Abstracts Now Due This Friday for IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009) (read
Tabletop Exhibits Now Available for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications (read
Abstracts Due January 16 for the 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging (read
listed in chronological order)
THURSDAY: Arizona Chapter December 11 Tabletop Exhibit and Lunch Meeting on Materials Challenges for High Density Microprocessor Packaging (read
THURSDAY: Orange Chapter December 11 Dinner Meeting on COTS, MOTS and Microcircuits (read
San Diego Chapter December 15 Holiday Mixer at Karl Strauss Brewing Co. (read
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) Begins Monday (read
Viking Chapter 3rd Annual Holiday Luncheon and Social Event at St. Paul Curling Club on December 29 (read
Metro Chapter January 14 Technical Meeting on Acquiring Patent / Intellectual Property Protection for Electronic Circuits and Systems (read
IMAPS France - 4th European ATW on Micropackaging and Thermal Management Technical Program Now Available (read
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read
INTERCONEX 2009 Technical Abstracts Now Being Accepted (read
EMPC 2009 - European Microelectronics and Packaging Conference (read
AND PUBLICATIONS Journal
of Microelectronics and Electronic Packaging 3rd Quarter
2008 Edition is Available On-line (read
IMAPS 2008 Symposium Proceedings Now Available For Purchase On-line (read
Device Packaging 2009 - Only 6 Booths Remain ^
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at firstname.lastname@example.org or by phone at 202-548-8717. Only 6 booths are available at this time and hall is expected to sell out soon.
Abstracts Now Due This Friday for IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009) ^
Top The 5th CICMT Conference is being held April 20-23, 2009, at The Curtis Hotel in Denver, Colorado. For more information, visit www.cicmt.org. Abstracts are due this Friday, December 12.
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.
Please send your 250-300 word abstract electronically only by December 12, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.
If you are
having problems with the on-line submittal form, please
email Jackki Morris-Joyner email@example.com or
call 1-305-382-8433 (USA).
CICMT 2009 will again feature a focused exhibition with a limited number of tabletops for suppliers who support the use
of the technologies. To view information about this exhibition, or to reserve your booth(s), visit www.cicmt.org. You may also contact Ann Bell at firstname.lastname@example.org or 202-548-8717 for information about Tabletop exhibits.
Tabletop Exhibits Now Available for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications^
Top This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. For more information, visit www.imaps.org/printed.
The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
Digital Printing / Deposition Technologies
Nanomaterials, inks & epoxies
Printed devices – Active and passive
Thin & printable battery technology
Membrane and capacitive switches
Novel die interconnect
Paper based, PET & PVC substrate media
Printable display & lighting
Design, Simulation and Modeling
Applications and new markets
Convergence of Graphics & electronics
A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at email@example.com or 202-548-8717 for information about Tabletop exhibits.
Abstracts Due January 16 for the 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging ^
Top The 2nd Annual Advanced Technology Workshop on Automotive Microelectronics and Packaging is now being held May 11-14, 2009, at the Doubletree Hotel in Dearborn, Michigan. For more information, visit www.imaps.org/automotive.
Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.
Planned Sessions Include:
Systems & Applications
Collision Avoidance and Safety
Driver Comfort/Information/Audio Systems
Thermal and Power Management
MEMS and Sensors
High Performance Interconnects
Systems on Chip
Materials & Process
Thermal and Power Packaging
Sensor and MEMS Packaging
Advanced Interconnects, Connectors and Wirebonding
Ceramic Substrates and Ceramic Technologies
High Density and High Performance Organic Substrates
Underfill/Encapsulants and Adhesives
Solder Materials, Processes, and Reliability
Flip-Chip and Bumping: Processes, Reliability
Embedded and Integrated Passives
Green Packaging/Compliance with RoHS
Those wishing to make a presentation at the Automotive Workshop, please submit a 250-300 word abstract electronically byJanuary 16, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (firstname.lastname@example.org) or call 305-382-8433.
All abstracts submitted must represent advanced technology and can be unpublished work. The abstracts should highlight the application area, design, and process or material covered within the automotive industry.
No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on April 10, 2009. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.
Materials Challenges for High Density Microprocessor Packaging
Dr. Gans Ganesan
Principal Engineer Assembly and Test Technology Development
The continual increase in performance/cost of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies that are being pursued. Material needs for high thermal dissipation, distortion-free high-speed signaling, efficient power delivery, and high-density interconnects are discussed. The current environment also drives the need for multiple chip integration on high density substrates. There is need for “Green” packaging which places significant challenges and opportunities for new innovation in packaging materials development. Advances made by the packaging industry are critical to the continuation of Moore's Law and driving more capability into less space. Further scaling will require new advances in material technologies, and packaging materials must continue to adapt to ensure that the silicon functions properly. This presentation highlights the challenges associated with first level interconnect (chip-to-organic substrate) materials, package thermal interface materials, and second level interconnect (package to system board).
Gans Ganesan received his Bachelor of Engineering from University of Madras, India, Master of Engineering (Distinction) in Mechanical Engineering from Indian Institute of Science, Bangalore, India and a PhD in Materials Science and Engineering from the University of Arizona, Tucson. He is currently employed as Principal Engineer at Intel Corporation in Chandler, Arizona. Before this assignment, he was with Motorola Semiconductor Products sector for 12 years as member of technical staff where he contributed in the various areas of high density packaging and test technologies and 4 years as Associate Research Scientist at CALCE center at the University of Maryland during which he conducted research in the areas of lead-free electronics, low temperature electronics and sensors and MEMS. He has over 20 publications in peer reviewed journals, holds 3 US patents issued and three International applications and has edited a book on Lead-free Electronics. He is a senior member of IEEE.
THURSDAY: Orange Chapter December 11 Dinner Meeting on COTS, MOTS and Microcircuits^
C.O.T.S., M.O.T.S., and Microcircuits
Chuck Nelson of TT Electronics, BI Technologies Corporation
This presentation will cover the current state of military microcircuits and discrete components that are "up-screened" to military standards. Mr. Nelson will discuss problems and benefits of the different approaches to military electronics from the standpoint of a microcircuits assembler. COTS stands for "commercial off the shelf" discrete components up screened to military like quality levels. MOTS stands for "military off the shelf" discrete components screened to Hybrid Military specifications. These are then put on PC Boards and screened to various quality levels. The purpose of this screening is to bypass the need to fabricate new microcircuits which is usually quite costly.
Chuck Nelson is the Product Marketing Manager of the hybrid microcircuit business unit at TT electronics, BI Technologies Corporation, Electronic Components Division. He is responsible for supporting the existing customer base as well as promoting new business growth. Mr. Nelson has extensive experience in hybrid process engineering, hybrid manufacturing, and technical sales and marketing. Mr. Nelson previously worked in electronic ceramic packaging with Kyocera in Marketing as a Sr. Applications Engineer, primarily developing new markets for optical sensor packaging. Chuck Nelson has his B.S. degree in Chemistry from California State University, Los Angeles and his M.B.A. degree in Finance from California State University, Fullerton.
Choice of Cajun Salmon, Tri-Tip Bourgulonne, Penne Margherita, or Breast of Chicken. Caesar, pasta salad, or potato salad. Mixed vegetables, potato, or specialty rice. Desert.
San Diego Chapter December 15 Holiday Mixer at Karl Strauss Brewing Co. ^
Monday, December 15, 2008
6:00 pm Dinner and Networking
Karl Strauss Brewing Co
Sorrento Mesa, Back Room
9675 Scranton Road
** Seating is Filling Fast, RSVP's Needed by Friday Dec 12th
Session Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
Viking Chapter 3rd Annual Holiday Luncheon and Social Event at St. Paul Curling Club on December 29 ^
The IMAPS Viking Chapter would like to invite you to an afternoon of curling. Curling is a game in which two teams of four players each slide a round stone by means of a gooseneck handle on the top over a 138-ft (42-m) stretch of ice toward a target circle. The object is to deliver the stone closest to the centre (called the house). Each player delivers two stones, which average 40 lbs (18.1 kg) apiece, often applying a curl to the stone's trajectory.
The player's teammates use a broom to sweep the ice ahead of the oncoming stone in order to facilitate a longer slide or to adjust the arc of the curl. Blocking and knocking out an opponent's stones are important strategies of the sport. Curling originated in Scotland in the early 16th century. World championships have been held since 1959 and are usually dominated by Canadians and Scandinavians. In 1998 curling became a medal sport in the Winter Olympic Games.
Please try to wear CLEAN dry tennis shoes. Also, keep in mind that the temperature when we are on the ice is around 42 degrees.
Lunch and beer/drinks will be provided!
Metro Chapter January 14 Technical Meeting on Acquiring Patent / Intellectual Property Protection for Electronic Circuits and Systems ^
Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering. If you wish to join membership information is available at www.imaps.org.
Acquiring Patent / Intellectual Property Protection
for Electronic Circuits and Systems
Steven Rubin, Counsel
Intellectual Property/Information Technology Practice Group, WolfBlock LLP
Patent protection is the strongest type of intellectual property available. It is also perhaps the most complex. Come and explore the basic requirements for patent protection focusing on issues relating to circuits, systems and signal processing. At this presentation, you will learn, understand and appreciate the four doors that must be passed in order to obtain patent protection in the United States, including:
(1) Statutory subject matter (What types of ideas/inventions should be awarded patent protection?)
(2) Novelty (Is the invention new to the world?)
(3) Non-obviousness (Is the invention obvious in light of prior teachings?)
(4) Written description requirements (Disclosure of the best way known for practicing the invention and some relevant issues regarding defining the scope of the invention)
We will also discuss some recent court decisions specifically ruling on inventions relating to circuit and systems such as: Is a signal patentable? Can you patent a process that includes mental steps? Can you patent a hardware structure that performs a particular function without setting forth an algorithm for performing that function?
Steven Rubin concentrates in technology relating to electronics and computer science and has worked in the fields of software, RF-ID, microlithography, cryptography, search engines, network configuration and architecture, optical communication, electrical signal encoding, networking systems, semiconductor technologies, antennas, electric and electronic circuits, computer architecture, mechanical technologies and methods of doing business. He advises clients throughout all phases of a patent's life from conception by an inventor to enforcement. He assists clients in determining what intellectual property protection is available, and recommended, in light of business objectives and drafts and prosecutes corresponding patent applications. He has managed large patent portfolios, identified potential patent infringement assertions and potential cross-licensing opportunities and provided infringement opinions as needed. He represents clients in patent enforcement and litigation matters domestically and internationally. Mr. Rubin also reviews patent portfolios and pending patent litigation in relation to corporate mergers, acquisitions and investments. Mr. Rubin is the author of many patent-related articles.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management Technical Program Now Available ^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle.
The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components.
A CD Rom including the presentations will be distributed to the attendees only.
International Microelectronics And Packaging Society France
49 rue Lamartine 78035 Versailles
Tel : + 33 (0) 1 39 67 17 73/ Fax : + 33 (0) 1 39 02 71 93 E-mail :
IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
INTERCONEX 2009 Technical Abstracts Now Being Accepted ^
April 7-8, 2009
Congress Centre of La Villette
Within INTERCONEX 2009, the technical committee proposes the following topics:
Packaging & Application of Power LED Devices
Packaging and reliability challenges of high pin count circuits
A one day technical workshop on:
Microelectronics and packaging for medical and healthcare applications
Technical conferences on the following subjects:
Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
Flip-chip (substrates and board technologies),
Reliability, thermal management,
Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
Modelling, simulation & design, ….
Characterization & test,
Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
Systems (optic, photonic, harsh environment, …)
We kindly ask you to send us your proposals with one page abstract word size before January 31, 2009. You may submit your abstract via email - email@example.com. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Products and Publications
Journal of Microelectronics and Electronic Packaging 3rd Quarter 2008 Edition is Available On-line^
Top The Third Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line. Access the Journal papers on-line .
The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).
IMAPS 2008 Symposium Proceedings Now Available For Purchase On-line^
Top The CD-Rom of Proceedings from the 2008 International Symposium on Microelectronics (IMAPS 2008) is now available for purchase on-line. The Conference was held November 2-6, 2008, at the Rhode Island Convention Center, Providence, Rhode Island, USA. This symposium featured more than 180 papers in 30 sessions addressing 7 technical tracks on: Industry Focused Sessions; Systems/Design; Materials; Reliability; Advanced Technologies; Signal Integrity; and Packaging Processes. The CD-Rom is available for $200 for members and $300 for non-members (shipping additional). For more information or to order on-line, visit http://www.imaps.org/imapsstore/detail.aspx?ID=3327.