IMAPS Home | Join/Renew | Industry Guide | Edit Member Record
February 12, 2008

AI Technology

   IMAPS EVENTS
Button You Have Two More Days -- Device Packaging Early Registration and Hotel Deadlines Now Thursday, February 14 (read more...)

Button GBC Spring 2008 Conference Deadlines This Thursday (read more...)

Button IMAPS 2008 Early-Bird Exhibitor Discount Ends This Friday, February 15 (read more...)

Button IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) - Program and Registration Now On-line (read more...)

Button How Is the Cost of Packaging Impacting Your Business? (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet New England Chapter Dinner Meeting Next Tuesday, February 19, Featuring Presentation on Photovoltaic Cell Metallization and Assembly (read more...)

Bullet Metro Chapter February 27 Dinner Meeting with presentation on An Evaluation of Various Cleaning Solutions Mark Graham Modular Devices (read more...)

Bullet Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read more...)

Bullet Announcing SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) - Abstracts Due February 29 (read more...)

   PRODUCTS AND PUBLICATIONS
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

You Have Two More Days -- Device Packaging Early Registration and Hotel Deadlines Now Thursday, February 14    ^ Top
The 4th International Conference and Exhibition on Device Packaging is being held March 17-20, 2008, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

Registrations are coming in quickly for this popular conference. Our hotel block has sold out quickly in the past two years and we expect the room block to sell out again r this year. Log-on to the conference website today and reserve your room before they are all gone.

Radisson Fort McDowell Resort
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$209/night
Rooms on hold March 15 – 20, 2008

For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1
For phone reservations:
call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 14, 2008.

Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line.

GBC Spring 2008 Conference Deadlines This Thursday    ^ Top
The GBC Spring Conference will be held March 16-17, 2008, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, AZ. Visit www.imaps.org/programs/gbc08spring.htm today to learn more about this conference and to register on-line.

This Conference precedes and is being held in conjunction with Device Packaging 2008.

The GBC Spring 2008 Conference will address:

  • What are the specific areas where assembly and packing cost needs to be addressed to enable the growth of the industry?
  • Where are the applications where performance rather than cost is the absolute driver?
  • What and where are the opportunities within the supply chain to meet these challenges and how many companies benefit from providing solutions?

Sunday March 16, 2008
12:00 Noon -- GBC Golf Outing. We-ko-pa Golf Course at the Ft. McDowell Radisson. 
6:00 PM -- Registration Opens and Welcome Reception

Monday, March 17, 2008
All listed times are approximate.
7:00 AM -- Registration opens
7:00 AM - 8:00 AM -- Continental breakfast
8:00 AM - 5:00 PM -- Program
12:00 Noon -- Lunch

8:00 AM -- Opening Remarks and Keynote Address:
Opening Remarks by
Howard Imhof, Chair of the IMAPS Global Business Council
Director of Sales and Marketing, Metalor Technologies USA

Keynote address by
Bill Bottoms, Chief Executive Officer, NanoNexus
“The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors.”

9:30 AM – 12:00 noon -- Microelectronics Industry Overview:

Jim Walker, Vice President Research, Gartner/Dataquest
 “Packaging the Supply Chain."

10:15 AM - Break

10:30 AM
Dr. Conor Dullaghan
Vice President, Sales & Marketing, Metalor Technologies USA  Advanced Coatings Division
"The Role of Precious Metals in Electronics & the Semiconductor Supply Chain - Past, Present, & Future."

11:15 AM
Loren Lancaster, Managing Director, Core Capital, Electronics and Semiconductor Group,
“How M&A Activities Are Affecting the Supply Chain in the Electronic Packaging Industry.”  

12:00 Noon - Lunch

1:00 PM – 2:30 PM -- Cost Driven Challenges:

1:00 PM
Steven J. Corbett, Chief Executive Officer, Cookson Electronics.
“How Do Materials and Process Suppliers Enable Next-generation Semiconductor Packaging While Addressing Ever Increasing Cost Pressures?”

1:45 PM
Lee Smith, Sr. Director, Business Development, Amkor Technology, Inc.
"Package Optimization for Cost Driven Applications."

2:30 PM - Break

2:45 PM – 5:00 PM -- Performance Driven Challenges:

2:45 PM
Scottie Ginn, Vice President of Design Enablement and Packaging, IBM Systems and Technology Group
"Common Platform Alliance for Semiconductor Packaging Technology."

3:30 PM
Robert Erich, Component Development Engineer, Medtronic Microelectronics Center
“Challenges for Adopting Standard IC Packaging Solutions for High Reliability Medical
Applications.”

4:15 PM
Mark Dimke, Engineering Manager, Microelectronics Packaging, Sensor Systems, Rockwell Collins. 
“Future Packaging Needs for High Reliability Microelectronics.”

5:00 Closing Remarks and Adjourn

5:00 – 7:00 Device Packaging Welcome Reception (beverages and light appetizers)

Visit www.imaps.org/programs/gbc08spring.htm today to learn more about this conference and to register on-line. Early registration ends on February 14, 2008, after which all registration fees will increase.

The hotel deadline is also February 14. Our hotel block has sold out quickly in the past two years and we expect the room block to fill up again this year. Log-on to the conference website today and reserve your room before they are all gone.

Radisson Fort McDowell Resort
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$209/night
Rooms on hold March 15 – 20, 2008

For on-line reservations: www.radisson.com/ftmcdowellaz - promotional code - IMAPS1
For phone reservations:
call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 14, 2008.

IMAPS 2008 Early-Bird Exhibitor Discount Ends This Friday, February 15   ^ Top
Join your industry colleagues and competitors at the 41st International Symposium on Microelectronics being held November 2-6, 2008, at the Rhode Island Convention Center in Providence, RI.

The exhibit floor is already more than 60% sold and on the way to selling out. Reserve your booth before it's too late.

Visit www.imaps2008.org for more information and to reserve your booth space before this Friday, February 15. For questions, contact Ann Bell at abell@imaps.org or 202-548-8717.

IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) - Program and Registration Now On-line   ^ Top
The 4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) is being April 21-24, 2008, in Munich, Germany. The early registration and tabletop exhibition discounts end on February 29. The hotel room block also expires on February 29. Availability and pricing will not be guaranteed by the hotel after the 29th. Visit www.cicmt.org to make your reservations before it's too late.

This three day event will bring together experts from Asia, Europe, North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 60 different organizations including universities as well as industrial R&D, the conference will provide a wide spectrum of interests reflected in 70 contributed papers in 16 sessions. Because of growing interest in the CICMT meeting, there will also be an expanded poster session.

Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To reserve space, visit www.cicmt.org or contact Jens Müller (jens.mueller@imaps.de: +49 3677 69 3381).

How Is the Cost of Packaging Impacting Your Business?   ^ Top
Complimentary insight on how several companies are addressing the costs of microelectronic packaging. Featuring speakers from NanoNexus, Gartner/Dataquest and IBM Systems and Technology Group.


IMAPS Lunch and Learn Series on
Addressing Cost and Performance Driven Semiconductor Packaging
Challenges through the Supply Chain

Thursday, February 21, 2008
12:00 noon - 12:45 pm EST
Registration: Complimentary Registration provided by IMAPS

Registration Deadline: Next Tuesday, February 19, 2008, at 5:00 pm Eastern


Global Business Council – GBC
www.imaps.org/gbc


Program Description

This virtual meeting will feature three speakers from the upcoming GBC Spring Conference. They will present short programs highlighting their full presentations given during the March GBC meeting.

The agenda for this e-meeting will be:

  • 12:00 pm - 12:05 pm – Introduction
  • 12:05 pm - 12:15 pm – Bill Bottoms, Chief Executive Officer, NanoNexus
    The 10th Anniversary Edition of the International Technology Roadmap for Semiconductors
  • 12:15 pm - 12:25 pm – Jim Walker, Vice President Research, Gartner/Dataquest
    Packaging the Supply Chain
  • 12:25 pm - 12:35 pm – Scottie Ginn, Vice President of Design Enablement and Packaging,
    IBM Systems and Technology Group
    Common Platform Alliance for Semiconductor Packaging Technology
  • 12:35 pm - 12:45 pm – Question/Answer and Closing Remarks

This virtual meeting is a teleconference on February 21st to discuss presentation slides that will be made available for download prior to the meeting. You must register in advance to gain access to the presentation slides.

The GBC Spring 2008 Spring Conference Addressing Cost and Performance Driven Semiconductor Packaging Challenges through the Supply Chain will be held in conjunction with the Device Packaging Conference. The GBC Conference will run March 16-17 addressing the following questions:

  • What are the specific areas where assembly and packing cost needs to be addressed to enable the growth of the industry?
  • Where are the applications where performance rather than cost is the absolute driver?
  • What and where are the opportunities within the supply chain to meet these challenges and how many companies benefit from providing solutions?

Register On-line
Registration Deadline: Tuesday, February 19, 2008, at 5:00 pm Eastern

Chapter Activities (events listed in chronological order)

New England Chapter Dinner Meeting Next Tuesday, February 19, Featuring Presentation on Photovoltaic Cell Metallization and Assembly   ^ Top

Date: February 19, 2008
Schedule: 5:30 p.m. Registration, Socializing, Networking & Cash Bar
6:30 Dinner
7:30 Presentation
(times are approximate)
Location:

Marlborough Courtyard Marriott in Marlborough MA

Cost:

Meeting Only N/C
Dinner - Non-Member $30.00
Dinner - Member $25.00
Dinner - Retired Member $20.00
Dinner - Student $5.00

Registration:

On-line registration with ACerS

Abstract:

The talk describes practical uses for new nanosilver inkjet and screen-print inks. These uses include the fabrication of silver collecting grids for PV cells and attaching silicon die to various substrates. These uses rely on the unique properties of nano materials. Nanosilver lines were printed on mono and polycrystalline Si substrates using either a Dimatix Material Inkjet Printer or manual screen printer, depending on the nanosilver ink choice. Lines widths ranged between 70 and 120 µm wide and between 1 and 3 µm thick. Large areas were also printed (15mm x 15mm) for die attach applications.

Mike Marczi B.S./M.S. Ceramic Engineering - Rutgers University Mike is the Director of New Business Development for Cookson Electronics with over 25 years of industry experience in ceramics, catalysis, electronic materials, display technology, thermal processing, surface mount assembly and nano materials. He has held positions in manufacturing, sales, marketing and strategic development. Granted multiple patents and published papers in the various fields described above. In his current position, Mike is focused on developing commercial applications for materials based on nano particle science.

Metro Chapter February 27 Dinner Meeting with presentation on An Evaluation of Various Cleaning Solutions Mark Graham Modular Devices    ^ Top

Date: February 27, 2008
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Cost:

Members: $30.00 if Pre-Registered February 25, 2008
$35.00 After February 25, 2008

Non-Members: $35.00 if Pre-Registered by February 25, 2008
$40.00 After February 25, 2008

Student Members: $10.00 if Pre-Registered before February 25, 2008
$20.00 after February 25, 2008

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Registration:

Steve Lehnert at slehnert@imaps.org or by phone: (631) 345-3100. For more information, visit www.imaps.org/chapters/metro.

An Evaluation of Various Cleaning Solutions
Mark Graham, Modular Devices

Abstract:

There are many different methods of cleaning used in the microelectronics industry. When flux is used in your manufacturing process you are faced with a different set of challenges. Residual flux contamination left in a unit will result in difficulties in all subsequent operations. Any contamination can result in a failed wire bond, a poor electrical connection or any number of other failure modes that will cause premature failure of the unit. This presentation will focus on utilizing a vapor degreaser and will compare the results of four different chemicals.

Mark Graham is Director of Program Development at Modular Devices Inc. He has been in the electronics industry for 27 years. Prior to joining Modular Devices in 1996, he was employed at Lucas Aerospace as a Senior Project Engineer.

Mark is responsible for overseeing all major programs at Modular and has recently been appointed to the Technology Review Board. It is in that capacity that he was asked to perform the cleaning solution experiments.

Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008    ^ Top

Date: May 7-9, 2008
Schedule:

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent

May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin
Founder of Engent

Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany
  • Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME)
  • Board of Directors, Surface Mount Technology Association (SMTA)
  • ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center
     

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008

We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:

Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered.

Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available)

Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org.

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation.

Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.

In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.

This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.

The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.

The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.

In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?

This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register

Announcing SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition

June 4, 2008
The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Technical Presentations with invited papers!
  • Tabletop Exhibits!
  • Door Prizes in the Exhibit Area!
  • Lunch included!

Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies.

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com.

Online Attendee RegistrationAvailable Soon

Further information – Contact:
Salim Akbany at 310-812-0343
Farman Mesdaghi at 310-813-5449
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:
Packaging, Substrates/Materials, Design/Evaluation/Simulation, Manufacturing/Process, Interconnection, Optoelectronics, Nano Technologies, MEMS, Organic Semiconductors, Trend/Education/Environmental, and Application. Other subject matter relating to electronics packaging will also be considered.

Registration Fee:
Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:
General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris) - Abstracts Due February 29    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France.

Papers are being accepted in the following topical areas:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...
  • Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

Abstract Submission:
We suggest that you send us your proposals in the form of one page abstract (word format) with the following information: company, speaker, phone, email, associated authors, title, and abstract text. Abstracts are due before February 29, 2008.

Contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org


Products and Publications

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.

iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP)
  • Advancing Microelectronics
  • IMAPS Symposium Proceedings
  • IMAPS Conference Proceedings
  • IMAPS Workshop Presentation Slides
  • Global Business Council Presentations
  • Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords
  • Author
  • Primary Author Company
  • Event / Category
  • Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives