Device Packaging 2009 - Abstracts Due December 5 ^
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than Friday, December 5, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at firstname.lastname@example.org or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at email@example.com or by phone at 202-548-8717. Less than 20 booths are available at this time and hall is expected to sell out soon.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at firstname.lastname@example.org later than this December 5, 2008.
Tabletop Exhibits Now Available for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications^
Top This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. For more information, visit www.imaps.org/printed.
The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
Digital Printing / Deposition Technologies
Nanomaterials, inks & epoxies
Printed devices – Active and passive
Thin & printable battery technology
Membrane and capacitive switches
Novel die interconnect
Paper based, PET & PVC substrate media
Printable display & lighting
Design, Simulation and Modeling
Applications and new markets
Convergence of Graphics & electronics
A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at email@example.com or 202-548-8717 for information about Tabletop exhibits.
IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009) - Tabletop Exhibits Now Available ^
Top The 5th CICMT Conference is being held April 20-23, 2009, at The Curtis Hotel in Denver, Colorado. For more information, visit www.cicmt.org.
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.
CICMT 2009 will again feature a focused exhibition with a limited number of tabletops for suppliers who support the use
of the technologies. To view information about this exhibition, or to reserve your booth(s), visit www.cicmt.org. You may also contact Ann Bell at firstname.lastname@example.org or 202-548-8717 for information about Tabletop exhibits.
listed in chronological order)
Northern California Chapter December 3 Lunch Meeting on Sensual Packaging ^
1217 Wildwood Avenue
Sunnyvale, CA 94089
Students (with ID) $10.00
Price includes lunch and program. Please email Gina Love at email@example.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.
Sensual Packaging – Packaging Technology that excites our senses Speaker: Srinivas T. Rao, Flextronics
With consumer electronics, meeting performance objectives is a requirement for entry but is no guarantee for success in the market place. Market acceptance and commercial success is driven often by intangibles that are easy to spot only after the fact. The make or break success is largely associated with final packaging. For mobile microelectronic products such as MP3 players, PDAs, cell phones and laptops the language of success is fashion; soft, sleek, sexy, ‘living’, glossy, hard, cold, green are the list of attributes. It is all about Sensual Packaging – Packaging Technology that excites our senses.
The press release in September from HP titled “The first-ever HP digital clutch to debut on Fashion Week runway” probably communicates the trend in consumer electronics. This presentation shares examples of product success, reviews technologies and mix to deliver ‘feelings’ expressed by the Industrial Designer to meet the mood of the consumer on ‘fashion’ and ‘green’ appeal. Value creation centered on Sensual packaging with methods that enhance touch, color, light, smell, and are environmentally compelling will be illustrated.
Srinivas Rao is vice president of Corporate Technology at Flextronics leading the initiative on Advanced Materials. He has held executive and senior technology positions as CEO and CTO of Molecular Nanosystems Inc., vice president of technology at Solectron Corporation, and held technology management and research positions at Raychem Corporation, Eastman Kodak Research Laboratories and RCA Laboratories. Dr. Rao’s technical background and expertise is in materials science, microelectronics and fabrication, electronic packaging, second level and system level assembly, and nanotechnology. Dr. Rao is a Distinguished Alumnus of Indian Institute of Technology Madras, and holds master’s and doctorate degrees in metallurgy and materials science from the Stevens Institute of Technology. He has served on the distinguished Blue Ribbon Task Force on Nanotechnology (2005) for the state of California, is recipient of RCAs “Outstanding Achievement Award, “Engineer of the Year” award in 2000 conferred by EP&P and the STAR Award (2004) for his services rendered to the Asian American community in Santa Clara County in California.
UK Chapter's Basic Packaging Workshop on December 4 ^
December 4, 2008
UNISEM, South Wales - NP11 3XT
Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat
Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.
An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:
Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.
Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking.
Test verification & Reliability looking at pull/Shear test equipment and general Package testing.
There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.
9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
a) Market briefing – Andy Longford, PandA Europe
b) Package technology trends and developments. - UNISEM
11.00 – 12.00 Session 2 - Mounting Die
a) Die prep – John Sweet, LOADPOINT
b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
1.30 – 2.30 Session 3 - Die Interconnection
a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
a) pull/Shear test equipment - Dr Stephen Clark, DAGE
b) Package testing. – Iain Gardiner, WAFERDATA
Materials Challenges for High Density Microprocessor Packaging
Dr. Gans Ganesan
Principal Engineer Assembly and Test Technology Development
The continual increase in performance/cost of microelectronics products places a high demand on packaging technologies. This presentation will discuss the current environment, challenges, and technologies that are being pursued. Material needs for high thermal dissipation, distortion-free high-speed signaling, efficient power delivery, and high-density interconnects are discussed. The current environment also drives the need for multiple chip integration on high density substrates. There is need for “Green” packaging which places significant challenges and opportunities for new innovation in packaging materials development. Advances made by the packaging industry are critical to the continuation of Moore's Law and driving more capability into less space. Further scaling will require new advances in material technologies, and packaging materials must continue to adapt to ensure that the silicon functions properly. This presentation highlights the challenges associated with first level interconnect (chip-to-organic substrate) materials, package thermal interface materials, and second level interconnect (package to system board).
Gans Ganesan received his Bachelor of Engineering from University of Madras, India, Master of Engineering (Distinction) in Mechanical Engineering from Indian Institute of Science, Bangalore, India and a PhD in Materials Science and Engineering from the University of Arizona, Tucson. He is currently employed as Principal Engineer at Intel Corporation in Chandler, Arizona. Before this assignment, he was with Motorola Semiconductor Products sector for 12 years as member of technical staff where he contributed in the various areas of high density packaging and test technologies and 4 years as Associate Research Scientist at CALCE center at the University of Maryland during which he conducted research in the areas of lead-free electronics, low temperature electronics and sensors and MEMS. He has over 20 publications in peer reviewed journals, holds 3 US patents issued and three International applications and has edited a book on Lead-free Electronics. He is a senior member of IEEE.
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (firstname.lastname@example.org) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management Technical Program Now Available ^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle.
The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components.
A CD Rom including the presentations will be distributed to the attendees only.
International Microelectronics And Packaging Society France
49 rue Lamartine 78035 Versailles
Tel : + 33 (0) 1 39 67 17 73/ Fax : + 33 (0) 1 39 02 71 93 E-mail :
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (email@example.com) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
INTERCONEX 2009 Technical Abstracts Now Being Accepted ^
April 7-8, 2009
Congress Centre of La Villette
Within INTERCONEX 2009, the technical committee proposes the following topics:
Packaging & Application of Power LED Devices
Packaging and reliability challenges of high pin count circuits
A one day technical workshop on:
Microelectronics and packaging for medical and healthcare applications
Technical conferences on the following subjects:
Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
Flip-chip (substrates and board technologies),
Reliability, thermal management,
Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
Modelling, simulation & design, ….
Characterization & test,
Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
Systems (optic, photonic, harsh environment, …)
We kindly ask you to send us your proposals with one page abstract word size before January 31, 2009. You may submit your abstract via email - firstname.lastname@example.org. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Products and Publications
Journal of Microelectronics and Electronic Packaging 3rd Quarter 2008 Edition is Available On-line^
Top The Third Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line. Access the Journal papers on-line .
The International Microelectronics and Packaging Society (IMAPS) is committed to the timely publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).
IMAPS 2008 Symposium Proceedings Now Available For Purchase On-line^
Top The CD-Rom of Proceedings from the 2008 International Symposium on Microelectronics (IMAPS 2008) is now available for purchase on-line. The Conference was held November 2-6, 2008, at the Rhode Island Convention Center, Providence, Rhode Island, USA. This symposium featured more than 180 papers in 30 sessions addressing 7 technical tracks on: Industry Focused Sessions; Systems/Design; Materials; Reliability; Advanced Technologies; Signal Integrity; and Packaging Processes. The CD-Rom is available for $200 for members and $300 for non-members (shipping additional). For more information or to order on-line, visit http://www.imaps.org/imapsstore/detail.aspx?ID=3327.