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June 10, 2008

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   IMAPS EVENTS
Button Abstracts Due This Friday, June 13, for the New RF and Microwave Packaging Workshop (read more...)

Button Advanced Technology Workshop and Tabletop Exhibition on Thermal Management (read more...)

Button Advanced Technology Workshop on Wire Bonding Next Month at SEMICON West (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Interconex 2008 (Paris) (read more...)

Bullet Viking Chapter Summer Technical Symposium and Plant Tour July 10 at HEI Inc. - A Really Big 3D Event (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

Bullet XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Bullet 7th International Symposium on Microelectronics and Packaging (ISMP 2008) (read more...)

   PRODUCTS AND PUBLICATIONS
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

Abstracts Due This Friday, June 13, for the New RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • High Power Electronics
  • Military / Space / Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than June 13, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.

Advanced Technology Workshop and Tabletop Exhibition on Thermal Management   ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is being held October 14-16, 2008, at the
Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California.

For more information, visit www.imaps.org/thermal. This workshop will now feature a limited number of tabletop booths - a maximum of 12 will be available and on display.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutionsto meet current and evolving requirements in computing and wireless/telco systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

Abstracts are being requested in the following areas:

  • Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
  • Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing.  Metallic, metal matrix and polymer matrix materials.
  • High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
  • Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
  • Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
  • Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.         
  • Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
  • Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

Preparation of Abstracts:

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 30, 2008.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted online at http://www.imaps.org/abstracts.htm.

Questions: contact Jackki Morris-Joyner with questions: jmorris@imaps.org or 305-382-8433. You may also contact the workshop chairs.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Advanced Technology Workshop on Wire Bonding Next Month at SEMICON West   ^ Top
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. The technical program and registration information is available on-line. For more information or to register, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008
.

This one-day workshop features 3 technical sessions on: Applications and Ultrasonics; Heavy Wire Wedge & Ribbon Bonding; and Stacked Die, Copper, Reliability. To view the full technical program and to register, visit www.imaps.org/wirebonding.

Chapter Activities (events listed in chronological order)

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level
  • Packaging...Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org

Viking Chapter Summer Technical Symposium and Plant Tour July 10 at HEI Inc. - A Really Big 3D Event    ^ Top

Date: July 10, 2008
Schedule:

1:30-5:30 pm

Location:
HEI Inc.
1495 Steiger Lake Lane
Victoria, MN 55386
Cost:
Members- Free
Non-Members-$15
Students-Free
Vendor Booths Available
Registration:
RSVP by July 7 to Char Thomas –
REStronics Northland
northlandsales@restronics.com
Phone: 952-941-9135
Fax: 952-941-9132

Keynote Presentations:

Dr. Christian Val founder of 3D Plus will present:
“Ultra Small Sytem-in-Package For Medical Applications”
www.3d-plus.com

Bernd Scholz from NDSU Center for Nanoscale Science and Engineering will present: “Interconnect Integrity Challenges in the Development of a Flexible Package” www.ndsu.nodak.edu/cnse

HEI will have three short presentations:

Bob Gosliak, Business Development Engineer/John Whitley, Engineering Manager: “High Density Interconnect Enabling Microelectronics Manufacturing”

Dave Barwig, Sr. Cell Engineer:
“Miniaturization Utilizing 3-D Packaging Techniques”

Lenny Hill, Continuous Improvement Engineer:
“Quick-turns Utilizing Cellular Manufacturing”

Poster Board Technical Paper:

*Peterson Sales*
“Ceramic capacitor reliability issues due to the use of base metal electrodes (BME) instead of precious metal electrodes (PME)”

**Plus Vendor Exhibit Area**

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
 
TECHNICAL PROGRAM:  
Sessions are being planned describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
 
SUBMISSION OF ABSTRACT/PAPER  
The abstract deadline has passed. If you have questions about submitting an abstract, please email: icept2008@fudan.edu.cn.

The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit http://www.icept.org/newweb/cpage.asp.

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference    ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.

The Conference topics will include:

  • Hybrid and Semiconductor Technology
  • Design Methods and Computer Simulations
  • Electronics Materials and Components
  • Microcircuits Applications
  • Thick-Film and Thin-Film Sensors
  • Packaging and PCB
  • Quality and Reliability Evaluation
  • Thermal Management
  • Optoelectronics and Photovoltaics
  • Education in Electronics

The Conference presentations will be made in the form of:

  • Invited lectures
  • Poster sessions for presentation of contributed papers

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl.

If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
E-mail:  imaps2008@imio.pw.edu.pl

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

7th International Symposium on Microelectronics and Packaging (ISMP 2008)    ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:

  1. Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
  2. LED, Solar cell

For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr.

Products and Publications

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP) Advancing Microelectronics IMAPS Symposium Proceedings IMAPS Conference Proceedings IMAPS Workshop Presentation Slides Global Business Council Presentations Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords Primary Author Primary Author Company Event / Category Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 14-16, 2008
Palo Alto, CA

*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact abell@imaps.org

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Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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