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May 7, 2008

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   IMAPS EVENTS
Button On-line Registration Closes Tomorrow for the International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008) (read more...)

Button Program and Registration Now Available for the Advanced Technology Workshop on Wire Bonding (read more...)

Button Abstracts Due in 2 Weeks for the New RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Cleveland-area May 20 Meeting Featuring Tour of Valtronic Technologies and Presentation on Manufacturing Miniaturized Medical Devices and Sensors (read more...)

Bullet Viking Chapter May 22 Spring Networking and Social Event (read more...)

Bullet SoCal 2008 - June 4 in Los Angeles, California (read more...)

Bullet Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert (read more...)

Bullet IMAPS UK's MicroTech 2008 Program and Registration Now On-line (read more...)

Bullet International Conference on Electronics Packaging (ICEP) 2008 (read more...)

Bullet Interconex 2008 (Paris) (read more...)

Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (read more...)

Bullet XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Bullet The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30 (read more...)

   PRODUCTS AND PUBLICATIONS
Advancing Microelectronics May/June 2008 On-line Magazine is Now Available (read more...)

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse! (read more...)

IMAPS Events (view full Web Calendar)

On-line Registration Closes Tomorrow for the International Conference and Tabletop Exhibition on High Temperature Electronics (HiTEC 2008)    ^ Top
The International Conference and Tabletop Exhibition on High Temperature Electronics will be held May 13-15, 2008, at Hotel Albuquerque Old Town in Albuquerque, New Mexico. HiTEC 2008 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society (IMAPS), HiTEC 2008 will be the forum for presenting leading high temperature electronics research results and applications requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

On-line registration ends tomorrow, Thursday, May 8. For more information, visit www.imaps.org/hitec.

Program and Registration Now Available for the Advanced Technology Workshop on Wire Bonding   ^ Top
This new ATW organized by IMAPS and SEMI is being held Monday, July 14, 2008, at the Intercontinental Hotel in San Francisco, California. The technical program and registration information is now available on-line. For more information or to register, visit www.imaps.org/wirebonding. The workshop is Co-located with SEMICON West 2008
.

This one-day workshop features 3 technical sessions on: Applications and Ultrasonics; Heavy Wire Wedge & Ribbon Bonding; and Stacked Die, Copper, Reliability. To view the full technical program, visit www.imaps.org/wirebonding.

Abstracts Due In 2 Weeks for the New RF and Microwave Packaging Workshop   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. For more information, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • High Power Electronics
  • Military / Space / Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • MMIC
  • Automotive
  • SIP

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 23, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than July 25, 2008. For more information, visit www.imaps.org/rf.

Chapter Activities (events listed in chronological order)

Cleveland-area May 20 Meeting Featuring Tour of Valtronic Technologies and Presentation on Manufacturing Miniaturized Medical Devices and Sensors   ^ Top

Date: May 20, 2008
Schedule:

Registration at 5:30 to 5:45
Facility Tour at 5:45 to 6:30
Presentation at 6:30 to 8:00
Beverages and light sandwiches will be available during the presentation

Location:

Valtronic Technologies (USA) Inc.
6168 Cochran Road
Solon, Ohio 44139
MAP

Cost:

No Charge for Attendees

Registration:
Please RSVP on-line by Friday, May 16 at: http://www.imaps.org/chapters/freepass.asp

Manufacturing Miniaturized Medical Devices and Sensors
Presented by:
Donald Styblo, Vice President of Technology, Valtronic Technologies (USA) Inc.

The presentation will address some of the advanced electronic packaging technology required to manufacture miniaturized medical devices and sensors, including Chip-on Board and Gold-on-Gold Flip Chip technologies. It will discuss many examples of products and how advances in technology have enabled the development of these new devices.

Presenter Bio:  Don Styblo
Donald Styblo is the Vice President of Technology at Valtronic Technologies (USA) Inc. (VTUSA)

In 1986, Mr. Styblo co-founded VTUSA. Within three years Valtronic expanded from a small office and lab and built a unique 28,000 square foot Engineering and Production facility complete with a clean room. Today, Valtronic successfully manufactures over 50 different miniaturized electronic subassemblies in medium to high volume quantities.  Prior to joining Valtronic, Mr. Styblo was part of Technicare’s original design team for the world's first full-body CT scanner and holds patents on the first full-body scanner. His past experience also includes working for Gould Ocean Systems where he was the lead engineer on the aft-body electronics in the development of the Navy’s MARK 48 ADCAP Torpedo, which is still the Navy’s heavy weight Torpedo after 20 years.

About Valtronic:
Valtronic Technologies partners with companies for the development and production of entire products, ranging from micro-electronics and mechanical parts to complex systems. We are a turn-key manufacturing partner for industrial, medical and government markets. We are ISO 9001:2000, ISO 13485:2003 certified and RoHS compliant. Over 75% of our manufacturing is dedicated to miniaturized devices and advanced sensors.

Our 25 years combining microelectronics with micromechanics includes developing advanced miniaturized sensors for aerospace and military applications. Recently, Valtronic Technologies has manufactured the pressure sensors for the Boeing 787 Dreamliner (tm) and the Acoustic Array Sensors for Navy Submarines.

Valtronic Technologies employs Chip-on-Board, Flip-Chip, Chip-on-Chip, MCM, MEMS, 3D CSP, Flex Circuit, Flex/Rigid Circuit packaging and Surface Mounted Devices (SMD) as small as 01005 (0.0010" x 0.0005") in size.

Viking Chapter May 22 Spring Networking and Social Event    ^ Top

Date: May 22, 2008
Schedule:

3-6 PM Dual Happy Hours
4-5 PM Lawn Bowling

Location:
Brit’s Pub
1110 Nicollet Mall
Minneapolis, MN 55403
612 332-3908
www.Britspub.com
Cost:

IMAPS members - $8.00
Non Members - $12.00

Students - No Charge

First 5 to register are complimentary

Registration:
RSVP to Sue Blankenheim by Monday, May 19
sue@omni-tronics.com
Phone: 763-425-7910
Fax: 763-424-2675

Bring a Friend and enter Raffle for $25 Gift Certificate/Door Prize.

Brit’s Pub is located on Nicollet Mall in Downtown Minneapolis. Please join us under the sun and up on the roof for afternoon of Springtime Fun and Cheer. Lawn Bowling is a cross between golf and bowling, with a lot less skill needed to play and a lot more luck needed to be successful.

DIRECTIONS: Brit’s is located between 11th and 12th Streets on Nicollet Mall across from Orchestra Hall.

SoCal 2008 - June 4 in Los Angeles, California    ^ Top
The IMAPS Southern California Chapters invite you to attend the SoCal’08 Technical Symposium and Tabletop Exhibition
June 4, 2008, from 9:00 am to 4:00 pm.

The Proud Bird
11022 Aviation Blvd.
Los Angeles, CA

  • Attendance is Complimentary
  • Lunch included
  • Door Prizes

Tabletop Exhibits Available
Sample of Exhibitors:
Micropac Industries, Solid State Devices, Sabritec, International Rectifier, Q-Tech Corp., Antares Advanced Test Technology, Gel-Pak, Semiconductor Equipment Corp., Crane, Minco Technology Labs, Calmont Wire & Cable Inc., Astron Electronics, F & K Delvotec Inc.

Technical Program
Papers Invited
Contact:  Salim Akbany salim.akbany@ngc.com or 310-812-0343

This year’s program will feature papers concurrent with the exhibits in the areas of Military, Aerospace, Space and Commercial Microelectronics and Electronics Packaging Technologies

Sample of Topics:
 “Determining the Effects of Package Parasitic on SI and EMC Performance”
“Evaluation of DirectFET® Flip Chip Packaging Technology”
“SAE G-19 Counterfeit Electronic Components Committee”
“Thin-Film Technology Using Nichrome”

Exhibitors – Contact Adrian Black at 310-813-3352, Fax 310-814-7777 or email  adrian.black@ngc.com. Online booth registration - http://www.imaps.org/registration/socal2008.htm

Online Complimentary Attendee Registration http://www.imaps.org/chapters/freepass.asp

Further information – Contact:
Maurice Lowery, at 310-814-1890   maurice.lowery@ngc.com

Phil Zulueta at pzulueta@mail1.jpl.nasa.gov

Florida Chapter June 4 Dinner Meeting with Presentation on LTCC from IMAPS Past-President Mike Ehlert    ^ Top

Date: June 4 , 2008
Schedule:

7:00-9:00 pm

Location:
Holiday Inn Select - Orlando Airport
Registration:
Contact :
Mike Newton, mnewton@harris.com

Speaker:

Michael R. Ehlert
Director of Process Engineering
1st Past President of IMAPS

Barry Industries Inc.
60 Walton Street
Attleboro, MA 02703
Phone (949) 929-4933
mike.ehlert@barryind.com

LTCC - Past Present and Future

This will be a broad overview of LTCC from conception through its growth to the present.  We will examine some of the key drivers for its conception, what makes it unique and possible future applications.

LTCC Standards Movement

This will be an up to the minute status report on current work in developing a comprehensive set of standards for all branches of the LTCC supply chain including Fired Properties, Un-Fired Properties and Processing.

IMAPS Initiatives
A succinct report on what is happening at the highest level including proposed organizational changes and their effect on the society worldwide.

IMAPS UK's MicroTech 2008 Program and Registration Now On-line    ^ Top
IMAPS United Kingdom Chapter is holding MicroTech 2008 June 10-11, 2008, at the Beaumont House Conference Centre in Old Windsor. This Conference and Tabletop Exhibition will focus on Advanced Interconnection and Packaging - Visions of the Future - featuring sessions on: 3D and Wafer Level Integration; Micro-Nano Systems; Advance Packaging; Large Area Electronics; and Market Watch. Visit www.imaps.org.uk to view the full program and to register on-line.

International Conference on Electronics Packaging (ICEP) 2008    ^ Top
ICEP 2008 will be held June 10-12, 2008, at Tokyo Big Sight in Tokyo, Japan. The conference is sponsored by JIEP (IMAPS Japan), IEEE CPMT Society Japan Chapter and supported by IMAPS Asia-ALC.

Sessions are being planned in the following topical areas:

  • PackagingSubstrates/MaterialsDesign/Evaluation/SimulationManufacturing/ProcessInterconnectionOptoelectronicsNano TechnologiesMEMSOrganic SemiconductorsTrend/Education/Environmental
  • Application.

Other subject matter relating to electronics packaging will also be considered

Registration Fee:

Speakers: 40,000 yen (Including Reception and Proceedings)
Students: 5,000 yen (Including Proceedings)

Organizing Committee:

General Chair: H. Asai (Toshiba)
Vice General Chair: H. Nishida (NEP Tech.),
K. Yokouchi (Fujitsu Interconnect Technologies)

Contact:
Secretariat of ICEP 2008
JIEP (IMAPS Japan)
(Japan Institute of Electronics Packaging)
E-mail: imaps-j@jiep.or.jp, URL: http://www.jiep.or.jp/icep/

Interconex 2008 (Paris)    ^ Top
Interconex 2008 will be held June 24-25, 2008, at Centre de Congrès de la Villette, in Paris, France. The conference is sponsored by IMAPS France. Papers were accepted in the following topical areas and the technical sessions will address many of the following subjects:

  • Materials and new processes : lead-free, polymers, assembly process, intraconnectionsPrinted circuit boards, new technologiesLarge BGA packagesAdvanced Packaging and interconnection technologies: SiP, 3D packaging, wafer level Packaging...Electronics on flexible supportApplications: microsystems, power, medical, telecommunication, automotive industriesModelling, simulationThermal management
  • Test, reliability and characterization

For more information, contact:
IMAPS Comité technique
Florence Vireton
Tel : + 33 (0) 1 39 67 17 73
Fax : +33 (0) 1 39 02 71 93
E-mail: imaps.france@imapsfrance.org, URL: http://www.imapsfrance.org

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
 
TECHNICAL PROGRAM:  
Sessions are being planned describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

IMPORTANT DATES
April 11, 2008 - Submission of Abstract
April 25, 2008 - Notification of Acceptance
June 20, 2008 - Submission of Manuscript
 
SUBMISSION OF ABSTRACT/PAPER  
The abstract deadline has passed. If you have questions about submitting an abstract, please email: icept2008@fudan.edu.cn.

Authors will be notified of paper acceptance by April 25, 2008. The final manuscript for publication in the conference proceedings is due by June 20, 2008. Selected papers will be recommended for publication in IEEE/CPMT journals. 

For more information, visit http://www.icept.org/newweb/cpage.asp.

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference    ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.

The Conference topics will include:

  • Hybrid and Semiconductor Technology
  • Design Methods and Computer Simulations
  • Electronics Materials and Components
  • Microcircuits Applications
  • Thick-Film and Thin-Film Sensors
  • Packaging and PCB
  • Quality and Reliability Evaluation
  • Thermal Management
  • Optoelectronics and Photovoltaics
  • Education in Electronics

The Conference presentations will be made in the form of:

  • Invited lectures
  • Poster sessions for presentation of contributed papers

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl.

If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
E-mail:  imaps2008@imio.pw.edu.pl

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

The 7th International Symposium on Microelectronics and Packaging (ISMP 2008) - Abstracts Due May 30    ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:

  1. Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
  2. LED, Solar cell

We are really sure that your presentation will greatly help the Symposium be successful and your internationally recognized expertise in the field will provide all the Symposium participants valuable scientific and technical information on the related area. We would extend a hearty welcome to all speakers in advance for accepting our invitation. Abstracts are now being accepted. Download the abstract form at www.imaps.org/chapter/asia/korea/ISMP2008_Invite.pdf. Abstracts must be sent to IMAPS-Korea by May 30th, 2008. For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr.

We would also like to ask you to introduce the Symposium to your colleagues. We remember that audience's response was really great to all the presentations of foreign speakers last year. We are sure that the Symposium will be more successful with help of world-wide experts including you.

Products and Publications

Advancing Microelectronics MayJune 2008 On-line Magazine is Now Available   ^ Top
The May/June issue of Advancing Microelectronics on Military, Aerospace and International Technology is now available on-line.
Log-on to access the May/June 2008 issue today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website.

Thousands of Technical Papers Available for Quick Download all at the Click of Your Mouse!    ^ Top
IMAPS on-line library, iKNOW Microelectronics, provides a centralized, searchable database of the technical papers and slides from IMAPS events and publications offered by the Society.
iKNOW Microelectronics currently contains more than 2,700 articles and publications from symposia, conferences, workshops, web meetings and other publications from 2003 through 2008. IMAPS will continue to incrementally load additional historical publications from 2002 and earlier throughout 2008. iKNOW Microelectronics contains the following publications in a Downloadable, CD-rom and/or Printed format:

  • Journal of Microelectronics and Electronic Packaging (JMEP) Advancing Microelectronics IMAPS Symposium Proceedings IMAPS Conference Proceedings IMAPS Workshop Presentation Slides Global Business Council Presentations Podcasts (archived web meetings)
  • Reference Textbooks

Using iKNOW’s Advanced Search Engine, you can locate papers by:

  • Keywords Primary Author Primary Author Company Event / Category Year
  • Publication Format

Expand your knowledge and research abilities today! Log-on to iKNOW Microelectronics today at www.imaps.org/imapsstore.

 

Ticona Engineering PolymersOneida Research Services

HiTEC 2008 -- International Conference on High Temperature Electronics
May 13-15, 2008
Albuquerque, NM
*Exhibitors contact abell@imaps.org

IMAPS/SEMI ATW on Wire Bonding
July 14, 2008
San Francisco, CA

ATW and Tabletop Exhibition on Photovoltaics, Fuel Cells and other Emerging Technologies in the Development of Alternative Energy
August 12-14, 2008
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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