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September 11, 2007

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   IMAPS EVENTS
Button Thermal Management Workshop In Less Than 2 Weeks - On-line Registration Closes September 18 (read more...)

Button Call For Abstracts -- International Conference and Tabletop Exhibition on Alternative Energy (read more...)

Button International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet This Thursday: Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits (read more...)

Bullet This Thursday: Indiana Chapter September 13 Tour of Haynes International and Dinner Meeting (read more...)

Bullet French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

Bullet News From IMAPS New England Chapter (read more...)

Bullet Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology (read more...)

Bullet MicroTech 2008 Call for Papers (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited (read more...)

IMAPS Events (view full Web Calendar)

Thermal Management Workshop In Less Than 2 Weeks - On-line Registration Closes September 18    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/thermal.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

View the complete Advance Program and register on-line at www.imaps.org/thermal.

Call For Abstracts -- International Conference and Tabletop Exhibition on Alternative Energy    ^ Top
The Alternative Energy Conference will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, April 8-10, 2008. This conference is a continuation of last years first Alternative Energy Conference and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

Solar - Photovoltaics
Fuel Cells
Geothermal
BioFuels
Batteries and Hybrids
Wind
Other Approaches

Thermal and Power Management
Inverter Materials and Design
Grid and Storage Approaches
Design for Efficiency

Materials & Reliability
Qualification Approaches
Environmental Regulations
Government/State Policies and Incentives

Those wishing to present a paper at the Energy Conference, please submit a 250-300 word abstract electronically by November 16, 2007, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the energy field, application area, design, and process/material, the submission section will aid in grouping the work within these four areas.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on March 7, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008)    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico. HiTEC 2008 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2008 will be the forum for presenting leading high temperature electronics research results and applications requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers are being sought from, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

TO SUBMIT AN ABSTRACT:
Those wishing to present a paper at the HiTEC 2008 Conference must submit a 200-300 word abstract electronically by November 21, 2007, using the On-Line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on April 4, 2008.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.


Chapter Activities (events listed in chronological order)

This Thursday: Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits   ^ Top

When: September 13, 2007
Schedule: Registration/Networking: 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Where: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

Members: $35.00 After September 6, 2007

Non-Members: $40.00 After September 6, 2007

Pre-Registration:

Email: slehnert@mdipower.com
Phone: Steve Lehnert  (631) 345-3100
Web: www.imaps.org/chapters/metro

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Nanotechnology
by
Dr. Martin Moskovits
Chief Technology Officer API Nanotronics

Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.

This Thursday: Indiana Chapter September 13 Tour of Haynes International and Dinner Meeting    ^ Top

When: September 13, 2007
Schedule: Tour Starts 4:00 PM
Dinner: 5:30 PM
Meeting: 6:00 PM
Where:

Haynes International
Kokomo, IN

Dinner & Meeting to follow at:
Pizza Hut
Kokomo, IN

Cost:

IMAPS Members: $10.00
Non-Members: $12.00
Students: $5.00

Pre-Registration:

Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00pm on Tuesday, September 11, 2007.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email m.ray.fairchild@delphi.com

Dave Fluck
Haynes International
Superintendent of Lab Services

Abstract:

Haynes International, Inc., headquartered in Kokomo, Indiana, USA, is a world leader as the inventor, developer, and producer of quality high performance nickel- and cobalt-based alloys.

Haynes International, Inc. is a technology and service oriented company devoted to the development and manufacture of high-performance nickel- and cobalt-based alloys for service in severe corrosion and high-temperature applications. Well-trained professionals within the company provide superior customer service and technical support worldwide. Haynes' service centers and affiliates have available in-stock sheet, plate, bar, wire, tubing, forging stock, fittings, and flanges.

Heat- and corrosion-resistant alloys are our only business. We go the extra mile to ensure that our products provide reliable performance, the kind of performance you've come to expect from HASTELLOY® and HAYNES® products. We offer our customers unmatched technical support and a full range of services including plasma cutting, water jet cutting, shearing, saw cutting, and others through our Service Center Network. If the alloy you need is in stock, we can typically ship within 24 hours.

The history of Haynes International, Inc. is one of innovation and continuous improvements in the processing and development of high performance alloys.   The company was started in 1912 in Kokomo, Indiana as the Haynes Stellite Works.  Its principal product was cobalt-chromium-tungsten metal-cutting tools, the invention of Elwood Haynes.  Over the past 95 years, Haynes International alloys have been used in aero space, petrochemical, nuclear, pharmaceutical, agrichemical, and  biopharmaceutical industries.  Since 1967, the company has won nine “R&D 100” awards for alloy developments.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,  www.imapsfrance.org.

News From IMAPS New England Chapter    ^ Top
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Micro Electronics and Fiber Optic Manufacturing".  For details please see the meeting notice at  http://www.imapsne.org/meeting.html.

The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA.  Call for technical papers are available at http://www.imapsne.org/docs/Call_2008.doc

Please visit the IMAPS New England Chapter Website for announcements of future events www.imapsne.org.

Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00


Special - No Charge for pre-registered attendees. (Vendor Tables available for $20)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, October 1.

RSVP by October 1, 2007, on-line at http://www.imaps.org/chapters/freepass.asp or by email - greg.clemons@intel.com. Reserve your display table at http://www.imaps.org/registration/az2007oct.htm.

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK.
Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK is looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

  1. Emerging Applications
  2. Future Interconnections
  3. Developing Technologies
  4. System Integration
  5. Advanced Substrates
  6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   
Email: office@imaps.org.uk

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.

Products and Publications

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit www.imaps40th.org and follow the links for registration or visit http://www.imaps.org/registration/pubs1.asp to reserve your copy today.

 

Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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