International Conference on Alternative Energy Begins Next Week - On-line Registration Ends Friday ^
Conference on Alternative Energy will be held January 16-18,
2007, at the Albuquerque
Embassy Suites Hotel & Spa in
Albuquerque, New Mexico. On-line registration closes this Friday, January 12 at 3pm Eastern. The technical program and registration form are now on-line at www.imaps.org/energy.
The technical program will feature the following:
- Session 1: Photovoltaics New Materials, Design and Economics
- Session 2: Concentrated Photovoltaics
- Session 3: Energy Policies
- Session 4: Photovoltaic Conductor Materials and Process
- Session 5: Next Generation Fuel Cells and Other Energy Technologies
- Session 6: Photovoltaic Commercialization, Economics and Storage
- Session 7: Process, Standards and RoHS
- Keynote Presentation: Fuel Cells: A Legislative Agenda for the 110th Congress and Beyond
- Panel Discussion: Alternative Energy, Key Technologies, Policies and Investment
The Energy Conference is being sponsored by the International Microelectronics And Packaging Society (IMAPS) and is a continuation of the past Fuel Cell Workshop and will focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.
Program, Registration and Tabletop Exhibit Application Now Available for CICMT 2007 - 3rd
IMAPS/ACerS International Conference and Exhibition on Ceramic
Interconnect and Ceramic Microsystems Technologies ^
The 2007 Conference is being held
April 23-26, 2007, at the Grand Hyatt Hotel in Denver, Colorado.
The program and registration is now available on-line at www.cicmt.org.
This three day event will bring together experts from Asia, Europe, North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 60 different organizations including universities as well as industrial R&D, the conference will provide a wide spectrum of interests reflected in 60 contributed papers in 14 sessions. This year’s keynote speakers will focus on: Molecular Medical Diagnostics, Microsystems and Microfluidics and Terabit Wireless Devices.
Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To facilitate networking, these exhibits will be located in the same room used for breaks and meals. To reserve space, visit www.cicmt.org or contact Ann Bell (email@example.com; 202-548-8717).
Military, Aerospace, Space and Homeland Security Abstract Deadline Extended Until Friday, January 19 ^
The Topical Workshop and Tabletop Exhibit on Military, Aerospace, Space and Homeland Security (MASH): Packaging Issues and Applications will be held May 8 - 10, 2007, at the Radisson Plaza Lord Baltimore Hotel, 20 W. Baltimore Street, Baltimore, MD 21201. For more information, visit www.imaps.org/mash. Abstracts will be accepted until Friday, January 19, 2007.
In our current environment where the focus is on military activities and homeland security; extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will expand upon the previous workshops and will focus on the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on materials and processing issues at the component level as well as the connected issues at the design and applications level.
An outstanding program is planned with internationally recognized authorities from industry and academia.
Those wishing to present papers may submit a 200 word or less abstract electronically by January 19, 2007; using the on-line submittal form at: www.imaps.org/abstracts.htm.
San Diego Chapter January 23 Dinner Meeting Featuring Update of RoHS Directives and Laws ^
The San Diego Chapter of IMAPS invites you to attend the January 23rd Dinner Meeting, at the Holiday Inn, 3805 Murphy Canyon Rd., San Diego. The after dinner
talk by Mike Dolbow, CEO of A Total Green Planet Solution, will be on topics
related to RoHS. Social hour is at 5:30 p.m., with dinner at 6:30 and the talk
at 7:15. The cost is $7 (RSVP’d Students), $15 (RSVP’d Members) or $20 (Others).
For information or to RSVP, contact Dave Virissimo at (619) 464-5430 or firstname.lastname@example.org.
Update of RoHS directives & laws
How to implement RoHS into process engineering, inspection
Fitting RoHS into present manufacturing structure physically
EPA Prop 65
CEO of A Total Green Planet Solution (www.atotalgps.com)
20+ years in Electronics Manufacturing Industry
BSEE, Portland State University
AA Computer Science, UCSM
OSHA Chemical and Safety Inspector (Chemical Associates Certification)
Process Certification and Defect Recognition - Hybrids, Microcircuits and
RF/MMIC Modules (IBM Certification)
8+ years Manufacturing Engineer
CQE (Certified Quality Engineer - American Society for Quality)
Lead Free High Reliability Soldering Course (Omni Certified)
Wire Bonding Certification / Ball / Wedge (IBM Certification)
Metallurgy Technologist Certification level 2 (IMA Certification)
Master Level ESD auditing and training certification (General Instruments)
Material handling for Medical Electronics (FDA Certification - Medication
23 other certifications in different aspects of process engineering.
Metro Chapter Dinner Meeting January 24 with Daniel Baldwin Presenting Flip Chip Technology: What, Why, How ^
Wednesday January 24, 2007
Dinner Buffet 6:30-7:15
Technical Presentation 7:15-8:00
Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Members: $30.00 if Pre-Registered by January 23, 2007
$35.00 At the door
Non-Members: $35.00 if Pre-Registered by January 23, 2007
$40.00 At the door
Phone: Steve Lehnert (631) 345-3100
Flip Chip Technology: What, Why, How
This presentation will give a detailed overview of Flip Chip die attach. It will discuss the various interconnection methods utilized including wafer bumping and adhesives. The paper will cover the driving forces behind Flip Chip as well as the advantages and disadvantages. Several examples will be shown and discussed, including RFID and Medical Applications. Some of the history of Flip Chip technology will also be presented.
Daniel F. Baldwin
Founder of ENGENT (Enabling Next Generation Technologies)
Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University
Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.
Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.
He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing.
New England Chapter
Technical Meeting January 24 on Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity ^
||Marlborough Marriott (Formerly the Radisson)
Route 495 to Exit 24B.
Take first right off exit just before gas station.
75 Felton Street, Marlborough, MA 508-480-0015
5:30 p.m. Registration, Socializing, Networking & Cash Bar
6:30 p.m. Dinner
7:30 p.m. Presentation by Jonathan Margalit, Ph.D / H.C. Starck Inc
"Thermal Modeling of a Refractory Metal Substrate with Improved Thermal Conductivity"
ABSTRACT: With the increasing performance and the miniaturization of electronic devices there is a growing need for advanced thermal management materials and components. Efficient heat dissipation is required to maintain device reliability, durability and performance consistency. This presentation reviews the thermal modeling and experimental data of a patent-pending, refractory metal (Mo) based, passive cooling element, containing Cu-filled through holes. An additional and unique feature of the product described is the ability to design the size, location, density and pattern of the through-holes. This allows the advantage of a targeted channeling of heat away from hot spots, i.e., localized areas with significantly higher heat loads.
Jonathan Margalit, Ph.D. in Material Science from the Technical University of Aachen, Germany (thermal expansion of Al-silicate based ceramics). National Service Manager for a semiconductor x-ray analysis tool manufacturer. With H.C. Starck since 2000 in various positions (Marketing, Product Management), currently responsible for new business development for thermal management related applications, including HB-LEDs, hybrid vehicle power converters, and power semiconductors.
Click for PDF Form
There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.
Dinner Choices 1) Chicken Saltimbocca, 2) Grilled Vegetarian Wellington.
Pre-registration must be received by Monday January 22nd!!
Send Registrations to: Susan Munyon
96 Grant Way, Lancaster, MA 01523-3112
At-door registration is an additional $5.00. If you make a reservation and can’t make the meeting, please cancel by Monday, January 22nd or the Chapter is billed for your meal.
Click for PDF Form
Contact Mark A. Occhionero with questions:
IMAPS New England Chapter President www.imapsne.org
Ceramics Process Systems www.alsic.com
(508) 222 0614 x 42
French Chapter Announces 2nd European ATW on Micropackaging and Thermal Management ^
After the real success of the first issue, last year, the 2nd European ATW on Micropackaging and Thermal Management will be held, January 31 and February 1st, in La Rochelle on the French Atlantic coast.
The aim of the workshop will be to help exchange of information between scientists and engineers involved in the field of thermal management, for high integration levels. Due to the rising speed and miniaturization the mastering of thermal effects is and will keep being a technological key for the future packaging solutions.
After a welcome session, including two keynote addresses, the technical program will gather 21 papers in five sessions:
Session 1: Materials
Session 2: Applications
Session 3: Thermal modelling and reliability
Session 4: Advanced cooling solutions
Session 5: Test and Measurement Methods
The international dimension of the event is attested by half of the presentations from five different countries, including Belgium (4), Germany (2), United States (2), Spain (1) and Sweden (1). The language will be English.
The workshop site will be: “Hotel Mercure Oceanide” on Vieux Port Sud (Old harbour). It is organized on a global fees basis for registration, hotel (2 nights) and meals (2 diners, 2 lunches). It will start on Tuesday January 30 by a welcome diner. On Wednesday evening the participants are invited to the “Corderie Royale”, an historic manufacture of naval ropes; after the visit the diner will be served on site.
For early registration, up to January 12:
€ 650 will be charged for members, € 750 for non members.
After January 12, the fees will rise to:
€ 750 for members and € 850 for non members.
Speakers and chairs benefit of a special rate of € 480.
The registration deadline will be January 26.
The ATW is open to table top exhibits, strictly limited to organisations involved in the field of thermal management. It will be charged € 300 VAT included for 1 table, two chairs and a poster panel.
For the foreign exhibitors (No VA tax) it will be charged € 250,84.
Up to twenty table tops may be accepted on a “first registered, first served” basis.
For registration, information or questions:
Please contact Florence Vireton at the IMAPS France office, email@example.com
Phone: 33-(0)1-39 67 17 73 Fax: 33-(0)1-39 02 71 93
Or visit the chapter web site, www.imapsfrance.org.
Norcal Chapter Meeting February 7 Featuring Presentation on Packaging Requirements to Meet Future Directions and Needs ^
||Wednesday, February 7, 2007
||11:45 AM – 1:15 PM
1217 Wildwood Avenue
Sunnyvale, CA 94089
||11:30 AM – 12 PM -- Registration, Networking, Social
11:30 AM – 12:15 PM -- Buffet Luncheon
12:00 PM – 1:00 PM -- Speaker Presentation
Students (with ID) $5.00
Prices include lunch and program. Please email Roger Underwood, firstname.lastname@example.org to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.
Packaging Requirements to meet Future Directions and Needs
Mr. Sunil Patel, Packaging Technologist
Recent years have seen growing demands of data storage in digital electronic industry and this trend will continue further during the first decade of 21st century. Hard disk drives will remain the primary choice of storage devices in all segments of PC market and in many non-PC emerging markets. Form factor and capacity are the distinguishing critical features of storage devices for emerging mobile market segment. Small form factor requirements of hard disk drive pose many challenges to semiconductor devices at both component level as well as system/board level. Microelectronic packaging technology has evolved since past few decades and continues to make advanced development to meet current and future requirements. This talk will discuss the trends and role of packaging in hard disk drive applications. Various packaging options for key electronic components are discussed. Concept of system level solution is introduced to meet next generation consumer application requirements.
Mr. Sunil Patel is a Packaging Technologist at Seagate Technology where he is responsible to coordinate cross-functional development of ASIC packaging and addressing key issues for various phases of manufacturing and productization of disc drives. Prior to joining Seagate, Mr. Patel played a key role in defining ASIC package and board level assembly solutions at a small start-up company, providing solutions for storage area network demands. He has also worked at LSI Logic where he built a highly motivated team to develop and qualify industry’s first laminate flip-chip package. Mr.Patel and his team played a key role in establishing industry infrastructure by establishing a robust flip-chip assembly process at major semiconductor package and assembly sub-contractor facilities.
Mr. Patel has worked at Digital Equipment & Eastman Kodak, working on thin film deposition process as well as packaging development and also contributed to industry consortiums like MCC and Sematech.
Call for Papers - International Conference on Electronics Packaging (ICEP) 2007 ^
IMAPS Japan / JIEP
IEEE CPMT Society Japan
April 18 -20, 2007
Shinagawa Prince Hotel, Tokyo, Japan
Technical Topics for Conference Papers:
Advanced Packaging, Area Array Packages, Board EMC Evaluation,
Built-up Substrates, Bump Formation, Environmental Aspects,
EPD/EAD Technology, Flip Chip Technology, High Speed Board Design,
Interconnections, LCD Module Packaging, Lead Free Soldering,
Manufacturing, Materials, MCM, MEMS Packages, Nano Technology,
Optoelectronics, Reliability and Testing, Stacked Structure,
Substrate/Interposer, System in Package, Thermal Management,
Thin Film Technologies, Trend and Education, Underfilling,
VLSI Packaging, Wafer Level Packaging, etc.
Abstract and Paper Submission:
Abstracts were due Wednesday, November 15, 2006.
Formal paper manuscript should be sent by February 1, 2007.
Speaker 40,000 yen. (Including Reception and Proceedings)
General Chair: Y. Shimada (NEC),
Vice General Chair: H. Nishida (NEP Tech.), M. Nakamura (Hitachi)
Secretariat of ICEP 2007
IMAPS Japan / JIEP (Japan Institute of Electronics Packaging)
3-12-2 Nishiogikita, Suginami-ku
Tokyo 167-0042, Japan
Tel: +81-3-5310-2010, Fax: +81-3-5310-2011
E-mail: email@example.com or firstname.lastname@example.org