RF/Microwave Workshop Registration and Hotel Deadlines - This Friday, August 22 ^
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. The early registration cut-off and the hotel deadline are Friday, August 22. After that date, registration prices increase significantly and hotel room rates and availability will not be guaranteed. To view the technical program and to register, visit www.imaps.org/rf.
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. Sessions will be held on:
Last Chance to Submit Abstracts Friday, August 22, for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management ^
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is being held October 14-16, 2008, at the Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California.
For more information, visit www.imaps.org/thermal. This workshop will now feature a limited number of tabletop booths. Tabletop space has sold out!
Abstracts are being requested in the following areas:
Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing. Metallic, metal matrix and polymer matrix materials.
High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.
Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
Preparation of Abstracts:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than August 22, 2008. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.
IMAPS 2008 Advance Program and Registration Now Available! ^
The advance program and registration for IMAPS 2008, the 41st International Symposium on Microelectronics, is now available on-line. The 2008 symposium returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence.
19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.
Device Packaging 2009 Conference and Exhibition - 3D Packaging Workshop ^
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.
The objective of the 3-D Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of 3D Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to 3D Packaging technologies, as well as to bridge the gap between the back-end wafer-level 3D integration and 3D packaging, covering wire-bonded chip stack, system-in-packaging (SiP), package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or chip), die-to-wafer, and wafer-to-wafer 3D approaches.
Attendees and presenters in the past have found that the 3D Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on 3D packaging technologies would be well worth attending. Abstracts are being requested on the following topics:
PWB Embedded Device Technologies
Through Silicon Vias
Thin Wafer Processing
Assembly Processes and Handling Issues
Testing and Probing Challenges
Failure Analysis and Reliability
Simulation and Modeling
Applications and System Requirements
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than September 26, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at email@example.com or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please contact Ann Bell by email at firstname.lastname@example.org or by phone at 202-548-8717. WE EXPECT THE EXHIBIT FLOOR TO SELL OUT BEFORE OCTOBER 1, 2008
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at email@example.com later than September 26, 2008.
listed in chronological order)
San Diego Chapter Meeting Next Tuesday Featuring Presentation on High Brightness Matrix LED Assembly Challenges and Solutions^
PROGRAM : HIGH BRIGHTNESS MATRIX LED ASSEMBLY CHALLENGES AND SOLUTIONS
Solid State Lighting is pervasive and will continue to grow in popularity as performance and costs mature. Products include camera phone flashes, televisions, display backlighting, automotive lighting, architectural lighting, and others still in development. Reaching performance and cost targets will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt. Several of the new products use a matrix of LED devices packaged together. These matrix LED packages present challenges for both die attach and wire bonding compared to single die packages.
A brief overview of market applications and the package options is presented. A case study is presented to highlight the challenges and solutions when producing matrix LED packages. Pulse heat eutectic die attach and wire chain bonding are explored for application to matrix LED assembly.
Dan Evans is Senior Scientist for Palomar Technologies (formerly Hughes Aircraft). He currently manages the applications department and has developed equipment and process for semiconductor and optoelectronic packaging since 1984 with several related patents. Dan holds a BSME / Purdue and MSME / Stanford both with emphasis in robotics and controls.
IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line^
The annual IMAPS Nordic 2008 conference will take place in Denmark, September 14-16. The 2008 conference will be held at the sea shore hotel Marienlyst, Helsingoer.The city Helsingoer with the famous Kronborg Castle has a direct train connection from the airport of Copenhagen.
A block of hotel rooms at the special IMAPS Nordic price was reserved until July 14.Room reservations are now on space available basis.For information of prices and hotel contact details, please read more at:http://www.imaps.org/chapters/europe/nordic/Past.asp.
XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.
This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.
The Conference topics will include:
Hybrid and Semiconductor Technology
Design Methods and Computer Simulations
Electronics Materials and Components
Thick-Film and Thin-Film Sensors
Packaging and PCB
Quality and Reliability Evaluation
Optoelectronics and Photovoltaics
Education in Electronics
The Conference presentations will be made in the form of:
Poster sessions for presentation of contributed papers
7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Submission of Abstract : 7/31/2008
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
The IMAPS INDIA Chapter is organizing an International Conference on “Emerging Microelectronics and Interconnection Technologies, EMIT-08”- from December 16 to 18, 2008, at Bangalore, India. A pre¬conference one day Tutorial / Workshop on latest technologies such as MEMS, MEOMS, VLSI Design, Hybrid Microelectronics is planned on December 15, 2008.
The Research & Development activities in Miniaturization, Design, Production Processes, Packaging and Applications of Monolithic, Thick and Thin Film Hybrid Microelectronics, Nano Electronics and Molecular Electronics, have made tremendous progress in the past decade. The VLSI Technology has given way to ULSI, and has already reached Nano¬metric scale (nm), 65 nm levels in production and less than 45 nm levels in R & D.
IMAPS India Chapter has been successfully organizing National and International Conferences in these areas and has received very good response earlier. EMIT 1996, 1998, and 2000 at Bangalore and all National Conferences held every year at various cities in India have seen very enthusiastic participation from leading Research & Academic Institutions and Industry.
To continue this tradition and to showcase all the new developments in the areas of Micro, Nano Electronics and allied fields, IMAPS India Chapter is organizing this International Conference, with the theme of Micro Systems: Design to Manufacturing, giving an opportunity to all researchers, academia and industry leaders to exchange latest information. Prior to the conference one day Tutorial / Workshop is scheduled by experts in the appropriate areas.
These events provide an excellent opportunity to the Scientists, Engineers, Technologists, Academicians and Industrialists to present papers and discuss in the areas of Microelectronics, Nano Electronics, Molecular Electronics & Electronic Packaging. The EMIT-08 will cover the presentations of the results of Research Findings, Developmental activities, Production Planning, Manpower Training, Establishment of Facilities, as well as, exchange of ideas on the state-of-art topics.
The venue of the Conference is at within idyllic surroundings providing an excellent ambience and ensuring good exchange of ideas and innovations as it is located at the highly rated Academic Institute in India.
First “CALL FOR PAPERS”:
Authors were invited to send original, unpublished papers for the EMIT-08 until July 31, 2008. If you are still interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (firstname.lastname@example.org) immediately. For more information, visit www.imapsindia.org.
Invited Talks / Special Talks:
Conference will also have Invited Talks from Experts in Specific Areas of Topical Interest. Some selected papers presented at other IMAPS Conferences in 2008 will also be invited to be presented at EMIT 2008 for the larger benefit of participants who could not attend them.
Suggested Topics, but not limited to:
In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].
Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.
Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle.
The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components.
The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging
Heat condcutive materials
Chip, board and system thermal management
Thermal modelisation and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at email@example.com.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (firstname.lastname@example.org) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Products and Publications
Journal of Microelectronics and Electronic Packaging 2nd Quarter 2008 Edition is Available On-line^
Top The Second Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line. Log-on
to access the Journal.
This issue contains papers on the following subjects:
Reliability Assessment: New Tools for the Next Generation of Packages
Maximum Attainable Deflections of Shape Memory Alloy-Layered Microcantilever
Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)
Numerical Optimization of Silicon Stacked Module for 3-D Packaging Applications
Laser Sintering of Silver Nanomaterial on Polymer Substrates
Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling
The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).