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September 5, 2007

AI Technology

Button Thermal Management Workshop In Less Than 3 Weeks (read more...)

Button Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Next Thursday: Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits (read more...)

Bullet Next Thursday: Indiana Chapter September 13 Tour of Haynes International and Dinner Meeting (read more...)

Bullet French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007  (read more...)

Bullet News From IMAPS New England Chapter (read more...)

Bullet Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology (read more...)

Bullet MicroTech 2008 Call for Papers (read more...)

Bullet Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium (read more...)

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited (read more...)

IMAPS Events (view full Web Calendar)

Thermal Management Workshop In Less Than 3 Weeks    ^ Top
Thermal Management 2007 is being held September 24-27, at the Holiday Inn San Jose in San Jose, California. The Advance Program and Registration is now available on-line at

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and wireless/telecom systems. Sessions will address the following topical areas: Market Drivers, Pumped Liquid Cooling, System Cooling, Air Cooling, Thermal Interface Materials,
Datacenter Cooling, Test and Equipment, High Conductivity Materials and Passive Phase-Change.

View the complete Advance Program and register on-line at

Call For Abstracts -- 4th International Conference and Exhibition on Device Packaging Featuring 5 Workshops on 3D Packaging, Flip Chip, Medical Devices, MEMS and Wafer Level Packaging/Embedded Packaging    ^ Top
IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging being held in Scottsdale/Fountain Hills, Arizona, from March 17-20, 2008. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types.

The format again this year will feature five workshops concentrating on:

These workshops have been at the core of previous Device Packaging Conferences and are a continuation of past successful IMAPS Advanced Technology Workshops. This format will provide a forum for the presentations of leading-edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Wafer Level Packaging/Embedded Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at no later than November 30, 2007.

Those wishing to present in one of the workshops of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

Chapter Activities (events listed in chronological order)

Next Thursday: Metro Chapter Dinner Meeting September 13 Featuring Presentation on Nanotechnology by Dr. Martin Moskovits   ^ Top

When: September 13, 2007
Schedule: Registration/Networking: 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Where: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Members: $30.00 if Pre-Registered September 6, 2007
$35.00 After September 6, 2007

Non-Members: $35.00 if Pre-Registered by September 6, 2007
$40.00 After September 6, 2007


Phone: Steve Lehnert  (631) 345-3100

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Dr. Martin Moskovits
Chief Technology Officer API Nanotronics

Prior to joining API Nanotronics Dr. Moskovits was the Dean of Science and Professor of Physical Chemistry at the University of California, Santa Barbara. He also has significant academic and industrial leadership and research experience. Dr. Moskovits¹ research expertise includes the area of nanoscience and nanotechnology with special emphasis on nanosensors and is also known for developing porous anodic aluminum oxide as a template platform for nanotechnology. He serves as Vice Chair of the U.S. Department of Energy Basic Energy Sciences Advisory Committee and was a member of the DOE advisory committee on the establishment of the DOE's five nanocenters.

Next Thursday: Indiana Chapter September 13 Tour of Haynes International and Dinner Meeting    ^ Top

When: September 13, 2007
Schedule: Tour Starts 4:00 PM
Dinner: 5:30 PM
Meeting: 6:00 PM

Haynes International
Kokomo, IN

Dinner & Meeting to follow at:
Pizza Hut
Kokomo, IN


IMAPS Members: $10.00
Non-Members: $12.00
Students: $5.00


Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00pm on Tuesday, September 11, 2007.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email

Dave Fluck
Haynes International
Superintendent of Lab Services


Haynes International, Inc., headquartered in Kokomo, Indiana, USA, is a world leader as the inventor, developer, and producer of quality high performance nickel- and cobalt-based alloys.

Haynes International, Inc. is a technology and service oriented company devoted to the development and manufacture of high-performance nickel- and cobalt-based alloys for service in severe corrosion and high-temperature applications. Well-trained professionals within the company provide superior customer service and technical support worldwide. Haynes' service centers and affiliates have available in-stock sheet, plate, bar, wire, tubing, forging stock, fittings, and flanges.

Heat- and corrosion-resistant alloys are our only business. We go the extra mile to ensure that our products provide reliable performance, the kind of performance you've come to expect from HASTELLOY® and HAYNES® products. We offer our customers unmatched technical support and a full range of services including plasma cutting, water jet cutting, shearing, saw cutting, and others through our Service Center Network. If the alloy you need is in stock, we can typically ship within 24 hours.

The history of Haynes International, Inc. is one of innovation and continuous improvements in the processing and development of high performance alloys.   The company was started in 1912 in Kokomo, Indiana as the Haynes Stellite Works.  Its principal product was cobalt-chromium-tungsten metal-cutting tools, the invention of Elwood Haynes.  Over the past 95 years, Haynes International alloys have been used in aero space, petrochemical, nuclear, pharmaceutical, agrichemical, and  biopharmaceutical industries.  Since 1967, the company has won nine “R&D 100” awards for alloy developments.

French Chapter Annual Conference/Exhibition, Toulouse, September 25-26, 2007   ^ Top
The organisation of INTERCONEX 2007 in the Ville Rose is now well engaged.

As expected, the favourable intellectual, technological and industrial environment met an exceptional adhesion of the exhibitors. So we are already sure of a first success with all the available booths (52) sold, in April, more than five months before the event.

The “Centre Pierre Baudis” premises allow us to organize the conference in a close vicinity of the exhibition hall. Under the title Packaging et Interconnexion dans les Systèmes Embarqués, the technical programme will be dedicated to new developments as well as industrial experience returns, in the field of packaging for on board equipments. It will be organized in five sessions, including a total of 34 papers.

In the morning of Tuesday, September 25, the opening session (four papers) will be dedicated to road maps and prospective R&D presentations. In the afternoon, Session “A” will be entitled “Innovative Sensors, as an interface of Smart Systems”. This nine papers session is a partnership of IMAPS with GIXEL (the French trade pool for the Interconnection of Electronic Components) and the LAAS (Laboratoire d’Analyse et d’Architecture des Systèmes). In parallel with the session “A” the session “B” (four papers) will be dedicated to “Experience returns on RoHS and Materials” and the session “C” will offer three papers on “design and Inspection”. In the morning of September 26, the session “D” “On board applications” will be shared in “On board avionics applications” (three papers) and “On board automotive applications” (four papers). Finally, in the session “E”, six papers will be dedicated to hard environment stress applications.

The close vicinity of the conference rooms with the exhibition will help fruitful exchanges between the auditors, the exhibitors and the visitors. For registration or information:

Please contact Florence Vireton at the IMAPS France office,
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Or visit the chapter web site,

News From IMAPS New England Chapter    ^ Top
The first Chapter Technical meeting of the 2007-2008 season will be Tuesday October 2 at 6:00 PM at the Marlborough Courtyard Marriot with a presentation by Andrew Webb, Head of Business Development OpTek Systems, on "Precision Laser Processing for Micro Electronics and Fiber Optic Manufacturing".  For details please see the meeting notice at

The New England Chapter is also pleased to announce that Dr. Amaresh Mahapatra of Linden Photonics will be our Technical Symposium Chair for our 35th Symposium and Expo to be held May 6 2008 at the Holiday Inn Boxborough Woods, Boxborough MA.  Call for technical papers are available at

Please visit the IMAPS New England Chapter Website for announcements of future events

Arizona Chapter October 4th Lunch Meeting on 3D Packaging Trends and Technology    ^ Top
Please join the IMAPS Arizona Chapter for a discussion on: 3D Packaging Trends and Technology, presented by Lee Smith, Senior Director of New Business Development, Amkor Technology. A broad overview of applications trends and technologies in 3D packaging will be presented. Mainstream technologies and applications to emerging developments will be covered with examples such as: wirebond stacked die; package on package stacking; Flip Chip + Wire Bond mixed technology stacks; and Thru Si via based stacking.

Date: Thursday, October 4, 2007
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location: Mesa City Library - Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202
Cost: Luncheon and presentation - $10.00
Vendor display tables available for $20.00

Special - No Charge for pre-registered attendees. (Vendor Tables available for $20)

On-line registration for attendees and exhibitors will close at 5pm Eastern on Monday, October 1.

RSVP by October 1, 2007, on-line at or by email - Reserve your display table at

MicroTech 2008 Call for Papers   ^ Top
MicroTech 2008 is being held March 11-12, 2008, at Glaziers Hall in London, UK.
Invitation…The 40th year of IMAPS UK – Gala Conference. This, the 40th anniversary event, will be a significant opportunity to share your knowledge and expertise; to contribute to the professional development of your colleagues and to impact the future direction of the industry.

The special topic of MicroTech 2008 is “Chip to System …  Interconnect & Packaging ”.  IMAPS UK is looking for visionary  technical contributions representing the leading edge of Technology Manufacturing and supporting the need for Intelligent Manufacturing of Advanced Electronics Products and Systems. Future products will be enabled by the use of microdevices and microsystems, spanning all areas of application and opening new business opportunities. Not only downscaling from existing products to smaller systems and components but also new concepts as well as the integration of the emerging field of nanotechnology and the micro-world will shape our future in an unprecedented way.

This ‘SPECIAL’ event brings together international leading experts in the field of micro-engineering from science, academia and industries who will present their views of future technology needs.  The conference should help to exchange innovative technical solutions and practical problems to stimulate new applications and to help to establish an infrastructure for a more cost effective future.

We are inviting Key technical papers covering:

  1. Emerging Applications
  2. Future Interconnections
  3. Developing Technologies
  4. System Integration
  5. Advanced Substrates
  6. Nano-Tech Integration

Abstracts of around 200 words should be sent to the MicroTech 2008 Technical Programme Committee via the IMAPS-UK secretariat by e-mail, post or fax. The closing date for receipt of abstracts is now September 30, 2007 and notification of acceptance will be sent to successful speakers by November 30, 2007. Final papers for publication will be required by December 1, 2007.

Contact details for the IMAPS-UK secretariat are:
4 The Close, Bracebridge Heath, Lincoln, LN4 2PB. 
Tel: +44 (0)1522 575212 - Fax: +44(0)1522 575582   

Indiana Chapter Announces Plans for 2008 Vendor's Day and Mini-Symposium   ^ Top
The Indiana Chapter will hold its 2008 Vendor's Day and Mini-Symposium on April 14 at the Indianapolis Holiday Inn Select-Airport. Further details will be available soon. Please visit the chapter website at for more information.

Products and Publications

IMAPS 2007 Printed Proceedings Available For Pre-Order - Supplies Limited    ^ Top
IMAPS Printed Proceedings are available again this year, but only to those who pre-order before October 10, 2007. While all IMAPS 2007 Full Symposium Registrants receive one copy of the Proceedings CD-Rom with their registration, the Printed Books are only available at an additional cost. Your Printed Proceedings will only be reserved if you pre-order a copy from IMAPS on/before October 10. Supplies are limited to pre-orders only and copies will not be made available after the Symposium. Visit and follow the links for registration or visit to reserve your copy today.


Oneida Research Services

Thermal Management
September 24-27, 2007
San Jose, CA

IMAPS 2007 - 40th International Symposium on Microelectronics
November 11-15, 2007
San Jose, CA

*Exhibitors contact

Integrated/Embedded Passives
November 15-16, 2007
San Jose, CA

Global Business Council Spring Conference 2008
March 16-17, 2008

Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

*Exhibitors contact

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact

^ Top

National Training Center For Microelectronics



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