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January 24, 2008

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   PRODUCTS AND PUBLICATIONS
Now Available - iKNOW Microelectronics, IMAPS On-line Library of Searchable Technical Publications (read more...)

Button Webcast Team Members Wanted (read more...)

   IMAPS EVENTS
Button Device Packaging Conference Program and Registration Now Available (read more...)

Button Military, Aerospace, Space and Homeland Security (MASH) Workshop - Call For Abstracts Deadline Tomorrow, January 25 (read more...)

Button Abstract Deadline Tomorrow for ATW on Advanced Substrates and Next Generation Semiconductors (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Next Week: New England Chapter January 29 Dinner Meeting Featuring Presentation on A More Informed Look at Your Process using Confidence Intervals for Capability Indices (read more...)

Bullet Next Week: Third European ATW on Micropackaging and Thermal Management, January 30-31, 2008 La Rochelle, France (read more...)

Bullet Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) - Abstracts Due February 29 (read more...)

Products and Publications

Now Available - iKNOW Microelectronics, IMAPS On-line Library of Searchable Technical Publications   ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.

iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP)
  • Advancing Microelectronics
  • IMAPS Symposium Proceedings
  • IMAPS Conference Proceedings
  • IMAPS Workshop Presentation Slides
  • Global Business Council Presentations
  • Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords
  • Author
  • Primary Author Company
  • Event / Category
  • Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

Webcast Team Members Wanted    ^ Top
As IMAPS moves into more Webcast activities, we are looking for volunteers to help with these programs. The volunteers would be joining a team of action-oriented society members who want to get involved with new methods of delivering educational content and technical information. It is envisaged that the Webcasts will be diverse in scope, but generally along the lines of IMAPS portfolio of technologies. As a team member, you would be helping to find technical experts from companies and universities, who are interested in presenting their work to an audience outside of a conventional workshop or conference. At the same time the team is looking to generate sponsorship for the presentations. The teams job is to keep a full schedule of web-delivered content, at least one webinar per month and preferably more often.

This is an opportunity to develop your skills in new methods of technical content delivery and help the society.

If you would like to volunteer to help, learn and have some fun doing this, contact Brian Schieman - bschieman@imaps.org or 202-548-8715.

 

IMAPS Events (view full Web Calendar)

Device Packaging Conference Program and Registration Now Available   ^ Top
The 4th International Conference and Exhibition on Device Packaging is being held March 17-20, 2008, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

This year’s conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topic areas related to microelectronic packaging: Flip Chip; Wafer Level/Chip Scale Packaging; 3-D Packaging; MEMS; and Biomedical. Technical presentations in these 5 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these 5 topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 16-17, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.

The Device Packaging Conference and Exhibition has doubled in attendance and sold out exhibit space every year since its inception. 2008 is no different - the hall is now sold out!

In addition to moving to a larger facility to accommodate more exhibitors, we have also enhanced the exhibit hall format this year to encourage more interaction between the vendor companies and the attendees seeking information and solutions. We have extended all breaks in the exhibit hall this year, including: a two and a half hour lunch break in the hall on Tuesday; a one hour coffee break that afternoon; a one hour Tuesday evening reception; and lunch in the hall again Wednesday, at 11:30 am, followed immediately by a poster session in the hall until 3:00 pm when exhibits close.

Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line..

Military, Aerospace, Space and Homeland Security (MASH) Workshop - Call For Abstracts Deadline Tomorrow, January 25    ^ Top
The Advanced Technology Workshop (ATW) on Military, Aerospace, Space and Homeland Security is being held April 28-30, 2008, at the Conference Center at the Maritime Institute in Linthicum Heights, Maryland - just minutes from downtown Baltimore and BWI Airport. For more information, visit www.imaps.org/mash. This workshop will feature tabletop exhibits and will be co-located with the Advanced Substrates/Next-Generation Semiconductors Advanced Technology Workshop (www.imaps.org/substrates).

In our current environment where the focus is on military activities and homeland security, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging.  The technical program will expand upon the previous workshops and will focus on the latest military, aerospace, space and homeland security electronic devices, systems, and applications, with particular emphasis on materials and processing issues at the component level as well as the connected issues at the design and applications level.

Abstracts are being requested for the following Military, Aerospace, Space and Homeland Security: Packaging Issues and Application topics:

  • Embedded Actives and Associated Technologies
  • Advanced Organic Substrate Development (i.e., Teflon LCP)
  • Lead-Free Soldering and Associated Reliability Issues and Concerns                    
  • MCM Packaging for Military, Aerospace, Space Applications
  • Outsourcing of Military, Aerospace, Space Packaging
  • Obsolescence and Counterfeit Part Challenges
  • Homeland Security Applications and Packaging Issues
  • Sensor Technology for Homeland Security
  • COTS, Near Hermetic Packaging Solutions for Military and Space

To Submit an Abstract:

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present papers may submit a 200-word or less abstract electronically by January 25, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you are having problems with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org.

Abstract Deadline Tomorrow for ATW on Advanced Substrates and Next Generation Semiconductors    ^ Top
The Advanced Technology Workshop (ATW) on Advanced Substrates/Next-Generation Semiconductors is being held April 30-May 1, 2008, at the Conference Center at the Maritime Institute in Linthicum Heights, Maryland - just minutes from downtown Baltimore and BWI Airport. For more information, visit www.imaps.org/substrates. This workshop will feature tabletop exhibits and will be co-located with the Military, Aerospace, Space and Homeland Security Advanced Technology Workshop (www.imaps.org/mash).

This all new workshop will feature state-of-the-art technologies related to novel engineered substrates and next-generation semiconductors. The objective of the workshop is to have a unique forum that brings together engineers, scientists, manufacturing, academia, and business experts from around the world. This workshop will focus on multiple aspects of advanced substrates/next-generation semiconductors from basic materials, processing and reliability issues to implications to packaging and leading-edge applications for commercial and defense activities and others. This mini-workshop is a great opportunity that allows for the presentation as well as debate with Advanced Substrates/Next-Generation Semiconductors developers who are bringing these technologies at the forefront of the marketplace. In addition, these technologies are essential as they are mitigating the limitations posed by conventional substrates and semiconductors.

Abstracts are being requested in the following areas:

Materials, Processing & Reliability

Packaging

Applications

  • Flex Inorganic Substrates
  • III-V Nitrides (GaN, AlN)
  • Silicon Carbides
  • SOI and SOD
  • Lithium Niobate/Lithium Tantalate
  • InGaP, InP, InGaAs
  • Interconnects
  • Thermal and Power Management
  • Thermo-mechanical modeling

 

  • High Power Electronics
  • Optoelectronics
  • SAW Devices
  • Space / Extreme Environments
  • Advanced Substrates for Large Area Electronics
  • MEMS/NEMS
  • Biosensing Platforms

Those wishing to present a paper at the Advanced Substrates/Next Generation Semiconductors Workshop must submit a 200-word abstract electronically by January 25, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you are having problems with the on-line submittal form, please email Brian Schieman at bschieman@imaps.org.

All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Chapter Activities (events listed in chronological order)

Next Week: New England Chapter January 29 Dinner Meeting Featuring Presentation on A More Informed Look at Your Process using Confidence Intervals for Capability Indices   ^ Top

Date: January 29, 2008
Schedule: Registration/Networking 5:30 pm
Dinner: 6:30 pm
Technical Presentation: 7:30 pm
Location: Holiday Inn Boxborough Woods
242 Adams Pl
Boxborough, MA 01719-1735
Phone 978 263 8701
Cost:

Meeting Only - N/C
Dinner - Non-Member $30.00
Dinner - Member $25.00
Dinner - Retired Member $20.00
Dinner - Student $5.00

Registration:

Registration form or Mail or E-mail completed form with all information to:
Susan Munyon
96 Grant Way Lancaster, MA 01523-3112
e-mail: SusanMunyon@comcast.net
phone/fax: 978-466-1877

Reservations must be received by Friday January 25th!! At-door registration is an additional $5.00. If you make a reservation and can't make the meeting, please cancel by Monday, January 28th!!! or the Chapter is billed for your meal. There's no charge for attending the Technical Meeting, only for dinner. You may attend without eating dinner.

"A More Informed Look at Your Process using Confidence Intervals for Capability Indices"

by Daryl L. Santos, Ph.D.
Center for Advanced Microelectronics Manufacturing
Department of Systems Science and Industrial Engineering
Binghamton University / Binghamton, NY

Abstract:
Many of us know that a simple process capability index (like Cp, Cpk, etc.) is calculated as a ratio of the tolerance of some feature (print tolerance, X-axis accuracy, placement force, etc.) to the variability of the process.  However, what many of us may not realize is that this process capability index, while taken for granted, is simply a point-estimator for the process performance and is based upon a sample.  This talk describes the use of confidence intervals to provide you and your customers a better understanding of where the actual process capability lies as opposed to just simply providing a single point estimate that probably is not, exactly, the true capability.

Biography:
Daryl L. Santos, Ph.D., is a Professor in the Systems Science and Industrial Engineering Department at Binghamton University in New York State.  He earned his Ph.D. (‘93) and M.S. (‘90) from the Department of Industrial Engineering at the University of Houston.  His B.S. (‘87) in Operations Research and Industrial Engineering was obtained at Cornell University, Ithaca, NY.

Since his arrival at Binghamton in May ‘94, Dr. Santos has worked closely with the Integrated Electronics Engineering Center and local and national industries and federal funding agencies to successfully resolve electronics manufacturing issues in the following areas: process analysis and improvement, production scheduling, engineering economics, and quality control.

On research projects he has worked with the following companies: Speedline Technologies, Cookson Electronics and many of its subsidiaries, IBM-Endicott, Universal Instruments, Intel, and several others.  He is currently helping to manage the Center for Advanced Microelectronics Manufacturing (CAMM) at Binghamton University; a major goal of the CAMM is to demonstrate the feasibility of flexible, roll-to-roll electronics manufacturing.

He is a Member of the SMTA, the American Society for Engineering Education (ASEE), the Institute of Industrial Engineers (IIE), the American Society for Quality (ASQ), and Alpha Pi Mu – the honor society of Industrial Engineering.

Next Week: Third European ATW on Micropackaging and Thermal Management, January 30-31, 2008 La Rochelle, France    ^ Top
The Third European ATW on Micropackaging and Thermal Management will be held, January 29-31, 2008 in La Rochelle on the French Atlantic coast. The venue for this workshop will be the Mercure Vieux Port Sud Hotel, Qual Louis Prunier, 17000 La Rochelle, France. You can book directly with the hotel at:
Tel : 33 (0) 5 46 50 61 50; Fax : 33 (0) 5 46 41 24 31; or Email : H0569@accor.com.

The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop program is now available on-line. Visit www.imapsfrance.org for more information.

Early Registration ended January 15, 2008
Final Registration ends on January 25, 2008

Registration Fees:
IMAPS MEMBER 750 €*VAT -- After January 15
IMAPS NON MEMBER 850 €*VAT -- After January 15
SPEAKERS/CHAIRS/TECHNICAL COMMITTEE 480 €* VAT
STUDENTS 100 € VAT (lunch excluded, no hotel)

*These prices include: Hotel for 2 nights (arrival on Tuesday), lunches and dinners for 2 days

Like it was done for the second issue, the ATW will be open to tabletop exhibits, strictly limited to organisations involved in the field of thermal management. Tabletops are limited to the first 20 participants on a first-come-first-serve basis. The tabletop reservation fees are 300 € VAT (19,60%) - an invoice will be sent. For foreign companies, VAT will not be charged. Price without VAT is 250,84 €.

As usual, the workshop is organized, at hotel “Mercure Oceanide”, on a global fees basis for registration, hotel and meals.

Visit www.imapsfrance.org for more information.

Interested to attend or exhibit?

Please contact Florence Vireton at the IMAPS France office, imaps.france@imapsfrance.org
Phone: 33-(0)1-39 67 17 73    Fax: 33-(0)1-39 02 71 93

Metro Chapter Announces its 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008    ^ Top

Date: May 7-9, 2008
Schedule:

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent

May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin
Founder of Engent

Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany
  • Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME)
  • Board of Directors, Surface Mount Technology Association (SMTA)
  • ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center
     

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008

We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:

Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered.

Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available)

Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org.

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation.

Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.

In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.

This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.

The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.

The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.

In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?

This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:
Packaging, Substrates/Materials, Design/Evaluation/Simulation, Manufacturing/Process, Interconnection, Optoelectronics, Nano Technologies, MEMS, Organic Semiconductors, Trend/Education/Environmental, and Application. Other subject matter relating to electronics packaging will also be considered.

Registration Fee:
Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:
General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris) - Abstracts Due February 29    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France.

Papers are being accepted in the following topical areas:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...
  • Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

Abstract Submission:
We suggest that you send us your proposals in the form of one page abstract (word format) with the following information: company, speaker, phone, email, associated authors, title, and abstract text. Abstracts are due before February 29, 2008.

Contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org


 

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

International Conference on Alternative Energy 2008
April 7-10, 2008
Albuquerque, NM

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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