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March 25, 2008

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   IMAPS EVENTS
Button IMAPS 2008, 41st International Symposium on Microelectronics -- Abstract Deadline This Friday, March 28 (read more...)

Button Abstracts Due This Friday, March 28, for the Advanced Technology Workshop on Wire Bonding (read more...)

Button Abstracts Being Accepted for the RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Metro Dinner Meeting This Thursday, March 27, Featuring Presentation on Embedded Discrete High K Capacitor Characterization in Low Temperature Co-Fired Ceramic (LTCC) (read more...)

Bullet New England Chapter April 8 Meeting and 'Stellar Industries Plant Tour' (read more...)

Bullet Indiana Chapter Announces Vendor’s Day 2008 - April 14 (read more...)

Bullet Capital Chapter April 30 Dinner Meeting (read more...)

Bullet Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read more...)

Bullet Announcing SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

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Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

IMAPS 2008, 41st International Symposium on Microelectronics -- Abstract Deadline This Friday, March 28    ^ Top
The 41st International Symposium on Microelectronics (IMAPS 2008) will be held at the Rhode Island Convention Center, Providence, Rhode Island, USA, November 2-6, 2008. Visit www.imaps2008.org for complete information on the symposium.

CALL FOR PAPERS - DEADLINE MARCH 28

The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.

View the list of topics of interest on-line at www.imaps2008.org.

To submit an abstract, go to www.imaps.org/abstracts.htm and send your 250-300 word abstract electronically by March 28, 2008.

If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner at jmorris@imaps.org or call 305-382-8433.

Abstracts due This Friday, March 28, for the Advanced Technology Workshop on Wire Bonding   ^ Top
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. For more information, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008
.

The objective of the Wire Bonding workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of wire bond interconnections. This workshop enables discussion and presentation of the latest wire bonding technology.

  • Fine pitch wire bonding
  • Stacked die wire bonding and looping
  • Heavy wire wedge and ribbon bonding
  • Assembly processes and handling issues
  • Bumping for High Brightness LEDs and Solar arrays
  • Novel wire bonded packages and designs
  • High Frequency wire bond packages
  • Electromigration and Interfacial Adhesion
  • Reliability and Testing
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Advanced Technology Workshop must submit a 200-300 word abstract electronically no later March 28, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 1, 2008. For more information, visit www.imaps.org/wirebonding.

Abstracts Being Accepted for the RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • High Power Electronics
  • Military / Space / ExtremeEnvironments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 23, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.

Chapter Activities (events listed in chronological order)

Metro Dinner Meeting This Thursday, March 27, Featuring Presentation on Embedded Discrete High K Capacitor Characterization in Low Temperature Co-Fired Ceramic (LTCC)    ^ Top

Date: March 27, 2008
Schedule:

Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Technical Presentation: 7:15-8:00 PM

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

Price: Members: $30.00 if Pre-Registered Tuesday March 25, 2008 $35.00 After March 25, 2008

Non-Members: $35.00 if Pre-Registered by March 25, 2008
$40.00 After March 25, 2008

Student Members: $10.00 if Pre-Registered before March 25, 2008
$20.00 after March 25, 2008

There are a limited number of vendor tables available for this meeting at a cost of $200.00 or 2 for 300.00. Please contact Steve Lehnert if you are interested.

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Embedded Discrete High K Capacitor Characterization in Low Temperature Co-Fired Ceramic (LTCC)

Michael Skurski, Dupont

Michael A. Skurski is a Sr. Technical Service Representative with DuPont Microcircuit Materials, specializing in 951 Green Tape technology (LTCC), automotive defogger materials, Fodel(R) photoimaging, and Diffusion Patterning(tm) advanced patterning techniques, in addition to performing R&D related functions in these areas, and conventional thick film technology.

Mike joined DuPont in 1979 where he has contributed to various groups within DuPont's Thick Film Electronic Materials Division, including Quality Assurance, Research & Development, Manufacturing Scale-up Engineering, and Technical Service.

This paper will discuss in detail the measurement results of the embedded discrete high K capacitors when fabricated within a Low Temperature Co-fired Ceramic (LTCC) structure. It will cover design rules and typical measured capacitor values and ranges which use high K thick film formulations of K ~500 and K ~1800 with X7R characteristics when embedded within the LTCC circuits.

These capacitors could be utilized as biased and decoupling capacitors; near and around MMIC's and IC's instead of using surface mount capacitors or integrating them in the IC technology.

Details of the properties of the dielectric materials, circuit functional designs and functional properties of the circuits will be discussed, along with processing details and recommendations.

New England Chapter April 8 Meeting and 'Stellar Industries Plant Tour'    ^ Top

Date: April 8 , 2008
Schedule:

5:00 PM - Registration, Socializing, Networking
5:45 PM - Dinner Mexican Buffet
6:30 PM - Presentation By Stellar Industries
6:45 PM - Tours Begin

Location: 50 Howe Avenue
Millbury, MA 01527
use the Lincoln Ave Extension Entrance
Cost:

Meeting Only N/C
Dinner - Non-Member $ 20.00
Dinner - Member $ 15.00
Dinner - Retired Member $10.00
Dinner - Student $5.00

Registration:

Contact Susan Munyon
96 Grant Way Lancaster, MA 01523-3112
e-mail SusanMunyon@comcast.net
978-466-1877 phone/fax


Stellar Industries Corp.
sells to the Telecom, Biomedical, and Defense Industries for custom products and services. Stellar’s products include custom lapped and polished electronic grade ceramics composed of Alumina, Beryllium Oxide, Aluminum Nitride, or specialty ceramics. Stellar also supplies custom services for metalizations on these ceramics using a variety of thick film, thin film, refractory and Direct Bond Copper metalizations. Their ceramic substrates are used in a variety of electronic components including:
Laser Diode / Photodetector Submounts:
• Featuring precision machining and wrap-around metalization vapor deposited gold/tin solder alloys
High Power Microelectronic substrates:
• Featuring Copper Clad High Temperature DBC metalization
Microwave and RF thin film substrates:
• Featuring Precision Ion Etch geometries

Stellar Industries Website

IMPORTANT PLEASE READ

  • Reservations must be received by Wednesday April 2nd!!   
  • Sorry No Walk-Ins You Must Register.
  • Limited Registration to 80 attendees!
  • Registrants must be a US Citizen. Please bring Passport or Birth Certificate.
  • Registrants must provide company affiliation, company address.
  • Stellar Industries reserves the right to reject registrants.
  • If you make a reservation and can't make the meeting, please cancel by , Friday April 4th!!! or the Chapter is billed for your meal.
  • There's no charge for attending the Tour, only for dinner. You may attend without eating dinner.

Indiana Chapter Announces Vendor’s Day 2008 - April 14    ^ Top
The Indiana Chapters of IMAPS and SMTA are joining together to sponsor their annual Vendor’s Day program on Monday, April 14, 2008. It will be held in Indianapolis, Indiana at the Holiday Inn Select – Indianapolis International Airport.

The vendor displays will be open from 4:30 P.M. to 7:00 P.M. and will include a cash bar, door prizes and free hors d’oeuvres for all. A joint IMAPS and SMTA technical symposium begins at 1:00 P.M., featuring presentations by a variety of industry leaders, engineers and inventors. Admission to both events is FREE to all attendees.

Vendor tables are $190 per six-foot table. To reserve a table please contact Vendor’s Day Chairman Larry Wallman at 317-887-2564, or at lwallman@sbcglobal.net. Table registrations will be accepted until April 4.

Anyone interested in making a technical presentation should contact Ray Fairchild at 765-451-1068. Presentations should be 25 minutes long and can cover any topic related to the microelectronics or surface mount industries.

Capital Chapter April 30 Dinner Meeting    ^ Top

Date: April 30, 2008
Schedule:

5:30 Registration and networking - Cash Bar
6:30 Dinner and Discussion, voting on future meetings of the Capital Chapter

Location:
Rose Restaurant
6075 Belle Grove Road
Baltimore, Maryland 21225
Cost:

IMAPS members $10.00
Non Members $20.00

Registration:
Contact :
Lou Razzetti, lou@avidassociates.com (preferred) or 301-588-0637
Please register no later than the Wednesday, April 23rd.

 

Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008    ^ Top

Date: May 7-9, 2008
Schedule:

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent
May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)
May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin

Founder of Engent Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME) Board of Directors, Surface Mount Technology Association (SMTA) ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center
     

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008
We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available). Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org.

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers,
quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee:
500.00 IMAPS Member
600.00 Non Member
(Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register

Announcing SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Technical Presentations with invited papers!
  • Tabletop Exhibits!Door Prizes in the Exhibit Area!
  • Lunch included!

Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies.

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com. Online booth registration - http://www.imaps.org/registration/socal2008.htm

Online Complimentary Attendee Registration http://www.imaps.org/chapters/freepass.asp

Further information – Contact:
Salim Akbany at 310-812-0343
Farman Mesdaghi at 310-813-5449
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • Packaging
  • Substrates/Materials
  • Design/Evaluation/Simulation
  • Manufacturing/Process
  • Interconnection
  • Optoelectronics
  • Nano Technologies
  • MEMS
  • Organic Semiconductors
  • Trend/Education/Environmental
  • Application.

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
 
CALL FOR PAPERS 
You are invited to submit an abstract, describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
 
SUBMISSION OF ABSTRACT/PAPER  
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file through the email: icept2008@fudan.edu.cn.

The abstracts must be received by April 11, 2008. Authors must include their affiliation, mailing address, telephone and fax numbers, and email address. Authors will be notified of paper acceptance by April 25, 2008. The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit http://www.icept.org/newweb/cpage.asp.


Products and Publications

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP)
  • Advancing Microelectronics
  • IMAPS Symposium Proceedings
  • IMAPS Conference Proceedings
  • IMAPS Workshop Presentation Slides
  • Global Business Council Presentations
  • Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords
  • Primary Author
  • Primary Author Company
  • Event / Category
  • Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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