||November 7 , 2007
||Registration/Networking 5:00 pm - 6:30pm
Dinner Buffet 6:30 pm - 7:15 pm
Technical Presentation 7:15 pm - 8:00 pm
||Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Members: $30.00 if Pre-Registered November 5, 2007
$35.00 After November 5,2007
Non-Members: $35.00 if Pre-Registered by November 5, 2007
$40.00 After November 5, 2007
Student Members: $10.00 if Pre-Registered before November 5, 2007 $20.00 after November 5, 2007
||There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert (firstname.lastname@example.org) or Scott Baldassarre (email@example.com) if you are interested.
Phone: Scott Baldassarre: (631) 436-7400 X 9853
Evaluation of Wire Bond Systems for Manufacturability
Presented by Student Members from Farmingdale College of the State University of NY:
Tim Resig & Christian Grigoleit
Facilitated by: Mike McKeown Orthodyne
As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.
This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.
PowerRibbon™ Bonding - An Alternative Interconnect Process for Present & Future Electronics Applications
Presented by Mike McKeown Orthodyne & Tim Resig
Large wire bonding is used in automotive electronics packaging since the mid-1970s. It is used as the interconnect of choice between the module housing as well as the power device and the electronic substrate. Large wire bonding is also the most commonly used interconnect for industrial power modules. It’s flexibility paired with benefits of being an environmentally friendly and robust process performed at room temperature made it the perfect interconnect choice for these complex applications with high reliability requirements. Electronic power steering and hybrid drives are only two of many examples in modern automotive applications which need increasingly higher current capabilities, requiring high power module packaging technology. To address these applications, manufacturers have historically increased the number of large aluminum wires per device or moved to alternative technologies. This posted a growing challenge for large wire bonding. Even though well established and accepted, in both areas, industrial and automotive power modules, the ever larger numbers of wires to be bonded virtually defect-free in a high volume environment under significant cost common for automotive applications, required a fresh review of the interconnect process and the equipment used. Where multiple wires only impact productivity, alternate technologies are less flexible or less reliable than wire bonding and can require extensive re-qualification efforts and investments in new capital equipment. Orthodyne's new PowerRibbon™ Technology was developed to meet the current and future interconnect needs of the power module market. PowerRibbon™ is a new technology designed to work in existing aluminum wire bonding applications, as well as new designs specified for PowerRibbonTM bonding. It requires little change in many of today's existing designs and utilizes the same environmentally friendly room temperature ultrasonic process as aluminum wire bonding. PowerRibbon™ combines the flexibility and robustness of the large aluminum wire bonding process with a higher productivity and in many applications an improved product performance. This paper will discuss wire and ribbon bonding design and performance aspects in present and future automotive applications.
IMAPS-Benelux Autumn Event Next Thursday, November 8, 2007, on Latest trends in Electronic Assembly ^
The IMAPS Benelux Chapter will hold its Autumn 2007 event on Thursday, November 8, 2007, at TBP Electronics bv,
3247 CP Dirksland,
PDF of Program/Registration Form
9.00 Registration, coffee, exhibition
9.30 Welcome by the chairman
Nienke Bruinsma, Philips Applied Technologies, NL
9.35 Roadmap assembly technology – trends and challenges
Boris Leekens, TBP Electronics nv, BE
TBP electronics will react to its new era of assembly in which logistics, quality, traceability, technology and flexibility are leading. Therefore the choices in manpower, equipment and software are of essential importance. The challenge is to reach the highest level in automation.
10.00 Packaging technology trends for future circuits – Opportunities of new interconnect types
Bernd Römer, Infineon Technologies AG, DE
System integration is becoming more and more mainstream for a wide range of applications, from consumer to high performance applications. Semiconductor components for system integration originate from different front end technologies (e.g. silicon ICs, passive chip, power, MEMS, etc.). The use of advanced packaging is an efficient and cost effective way for heterogeneous system integration. Packaging technologies offer many opportunities to integrate different chips, passive components, including separately optimized systems to a system-in-package. 3D integration techniques applying various types of stacked structures and wafer level assembly offer an excellent way to address high electrical performance, e.g. less delay time at higher miniaturization. An overview on different approaches will be given with focus on the future opportunities and collaboration needs to enable such designs.
10.50 Coffee, exhibition
11.20 Through wafer interconnect technologies for 3D system-in-package
Eric van Grunsven, Philips Applied Technologies, NL
Philips and NXP have developed a SB-SiP platform (silicon based system in package) to enable heterogeneous integration. Next generations of modules in the platform, especially in the application of cellular RF transceivers, require a three dimensional interconnect. This paper presents technologies that recently have been studied. First, an overview of different through wafer interconnect technologies, developed within Philips and NXP, will be given. Next, the considerations for through wafer interconnect will be discussed, with special attention on via forming by means of deep reactive ion etching. Third, the first results of a recently developed concept for via filling, by means of paste printing, will be presented.
11.45 Fine pitch components and lead free assembly: trends and production issues
Bart Allaert, Connectronics,
division of IPTE nv, BE
The introduction of lead-free manufacturing has led to several production issues. At the same time, the diversity of packages is growing, and the evolution towards finer pitch components is continuing. The combination of these trends asks for specific assembly processes and a better manufacturing control. In this presentation the trends regarding fine pitch components and new packages will be given and typical problems with lead free assembly of fine pitch components will be discussed.
12.10 Lunch, exhibition, followed by factory tour
13.30 Die and Flip Chip Bonding Equipment for advanced Technologies
Datacon Technology GmbH, AT
Requirements of present packages are mainly driven by two factors. These are on one side the packaging cost and on the other side the increased functionality at highest possible fill factor.
This presentation will show some trends as they are seen by a leading equipment supplier. Solutions to handle thin dice as well as different solutions for stacked die packages will be presented. These techniques are already state of the art for the production of memory devices.
To follow the trend towards higher integration, direct contact bonding of stacked dice will be the next stage. Especially the up coming through hole via (TSV) and the flip chip type solid face to face technology require dedicated equipment with a high alignment accuracy at a significant speed. The state of the art equipment for the production will be discussed, as well as the impact of these technologies on future generations of equipment.
14.20 Het omschakelen naar RoHS (loodvrije) productie in het midden - en klein bedrijf.
Gerrit Versteeg, Global Electronics, NL
Toegespitst op assemblage voor derden. Wat komt er op ons af? Waar liggen onze verantwoordelijkheden? Welke informatie is er beschikbaar en waar? Waar en waarom is er externe kennis benodigd? Al deze vragen hebben op logistieke - evenals productiezaken betrekking.
Waar zijn we gestart in 2004 en waar staan wij op dit moment? Welke nieuwe ontwikkelingen komen er nog op ons af? Deze omschakeling is een keten verantwoordelijkheid en de Keten bepaalt het uiteindelijke succes.
14.45 Inspection and Metrology for HDI substrates
Pieter Vandewalle, ICOS Vision Systems, BE
The CI-T120S/CI-T130S is an automated metrology and inspection tool dedicated to High Density Interconnect substrates. The machine combines very advanced inspection technology with very fast substrate handling and sorting capabilities. The innovative 4-in-1 inspection concept combines surface and warpage inspection with the latest COSSAP confocal metrology: bump metrology with metrological accuracy of less than 1 micron, substrate warpage and pad inspection, top surface inspection and bottom surface inspection.
The high throughput of the machine enables substrate manufacturers to perform 100% inspection and metrology in a production environment.
15.10 Tea, exhibition
15.30 Combination of experiments and simulations in board level reliability
Hans de Vries, Philips Applied Technologies, NL
Several trends in modern electronic applications require a different approach to reliability assessment. Among other things the combination of experiments and model simulations are necessary to save time and costs in reliability tests. In particular the ongoing trend in portable applications requires new types of packages such as HV-QFN, and testing methods, such as board level drop tests and cyclic bending. In this contribution examples will be given of experiments and simulations mutually supporting each other.
15.55 PBA DfX in the RoHS era: Specify the requirements!
Geert Willems, IMEC, BE
From experience we know that a typical PBA design is incomplete with regard to the specification of PCB substrate, components and assembly variables when the design leaves the design department and enters the electronic supply chain. The missing parameters are filled in by the different players in the supply chain such as purchasing departments, PCB manufacturing, component suppliers, assembly contractors, etc. The robust SnPb soldering with its relatively large process window and benign process temperatures was relatively forgiving for this rather nonchalant way of working. However, those days are over since we have entered the RoHS era. The increased material, processing and logistical complexity, the reduced process windows and increased temperatures combined with new and reinforced failure mechanisms both increases the chance on as well as the gravity of PBA failure. Something even Microsoft has experienced recently.
In this presentation we discuss what needs to be specified and what may happen if you don't.
16.20 Informal meeting, drinks will be served
Register as (includes lunch and coffee) :
Non-Benelux IMAPS member 80 EUR
membership nr # …………………….
Only for IMAPS Benelux members : 140 EUR
workshop fee includes 2008 membership fee
membership nr #................................
Non member 150 EUR
workshop fee includes 2008 membership fee
Student fee 30 EUR
Registrations should be made before November 5, 2007. Cancellations after November 5 will not be refunded.
After registration, you will receive a confirmation and driving directions.
To register or inquire about tables for exhibition, please contact:
Katrien Vanneste, ELIS-TFCG, Gent University
Technologiepark 914A, B-9052 Zwijnaarde
Tel: +32 (0) 9 264 5350
FAX: +32 (0) 9 264 5374
E-mail : firstname.lastname@example.org
Third European ATW on Micropackaging and Thermal Management, January 29-31, 2008 La Rochelle, France ^
The Third European ATW on Micropackaging and Thermal Management will be held, January 29-31, 2008 in La Rochelle on the French Atlantic coast.
The aim of the workshop - now a yearly must - is to help the exchange of information between scientists and engineers who are involved in thermal management, in R&D labs or in the industry.
Like it was done for the second issue, the ATW will be open to table top exhibits, strictly limited to organisations involved in the field of thermal management.
As usual, the workshop is organized, at hotel “Mercure Oceanide”, on a global fees basis for registration, hotel and meals.
Abstracts are being accepted until Monday, November 5, 2007. Visit www.imapsfrance.org for more information.
Interested to attend?
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93