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March 4, 2008

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   IMAPS EVENTS
Button Device Packaging Conference Begins in Two Weeks - On-line Registration Closes Next Friday, March 14 (read more...)

Button GBC Spring 2008 Conference - Just Added: Professor Bi Keyun's Presentation on The Development of Semiconductor Packaging and Testing Industry of China (read more...)

Button IMAPS 2008, 41st International Symposium on Microelectronics -- Abstracts Due in Three Weeks (read more...)

Button International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) - Program and Registration Now On-Line (read more...)

Button Date Change: ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Indiana Chapter March 6 Tour of Wabash National Corporation Followed by Dinner and Meeting (read more...)

Bullet Angel Chapter March 25 Dinner Meeting with Presentation on Small Outline Packaging of Pressure Sensors for TPMS (read more...)

Bullet New England Chapter March 25 Dinner Meeting with Presentation on Understanding and Effectively Using XRF Technology for Components and Materials Inspection (read more...) 

Bullet Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008 (read more...)

Bullet Announcing SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

   PRODUCTS AND PUBLICATIONS
Advancing Microelectronics March/April 2008 On-line Magazine is Now Available (read more...)

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

Device Packaging Conference Begins in Two Weeks - On-line Registration Closes Next Friday, March 14    ^ Top
The 4th International Conference and Exhibition on Device Packaging begins in two weeks - March 17-20, 2008, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

Pre-registrations have surpassed each of the previous pre-registrations for the Device Packaging Conferences. The exhibit hall sold out months before the Conference and our hotel block has again sold out early. This is the spring event that your colleagues and competitors don't want to miss!

On-line registration closes next Friday, March 14, 2008. Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line.

GBC Spring 2008 Conference - Just Added: Professor Bi Keyun's Presentation on The Development of Semiconductor Packaging and Testing Industry of China    ^ Top
The GBC Spring Conference will be held March 16-17, 2008, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, AZ. Visit www.imaps.org/programs/gbc08spring.htm today to learn more about this conference and to register on-line.

The GBC Committee has just announced the addition of speaker Professor Bi Keyun, President of the China Electronics Packaging Society. Professor Keyun will discuss The Development of Semiconductor Packaging and Testing Industry of China.

This Conference precedes and is being held in conjunction with Device Packaging 2008. On-line registration closes next Friday, March 14, 2008. Visit www.imaps.org/programs/gbc08spring.htm today to register on-line.

IMAPS 2008, 41st International Symposium on Microelectronics -- Abstracts Due in Three Weeks    ^ Top
The 41st International Symposium on Microelectronics (IMAPS 2008) will be held at the Rhode Island Convention Center, Providence, Rhode Island, USA, November 2-6, 2008. Visit www.imaps2008.org for complete information on the symposium.

CALL FOR PAPERS - DEADLINE MARCH 28

The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.

View the list of topics of interest on-line at www.imaps2008.org.

To submit an abstract, go to www.imaps.org/abstracts.htm and send your 250-300 word abstract electronically by March 28, 2008.

If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner at jmorris@imaps.org or call 305-382-8433.

International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) - Program and Registration Now On-Line    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico.
To register on-line, make hotel reservations or for more information, visit www.imaps.org/hitec.

This is the premier event addressing the needs of the high temperature electronics community. Applications for high temperature electronics include underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc.

HiTEC 2008 provides a comprehensive technical program addressing the applications and the latest developments in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of these applications.

Tabletop exhibits will complement the technical program by providing you an opportunity to view the latest products for high temperature electronics.

This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important area. Visit www.imaps.org/hitec today.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits

Date Change: ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy has been rescheduled due to conflicts with other competing events in the New Mexico-area. The workshop will still be held at the Hotel Albuquerque Old Town in Albuquerque, New Mexico, but it is now being held August 12-14, 2008.

This event is a continuation of last years first Alternative Energy Conference and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.

Abstracts are being solicited in the following areas:

Solar - Photovoltaics
Fuel Cells
Geothermal
BioFuels
Batteries and Hybrids
Wind
Other Approaches

Thermal and Power Management
Inverter Materials and Design
Grid and Storage Approaches
Design for Efficiency

Materials & Reliability
Qualification Approaches
Environmental Regulations
Government/State Policies and Incentives

Those wishing to present a paper at the Energy Workshop, please submit a 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. Abstracts are now due on May 9, 2008. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

No formal technical paper is required.  A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on July 18, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees.

All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Chapter Activities (events listed in chronological order)

Indiana Chapter March 6 Tour of Wabash National Corporation Followed by Dinner and Meeting    ^ Top

Date: March 6 , 2008
Schedule: Tour: 4:00 PM
Dinner: 6:00 PM
Meeting: 7:00 PM
Location:

Tour of Wabash National
Lafayette, IN

Dinner & Meeting
The Trails Restaurant
West Lafayette, IN

Cost:

Members: $20.00
Non-Members: $22.00
Student Members: $5.00

Registration:

Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00 pm on Tuesday, March 4, 2008.  Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email m.ray.fairchild@delphi.com.

Wabash National Corporation is one of the leading manufacturers of semi trailers in North America.  Established in 1985, the company specializes in the design and production of dry freight vans, refrigerated vans, flatbed trailers, drop deck trailers, and intermodal equipment. Its innovative core products are sold under the DuraPlate®, ArcticLite®, and Eagle® brand names. Wabash National was established in 1985 as a start-up company.  It experienced rapid sales growth throughout the 1990s.  In 1991 Wabash National became publicly traded.  The company has maintained a leading industry position since 1994. Wabash National acquired Transcraft Corporation in 2006.  Currently, Wabash National employs 4,000 workers in the US and Canada. For more information, visit www.imaps.org/chapters/indiana.

Angel Chapter March 25 Dinner Meeting with Presentation on Small Outline Packaging of Pressure Sensors for TPMS    ^ Top

Date: March 25 , 2008
Schedule: 6:00 - Arrival & Networking
6:30 - Announcements Angel Chapter – Maurice Lowery
6:45 - Dinner
7:30 - Technical Presentation By, Robert Hunter Kavlico
8:30 - Adjourn
Location:

PROUD BIRD RESTAURANT
11022 Aviation Blvd.
Los Angeles (Near LAX)
(310) 670-3815

Cost:

Members: $15.00
Non-Members: $20.00
(No charge for Presentation only)

Registration:

Please RSVP to Maurice Lowery (maurice.lowery@ngc.com or 310-814-1890) by Mar. 20, 2008 (Specify any diet restrictions)

ABOUT THE PRESENTATION AND AUTHOR:

Small Outline Packaging of Pressure Sensors for TPMS

Abstract
This presentation outlines a low cost packaging solution using an open cavity QFN in conjunction with an integrated silicon capacitive sensor for Tire Pressure Monitoring Systems (TPMS). The open cavity QFN design allows for the pressure die to be attached and wire bonded after the package has been molded. For environmental protection, a lid that incorporates a hydrophobic filter is attached to the package. This QFN pressure sensor assembly uses a standard JEDEC outline lead frame, which can be attached to FR4 or other board material by standard reflow processes for ease of system integration.

The Speaker
Mr. Robert Hunter is a Senior MEMS Engineer at Kavlico, Moorpark, California. Currently working on the mechanical design of Intergrated Capacitive MEMS pressure sensors along with MEMS packaging projects. He graduated with BSME from University of Rhode Island in 1997. 

New England Chapter March 25 Dinner Meeting with Presentation on Understanding and Effectively Using XRF Technology for Components and Materials Inspection   ^ Top

Date: March 25 , 2008
Schedule:

5:00 - 6:00 PM Sign-In, Socializing and Tours thru SMT Facility Tour and/or Textron Product Showcase

6:00 - 6:50 PM Buffet Dinner

6:50 - 7:00 PM SMTA and iMAPS Chapter and Upcoming Meeting Announcements

7:00 - 8:15 PM Technical Presentation on XRF Technology

8:15 – 9:00 PM Optional XRF Technology Equipment Demonstrations @ Incoming Inspection Areas

Location:

Textron
201 Lowell Street, Wilmington, MA

Cost:

Buffet Dinner Cost:
$25.00 Members
$30.00 Non-members
Cash or check only.

Registration:

Please RSVP to Mike Sivigny at smta@cetaq-americas.com by Friday, March 21st.

If you make a reservation and can't come, please let us know by Monday, March 24th at noon or the chapter gets billed for your meal!

"Understanding and Effectively Using XRF Technology for Components and Materials Inspection"

Presentation Speaker: 
Gary Efronson of Fischer Technology

Gary received his BS degree in Environmental Sciences from Michigan State University.  He has been in the Plating and metal analysis industry for over 25 years.  He has been with Fischer Technology for 5 Years. 

This presentation should educate all our attendees with the following information:

  • How XRF (X-ray Fluorescence) Technology works
  • Different Technologies available (SiLi detectors, Si-PIN photodiodes and Proportional Counters).
  • The different types of systems that are available (bench top and handheld)
  • The advantages and disadvantages of the different technologies and systems
  • Review different applications and present some case studies showing value of having systems in-house. How companies have avoided major issues by being able to use this technology in-house.
  • Include live demonstrations of Fischer’s Bench top XRF equipment (ie: New Fischer XRF Machine which incorporates the latest pin diode technology as well as older Proportional Counter Machine).
  • Before meeting, Offer attendees opportunity to see Textron’s SMT Facility and/or Product Showcase.
  • In Auditorium meeting area, we can post some of the Technical Job Opportunities within Textron 

For more information, visit http://www.imapsne.org/meeting.html.

Metro Chapter 3-Day Technical Symposium and Workshop Being Held May 7-9, 2008    ^ Top

Date: May 7-9, 2008
Schedule:

May 7, 2008:
A full day presentation on flip chip and chip on board technology Presented by Dr. Daniel Baldwin of Engent
May 8, 2008:
½ Day Symposium and Vendor Table Top Show

May 9, 2008:
A full day presentation on Hermeticity, Near Hermetic Packages and RGA. Presented by Tom Green of TJ Green Associates

Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500
Cost:

May 7 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)
May 8 Vendor Table Fees:
Cost 350.00 before 3/31/08
450.00 after (If any are still available)

May 9 Course fee:
500.00 IMAPS Member; 600.00 Non Member
(Includes Continental Breakfast and Lunch)

Registration:

Contact Steve Lehnert to register.
Phone (631) 345-3100
Email slehnert@imaps.org

Tentative Schedule:

May 7, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on Flip Chip and Chip on Board Technology presented by:
Dr. Daniel F. Baldwin

Founder of Engent Dr. Baldwin holds a Ph.D. and S.M., Mechanical Engineering: Massachusetts Institute of Technology B.S.E, Mechanical Engineering, Arizona State University

Dr. Baldwin has been a leading expert in the Microelectronics Packaging industry for eight years. He was pursued and hired by Siemens to synthesize, construct, and run the Advanced Assembly Technology Division of Siemens Dematic serving as the Director and promoted to the Vice President of the Division. Dr. Baldwin subsequently led the efforts related to the management buy-out and formation of Engent.

Dr. Baldwin is a Professor of Mechanical Engineering at the Georgia Institute of Technology, with specialization in Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging, and Board Assembly since 1995. Dr. Baldwin managed large technology development programs at Georgia Tech with over 50 employees. During his tenure at Georgia Tech he raised over $10M in capital funding and constructing a $10M state of the art electronics manufacturing and MEMS/MOEMS packaging development facility.

He received his Master of Science and his Doctoral degrees in Mechanical Engineering from Massachusetts Institute of Technology (MIT), and has over 250 published or delivered articles, scholarly papers, keynote addresses, conference proceedings, and textbooks. Dr. Baldwin held prior positions Bell Labs in Princeton, NJ, where his work focused on electronics products miniaturization and advanced interconnect technologies and MIT as a research manager. Baldwin is renown in the field of leading-edge electronics-assembly technology, micro (opto) electromechanical systems (MEMS/MOEMS) packaging, optoelectronics packaging, and advanced materials processing. A handful of his many honors include:

  • Keynote Address: “Visions of Electronics Manufacturing, Assembly, and Packaging,” EXPO 2000 World Exposition, Hanover, Germany Board of Advisors, Association for Electronics Manufacturing, Society of Manufacturing Engineers (EM/SME) Board of Directors, Surface Mount Technology Association (SMTA) ASME, Outstanding Young Engineer Award, Electrical and Electronics Packaging Division
  • Outstanding Research Award, National Science Foundation, Packaging Research Center
     

Course fee: 500.00 IMAPS Member 600.00 Non Member (Includes Continental Breakfast and Lunch)

May 8, 2008
We will be holding a ½ Day Symposium & Table Top Show

We are presently looking for Technical Presentations in the following Areas:Advanced Technologies, Quality & Reliability, Extreme Environments & Design, Thermal Design. However all other subjects relating to the industry will be considered. Contact Bob Conte if you would like to present a paper. Phone: (631) 586-7600 x263 Email: Bob.Conte@rsm.com

We have a limited number of vendor tables (Approximately 40) available on a first come first served basis. Cost 350.00 before 3/31/08 450.00 after (If any are still available). Contact Steve Lehnert for further information or to reserve a table. Phone (631) 345-3100 Email: slehnert@imaps.org.

We are considering a Golf outing on May 7, 8, or 9. Contact Mike McKeown if interested. Phone: (516) 739-2690 Email: Mike.McKeown@orthodyne.net.

May 9, 2008
Time: 8:00 AM-4:30 PM

A full day presentation on: Hermeticity Testing , RGA and "Near Hermetic" Packaging Concepts

A discussion of the new Hereticity requirements in Mil-Std 750 and potential impact in Mil-Std 883 will be included in this presentation. Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, OLEDs, wafer scale packaging, optoelectronic devices and packaging for Military and Space.In addition, there are a host of medical implants, bio medical devices and emerging nanotechology applications that all require hermetic packages and valid techniques to measure the leak rate. In contrast to a hermetic cavity style package "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to make a package that provides just enough moisture protection to survive in the intended end user environment.This course begins with an overview of hermetic sealing processes. The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs air leak rates, “one way leakers”, virtual leakers will be addressed, along with gross leak testing; bubble, weight gain etc. In each case the focus will be on practical issues facing the industry.The latest techniques for measuring both gross and fine leak testing is Optical Leak Test (OLT). In this method a laser interferometer measures out of plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. For some packages (e.g. MEMS and Opto devices) OLT is the only available viable technique.The ultimate goal is to seal the sensitive microelectronic component in a dry, inert atmosphere to allow reliable functioning of the device over it’s intended lifetime. The gas ambient inside the package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation MEMS/MOEMS and Nanotechnology. Besides moisture what other gases are of concern?

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.In addition to a comprehensive set of course notes each student receives a copy of a "Practical Guide to TM 1014" authored by the Instructor.

Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers,
quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new cavity style packages.

Course fee:
500.00 IMAPS Member
600.00 Non Member
(Includes Continental Breakfast and Lunch)

Contact Steve Lehnert Phone (631) 345-3100 Email slehnert@imaps.org to register

Announcing SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Technical Presentations with invited papers!
  • Tabletop Exhibits!Door Prizes in the Exhibit Area!
  • Lunch included!

Technical Program – This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies.

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com. Online booth registration - http://www.imaps.org/registration/socal2008.htm

Online Complimentary Attendee Registration http://www.imaps.org/chapters/freepass.asp

Further information – Contact:
Salim Akbany at 310-812-0343
Farman Mesdaghi at 310-813-5449
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • Packaging
  • Substrates/Materials
  • Design/Evaluation/Simulation
  • Manufacturing/Process
  • Interconnection
  • Optoelectronics
  • Nano Technologies
  • MEMS
  • Organic Semiconductors
  • Trend/Education/Environmental
  • Application.

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.), K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnections
  • Printed circuit boards, new technologies
  • Large BGA packages
  • Advanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible support
  • Applications: microsystems, power, medical, telecommunication, automotive industries
  • Modelling, simulation
  • Thermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
 
CALL FOR PAPERS 
You are invited to submit an abstract, describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
 
SUBMISSION OF ABSTRACT/PAPER  
Abstracts are solicited to describe original and unpublished work. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, conclusions and important references of the work. All abstracts must be in English and should be submitted using the format provided in the attached word file through the email: icept2008@fudan.edu.cn.

The abstracts must be received by April 11, 2008. Authors must include their affiliation, mailing address, telephone and fax numbers, and email address. Authors will be notified of paper acceptance by April 25, 2008. The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit http://www.icept.org/newweb/cpage.asp.


Products and Publications

Advancing Microelectronics March/April 2008 On-line Magazine is Now Available   ^ Top
The March/April issue of Advancing Microelectronics on Ceramics and MEMS Packaging is now available on-line.
Log-on to access the March/April 2008 issue today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website.

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP)
  • Advancing Microelectronics
  • IMAPS Symposium Proceedings
  • IMAPS Conference Proceedings
  • IMAPS Workshop Presentation Slides
  • Global Business Council Presentations
  • Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords
  • Primary Author
  • Primary Author Company
  • Event / Category
  • Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering Polymers

Oneida Research Services

Global Business Council Spring Conference 2008
March 16-17, 2008
Scottsdale/Fountain Hills, AZ

International Conference and Exhibition on Device Packaging
March 17-20, 2008
Scottsdale/Fountain Hills, AZ
*Exhibitors contact abell@imaps.org

CICMT 2008 -- IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 21-24, 2008
Munich, Germany

ATW and Tabletop Exhibition on Military, Aerospace, Space and Homeland Security (MASH 2008)
4/28/2008 - 4/30/2008

Baltimore, MD
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Advanced Substrates and Next Generation Semiconductors
4/30/2008 - 5/1/2008

Baltimore, MD

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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