Abstracts Due This Friday, May 23, for the New RF and Microwave Packaging Workshop (read
Abstract Deadline This Friday, May 23, for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy (read
Call for Abstracts Now Open for the Advanced Technology Workshop on Thermal Management (read
Program and Registration Now Available for the Advanced Technology Workshop on Wire Bonding (read
listed in chronological order)
TODAY: Cleveland-area May 20 Meeting Featuring Tour of Valtronic Technologies and Presentation on Manufacturing Miniaturized Medical Devices and Sensors (read
This Thursday: Viking Chapter May 22 Spring Networking and Social Event (read
San Diego Chapter Lunch Meeting Next Tuesday, May 27, with Technical Presentation at New StratEdge Facilities (read
SoCal 2008 - June 4 in Los Angeles, California (read
Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert (read
Upstate New York Meeting June 10 Featuring Presentation on Ceramics In Clean Tech and Tour of Infotonics Technology Center (read
IMAPS UK's MicroTech 2008 Program and Registration Now On-line (read
International Conference on Electronics Packaging (ICEP) 2008 (read
Interconex 2008 (Paris) (read
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read
XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read
Abstracts Due Next Friday, May 30, for the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) (read
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read
full Web Calendar)
Abstracts Due This Friday, May 23, for the New RF and Microwave Packaging Workshop ^
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Abstracts are being requested in the following areas:
- 60 GHz Personal Area Network (PAN)
- Short wave IR packaging
- 3D RF/MW
- New and disruptive technology
- EMI shielding for RF/MW packaging
- New power amplifier design beyond LDMOS
- Thermal management
- New IR sensors without cooling
- Plastic RF/MW packaging
- Lead free
- RF MEMS
- High Power Electronics
- Military / Space / Extreme Environments
Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than May 23, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.
Abstract Deadline This Friday, May 23, for the Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy ^
The Advanced Technology Workshop and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy will be held at the Hotel Albuquerque at Old Town, Albuquerque, New Mexico, August 12-14, 2008. This workshop is a continuation of past Alternative Energy and Fuel Cell events and will also focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve new technologies, materials and processes for renewable, non-renewable and innovative application of existing technologies. Incentives for research, investment and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage adoption, research and development of new technologies.
Abstracts are being solicited in the following areas:
- Solar - Photovoltaics
- Fuel Cells
- Alternative Energy
- Batteries and Hybrids
- Other Approaches
- Focus Thermal and Power Management
- Inverter Materials and Design
- Grid and Storage Approaches
- Design for Efficiency
- Materials & Reliability
- Qualification Approaches
- Environmental Regulations
- Government/State Policies and Incentives
Those wishing to present a paper at this workshop, please submit a 250-300 word abstract electronically on/before May 23 , using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (firstname.lastname@example.org) or call 305-382-8433.
No formal technical paper is required. A reproduction-ready one- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on July 18, 2008. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Contact Ann Bell at email@example.com or 202-548-8717 for information about Tabletop exhibits.
Call for Abstracts Now Open for the Advanced Technology Workshop on Thermal Management ^
The Advanced Technology Workshop on Thermal Management is being held October 14-16, 2008, at the Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California. For more information, visit www.imaps.org/thermal.
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutionsto meet current and evolving requirements in computing and wireless/telco systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.
Abstracts are being requested in the following areas:
- Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
- Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing. Metallic, metal matrix and polymer matrix materials.
- High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
- Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
- Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
- Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
- System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
- Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.
- Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
- Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
- Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
Preparation of Abstracts:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 30, 2008. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.
Abstracts must be submitted online at http://www.imaps.org/abstracts.htm.
Questions: contact Jackki Morris-Joyner with questions: firstname.lastname@example.org or 305-382-8433. You may also contact the workshop chairs.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Program and Registration Now Available for the Advanced Technology Workshop on Wire Bonding ^
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. The technical program and registration information is now available on-line. For more information or to register, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008.
This one-day workshop features 3 technical sessions on: Applications and Ultrasonics; Heavy Wire Wedge & Ribbon Bonding; and Stacked Die, Copper, Reliability. To view the full technical program, visit www.imaps.org/wirebonding.
listed in chronological order)
TODAY: Cleveland-area May 20 Meeting Featuring Tour of Valtronic Technologies and Presentation on Manufacturing Miniaturized Medical Devices and Sensors ^
||May 20, 2008
Registration at 5:30 to 5:45
Facility Tour at 5:45 to 6:30
Presentation at 6:30 to 8:00
Beverages and light sandwiches will be available during the presentation
Valtronic Technologies (USA) Inc.
6168 Cochran Road
Solon, Ohio 44139
No Charge for Attendees
You must now register on-site for this event.
Manufacturing Miniaturized Medical Devices and Sensors
Donald Styblo, Vice President of Technology, Valtronic Technologies (USA) Inc.
The presentation will address some of the advanced electronic packaging technology required to manufacture miniaturized medical devices and sensors, including Chip-on Board and Gold-on-Gold Flip Chip technologies. It will discuss many examples of products and how advances in technology have enabled the development of these new devices.
Presenter Bio: Don Styblo
Donald Styblo is the Vice President of Technology at Valtronic Technologies (USA) Inc. (VTUSA)
In 1986, Mr. Styblo co-founded VTUSA. Within three years Valtronic expanded from a small office and lab and built a unique 28,000 square foot Engineering and Production facility complete with a clean room. Today, Valtronic successfully manufactures over 50 different miniaturized electronic subassemblies in medium to high volume quantities. Prior to joining Valtronic, Mr. Styblo was part of Technicare’s original design team for the world's first full-body CT scanner and holds patents on the first full-body scanner. His past experience also includes working for Gould Ocean Systems where he was the lead engineer on the aft-body electronics in the development of the Navy’s MARK 48 ADCAP Torpedo, which is still the Navy’s heavy weight Torpedo after 20 years.
Valtronic Technologies partners with companies for the development and production of entire products, ranging from micro-electronics and mechanical parts to complex systems. We are a turn-key manufacturing partner for industrial, medical and government markets. We are ISO 9001:2000, ISO 13485:2003 certified and RoHS compliant. Over 75% of our manufacturing is dedicated to miniaturized devices and advanced sensors.
Our 25 years combining microelectronics with micromechanics includes developing advanced miniaturized sensors for aerospace and military applications. Recently, Valtronic Technologies has manufactured the pressure sensors for the Boeing 787 Dreamliner (tm) and the Acoustic Array Sensors for Navy Submarines.
Valtronic Technologies employs Chip-on-Board, Flip-Chip, Chip-on-Chip, MCM, MEMS, 3D CSP, Flex Circuit, Flex/Rigid Circuit packaging and Surface Mounted Devices (SMD) as small as 01005 (0.0010" x 0.0005") in size.
This Thursday: Viking Chapter May 22 Spring Networking and Social Event ^
||May 22, 2008
3-6 PM Dual Happy Hours
4-5 PM Lawn Bowling
1110 Nicollet Mall
Minneapolis, MN 55403
IMAPS members - $8.00
Non Members - $12.00
Students - No Charge
First 5 to register are complimentary
Bring a Friend and enter Raffle for $25 Gift Certificate/Door Prize.
Brit’s Pub is located on Nicollet Mall in Downtown Minneapolis. Please join us under the sun and up on the roof for afternoon of Springtime Fun and Cheer. Lawn Bowling is a cross between golf and bowling, with a lot less skill needed to play and a lot more luck needed to be successful.
DIRECTIONS: Brit’s is located between 11th and 12th Streets on Nicollet Mall across from Orchestra Hall.
San Diego Chapter Lunch Meeting Next Tuesday, May 27, with Technical Presentation at New StratEdge Facilities ^
||May 27, 2008
6335 Ferris Square, Suite C
San Diego, CA 92121
$ 5 RSVP'd Members
** Seating is limited, so reserve your seat Now
PROGRAM : ELECTRONIC PACKAGE DESIGN, A BROAD PROSPECTIVE
A discussion of mistakes commonly made in the design of electronic packages and how to avoid them.
StratEdge, founded in 1992, designs, manufactures, and provides test and assembly services for a complete line of high performance semiconductor packages operating from DC to 50+ GHz for the high speed digital (OC-48, OC-192, OC-768), mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters.
Still located in San Diego, California, the new site enables StratEdge to increase capabilities and space for package design, manufacturing, assembly, and test, and to streamline these processes to maximize quality and efficiency.
The new StratEdge facility is located at 6335 Ferris Square, Suite C, San Diego, CA 92121. It contains 12,268 square feet and includes a Class 100 manufacturing area for precision bare die assembly. Besides corporate offices, the plant will house design, manufacturing, assembly, and test for StratEdge's high performance packages that operate at frequencies from DC to over 50 GHz.
ABOUT THE SPEAKER
Jerry Carter, Senior Product Applications Engineer, has worked with electronic materials since 1975. He worked on process development and manufacturing support for all phases of electronic packaging, with an emphasis on thin and thick film materials. He has published numerous technical papers and holds several patents in electronic packaging. He worked for Hughes Aircraft, General Dynamics, Tekform Products, and General Ceramics prior to joining StratEdge in 1993. His educational background includes doctoral studies at University of California at Irvine and he holds a BS in Chemistry from Butler University.
SoCal 2008 - June 4 in Los Angeles, California ^
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition June 4, 2008, from 9:00 am to 4:00 pm.
The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA
- Attendance is Complimentary
- Lunch included
- Door Prizes
Tabletop Exhibits Available
Sample of Exhibitors:
Micropac Industries, Solid State Devices, Sabritec,
International Rectifier, Q-Tech Corp., Antares Advanced Test Technology,
Gel-Pak, Semiconductor Equipment Corp., Crane, Minco Technology Labs,
Calmont Wire & Cable Inc., Astron Electronics, F & K Delvotec Inc.
Contact: Salim Akbany email@example.com or 310-812-0343
This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies
Sample of Topics:
“Determining the Effects of Package Parasitic on SI and EMC Performance”
“Evaluation of DirectFET® Flip Chip Packaging Technology”
“SAE G-19 Counterfeit Electronic Components Committee”
“Thin-Film Technology Using Nichrome”
Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email firstname.lastname@example.org.
Online booth registration - http://www.imaps.org/registration/socal2008.htm
Online Complimentary Attendee Registration – http://www.imaps.org/chapters/freepass.asp
Further information – Contact:
Maurice Lowery, at 310-814-1890 email@example.com
Phil Zulueta at firstname.lastname@example.org
Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert ^
Michael R. Ehlert
Director of Process Engineering
1st Past President of IMAPS
Barry Industries Inc.
60 Walton Street
Attleboro, MA 02703
Phone (949) 929-4933
LTCC - Past Present and Future
This will be a broad overview of LTCC from conception through its growth to the present. We will examine some of the key drivers for its conception, what makes it unique and possible future applications.
LTCC Standards Movement
This will be an up to the minute status report on current work in developing a comprehensive set of standards for all branches of the LTCC supply chain including Fired Properties, Un-Fired Properties and Processing.
A succinct report on what is happening at the highest level including proposed organizational changes and their effect on the society worldwide.
Upstate New York Meeting June 10 Featuring Presentation on Ceramics In Clean Tech and Tour of Infotonics Technology Center ^
||June 10, 2008
3:00 Introduction and welcome
3:15 Presentation and Q & A
4:00 Tour of the Infotonics Technology Center
5:00 Light catered dinner and social/networking
Students - $12
Members - $15
Non-members - $20
Ceramics In Clean Tech
Mr. John Olenick, President of ENrG Inc., www.enrg-inc.com
This presentation will address the use of varying amounts of porosity, to modify membrane and catalysis coating characteristics in fuel cell, gas separation membrane, and insulation packaging applications. These applications differ in the amount of porosity used in the key separation membrane, the yittria-stablized zirconia electrolyte in the fuel cell, the ceramic support structure in gas separation member, and the near total porosity fiber structure of ceramic insulation.
Presenter Bio: John Olenick
Mr. Olenick is a business entrepreneur with 29 years of corporate background in the electronics, ceramics, and energy industry segments. At ENrG, Mr. Olenick is responsible for the strategic planning, funding, and political positioning of the corporation. Having started the corporation in January 2003, he has led the growth to $1.5M with 14 employees. Mr. Olenick is a 1978 graduate of The Pennsylvania State University, and has added to his studies at University of Connecticut and University of Buffalo. He has been a IMAPs member for 24 years and is the current Technical Co-Chair for this year’s International Symposium in Providence, RI.
About ENrG Inc.:
ENrG Incorporated (ENrG) develops and manufactures critical ceramic components for clean energy systems such as fuel cell systems and clean coal technology. The company was started in January 2003 and is currently located in an Economic Development Zone at the Buffalo Free Trade Center. ENrG works with OEMs to design and manufacture ceramic components required for the commercialization of membrane based systems.
About the Infotonics Technology Center (ITC):
ITC is a New York State Center of Excellence in MEMS/NEMS microsystems development, fabrication, and packaging. It provides vertically integrated services from product concept through production in our state-of-the-art facility. ITC supports commercialization of microsystems and chip scale devices that integrate mechanics, optics, fluidics and chemistry on a microelectronics chip. ITC offers a full-range of MEMS-related services under one roof, enabling customers to produce cutting-edge products and devices more efficiently and cost-effectively.
Register on-line by Friday, June 6 at: http://www.imaps.org/registration/ny2008.htm
IMAPS UK's MicroTech 2008 Program and Registration Now On-line ^
IMAPS United Kingdom Chapter is holding MicroTech 2008 June 10-11, 2008, at the Beaumont House Conference Centre in Old Windsor. This Conference and Tabletop Exhibition will focus on Advanced Interconnection and Packaging - Visions of the Future - featuring sessions on: 3D and Wafer Level Integration; Micro-Nano Systems; Advance Packaging; Large Area Electronics; and Market Watch. Visit www.imaps.org.uk to view the full program and to register on-line.
International Conference on Electronics Packaging (ICEP) 2008 ^
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.
Sessions are being planned in the following topical areas:
- PackagingSubstrates/MaterialsDesign/Evaluation/SimulationManufacturing/ProcessInterconnectionOptoelectronicsNano TechnologiesMEMSOrganic SemiconductorsTrend/Education/Environmental
Other subject matter relating to electronics packaging will also be considered
Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)
General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.),
K. Yokouchi (Fujitsu Interconnect Technologies)
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: email@example.com, URL: http://www.jiep.or.jp/icep/
Interconex 2008 (Paris) ^
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:
- Materials and new processes : lead-free, polymers, assembly process, intraconnectionsPrinted circuit boards, new technologiesLarge BGA packagesAdvanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible supportApplications: microsystems, power, medical, telecommunication, automotive industriesModelling, simulationThermal management
- Test, reliability and characterization
For more information, contact:
IMAPS Comité technique
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: firstname.lastname@example.org, URL: http://www.imapsfrance.org
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) ^
ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
Sessions are being planned describing new development in the following themes:
Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.
High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.
Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.
Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.
Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.
Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.
Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.
Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
SUBMISSION OF ABSTRACT/PAPER
The abstract deadline has passed. If you have questions about submitting an abstract, please email: email@example.com.
The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals.
For more information, visit http://www.icept.org/newweb/cpage.asp.
XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.
This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.
The Conference topics will include:
- Hybrid and Semiconductor Technology
- Design Methods and Computer Simulations
- Electronics Materials and Components
- Microcircuits Applications
- Thick-Film and Thin-Film Sensors
- Packaging and PCB
- Quality and Reliability Evaluation
- Thermal Management
- Optoelectronics and Photovoltaics
- Education in Electronics
The Conference presentations will be made in the form of:
- Invited lectures
- Poster sessions for presentation of contributed papers
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl.
If you have any question please do not hesitate to contact us. The address for correspondence:
Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
Abstracts Due Next Friday, May 30, for the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:
- Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
- LED, Solar cell
We are really sure that your presentation will greatly help the Symposium be successful and your internationally recognized expertise in the field will provide all the Symposium participants valuable scientific and technical information on the related area. We would extend a hearty welcome to all speakers in advance for accepting our invitation. Abstracts are now being accepted. Download the abstract form at www.imaps.org/chapter/asia/korea/ISMP2008_Invite.pdf. Abstracts must be sent to IMAPS-Korea by May 30th, 2008. For more information, please contact firstname.lastname@example.org or visit http://www.imapsk.or.kr.
We would also like to ask you to introduce the Symposium to your colleagues. We remember that audience's response was really great to all the presentations of foreign speakers last year. We are sure that the Symposium will be more successful with help of world-wide experts including you.
|Products and Publications
Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! ^
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society. iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:
- Journal of Microelectronics and Electronic Packaging (JMEP) Advancing Microelectronics IMAPS Symposium Proceedings IMAPS Conference Proceedings IMAPS Workshop Presentation Slides Global Business Council Presentations Podcasts (archived web meetings)
- Reference Textbooks
Using iKNOW’s Advanced Search Engine, you can locate papers by:
- Keywords Primary Author Primary Author Company Event / Category Year
- Publication Format
Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.
IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA
ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
*Exhibitors contact email@example.com
ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA
ATW on Thermal Management
October 14-16, 2008
Palo Alto, CA
IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
*Exhibitors contact firstname.lastname@example.org