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November 18, 2008

Draper Laboratory

Button Abstracts Due This Friday for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications (read more...)

Button This Friday: Abstracts Due for the IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009) (read more...)

Button Device Packaging 2009 - Abstracts Due December 5 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet THIS THURSDAY: Benelux Chapter Autumn Event on MEMS Packaging, Integration and Applications (read more...)

Bullet Northern California Chapter December 3 Lunch Meeting on Sensual Packaging (read more...)

Bullet UK Chapter's Basic Packaging Workshop on December 4 (read more...)

Bullet Metro Chapter December 4 Holiday Party (read more...)

Bullet Arizona Chapter December 11 Tabletop Exhibit and Lunch Meeting on Materials Challenges for High Density Microprocessor Packaging (read more...)

Bullet IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) (read more...)

Bullet IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management (read more...)

Bullet IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

Journal of Microelectronics and Electronic Packaging 3rd Quarter 2008 Edition is Available On-line (read more...)

AI Technology

IMAPS Events (view full Web Calendar)

Abstracts Due This Friday for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications   ^ Top
This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. For more information, visit

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 21, 2008, using the on-line submittal form at: Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 23, 2009.

Please contact Jackki Morris-Joyner by email at or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Contact Ann Bell at or 202-548-8717 for information about Tabletop exhibits.

This Friday: Abstracts Due for the IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009)   ^ Top
The 5th CICMT Conference is being held April 20-23, 2009, at The Curtis Hotel in Denver, Colorado. For more information, visit
Abstracts must be submitted electronically no later than this Friday, November 21, 2008, using the on-line submittal form at:

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Energy and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials
• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics

Markets and Applications
• Automotive
• Aerospace
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• Green Tape Manufacturing
• Multilayer Ceramics
- Via and Pattern Generation
- Metallization Processes
- Lamination
- Binder Burnout and Co-Firing
• Laser trimming and deposition
• Advanced Thick Film Processing
• Fine Structuring Technologies
• Rapid Prototyping
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction

Please send your 250-300 word abstract electronically only by November 21, 2008, using the on-line submittal form at: All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner or call 1-305-382-8433 (USA).

Device Packaging 2009 - Abstracts Due December 5   ^ Top
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit

The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Chip Scale Packaging; Electronics Packaging for Biomedical Devices; and Packaging and Application of Power LED Devices (new in 2009)

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than Friday, December 5, 2008, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at or by phone at 202-548-8717. Less than 20 booths are available at this time and hall is expected to sell out soon.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than this December 5, 2008.

Chapter Activities (events listed in chronological order)

THIS THURSDAY: Benelux Chapter Autumn Event on MEMS Packaging, Integration and Applications    ^ Top

Thursday, November 20th, 2008


Holst Centre
High Tech Campus 31
The Netherlands



9.00        Registration, coffee, exhibition

9.30        Welcome by the chairman

Fred Roozeboom, NXP Research and TU/e, NL

9.35        Introduction to the Holst Centre

Jaap Lombaers, Holst Centre, NL

9.40            iPill: Design considerations of an electronic pill for drug delivery

Frits Dijksman, Philips Research, NL

10.10          “SoC or SiP ?” : Impact on Test and Packaging
Appo van der Wiel, Melexis, BE

10.40      Coffee, exhibition

11.10      Next generation Lab-on-a-Chip systems: cells, proteins and direct sensing

Edwin Carlen and Albert van den Berg, University of Twente and MESA+, NL

11.40      Packaging issues for variable-focus liquid lenses

Stein Kuiper, Philips Research, NL

12.10      Hand-held diagnostics platform with short test time

Joost Maast, Philips Applied Technologies, NL

12.40      Lunch, exhibition – Holst tour

13.45      MEMS packaging using 3D-Si integration approaches

Anne Jourdain and Eric Beyne, IMEC, BE

14.15      Inkjet printing for semiconductor applications

Peter Briër, PixDro BV , NL

14.45      Coffee, exhibition

15.15      Packaging aspects for MEMS based energy harvesters

Rob van Schaijk and Ruud Vullers, IMEC-NL, NL

15.45      MEMS oscillators for timing applications

Joost van Beek, NXP Semiconductors, NL

16.15      Informal meeting – drinks will be served

17.00      Closing


More info & registration

Register On-line

Or Contact:

Katrien Vanneste, ELIS-CMST, Gent University                 
Technologiepark 914A, B-9052 Zwijnaarde 
Tel: +32 (0) 9 264 5350
FAX: +32 (0) 9 264 5374                                                             
E-mail :

Northern California Chapter December 3 Lunch Meeting on Sensual Packaging    ^ Top

Date: December 3, 2008

11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation


Ramada Inn
1217 Wildwood Avenue
Sunnyvale, CA 94089


Members/General $20.00
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.

Sensual Packaging – Packaging Technology that excites our senses
Speaker: Srinivas T. Rao, Flextronics

With consumer electronics, meeting performance objectives is a requirement for entry but is no guarantee for success in the market place. Market acceptance and commercial success is driven often by intangibles that are easy to spot only after the fact. The make or break success is largely associated with final packaging. For mobile microelectronic products such as MP3 players, PDAs, cell phones and laptops the language of success is fashion; soft, sleek, sexy, ‘living’, glossy, hard, cold, green are the list of attributes. It is all about Sensual Packaging – Packaging Technology that excites our senses.

The press release in September from HP titled “The first-ever HP digital clutch to debut on Fashion Week runway” probably communicates the trend in consumer electronics. This presentation shares examples of product success, reviews technologies and mix to deliver ‘feelings’ expressed by the Industrial Designer to meet the mood of the consumer on ‘fashion’ and ‘green’ appeal. Value creation centered on Sensual packaging with methods that enhance touch, color, light, smell, and are environmentally compelling will be illustrated.

Srinivas Rao is vice president of Corporate Technology at Flextronics leading the initiative on Advanced Materials. He has held executive and senior technology positions as CEO and CTO of Molecular Nanosystems Inc., vice president of technology at Solectron Corporation, and held technology management and research positions at Raychem Corporation, Eastman Kodak Research Laboratories and RCA Laboratories. Dr. Rao’s technical background and expertise is in materials science, microelectronics and fabrication, electronic packaging, second level and system level assembly, and nanotechnology. Dr. Rao is a Distinguished Alumnus of Indian Institute of Technology Madras, and holds master’s and doctorate degrees in metallurgy and materials science from the Stevens Institute of Technology. He has served on the distinguished Blue Ribbon Task Force on Nanotechnology (2005) for the state of California, is recipient of RCAs “Outstanding Achievement Award, “Engineer of the Year” award in 2000 conferred by EP&P and the STAR Award (2004) for his services rendered to the Asian American community in Santa Clara County in California.

UK Chapter's Basic Packaging Workshop on December 4    ^ Top

Date: December 4, 2008
Hosted by: 
UNISEM, South Wales - NP11  3XT


Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat

To book for this event, please complete the booking form and return to the IMAPS-UK Secretariat fax +44 1522 575212 e-mail

Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.

An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:

  • Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
  • Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.  
  • Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking. 
  • Test verification & Reliability looking at pull/Shear test equipment and general Package testing.

There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.


9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
            a) Market briefing – Andy Longford, PandA Europe
            b) Package technology trends and developments.  -  UNISEM
11.00 – 12.00 Session 2 - Mounting Die
            a) Die prep – John Sweet,  LOADPOINT
            b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
Lunch break
1.30 – 2.30 Session 3 - Die Interconnection
            a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
            b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
            a) pull/Shear test equipment -  Dr Stephen Clark, DAGE
            b) Package testing. – Iain Gardiner, WAFERDATA

Metro Chapter December 4 Holiday Party    ^ Top

Date: December 4 , 2008

6:00 – 10:00 pm

Holiday Inn Ronkonkoma
Click here for Directions

Complimentary to both current Metro Chapter members AND any IMAPS members that have paid to attend any Metro Chapter event in the past 18 months.

$30.00 for guests and non-chapter IMAPS members that have not attended a Metro event in the past 18 months.

$60.00 for all others. Not a current IMAPS member? Join or renew prior to November 30, 2008 and receive the member price. Join/renew at


For reservations, send an email to: Please include your IMAPS membership number.

If you would like to contribute a door prize, please contact Steve Lehnert at 631-379-8239 or e-mail to

Program features a dinner buffet, prize drawings, 50/50 drawing, and open bar. Come out and socialize with all your friends and meet industry colleagues.

Arizona Chapter December 11 Tabletop Exhibit and Lunch Meeting on Materials Challenges for High Density Microprocessor Packaging    ^ Top

Date: December 11, 2008

Registration and Lunch at 11:30 – 12:00
Presentation at 12:00 – 1:00


Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Road
Mesa AZ 85202


Luncheon and presentation - $10.00 !!!
Special - No Charge for pre-registered attendees!!!

RSVP by 9 December 2008 at our website or e-mail: /

Vendor display tables available for $15.00

Materials Challenges for High Density Microprocessor Packaging
Presented by:
Dr. Gans Ganesan
Principal Engineer Assembly and Test Technology Development
Intel Corporation

The continual increase in performance/cost of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies that are being pursued. Material needs for high thermal dissipation, distortion-free high-speed signaling, efficient power delivery, and high-density interconnects are discussed. The current environment also drives the need for multiple chip integration on high density substrates. There is need for “Green” packaging which places significant challenges and opportunities for new innovation in packaging materials development. Advances made by the packaging industry are critical to the continuation of Moore's Law and driving more capability into less space. Further scaling will require new advances in material technologies, and packaging materials must continue to adapt to ensure that the silicon functions properly. This presentation highlights the challenges associated with first level interconnect (chip-to-organic substrate) materials, package thermal interface materials, and second level interconnect (package to system board).

Presenter Bio:

Gans Ganesan received his Bachelor of Engineering from University of Madras, India, Master of Engineering (Distinction) in Mechanical Engineering from Indian Institute of Science, Bangalore, India and a PhD in Materials Science and Engineering from the University of Arizona, Tucson. He is currently employed as Principal Engineer at Intel Corporation in Chandler, Arizona. Before this assignment, he was with Motorola Semiconductor Products sector for 12 years as member of technical staff where he contributed in the various areas of high density packaging and test technologies and 4 years as Associate Research Scientist at CALCE center at the University of Maryland during which he conducted research in the areas of lead-free electronics, low temperature electronics and sensors and MEMS. He has over 20 publications in peer reviewed journals, holds 3 US patents issued and three International applications and has edited a book on Lead-free Electronics. He is a senior member of IEEE.

IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08)    ^ Top

Date: December 15-18, 2008

December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition

JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India

1. Conference:
General - Rs 3500/$350
IMAPS [India Chapter] Members - Rs 2500
Students - Rs 1000
Authors - Rs 2500 / $250

2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000

Time Table:
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference

Micro Systems : Design to Manufacturing


Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email ( immediately. For more information, visit

Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.

IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management    ^ Top
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.

In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas: 
  • Cooling for microelectronics packaging
  • Microcooling solutions
  • Heat condcutive materials
  • Chip, board and system thermal management
  • Thermal modelisation and simulation
  • Heatsinks, heatpipes and other cooling products
  • Liquid and phase change cooling
  • New cooling solutions
  • Experience return (products and systems cooling, power electronics, automotive, transport,...)
  • Thermal management of opto electronics components  

Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit or contact Florence Vireton at

IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging    ^ Top
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh.  The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics.  Papers from industry are especially important.  Industry papers may have product content but must not be commercial.  Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.

Please submit your Abstract to the Secretariat of IMAPS-UK ( no later than 31st October 2008.  We will notify authors of the selection of papers no later than 30th November

The Call for Papers and other information are available at

Prof Nihal Sinnadurai
Conference Chair MicroTech 2009

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at

Products and Publications

Journal of Microelectronics and Electronic Packaging 3rd Quarter 2008 Edition is Available On-line   ^ Top
The Third Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line.
Access the Journal papers on-line .

This issue contains the following papers:

The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.

As in the past, this publication is available to all IMAPS members via web access (, and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).


CAD Design Software

Oneida Research Services

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ

*Exhibitors contact

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact

ATW on Automotive Microelectronics and Packaging
May 11-14, 2009
Dearborn, MI

^ Top

Compex Corp


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