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June 3, 2008

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   IMAPS EVENTS
Button Advanced Technology Workshop on Wire Bonding Next Month at SEMICON West (read more...)

Button Abstracts Will Be Accepted Until Next Friday, June 13, for the New RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet SoCal 2008 Technical Symposium and Tabletop Exhibition - Tomorrow (read more...)

Bullet Tomorrow - Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert (read more...)

Bullet Arizona Chapter Lunch Meeting This Thursday, June 5, on Supply Chain Collaboration – Key for Transition to Fine Pitch (0.3mm) CSPs - On-line Registration Ends Tonight (read more...)

Bullet Upstate New York Meeting Next Tuesday, June 10, Featuring Presentation on Ceramics In Clean Tech and Tour of Infotonics Technology Center (read more...)

Bullet IMAPS UK's MicroTech 2008 Begins Next Tuesday, June 10 - A Few Spots Remain (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 Begins Next Tuesday, June 10, in Tokyo (read more...)

Bullet Interconex 2008 (Paris) (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

Bullet XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Bullet 7th International Symposium on Microelectronics and Packaging (ISMP 2008) (read more...)

   PRODUCTS AND PUBLICATIONS
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

Advanced Technology Workshop on Wire Bonding Next Month at SEMICON West   ^ Top
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. The technical program and registration information is now available on-line. For more information or to register, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008
.

This one-day workshop features 3 technical sessions on: Applications and Ultrasonics; Heavy Wire Wedge & Ribbon Bonding; and Stacked Die, Copper, Reliability. To view the full technical program and to register, visit www.imaps.org/wirebonding.

Abstracts will be Accepted Until Next Friday, June 13, for the New RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • High Power Electronics
  • Military / Space / Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than June 13, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.

Chapter Activities (events listed in chronological order)

SoCal 2008 Technical Symposium and Tabletop Exhibition - Tomorrow    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008, from 9:00 am to 4:00 pm. On-line registration has closed. You must register on-site for this event.

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Attendance is Complimentary
  • Lunch included
  • Door Prizes

Tabletop Exhibits Available
Sample of Exhibitors:
Micropac Industries, Solid State Devices, Sabritec, International Rectifier, Q-Tech Corp., Antares Advanced Test Technology, Gel-Pak, Semiconductor Equipment Corp., Crane, Minco Technology Labs, Calmont Wire & Cable Inc., Astron Electronics, F & K Delvotec Inc.

Technical Program
Papers Invited
Contact:  Salim Akbany salim.akbany@ngc.com or 310-812-0343

This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies

Sample of Topics:
 “Determining the Effects of Package Parasitic on SI and EMC Performance”
“Evaluation of DirectFET® Flip Chip Packaging Technology”
“SAE G-19 Counterfeit Electronic Components Committee”
“Thin-Film Technology Using Nichrome”

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com.

Further information – Contact:
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

Phil Zulueta at pzulueta@mail1.jpl.nasa.gov

Tomorrow - Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert    ^ Top

Date: June 4 , 2008
Schedule:

7:00-9:00 pm

Location:
Holiday Inn Select - Orlando Airport
Registration:
Contact: Mike Newton, mnewton@harris.com

Speaker:

Michael R. Ehlert
Director of Process Engineering
1st Past President of IMAPS

Barry Industries Inc.
60 Walton Street
Attleboro, MA 02703
Phone (949) 929-4933
mike.ehlert@barryind.com

LTCC - Past Present and Future

This will be a broad overview of LTCC from conception through its growth to the present.  We will examine some of the key drivers for its conception, what makes it unique and possible future applications.

LTCC Standards Movement

This will be an up to the minute status report on current work in developing a comprehensive set of standards for all branches of the LTCC supply chain including Fired Properties, Un-Fired Properties and Processing.

IMAPS Initiatives
A succinct report on what is happening at the highest level including proposed organizational changes and their effect on the society worldwide.

Arizona Chapter Lunch Meeting This Thursday, June 5, on Supply Chain Collaboration – Key for Transition to Fine Pitch (0.3mm) CSPs - On-line Registration Ends Tonight    ^ Top

Date: June 5 , 2008
Schedule:

Registration and Lunch: 11:30 am - 12:00 noon
Presentation: 12:00 noon - 1:00 pm

Location: Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa, AZ 85202
Registration:

Complimentary On-line for Attendees at http://www.imaps.org/chapters/freepass.asp (Closes Tuesday, June 3)

$15/Table On-line for Vendors at www.imaps.org/registration/az2008jun.htm (Closes Tuesday, June 3)

Contact: Chunho Kim, chunho.kim@intel.com

Supply Chain Collaboration – Key for Transition to Fine Pitch (0.3mm) CSPs

  • Smartphone (feature rich handset) requirements for fine pitch CSP
  • Design considerations for laminate and wafer level CSPs
  • PWB and SMT considerations
  • Board level reliability results and considerations

Speaker:

Ahmer Syed (on behalf of Lee Smith)
VP of Mechanical/Thermal Engineering
Amkor Technology
Chandler, Arizona

Upstate New York Meeting Next Tuesday, June 10, Featuring Presentation on Ceramics In Clean Tech and Tour of Infotonics Technology Center    ^ Top

Date: June 10, 2008
Schedule:

2:45 Registration
3:00 Introduction and welcome
3:15 Presentation and Q & A
4:00 Tour of the Infotonics Technology Center
5:00 Light catered dinner and social/networking
6:30 Adjourn

Location:

Infotonics Technology Center - www.infotonics.org
5450 Campus Drive
Canandaigua, NY 14424  (Near Rochester)
Map and Directions, Click here
(585) 919-3000 • (585) 919-3011

Cost:

Students - $12
Members - $15
Non-members - $20

Registration:
Please RSVP on-line by Friday, June 6 at: http://www.imaps.org/registration/ny2008.htm

Ceramics In Clean Tech
Presented by:
Mr. John Olenick, President of ENrG Inc., www.enrg-inc.com

This presentation will address the use of varying amounts of porosity, to modify membrane and catalysis coating characteristics in fuel cell, gas separation membrane, and insulation packaging applications. These applications differ in the amount of porosity used in the key separation membrane, the yittria-stablized zirconia electrolyte in the fuel cell, the ceramic support structure in gas separation member, and the near total porosity fiber structure of ceramic insulation.

Presenter Bio:  John Olenick
Mr. Olenick is a business entrepreneur with 29 years of corporate background in the electronics, ceramics, and energy industry segments. At ENrG, Mr. Olenick is responsible for the strategic planning, funding, and political positioning of the corporation. Having started the corporation in January 2003, he has led the growth to $1.5M with 14 employees. Mr. Olenick is a 1978 graduate of The Pennsylvania State University, and has added to his studies at University of Connecticut and University of Buffalo. He has been a IMAPs member for 24 years and is the current Technical Co-Chair for this year’s International Symposium in Providence, RI.

About ENrG Inc.:
ENrG Incorporated (ENrG) develops and manufactures critical ceramic components for clean energy systems such as fuel cell systems and clean coal technology. The company was started in January 2003 and is currently located in an Economic Development Zone at the Buffalo Free Trade Center. ENrG works with OEMs to design and manufacture ceramic components required for the commercialization of membrane based systems.

About the Infotonics Technology Center (ITC):
ITC is a New York State Center of Excellence in MEMS/NEMS microsystems development, fabrication, and packaging. It provides vertically integrated services from product concept through production in our state-of-the-art facility. ITC supports commercialization of microsystems and chip scale devices that integrate mechanics, optics, fluidics and chemistry on a microelectronics chip. ITC offers a full-range of MEMS-related services under one roof, enabling customers to produce cutting-edge products and devices more efficiently and cost-effectively.

Register on-line by Friday, June 6 at: http://www.imaps.org/registration/ny2008.htm

IMAPS UK's MicroTech 2008 Begins Next Tuesday, June 10 - A Few Spots Remain    ^ Top
IMAPS United Kingdom Chapter is holding MicroTech 2008 June 10-11, 2008, at the Beaumont House Conference Centre in Old Windsor. This Conference and Tabletop Exhibition will focus on Advanced Interconnection and Packaging - Visions of the Future - featuring sessions on: 3D and Wafer Level Integration; Micro-Nano Systems; Advance Packaging; Large Area Electronics; and Market Watch. Visit www.imaps.org.uk to view the full program and to register on-line.

There is still time to book for IMAPS-UK's MicroTech 2008. Many of you will be attending the ELC meeting the day before so why not stay on and join us for our 40th anniversary event. There is a special price for ELC members of £305 +vat (total of £358.38) and this includes overnight accommodation and all meals including the gala dinner as well as conference admission.

Entertainment at the dinner will be by the internationally famous Mazaika - http://www.mazaika-music.com.

In addition there are still one or two exhibition spaces available if you are interested please contact Sylvia Outteridge, phone +44 1522 575212 or e-mail imapsuk@aol.com.

International Conference on Electronics Packaging (ICEP) 2008 Begins Next Tuesday, June 10, in Tokyo    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • Packaging
  • Substrates/Materials
  • Design/Evaluation/Simulation
  • Manufacturing/Process
  • Interconnection
  • Optoelectronics
  • Nano Technologies
  • MEMS
  • Organic Semiconductors
  • Trend/Education/Environmental
  • Application

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.),
K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level
  • Packaging...Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
 
TECHNICAL PROGRAM:  
Sessions are being planned describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
 
SUBMISSION OF ABSTRACT/PAPER  
The abstract deadline has passed. If you have questions about submitting an abstract, please email: icept2008@fudan.edu.cn.

The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit http://www.icept.org/newweb/cpage.asp.

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference    ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.

The Conference topics will include:

  • Hybrid and Semiconductor Technology
  • Design Methods and Computer Simulations
  • Electronics Materials and Components
  • Microcircuits Applications
  • Thick-Film and Thin-Film Sensors
  • Packaging and PCB
  • Quality and Reliability Evaluation
  • Thermal Management
  • Optoelectronics and Photovoltaics
  • Education in Electronics

The Conference presentations will be made in the form of:

  • Invited lectures
  • Poster sessions for presentation of contributed papers

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl.

If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
E-mail:  imaps2008@imio.pw.edu.pl

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

7th International Symposium on Microelectronics and Packaging (ISMP 2008)    ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:

  1. Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
  2. LED, Solar cell

For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr.

Products and Publications

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP) Advancing Microelectronics IMAPS Symposium Proceedings IMAPS Conference Proceedings IMAPS Workshop Presentation Slides Global Business Council Presentations Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords Primary Author Primary Author Company Event / Category Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

ATW on Thermal Management
October 14-16, 2008
Palo Alto, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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