Metro Chapter November 7 Dinner Meeting Now Featuring Two Presentations    ^ Top

Date:	November 7 , 2007
Schedule:	Registration/Networking 5:00 pm - 6:30pm Dinner Buffet 6:30 pm - 7:15 pm Technical Presentation 7:15 pm - 8:00 pm
Location:	Holiday Inn Ronkonkoma 3845 Veterans Highway Ronkonkoma, NY 11779 Ph: 631-585-9500
Cost:	Members: $30.00 if Pre-Registered November 5, 2007 $35.00 After November 5,2007 Non-Members: $35.00 if Pre-Registered by November 5, 2007 $40.00 After November 5, 2007 Student Members: $10.00 if Pre-Registered before November 5, 2007 $20.00 after November 5, 2007
Exhibits:	There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert (slehnert@mdipower.com) or Scott Baldassarre (sbaldassarre@miteq.com) if you are interested.
Registration:	Email: sbaldassarre@miteq.com Phone: Scott Baldassarre: (631) 436-7400 X 9853 WEB: www.imaps.org/chapters/metro

Evaluation of Wire Bond Systems for Manufacturability

Presented by Student Members from Farmingdale College of the State University of NY:

Tim Resig & Christian Grigoleit
Facilitated by: Mike McKeown Orthodyne

Abstract:

As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.

This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.

PowerRibbon™ Bonding - An Alternative Interconnect Process for Present & Future Electronics Applications

Presented by Mike McKeown Orthodyne & Tim Resig

Large wire bonding is used in automotive electronics packaging since the mid-1970s. It is used as the interconnect of choice between the module housing as well as the power device and the electronic substrate. Large wire bonding is also the most commonly used interconnect for industrial power modules. It’s flexibility paired with benefits of being an environmentally friendly and robust process performed at room temperature made it the perfect interconnect choice for these complex applications with high reliability requirements. Electronic power steering and hybrid drives are only two of many examples in modern automotive applications which need increasingly higher current capabilities, requiring high power module packaging technology. To address these applications, manufacturers have historically increased the number of large aluminum wires per device or moved to alternative technologies. This posted a growing challenge for large wire bonding. Even though well established and accepted, in both areas, industrial and automotive power modules, the ever larger numbers of wires to be bonded virtually defect-free in a high volume environment under significant cost common for automotive applications, required a fresh review of the interconnect process and the equipment used. Where multiple wires only impact productivity, alternate technologies are less flexible or less reliable than wire bonding and can require extensive re-qualification efforts and investments in new capital equipment. Orthodyne's new PowerRibbon™ Technology was developed to meet the current and future interconnect needs of the power module market. PowerRibbon™ is a new technology designed to work in existing aluminum wire bonding applications, as well as new designs specified for PowerRibbonTM bonding. It requires little change in many of today's existing designs and utilizes the same environmentally friendly room temperature ultrasonic process as aluminum wire bonding. PowerRibbon™ combines the flexibility and robustness of the large aluminum wire bonding process with a higher productivity and in many applications an improved product performance. This paper will discuss wire and ribbon bonding design and performance aspects in present and future automotive applications.