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IMAPS EVENTS
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ACTIVITIES (events
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Device Packaging 2009 - Only 6 Booths Remain ^
Top The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Chip Scale Packaging; Electronics Packaging for Biomedical Devices; and Packaging and Application of Power LED Devices (new in 2009) IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717. Only 6 booths are available at this time and hall is expected to sell out soon. Abstracts Now Due This Friday for IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009) ^
Top The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities. Please send your 250-300 word abstract electronically only by December 12, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee. If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 1-305-382-8433 (USA). CICMT 2009 will again feature a focused exhibition with a limited number of tabletops for suppliers who support the use of the technologies. To view information about this exhibition, or to reserve your booth(s), visit www.cicmt.org. You may also contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits. Tabletop Exhibits Now Available for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications ^
Top The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits. Abstracts Due January 16 for the 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging ^
Top Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need. Planned Sessions Include: Systems & Applications
Design
Materials & Process
Those wishing to make a presentation at the Automotive Workshop, please submit a 250-300 word abstract electronically by January 16, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433. All abstracts submitted must represent advanced technology and can be unpublished work. The abstracts should highlight the application area, design, and process or material covered within the automotive industry. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on April 10, 2009. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. |
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THURSDAY: Arizona Chapter December 11 Tabletop Exhibit and Lunch Meeting on Materials Challenges for High Density Microprocessor Packaging ^ Top
Materials Challenges for High Density Microprocessor Packaging The continual increase in performance/cost of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies that are being pursued. Material needs for high thermal dissipation, distortion-free high-speed signaling, efficient power delivery, and high-density interconnects are discussed. The current environment also drives the need for multiple chip integration on high density substrates. There is need for “Green” packaging which places significant challenges and opportunities for new innovation in packaging materials development. Advances made by the packaging industry are critical to the continuation of Moore's Law and driving more capability into less space. Further scaling will require new advances in material technologies, and packaging materials must continue to adapt to ensure that the silicon functions properly. This presentation highlights the challenges associated with first level interconnect (chip-to-organic substrate) materials, package thermal interface materials, and second level interconnect (package to system board). Presenter Bio: Gans Ganesan received his Bachelor of Engineering from University of Madras, India, Master of Engineering (Distinction) in Mechanical Engineering from Indian Institute of Science, Bangalore, India and a PhD in Materials Science and Engineering from the University of Arizona, Tucson. He is currently employed as Principal Engineer at Intel Corporation in Chandler, Arizona. Before this assignment, he was with Motorola Semiconductor Products sector for 12 years as member of technical staff where he contributed in the various areas of high density packaging and test technologies and 4 years as Associate Research Scientist at CALCE center at the University of Maryland during which he conducted research in the areas of lead-free electronics, low temperature electronics and sensors and MEMS. He has over 20 publications in peer reviewed journals, holds 3 US patents issued and three International applications and has edited a book on Lead-free Electronics. He is a senior member of IEEE. THURSDAY: Orange Chapter December 11 Dinner Meeting on COTS, MOTS and Microcircuits ^
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C.O.T.S., M.O.T.S., and Microcircuits Program: Speaker Bio: Dinner: San Diego Chapter December 15 Holiday Mixer at Karl Strauss Brewing Co. ^
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CHOICES OF 3 ENTREES: Lemon Hef Chicken & Mushroom Risotto Ginger Crusted Salmon BBQ Half Rack Ribs Desert - New York Cheesecake Includes unlimited soft drinks, coffee, or tea, and one complimentary alcohol beverage IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) Begins Monday ^
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Micro Systems : Design to Manufacturing For more information, visit www.imapsindia.org. Session Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like. Viking Chapter 3rd Annual Holiday Luncheon and Social Event at St. Paul Curling Club on December 29 ^
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An Afternoon of Curling! The IMAPS Viking Chapter would like to invite you to an afternoon of curling. Curling is a game in which two teams of four players each slide a round stone by means of a gooseneck handle on the top over a 138-ft (42-m) stretch of ice toward a target circle. The object is to deliver the stone closest to the centre (called the house). Each player delivers two stones, which average 40 lbs (18.1 kg) apiece, often applying a curl to the stone's trajectory. The player's teammates use a broom to sweep the ice ahead of the oncoming stone in order to facilitate a longer slide or to adjust the arc of the curl. Blocking and knocking out an opponent's stones are important strategies of the sport. Curling originated in Scotland in the early 16th century. World championships have been held since 1959 and are usually dominated by Canadians and Scandinavians. In 1998 curling became a medal sport in the Winter Olympic Games. Please try to wear CLEAN dry tennis shoes. Also, keep in mind that the temperature when we are on the ice is around 42 degrees. Lunch and beer/drinks will be provided! Metro Chapter January 14 Technical Meeting on Acquiring Patent / Intellectual Property Protection for Electronic Circuits and Systems ^
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Acquiring Patent / Intellectual Property Protection Program Info: We will also discuss some recent court decisions specifically ruling on inventions relating to circuit and systems such as: Is a signal patentable? Can you patent a process that includes mental steps? Can you patent a hardware structure that performs a particular function without setting forth an algorithm for performing that function? Speaker Bio: IMAPS France - 4th European ATW on Micropackaging and Thermal Management Technical Program Now Available ^
Top The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. A CD Rom including the presentations will be distributed to the attendees only.
The workshop will feature sessions on:
To view the full technical program, reserve exhibit booths, or register for the workshop, visit www.imapsfrance.org or contact Florence Vireton at imaps.france@imapsfrance.org. Organized by: IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging ^
Top The Program and other information are available at www.imaps.org.uk. Prof Nihal Sinnadurai INTERCONEX 2009 Technical Abstracts Now Being Accepted ^ Top
Within INTERCONEX 2009, the technical committee proposes the following topics: KEYNOTE PAPERS:
A one day technical workshop on:
Technical conferences on the following subjects:
We kindly ask you to send us your proposals with one page abstract word size before January 31, 2009. You may submit your abstract via email - imaps.france@imapsfrance.org. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73. EMPC 2009 - European Microelectronics and Packaging Conference ^
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Journal of Microelectronics and Electronic Packaging 3rd Quarter 2008 Edition is Available On-line ^
Top This issue contains the following papers:
The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format. As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx). IMAPS 2008 Symposium Proceedings Now Available For Purchase On-line ^
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Device Packaging 2009 - Only 6 Booths Remain (
ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL
*Exhibitors contact abell@imaps.org
Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ
*Exhibitors contact abell@imaps.org
CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO
*Exhibitors contact abell@imaps.org
ATW on Automotive Microelectronics and Packaging
May 11-14, 2009
Dearborn, MI
