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September 18, 2007

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   IMAPS EVENTS
Button Thermal Management Workshop Begins Monday (read more...)

Button See What's In Store For You At IMAPS 2007 - Program-at-a-Glance (read more...)

Button Advanced Technology Workshop on Integrated/Embedded Passives (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Tomorrow: Orange Chapter Meeting During SoCalEE with Presentation on Principles of Rework: Processes, Techniques and Methods  (read more...)

Bullet Next Week: French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   (read more...)

Bullet Next Week: San Diego Chapters Dinner Meeting September 25 Featuring Northrop Grumman Space Technology presentation on MMIC Compatible, Low Temperature Hermetic Wafer-Level Packaging Technology (read more...)

Bullet News From IMAPS New England Chapter (read more...)

Bullet Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

   PRODUCTS AND PUBLICATIONS
Advancing Microelectronics September/October 2007 On-line Magazine is Now Available (read more...)

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited (read more...)

IMAPS Events (view full Web Calendar)

Thermal Management Workshop Begins Monday    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program is available on-line at www.imaps.org/thermal. On-line registration has closed. You must register on-site in San Jose for this workshop.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

See What's In Store For You At IMAPS 2007 - Program-at-a-Glance
The 40th International Symposium on Microelectronics will be held November 11-15, 2007, at the McEnery Convention Center in San Jose, California. For more information, and to register, visit www.imaps40th.org.

With this being the 40th Anniversary of the Society, we have planned incredible programs and activities for you while you're in San Jose this November. Use the program grid below to quickly access information about IMAPS 2007, its six technical tracks, 30 sessions, keynote presentations, and many other activities we have in store for you. Most areas below are linked to the details for each item you are interested in. Or link directly to the Technical Program, PDCs, Poster Sessions, Program Grid (At-a-Glance), or GBC.

Sunday, November 11
9:00 am -
5:00 pm
5:00 pm -
6:00 pm
Professional Development Course Reception (Registrants and Instructors Only)
Sponsored by Panasonic
Monday, November 12
9:00 am -
5:00 pm
6:30 pm -
8:30 pm
40th Anniversary Celebration & Welcome Reception (All are invited)
Sponsored by Heraeus
 
RF, Automotive and Translated Track"
Systems/Design
Track
Materials Track
Signal Integrity Track
Reliability Track
Advanced Technologies Track
 
Tuesday, November 13
8:00 am -
10:45 am
 
10:00 am -
5:00 pm
11:00 am -
11:15 am
11:15 am -
11:45 am
11:45 am -
12:30 pm
Keynote Presentation
Mr. Stephen M.R. Covey, CoveyLink Worldwide
12:30 pm -
1:45 pm
Lunch Kiosks (Food not provided by IMAPS)
1:45 pm -
4:55 pm
 
Wednesday, November 14
8:00 am -
11:25 am
 
9:00 am -
5:00 pm
11:35 am -
12:30 pm
Keynote Presentation
Mr. James R. Miller, CISCO Systems, Inc.
12:30 pm -
1:30 pm
Lunch in the Exhibit Hall (Provided by IMAPS)
Sponsored by Heraeus
1:30 pm -
4:55 pm
5:15 pm -
6:50 pm
Global Business Council (GBC) Marketing Forum
(INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
6:50 pm -
7:30 pm
Thursday, November 15
8:00 am -
8:45 am
Keynote Presentation
Dr. Dongkai Shangguan, Flextronics International
8:50 am -
12:00 pm
9:00 am -
12:00 pm
9:00 am -
12:00 pm
IMAPS 2008 Booth Selection in the Exhibit Hall
12:45 pm
Integrated/Embedded Passives Workshop Begins (visit www.imaps/passives, for more information.)

For more information, and to register, visit www.imaps40th.org. Come celebrate the 40th Anniversary of the society!

Advanced Technology Workshop on Integrated/Embedded Passives    ^ Top
Integrated/Embedded Passives 2007 is being held November 15-16, at the San Jose Convention/Fairmont Hotel in San Jose, California. The Advance Program and Registration is now available on-line at www.imaps.org/passives. The hotel cut-off and early registration deadline are October 10, 2007.

The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered. Passive technologies are essential for implementing smaller, cheaper and faster products.

This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace. Sessions will address the following topical areas: Materials, Processing, Applications, Design and Market Trends

View the complete Advance Program and register on-line at www.imaps.org/passives.

Chapter Activities (events listed in chronological order)

Tomorrow: Orange Chapter Meeting During SoCalEE with Presentation on Principles of Rework: Processes, Techniques and Methods    ^ Top

Date: Wednesday, September 19, 2007
Time: 10:00 am
Location: ORANGE COUNTY FAIR & EXPO CENTER
COSTA MESA
Cost: SoCalEE – Free Registration - http://www.socalee.com/

NOTE TIME AND LOCATION CHANGE!
We will be having this months meeting as part of the SoCalEE Technical Program

Principles of Rework: Processes techniques and Methods
By Jay Boyd, OK International

ABSTRACT:
At best, rework is a zero-sum game where a dysfunctional or non-working assembly is brought to a functional state.  Rework implies added expense to the assembly process.  The need for fast, effective and repeatable rework processes will aid in mitigating expense. Rework processes can categorized by component geometry including plated through-hole components and surface mount components (SMC).  Considerations to lead types generally drive the efficacy of SMC rework and help define the processes and equipment to be used.  This presentation will provide an overview of rework processes considering component types and alternative methods for rework.  It will cover the three basic methods for heating and look at mechanical and visual aids for aiding the process to improve speed and repeatability.

SPEAKER BIO:
Jay Boyd is an industry veteran serving in a variety of technical and marketing roles in the electronics manufacturing industry for 25 years.  He has worked with OK International for over ten years primarily focused on soldering and rework processes.

SoCalEE  September 19, 2007
ORANGE COUNTY FAIR & EXPO CENTER, COSTA MESA
Register to attend at http://www.socalee.com/

RSVP to: Bill Gaines, (626)812-2199, william.gaines@ngc.com

Next Week: French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,  www.imapsfrance.org.

Next Week: San Diego Chapters Dinner Meeting September 25 Featuring Northrop Grumman Space Technology presentation on MMIC Compatible, Low Temperature Hermetic Wafer-Level Packaging Technology    ^ Top

Date: Tuesday, September 25, 2007
Time: 5:30 Social Hour
6:30 Dinner
7:15 Presentation
Location: Holiday Inn
3805 Murphy Canyon Rd.
San Diego
Cost: $15 RSVP'd Members
$7 RSVP'd Students
$20 Others
Registration: Click here to RSVP or call Dave Virissimo at 619-464-5430.

WHO SHOULD ATTEND: Engineers, Managers, Assembly Techs, Marketing Managers, Project Managers, and Executive Decision-Makers

PROGRAM:
NGST (Northrop Grumman Space Technology), located in Redondo Beach, CA, has developed a hermetic, MMIC compatible Wafer-Level Packaging (WLP) technology. This WLP technology consists of only low temperature processing steps, and is designed to be compatible with NGST's standard 100mm MMIC fabrication processes.

MMIC compatible hermetic packaging techniques implemented with batch fabrication processes is the enabling technology for realizing light-weight multi-functional modules.

This WLP technology is capable of integrating MMICs fabricated by different technologies with dissimilar substrates, and compacting their functionalities in a batch fabricated hermetic packages. Furthermore, WLP technology enhances module performance by eliminating lossy wire bonds that are often necessary to connect different circuits within the module, making it suitable for high frequency mmW applications.WLP uses batch processes and is capable of producing a large number of packaged chips in one fabrication pass.

The talk will briefly describe the WLP processes developed at NGST. Several demonstrations of this packaging technology will be also be presented, including advanced multiple layer integration and integrated RF front-end modules.

SPEAKER:
Dr. Patty P. Chang-Chien is a Staff Engineer within the Technology Development Department of Northrop Grumman Space Technology Sector in Redondo Beach, California. She is currently leading the wafer-level packaging, RF MEMS technology, and heterogeneous integration development effort at NGST. She has over twelve years experience in wafer-level packaging, heterogeneous integration, MEMS device design, fabrication and testing. She received her B.S. degree from the California Institute of Technology; her M.S. degree from the University of California at Los Angeles; and her Ph.D. degree from the University of Michigan, Ann Arbor, all in Electrical Engineering. She has authored numerous conference and journal papers on wafer-level packaging and RF MEMS technology. Her interests are wafer-level packaging, heterogeneous integration of MMIC devices and MEMS, RF MEMS and MEMS reliability.

News From IMAPS New England Chapter    ^ Top
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Micro Electronics and Fiber Optic Manufacturing".  For details please see the meeting notice at  http://www.imapsne.org/meeting.html.

The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA.  Call for technical papers are available at http://www.imapsne.org/docs/Call_2008.doc

Please visit the IMAPS New England Chapter Website for announcements of future events www.imapsne.org.

Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00


Special - No Charge for pre-registered attendees. (Vendor Tables available for $20)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, October 1.

RSVP by October 1, 2007, on-line at http://www.imaps.org/chapters/freepass.asp or by email - greg.clemons@intel.com. Reserve your display table at http://www.imaps.org/registration/az2007oct.htm.

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at http://www.imaps.org/chapters/indiana/ for more information.

Products and Publications

Advancing Microelectronics September/October 2007 On-line Magazine is Now Available   ^ Top
The September/October issue of Advancing Microelectronics is now available on-line. This is the "show issue" for IMAPS 2007, the 40 International Symposium on Microelctroincs, and the 40th anniversary celebration of IMAPS.
Log-on to access the July/August 2007 issue today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website.

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit www.imaps40th.org and follow the links for registration or visit http://www.imaps.org/registration/pubs1.asp to reserve your copy today.

 

Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact abell@imaps.org

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

^ Top

National Training Center For Microelectronics

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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