IMAPS 2008, 41st International Symposium on Microelectronics -- Abstract Deadline Extended Until April 25 (read
Abstracts Still Being Accepted for the Advanced Technology Workshop on Wire Bonding (read
Abstract Deadline Just 3 Weeks Away for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy (read
Military, Aerospace, Space and Homeland Security (MASH) Workshop - On-line Registration Ends Next Friday, April 25 (read
On-line Registration Ends Next Friday for the ATW on Advanced Substrates and Next Generation Semiconductors (read
listed in chronological order)
TOMORROW: Arizona Chapter Lunch Meeting, Thursday, April 17, Featuring Tour of ASU Flexible Display Center and Presentation on Amorphous Silicon Displays on Flexible Substrates: Performance and Manufacturing Challenges (read
Capital Chapter April 30 Dinner Meeting (read
Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read
Viking Chapter May 22 Spring Networking and Social Event (read
SoCal 2008 - June 4 in Los Angeles, California (read
International Conference on Electronics Packaging (ICEP) 2008 (read
Interconex 2008 (Paris) (read
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read
Abstracts Due April 30 for the XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read
The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30 (read
of Microelectronics and Electronic Packaging 1st Quarter
2008 Edition is Available On-line (read
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read
full Web Calendar)
IMAPS 2008, 41st International Symposium on Microelectronics -- Abstract Deadline Extended Until April 25 ^
The 41st International Symposium on Microelectronics (IMAPS 2008) will be held at the Rhode Island Convention Center, Providence, Rhode Island, USA, November 2-6, 2008. Visit www.imaps2008.org for complete information on the symposium.
The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.
View the list of topics of interest on-line at www.imaps2008.org.
To submit an abstract, go to www.imaps.org/abstracts.htm and send your 250-300 word abstract before Friday, April 25, 2008.
If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner at email@example.com or call 305-382-8433.
Abstracts Still Being Accepted for the Advanced Technology Workshop on Wire Bonding ^
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. For more information, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008.
The objective of the Wire Bonding workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of wire bond interconnections. This workshop enables discussion and presentation of the latest wire bonding technology.
- Fine pitch wire bonding
- Stacked die wire bonding and looping
- Heavy wire wedge and ribbon bonding
- Assembly processes and handling issues
- Bumping for High Brightness LEDs and Solar arrays
- Novel wire bonded packages and designs
- High Frequency wire bond packages
- Electromigration and Interfacial Adhesion
- Reliability and Testing
- Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Advanced Technology Workshop must submit a 200-300 word abstract electronically on/before Friday, April 25 using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 1, 2008. For more information, visit www.imaps.org/wirebonding.
Abstract Deadline Just 3 Weeks Away for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy ^
The Advanced Technology Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, August 12-14, 2008. This workshop is a continuation of past Alternative Energy and Fuel Cell events and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.
Abstracts are being solicited in the following areas:
- Solar - Photovoltaics
- Fuel Cells
- Alternative Energy
- Batteries and Hybrids
- Other Approaches
- Focus Thermal and Power Management
- Inverter Materials and Design
- Grid and Storage Approaches
- Design for Efficiency
- Materials & Reliability
- Qualification Approaches
- Environmental Regulations
- Government/State Policies and Incentives
Those wishing to present a paper at this workshop, please submit a 250-300 word abstract electronically on/before May 9, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (firstname.lastname@example.org) or call 305-382-8433.
No formal technical paper is required. A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on July 18, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Contact Ann Bell at email@example.com or 202-548-8717 for information about Tabletop exhibits.
Military, Aerospace, Space and Homeland Security (MASH) Workshop - On-line Registration Ends Next Friday, April 25 ^
The Advanced Technology Workshop (ATW) on Military, Aerospace, Space and Homeland Security is being held April 28-30, 2008, at the Conference Center at the Maritime Institute in Linthicum Heights, Maryland - just minutes from downtown Baltimore and BWI Airport. For more information, visit www.imaps.org/mash. On-line registration ends next Friday, April 25.
This workshop will feature tabletop exhibits and will be co-located with the Advanced Substrates/Next-Generation Semiconductors Advanced Technology Workshop (www.imaps.org/substrates).
On-line Registration Ends Next Friday for the ATW on Advanced Substrates and Next Generation Semiconductors ^
The Advanced Technology Workshop (ATW) on Advanced Substrates/Next-Generation Semiconductors is being held April 30-May 1, 2008, at the Conference Center at the Maritime Institute in Linthicum Heights, Maryland - just minutes from downtown Baltimore and BWI Airport. For more information, visit www.imaps.org/substrates.On-line registration ends next Friday, April 25.
This workshop will be co-located with the Military, Aerospace, Space and Homeland Security Advanced Technology Workshop (www.imaps.org/mash).
This all new workshop will feature state-of-the-art technologies related to novel engineered substrates and next-generation semiconductors. The objective of the workshop is to have a unique forum that brings together engineers, scientists, manufacturing, academia, and business experts from around the world. This workshop will focus on multiple aspects of advanced substrates/next-generation semiconductors from basic materials, processing and reliability issues to implications to packaging and leading-edge applications for commercial and defense activities and others. This mini-workshop is a great opportunity that allows for the presentation as well as debate with Advanced Substrates/Next-Generation Semiconductors developers who are bringing these technologies at the forefront of the marketplace. In addition, these technologies are essential as they are mitigating the limitations posed by conventional substrates and semiconductors.
listed in chronological order)
TOMORROW: Arizona Chapter Lunch Meeting Thursday, April 17, Featuring Tour of ASU Flexible Display Center and Presentation on Amorphous Silicon Displays on Flexible Substrates: Performance and Manufacturing Challenges ^
||April 17 , 2008
Registration and Lunch at 11:30 – 12:00
Presentation and Tour at 12:00 – 1:00
||WP Carey Room
Flexible Display Center at ASU
7700 South River Parkway
Tempe, AZ 85287-0808
No charge for pre-registered attendees
On-site Attendees - Luncheon and Presentation - $10.00
Email Greg Clemons to attend:
Amorphous Silicon Displays on Flexible Substrates: Performance and Manufacturing Challenges
Shawn M. O’Rourke, Director of Operations and Douglas Loy, Ph.D., Technology Integration Manager, Flexible Display Center at ASU
A low temperature, 180 °C, amorphous Si (a-Si:H) process on bonded stainless steel substrates is discussed and a 3.8-inch QVGA active matrix (AM) electrophoretic display as well as a 64x64 electrophoretic display with integrated column drivers are demonstrated. The n-channel thin-film transistors (TFTs) exhibited saturation mobilities of 0.7 cm2/V-sec, median drive currents of 26.2 mA and low defectivity. An overview of manufacturing challenges will also be discussed.
Shawn M. O’Rourke, the Director of Operations was instrumental in the conceptualization, award and development of the Flexible Display Center. His responsibilities include tool acquisition, new processes, materials, and tool development, and operation of the 6-in wafer scale and GEN II backplane fabrication pilot lines, as well as supply chain and new business development. He is the Chairman of the FDC Manufacturing and Integration Technical Advisory Board and participates on the U.S. Display Consortium Technical Council. His research expertise gained at Argonne National and Pacific Northwest Laboratories and as a Principal Staff Engineer with Motorola Flat Panel Display and Life Sciences Divisions have spanned microelectronics packaging, bioMEMS, thick film materials, and display manufacturing. He has published more than 15 technical papers and is the holder of nine U.S. patents with 4 patents pending. Prior to assuming the Director of Operation’s position at the Center launch in spring 2004, he was a Process Engineering Manager at ASU’s Center for Applied NanoBioscience from 2001 to 2004., He earned a B.S. of Ceramic Science from Alfred University in 1993; a M.S. Materials Science and Engineering at the University of Washington in 1996; and an M.B.A. from ASU in 2005.
Douglas Loy, Ph.D., the Technology Integration Manager, is responsible for developing material technologies, handling processes, and toolsets for pilot line applications including: permanent and temporary adhesives and associated bond/debond tools and manufacturing processes; flexible substrate planarization materials and handling procedures; display build processes and inventories. Prior to his current role, Dr. Loy was Director of Technology Assessment and cofounder of E3 Innovation where he performed competitive intelligence and technology assessments for clients. Before forming E3 he worked at Three-Five Systems where he charted an R&D program on Organic Light Emitting Displays and was instrumental in the formation of Three-D OLED, a Joint-Venture between Three-Five Systems and DuPont. Dr. Loy came to Three-Five Systems after serving as Sr. Research Chemist at Polar Vision. Dr. Loy has 9 years in engineering, R&D program management & process improvement. He brings an extensive technical background in basic and applied research of new electronic materials and display technologies. As a result of his research, he has 5 issued patents in the field of organic electronics. His directed research efforts include the development of polarizing films with increased environmental stability, fabrication and testing of small molecule and polymer optoelectronic devices, and the development of organic electronic materials with improved thermal stability. Dr. Loy earned a Bachelor's degree in Chemistry Physics from Kean University and a Ph.D. in Chemistry from the University of Southern California.
Capital Chapter April 30 Dinner Meeting ^
||April 30, 2008
5:30 Registration and networking - Cash Bar
6:30 Dinner and Discussion, voting on future meetings of the Capital Chapter
6075 Belle Grove Road
Baltimore, Maryland 21225
IMAPS members $10.00
Non Members $20.00
Please register no later than the Wednesday, April 23rd.
Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 ^
||May 7-9, 2008
May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent May 8, 2008:
½ Day Symposium and Vendor Table Top Show
May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates
||Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)
May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)
Contact Steve Lehnert to register.
Phone (631) 345-3100
May 7, 2008
Time: 8:00 AM-4:30 PM
A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin
Founder of Engent Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University
Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.
Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.
He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:
- Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME) Board of Directors, Surface Mount Technology Association (SMTA) ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
- Outstanding Research Award, National Science Foundation, Packaging Research Center
Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)
May 8, 2008
We will be holding a ½ Day Symposium & Table Top Show
We are presently looking for Technical Presentations in the following Areas:Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com
We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available). Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: firstname.lastname@example.org.
We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.
May 9, 2008
Time: 8:00 AM-4:30 PM
A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts
A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?
Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.
Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.
500.00 IMAPS Member
600.00 Non Member
(Includes Continental Breakfast and Lunch)
Contact Steve Lehnert Phone (631) 345-3100 Email email@example.com to register
Viking Chapter May 22 Spring Networking and Social Event ^
||May 22, 2008
3-6 PM Dual Happy Hours
4-5 PM Lawn Bowling
1110 Nicollet Mall
Minneapolis, MN 55403
IMAPS members - $8.00
Non Members - $12.00
Students - No Charge
First 5 to register are complimentary
|RSVP to Sue Blankenheim by Monday, May 19
Bring a Friend and enter Raffle for $25 Gift Certificate/Door Prize.
Brit’s Pub is located on Nicollet Mall in Downtown Minneapolis. Please join us under the sun and up on the roof for afternoon of Springtime Fun and Cheer. Lawn Bowling is a cross between golf and bowling, with a lot less skill needed to play and a lot more luck needed to be successful.
DIRECTIONS: Brit’s is located between 11th and 12th Streets on Nicollet Mall across from Orchestra Hall.
SoCal 2008 - June 4 in Los Angeles, California ^
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition June 4, 2008
The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA
- Technical Presentations with invited papers!
- Tabletop Exhibits!Door Prizes in the Exhibit Area!
- Lunch included!
Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies.
Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email firstname.lastname@example.org. Online booth registration - http://www.imaps.org/registration/socal2008.htm
Online Complimentary Attendee Registration – http://www.imaps.org/chapters/freepass.asp
Further information – Contact:
Salim Akbany at 310-812-0343
Farman Mesdaghi at 310-813-5449
Maurice Lowery, at 310-814-1890 email@example.com
International Conference on Electronics Packaging (ICEP) 2008 ^
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.
Sessions are being planned in the following topical areas:
- Nano Technologies
- Organic Semiconductors
Other subject matter relating to electronics packaging will also be considered
Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)
General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: firstname.lastname@example.org, URL: http://www.jiep.or.jp/icep/
Interconex 2008 (Paris) ^
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:
- Materials and new processes : lead-free, polymers, assembly process, intraconnections
- Printed circuit boards, new technologies
- Large BGA packages
- Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible support
- Applications: microsystems, power, medical, telecommunication, automotive industries
- Modelling, simulation
- Thermal management
- Test, reliability and characterization
For more information, contact:
IMAPS Comité technique
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: email@example.com, URL: http://www.imapsfrance.org
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) ^
ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
Sessions are being planned describing new development in the following themes:
Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.
High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.
Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.
Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.
Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.
Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.
Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.
Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
SUBMISSION OF ABSTRACT/PAPER
The abstract deadline has passed. If you have questions about submitting an abstract, please email: firstname.lastname@example.org.
Authors will be notified of paper acceptance by April 25, 2008. The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals.
For more information, visit http://www.icept.org/newweb/cpage.asp.
Abstracts Due April 30 for the XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.
This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.
The Conference topics include:
- Hybrid and Semiconductor Technology
- Design Methods and Computer Simulations
- Electronics Materials and Components
- Microcircuits Applications
- Thick-Film and Thin-Film Sensors
- Packaging and PCB
- Quality and Reliability Evaluation
- Thermal Management
- Optoelectronics and Photovoltaics
- Education in Electronics
The Conference presentations will be made in the form of:
- Invited lectures
- Poster sessions for presentation of contributed papers
Please submit one-page abstract of your paper before 30 April 2008. You should receive notification about acceptance before 30 May, 2008. Please note that the accepted abstracts will be printed in a book form after the full review procedure.
The deadline for full paper submission is 30 June 2008. The accepted papers will be published in the Conference Proceedings edited in electronic form.
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl.
If you have any question please do not hesitate to contact us. The address for correspondence:
Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30 ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:
- Automotive Electronics, Telematics, MEMS, Power
- 3-D, Embedded Substrate
- Cu/Low k, Wafer Level
- LED, Solar cell
We are really sure that your presentation will greatly help the Symposium be successful and your internationally recognized expertise in the field will provide all the Symposium participants valuable scientific and technical information on the related area. We would extend a hearty welcome to all speakers in advance for accepting our invitation.
Abstracts are now being accepted. Download the abstract form at www.imaps.org/chapter/asia/korea/ISMP2008_Invite.pdf. Abstracts must be sent to IMAPS-Korea by May 30th, 2008.
For more information, please contact email@example.com or visit http://www.imapsk.or.kr.
We would also like to ask you to introduce the Symposium to your colleagues. We remember that audience's response was really great to all the presentations of foreign speakers last year. We are sure that the Symposium will be more successful with help of world-wide experts including you.
|Products and Publications
Re-Designed Journal of Microelectronics and Electronic Packaging 1st Quarter 2008 Edition is Available On-line ^
The First Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line. Log-on
to access the Journal.
With this 1st quarter 2008 issue, you will notice a comprehensive change in the formatting and style from what we have published in the past. We hope that you will find this format both pleasing to the eye and more pleasant to read.
The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! ^
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society. iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:
- Journal of Microelectronics and Electronic Packaging (JMEP)
- Advancing Microelectronics
- IMAPS Symposium Proceedings
- IMAPS Conference Proceedings
- IMAPS Workshop Presentation Slides
- Global Business Council Presentations
- Podcasts (archived web meetings)
- Reference Textbooks
Using iKNOW’s Advanced Search Engine, you can locate papers by:
- Primary Author
- Primary Author Company
- Event / Category
- Publication Format
Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.
CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008
*Exhibitors contact firstname.lastname@example.org
ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008
HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
*Exhibitors contact email@example.com
IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA
ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
*Exhibitors contact firstname.lastname@example.org
ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA
IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
*Exhibitors contact email@example.com