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April 30, 2008

AI Technology

Button Abstract Deadline Next Friday, May 9, for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy (read more...)

Button Abstracts Due in 3 Weeks for the New RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: Capital Chapter Dinner Meeting Next Wednesday, April 30 (read more...)

Bullet TODAY: Abstracts Due for the XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Bullet Metro Chapter 3-Day Technical Symposium and Workshop Being Held in Two Weeks - May 7-9, 2008 (read more...)

Bullet Viking Chapter May 22 Spring Networking and Social Event (read more...)

Bullet SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert (read more...)

Bullet IMAPS UK's MicroTech 2008 Program and Registration Now On-line (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

Bullet The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30 (read more...)

Advancing Microelectronics May/June 2008 On-line Magazine is Now Available (read more...)

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

Abstract Deadline Next Friday, May 9, for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, August 12-14, 2008. This workshop is a continuation of past Alternative Energy and Fuel Cell events and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

  • Solar - Photovoltaics
  • Fuel Cells
  • Alternative Energy
    • Geothermal
    • BioFuels
    • Batteries and Hybrids
    • Wind
    • Other Approaches
  • Focus Thermal and Power Management
  • Inverter Materials and Design
  • Grid and Storage Approaches
  • Design for Efficiency
  • Materials & Reliability
  • Qualification Approaches
  • Environmental Regulations
  • Government/State Policies and Incentives

Those wishing to present a paper at this workshop, please submit a 250-300 word abstract electronically on/before May 9, using the on-line submittal form at: If you need assistance with the on-line submission form, please email Jackki Morris-Joyner ( or call 305-382-8433.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on July 18, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at or 202-548-8717 for information about Tabletop exhibits.

Abstracts Due In 3 Weeks for the New RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • High Power Electronics
  • Military / Space / Extreme Environments
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 23, 2008, using the on-line submittal form at: Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit

Chapter Activities (events listed in chronological order)

TODAY: Capital Chapter Dinner Meeting    ^ Top

Date: April 30, 2008

5:30 Registration and networking - Cash Bar
6:30 Dinner and Discussion, voting on future meetings of the Capital Chapter

Rose Restaurant
6075 Belle Grove Road
Baltimore, Maryland 21225

IMAPS members $10.00
Non Members $20.00

Contact :
Lou Razzetti, (preferred) or 301-588-0637


TODAY: Abstracts Due for the XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference    ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle ( on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.

The Conference topics include:

  • Hybrid and Semiconductor Technology
  • Design Methods and Computer Simulations
  • Electronics Materials and Components
  • Microcircuits Applications
  • Thick-Film and Thin-Film Sensors
  • Packaging and PCB
  • Quality and Reliability Evaluation
  • Thermal Management
  • Optoelectronics and Photovoltaics
  • Education in Electronics

The Conference presentations will be made in the form of:

  • Invited lectures
  • Poster sessions for presentation of contributed papers

Please submit one-page abstract of your paper before 30 April 2008. You should receive notification about acceptance  before 30 May, 2008. Please note that the accepted abstracts will be printed in a book form after the full review procedure.

The deadline for full paper submission is 30 June 2008. The accepted papers will be published in the Conference Proceedings edited in electronic form.

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation:

If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03

Metro Chapter 3-Day Technical Symposium and Workshop Begins Next Week - May 7-9, 2008    ^ Top

Date: May 7-9, 2008

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent
May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

May 8 Vendor Table Fees:
Cost 450.00

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)


Contact Steve Lehnert to register.
Phone (631) 345-3100

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin

Founder of Engent Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME) Board of Directors, Surface Mount Technology Association (SMTA) ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008
We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email:

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available). Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email:

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email:

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers,
quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee:
500.00 IMAPS Member
600.00 Non Member
(Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email to register

Viking Chapter May 22 Spring Networking and Social Event    ^ Top

Date: May 22, 2008

3-6 PM Dual Happy Hours
4-5 PM Lawn Bowling

Brit’s Pub
1110 Nicollet Mall
Minneapolis, MN 55403
612 332-3908

IMAPS members - $8.00
Non Members - $12.00

Students - No Charge

First 5 to register are complimentary

RSVP to Sue Blankenheim by Monday, May 19
Phone: 763-425-7910
Fax: 763-424-2675

Bring a Friend and enter Raffle for $25 Gift Certificate/Door Prize.

Brit’s Pub is located on Nicollet Mall in Downtown Minneapolis. Please join us under the sun and up on the roof for afternoon of Springtime Fun and Cheer. Lawn Bowling is a cross between golf and bowling, with a lot less skill needed to play and a lot more luck needed to be successful.

DIRECTIONS: Brit’s is located between 11th and 12th Streets on Nicollet Mall across from Orchestra Hall.

SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008, from 9:00 am to 4:00 pm.

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Attendance is Complimentary
  • Lunch included
  • Door Prizes

Tabletop Exhibits Available
Sample of Exhibitors:
Micropac Industries, Solid State Devices, Sabritec, International Rectifier, Q-Tech Corp., Antares Advanced Test Technology, Gel-Pak, Semiconductor Equipment Corp., Crane, Minco Technology Labs, Calmont Wire & Cable Inc., Astron Electronics, F & K Delvotec Inc.

Technical Program
Papers Invited
Contact:  Salim Akbany or 310-812-0343

This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies

Sample of Topics:
 “Determining the Effects of Package Parasitic on SI and EMC Performance”
“Evaluation of DirectFET® Flip Chip Packaging Technology”
“SAE G-19 Counterfeit Electronic Components Committee”
“Thin-Film Technology Using Nichrome”

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email Online booth registration -

Online Complimentary Attendee Registration

Further information – Contact:
Maurice Lowery, at 310-814-1890

Phil Zulueta at

Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert    ^ Top

Date: June 4 , 2008

7:00-9:00 pm

Holiday Inn Select - Orlando Airport
Contact :
Mike Newton,


Michael R. Ehlert
Director of Process Engineering
1st Past President of IMAPS

Barry Industries Inc.
60 Walton Street
Attleboro, MA 02703
Phone (949) 929-4933

LTCC - Past Present and Future

This will be a broad overview of LTCC from conception through its growth to the present.  We will examine some of the key drivers for its conception, what makes it unique and possible future applications.

LTCC Standards Movement

This will be an up to the minute status report on current work in developing a comprehensive set of standards for all branches of the LTCC supply chain including Fired Properties, Un-Fired Properties and Processing.

IMAPS Initiatives
A succinct report on what is happening at the highest level including proposed organizational changes and their effect on the society worldwide.

IMAPS UK's MicroTech 2008 Program and Registration Now On-line    ^ Top
IMAPS United Kingdom Chapter is holding MicroTech 2008 June 10-11, 2008, at the Beaumont House Conference Centre in Old Windsor. This Conference and Tabletop Exhibition will focus on Advanced Interconnection and Packaging - Visions of the Future - featuring sessions on: 3D and Wafer Level Integration; Micro-Nano Systems; Advance Packaging; Large Area Electronics; and Market Watch. Visit to view the full program and to register on-line.

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • PackagingSubstrates/MaterialsDesign/Evaluation/SimulationManufacturing/ProcessInterconnectionOptoelectronicsNano TechnologiesMEMSOrganic SemiconductorsTrend/Education/Environmental
  • Application.

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.),
K. Yokouchi (Fujitsu Interconnect Technologies)

Secretariat of ICEP 2008
(Japan Institute of Electronics Packaging)
E-mail:, URL:

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnectionsPrinted circuit boards, new technologiesLarge BGA packagesAdvanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible supportApplications: microsystems, power, medical, telecommunication, automotive industriesModelling, simulationThermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail:, URL:

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
Sessions are being planned describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
The abstract deadline has passed. If you have questions about submitting an abstract, please email:

Authors will be notified of paper acceptance by April 25, 2008. The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit

The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30    ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:

  1. Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
  2. LED, Solar cell

We are really sure that your presentation will greatly help the Symposium be successful and your internationally recognized expertise in the field will provide all the Symposium participants valuable scientific and technical information on the related area. We would extend a hearty welcome to all speakers in advance for accepting our invitation. Abstracts are now being accepted. Download the abstract form at Abstracts must be sent to IMAPS-Korea by May 30th, 2008. For more information, please contact or visit

We would also like to ask you to introduce the Symposium to your colleagues. We remember that audience's response was really great to all the presentations of foreign speakers last year. We are sure that the Symposium will be more successful with help of world-wide experts including you.

Products and Publications

Advancing Microelectronics MayJune 2008 On-line Magazine is Now Available   ^ Top
The May/June issue of Advancing Microelectronics on Military, Aerospace and International Technology is now available on-line.
Log-on to access the May/June 2008 issue today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website.

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP) Advancing Microelectronics IMAPS Symposium Proceedings IMAPS Conference Proceedings IMAPS Workshop Presentation Slides Global Business Council Presentations Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords Primary Author Primary Author Company Event / Category Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at


Ticona Engineering PolymersOneida Research Services

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact

^ Top

Compex Corp


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