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September 25, 2007

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Button IMAPS 2007 - 18 Professional Development Courses Being Offered - Pre-register Before October 10th (read more...)

Button ATW on Integrated/Embedded Passives - Registration/Hotel Deadline In Two Weeks (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet New England Chapter - Dinner Meeting Next Tuesday, October 2, on Precision Laser Processing for Microelectronics and Fiber Optic Manufacturing (read more...)

Bullet Arizona Chapter Lunch Meeting Next Thursday, October 4, on 3D Packaging Trends and Technology (read more...)

Bullet Metro Chapter November 7 Dinner Meeting on Evaluation of Wire Bond Systems for Manufacturability (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

IMAPS 2007 Printed Proceedings DEADLINE October 10, 2007 - Pre-Orders Only - Supplies Limited (read more...)

IMAPS Events (view full Web Calendar)

IMAPS 2007 - 18 Professional Development Courses Being Offered - Pre-register Before October 10th
The 40th International Symposium on Microelectronics will be held November 11-15, 2007, at the McEnery Convention Center in San Jose, California. For more information, and to register, visit The hotel cut-off and early registration deadlines are October 10, 2007. After October 10 IMAPS cannot guarantee hotel availability or pricing and registration/PDC fees will increase significantly.

Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community.  So please be sure to choose from the 18 in-depth Professional Development Courses taught by recognized industry experts.  You will discover the following key ways that will benefit you.

  • Better understand the skills and knowledge necessary in today’s industry.
  • Be exposed to the rapidly expanding developments in new materials and technologies.
  • Consult with renowned authorities about your current R&D or manufacturing problems and challenges.
  • Learn new ways to identify, think about, and address your problems and opportunities.
  • Great opportunities to interact with industry experts and other course attendees.
  • Certificate of Attendance and much more…

PDCs run 9:00 am - 5:00 pm on Sunday, November 11, and Monday, November 12, unless otherwise noted. The 18 PDCs are listed below. To view information on a PDC, click on the hyper-linked course title below or visit

Sunday, November 11, 2007

S1: RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates
S2: Electronics Reliability Overview
Course Leader: Andrew D. Kostic, Ph.D., Northrop Grumman Electronic Systems
S3: Technology of Screen Printing
Course Leaders: Art Dobie, Sefar Printing Solutions & David
Malanga, Heraeus, Inc. - Thick Film Division
S4: Adhesion Fundamentals in Microelectronic Packaging
Course Leader: Raymond A. Pearson, Ph.D., Lehigh University
S5: Advanced Power Packaging for High Reliability and Higher

Course Leader: Dr. Douglas C. Hopkins, University at Buffalo
S6 - ½ day: 9 am - Noon
Gas Analysis of Hermetically Sealed Enclosures

Course Leader: Robert K. Lowry, Affiliate, Oneida Research
Services, and Consultant, Electronic Materials Characterization
S7 - ½ day: 1 pm - 5 pm
Principles of Technical Selling

Course Leader: Michael P. O’Neill, Heraeus Inc.

Monday, November 12, 2007

M1: Wire Bonding in Microelectronics
Course Leader: George G. Harman, National Institute of Standards and Technology
M2: Advanced Thermal Management and Packaging Materials
Course Leader: Carl Zweben, Ph. D., Advanced Thermal Materials
M3: Low Temperature Co-fired Ceramics (LTCC)
Course Leaders: Dr. Aicha Elshabini & Dr. Fred D. Barlow,
University of Idaho
M4: Hermeticity and “Near Hermetic” Packaging Concepts
Course Leaders: Thomas J Green, TJ Green Associates &
Aaron Der Marderosian Sr., Raytheon Company
M5: Introduction to Microelectronics Packaging Technology
Course Leader: Phillip G. Creter, Creter & Associates
M6: Plating Processes for High Reliability Microelectronic Devices
Course Leader: Fred Mueller, Consultant, ASEF Instructor
M7: Failures and their Prevention in Electronic Assemblies with Focus on Lead (Pb) Free Technology
Course Leader: Dr. Puligandla Viswanadham, University of
Texas at Arlington
M8: Selecting a Lead Free Solution for Military, Avionic
and Space Applications

Course Leaders: Craig Hillman &
Jim McLeish, DfR Solutions
M9: Packaging and Integration of RFIDs and Related Identification

Course Leaders: Ajay P. Malshe, Ph.D., University of Arkansas &
Frank Bachner, TechSearch International,
M10 - ½ day: 9 am – Noon
ESD Factory & Cleanroom Issues, Equipment Troubleshooting,
ESD Packaging & Materials and ESD Standards/Test Methods

Course Leader: Robert J. Vermillion, RMV Technology Group, LLC
Institute of Packaging Professionals/CPP-Lifetime/Fellow
Certified, ESD Engineer-iNARTE
Certified, Product Safety Engineer-iNARTE
M11 - ½ day: 1 pm – 5 pm
Biomedical Materials, Devices and Packaging

Course Leader: Z. Joan Delalic, PhD, Temple University

For more information, and to register, visit Come celebrate the 40th Anniversary of the society!

ATW on Integrated/Embedded Passives - Registration/Hotel Deadline In Two Weeks    ^ Top
Integrated/Embedded Passives 2007 is being held November 15-16, at the San Jose Convention/Fairmont Hotel in San Jose, California. The Advance Program and Registration is available on-line at The hotel cut-off and early registration deadline are October 10, 2007. After October 10 IMAPS cannot guarantee hotel availability or pricing and registration fees will increase significantly.

The Advanced Technology Workshop (ATW) on Passive Integration features the latest papers on integrating resistors, capacitors, and inductors into leading edge applications. Topics will be presented from industry leaders like AVX, DuPont, NXP Semiconductors, Oak Mitsui, Omega Technologies, Samsung and leading research institutions like Georgia Tech, Fraunhofer Institute, IMEC, University of Arkansas and others. This workshop will focus on all aspects of passive integration from basic materials to design to manufacturing to applications like SiP. In addition, passive integration technology and market trends will be covered. Passive technologies are essential for implementing smaller, cheaper and faster products.

This workshop is an opportunity for passive integration developers to interact with industry leaders who are bringing these technologies to the marketplace. Sessions will address the following topical areas: Materials, Processing, Applications, Design and Market Trends

View the complete Advance Program and register on-line at

Chapter Activities (events listed in chronological order)

New England Chapter - Dinner Meeting Next Tuesday, October 2, on Precision Laser Processing for Microelectronics and Fiber Optic Manufacturing    ^ Top
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Microelectronics and Fiber Optic Manufacturing".  For details please see the meeting notice at

The application of laser based materials processing for precision micro scale manufacturing in the electronics and fiber optic industry is becoming increasingly widespread and accepted. This presentation will review latest laser technologies available and discuss the issues to be considered in choosing the most appropriate laser and processing parameters. High repetition rate, short duration pulsed lasers have improved rapidly in recent years in terms of both performance and reliability enabling flexible, cost effective processing of many material types including metal, silicon, plastic, ceramic and glass.

Demonstrating the relevance of laser micromachining, application examples where laser processing is in use for production today will be presented, including miniaturization of surface mount capacitors by applying a laser technique for demetalization of tracks in the capacitor manufacturing process and high quality laser machining of fiber optics including stripping, cleaving and lensing, resulting in optical quality finishes without the need for traditional polishing. Applications include telecoms, biomedical and sensing.

OpTek Systems were formed in 2000 and provide fully integrated systems and sub contract services for laser processes. They are headquartered in the UK and are currently establishing a presence in North America through a laser processing facility in South Carolina and a sales office in the North East.

Andrew Webb has been involved in the laser industry for about 16 years and is currently Head of Business Development at OpTek Systems Inc. He is primarily responsible for the precision laser machining division, expanding OpTek's presence in North America. He was previously a Sales Director at Oxford Lasers Inc. working in the application areas of laser micro machining and laser based high speed imaging.

Prior to locating in the US 9 years ago Andrew was an applications engineer with Oxford Lasers Ltd and started his career as an engineering apprentice with the UK Atomic Energy Authority achieving a HND in Mechanical Engineering from Oxford Brookes University.

The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA.  Call for technical papers are available at

Please visit the IMAPS New England Chapter Website for announcements of future events

Arizona Chapter Lunch Meeting Next Thursday, October 4, on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00

Special - No Charge for pre-registered attendees. (Vendor Tables available for $20)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, October 1.

RSVP by October 1, 2007, on-line at or by email - Reserve your display table at

Metro Chapter November 7 Dinner Meeting on Evaluation of Wire Bond Systems for Manufacturability    ^ Top

Date: November 7 , 2007
Schedule: Registration/Networking 5:00 pm - 6:30pm
Dinner Buffet 6:30 pm - 7:15 pm
Technical Presentation 7:15 pm - 8:00 pm
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Members: $30.00 if Pre-Registered November 5, 2007
$35.00 After November 5,2007

Non-Members: $35.00 if Pre-Registered by November 5, 2007
$40.00 After November 5, 2007

Student Members: $10.00 if Pre-Registered before November 5, 2007 $20.00 after November 5, 2007

Exhibits: There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert ( or Scott Baldassarre ( if you are interested.

Phone: Scott Baldassarre: (631) 436-7400 X 9853

Evaluation of Wire Bond Systems for Manufacturability

Presented by Student Members from Farmingdale College of the State University of NY:

Tim Resig & Christian Grigoleit
Facilitated by: Mike McKeown Orthodyne


As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.

This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at for more information.

Products and Publications

IMAPS 2007 Printed Proceedings DEADLINE October 10, 2007 - Pre-Orders Only - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit and follow the links for registration or visit to reserve your copy today.


Oneida Research Services

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact

^ Top

National Training Center For Microelectronics



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