abstract:

As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.

This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.

PowerRibbon™ Bonding - An Alternative Interconnect Process for Present & Future Electronics Applications

Presented by Mike McKeown Orthodyne & Tim Resig

Large wire bonding is used in automotive electronics packaging since the mid-1970s. It is used as the interconnect of choice between the module housing as well as the power device and the electronic substrate. Large wire bonding is also the most commonly used interconnect for industrial power modules. It’s flexibility paired with benefits of being an environmentally friendly and robust process performed at room temperature made it the perfect interconnect choice for these complex applications with high reliability requirements. Electronic power steering and hybrid drives are only two of many examples in modern automotive applications which need increasingly higher current capabilities, requiring high power module packaging technology. To address these applications, manufacturers have historically increased the number of large aluminum wires per device or moved to alternative technologies. This posted a growing challenge for large wire bonding. Even though well established and accepted, in both areas, industrial and automotive power modules, the ever larger numbers of wires to be bonded virtually defect-free in a high volume environment under significant cost common for automotive applications, required a fresh review of the interconnect process and the equipment used. Where multiple wires only impact productivity, alternate technologies are less flexible or less reliable than wire bonding and can require extensive re-qualification efforts and investments in new capital equipment. Orthodyne's new PowerRibbon™ Technology was developed to meet the current and future interconnect needs of the power module market. PowerRibbon™ is a new technology designed to work in existing aluminum wire bonding applications, as well as new designs specified for PowerRibbonTM bonding. It requires little change in many of today's existing designs and utilizes the same environmentally friendly room temperature ultrasonic process as aluminum wire bonding. PowerRibbon™ combines the flexibility and robustness of the large aluminum wire bonding process with a higher productivity and in many applications an improved product performance. This paper will discuss wire and ribbon bonding design and performance aspects in present and future automotive applications.

 

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.

Products and Publications

IMAPS 2007 Printed Proceedings DEADLINE Next Wednesday, October 10, 2007 - Pre-Orders Only - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit www.imaps40th.org and follow the links for registration or visit http://www.imaps.org/registration/pubs1.asp to reserve your copy today.

The Journal of Microelectronics and Electronic Packaging 3rd Quarter 2007 Edition is Available On-line   ^ Top
The Third Quarter 2007 issue of the Journal of Microelectronics and Electronic Packaging is available on-line.
Log-on to access the Journal.

The Journal of Microelectronics and Electronic Packaging is published quarterly and offered to all members electronically via the IMAPS Website. Print subscriptions are available for an addtional rate.


 

Oneida Research Services

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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