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February 26, 2008

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   IMAPS EVENTS
Button Registration and Hotel Deadlines This Friday, February 29, for IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) (read more...)

Button Date Change: ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy (read more...)

Button IMAPS 2008, 41st International Symposium on Microelectronics -- Abstracts Due March 28 (read more...)

Button IMAPS and SEMI Proudly Announce an Advanced Technology Workshop on Wire Bonding (read more...)

Button Abstracts Now Being Accepted for the New RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Metro Chapter Dinner Meeting TOMORROW, Wednesday, February 27, with presentation on An Evaluation of Various Cleaning Solutions Mark Graham Modular Devices (read more...)

Bullet Indiana Chapter March 6 Tour of Wabash National Corporation Followed by Dinner and Meeting (read more...)

Bullet Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read more...)

Bullet Announcing SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) - Abstracts Due This Friday, February 29 (read more...)

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IMAPS Events (view full Web Calendar)

Registration and Hotel Deadlines This Friday, February 29, for IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)   ^ Top
The 4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) is being April 21-24, 2008, in Munich, Germany. The early registration and tabletop exhibition discounts end on February 29. The hotel room block also expires on February 29. Availability and pricing will not be guaranteed by the hotel after the 29th. Visit www.cicmt.org to make your reservations before it's too late.

This three day event will bring together experts from Asia, Europe, North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 60 different organizations including universities as well as industrial R&D, the conference will provide a wide spectrum of interests reflected in 70 contributed papers in 16 sessions. Because of growing interest in the CICMT meeting, there will also be an expanded poster session.

Finally, to provide an opportunity for those involved in development and manufacturing to meet suppliers who support the industry, space has been set aside for tabletop exhibits. To reserve space, visit www.cicmt.org or contact Jens Müller (jens.mueller@imaps.de: +49 3677 69 3381).

Date Change: ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy has been rescheduled due to conflicts with other competing events in the New Mexico-area. The workshop will still be held at the Hotel Albuquerque Old Town in Albuquerque, New Mexico, but it is now being held August 12-14, 2008.

This event is a continuation of last years first Alternative Energy Conference and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

Solar - Photovoltaics
Fuel Cells
Geothermal
BioFuels
Batteries and Hybrids
Wind
Other Approaches

Thermal and Power Management
Inverter Materials and Design
Grid and Storage Approaches
Design for Efficiency

Materials & Reliability
Qualification Approaches
Environmental Regulations
Government/State Policies and Incentives

Those wishing to present a paper at the Energy Workshop, please submit a 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. Abstracts are now due on May 9, 2008. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on July 18, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees.

All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

IMAPS 2008, 41st International Symposium on Microelectronics -- Abstracts Due March 28    ^ Top
The 41st International Symposium on Microelectronics (IMAPS 2008) will be held at the Rhode Island Convention Center, Providence, Rhode Island, USA, November 2-6, 2008. Visit www.imaps2008.org for complete information on the symposium.

CALL FOR PAPERS - DEADLINE MARCH 30

The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.

View the list of topics of interest on-line at www.imaps2008.org.

To submit an abstract, go to www.imaps.org/abstracts.htm and send your 250-300 word abstract electronically by March 28, 2008.

If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner at jmorris@imaps.org or call 305-382-8433.

IMAPS and SEMI Proudly Announce an Advanced Technology Workshop on Wire Bonding   ^ Top
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. For more information, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008
.

The objective of the Wire Bonding workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of wire bond interconnections. This workshop enables discussion and presentation of the latest wire bonding technology.

  • Fine pitch wire bonding
  • Stacked die wire bonding and looping
  • Heavy wire wedge and ribbon bonding
  • Assembly processes and handling issues
  • Bumping for High Brightness LEDs and Solar arrays
  • Novel wire bonded packages and designs
  • High Frequency wire bond packages
  • Electromigration and Interfacial Adhesion
  • Reliability and Testing
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Advanced Technology Workshop must submit a 200-300 word abstract electronically no later March 28, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 1, 2008. For more information, visit www.imaps.org/wirebonding.

Abstracts Now Being Accepted for the New RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • High Power Electronics
  • Military / Space / ExtremeEnvironments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 23, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.

 

Chapter Activities (events listed in chronological order)

Metro Chapter Dinner Meeting TOMORROW, Wednesday, February 27, with presentation on An Evaluation of Various Cleaning Solutions Mark Graham Modular Devices    ^ Top

Date: February 27, 2008
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Cost:

Members: $35.00 After February 25, 2008

Non-Members: $40.00 After February 25, 2008

Student Members: $20.00 after February 25, 2008

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Registration:

Steve Lehnert at slehnert@imaps.org or by phone: (631) 345-3100. For more information, visit www.imaps.org/chapters/metro.

An Evaluation of Various Cleaning Solutions
Mark Graham, Modular Devices
Abstract:There are many different methods of cleaning used in the microelectronics industry. When flux is used in your manufacturing process you are faced with a different set of challenges. Residual flux contamination left in a unit will result in difficulties in all subsequent operations. Any contamination can result in a failed wire bond, a poor electrical connection or any number of other failure modes that will cause premature failure of the unit. This presentation will focus on utilizing a vapor degreaser and will compare the results of four different chemicals. Mark Graham is Director of Program Development at Modular Devices Inc. He has been in the electronics industry for 27 years. Prior to joining Modular Devices in 1996, he was employed at Lucas Aerospace as a Senior Project Engineer. Mark is responsible for overseeing all major programs at Modular and has recently been appointed to the Technology Review Board. It is in that capacity that he was asked to perform the cleaning solution experiments.

Indiana Chapter March 6 Tour of Wabash National Corporation Followed by Dinner and Meeting    ^ Top

Date: March 6 , 2008
Schedule: Tour: 4:00 PM
Dinner: 6:00 PM
Meeting: 7:00 PM
Location:

Tour of Wabash National
Lafayette, IN

Dinner & Meeting
The Trails Restaurant
West Lafayette, IN

Cost:

Members: $20.00
Non-Members: $22.00
Student Members: $5.00

Registration:

Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00 pm on Tuesday, March 4, 2008.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email m.ray.fairchild@delphi.com.

Wabash National Corporation is one of the leading manufacturers of semi trailers in North America.  Established in 1985, the company specializes in the design and production of dry freight vans, refrigerated vans, flatbed trailers, drop deck trailers, and intermodal equipment. Its innovative core products are sold under the DuraPlate®, ArcticLite®, and Eagle® brand names. Wabash National was established in 1985 as a start-up company.  It experienced rapid sales growth throughout the 1990s.  In 1991 Wabash National became publicly traded.  The company has maintained a leading industry position since 1994. Wabash National acquired Transcraft Corporation in 2006.  Currently, Wabash National employs 4,000 workers in the US and Canada. For more information, visit www.imaps.org/chapters/indiana.

Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008    ^ Top

Date: May 7-9, 2008
Schedule:

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent
May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)
May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin

Founder of Engent Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME) Board of Directors, Surface Mount Technology Association (SMTA) ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center
     

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008
We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available). Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org.

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers,
quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee:
500.00 IMAPS Member
600.00 Non Member
(Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register

Announcing SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Technical Presentations with invited papers!
  • Tabletop Exhibits!Door Prizes in the Exhibit Area!
  • Lunch included!

Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies.

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com. Online booth registration - http://www.imaps.org/registration/socal2008.htm

Online Complimentary Attendee Registration http://www.imaps.org/chapters/freepass.asp

Further information – Contact:
Salim Akbany at 310-812-0343
Farman Mesdaghi at 310-813-5449
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • Packaging
  • Substrates/Materials
  • Design/Evaluation/Simulation
  • Manufacturing/Process
  • Interconnection
  • Optoelectronics
  • Nano Technologies
  • MEMS
  • Organic Semiconductors
  • Trend/Education/Environmental
  • Application.

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris) - Abstracts Due This Friday, February 29    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France.Papers are being accepted in the following topical areas:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

Abstract Submission:
We suggest that you send us your proposals in the form of one page abstract (word format) with the following information: company, speaker, phone, email, associated authors, title, and abstract text. Abstracts are due before February 29, 2008.

Contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org


Products and Publications

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP)
  • Advancing Microelectronics
  • IMAPS Symposium Proceedings
  • IMAPS Conference Proceedings
  • IMAPS Workshop Presentation Slides
  • Global Business Council Presentations
  • Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords
  • Primary Author
  • Primary Author Company
  • Event / Category
  • Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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