IMAPS 2008, Providence, Rhode Island - Expand Your Training with this year's Professional Development Courses ^
IMAPS 2008, the 41st International Symposium on Microelectronics, returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence. Learn more about IMAPS 2008 and register on-line at www.imaps2008.org.
19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community. So please be sure to choose from the 19 in-depth Professional Development Courses taught by recognized industry experts. You will discover the following key ways that will benefit you.
The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.
IMAPS 2008 Global Business Council's (GBC) Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends^
This year's GBC Marketing Forum will be held during IMAPS 2008, the 41st International Symposium on Microelectronics, November 2-6 at the Rhode Island Convention Center in Providence. The Marketing Forum will run Wednesday, November 5, 2008, from 5:30 pm - 6:45 pm.
Chairs: Howard Imhof, Metalor Technologies USA and Arne Knudsen, Kyocera America, Inc.
This GBC-Marketing Forum is a business session for all IMAPS 2008 attendees who wish to participate. A Networking Reception will follow from 6:50 pm to 7:30 pm.Pre-registration is strongly recommended in order to plan the reception. You must register on-line.
PV Industry and the Challenges of Rapid Growth
Mr. Richard Chleboski, Strategic Marketing Vice President, Evergreen Solar
Mr. Chleboski will provide an overview of the solar power industry. The talk will provide a brief overview of the industry’s history, its recent rapid growth and future opportunities. Particular focus will be on the supply chain challenges for an industry that has been growing over 50% annually and what challenges the industry faces to achieve parity with grid power.
Mr. Chleboski co-founded Evergreen Solar in 1994. He has served in many leadership positions since then. Previously, he worked at Mobil Solar Energy Corporation for seven years where he was the Strategic Planner focusing on developing long-range business plans working with strategic partners. He also served as a Process Engineer responsible for the operation of Mobil Solar’s manufacturing line. Mr. Chleboski received a B.S. in Electrical Engineering from the Massachusetts Institute of Technology and an M.B.A. from Boston College.
About Evergreen Solar Inc.
Evergreen Solar Inc. is a global innovation leader in developing, manufacturing and marketing photovoltaic modules – the engines of solar electric systems. The company is recognized as one of the brightest rising stars in the solar industry. Evergreen produces solar panels using the company’s proprietary crystalline silicon technology, known as String Ribbon™. For more information, see www.evergreensolar.com.
Policies and Incentives to Develop the Solar Industry
Ms. Cecilia Aguillon, Director, Business Development and Government Relations, Kyocera Solar, Inc.
Ms. Aguillon will speak about the roles of government and the private sector in encouraging the growth of solar energy markets in Asia, Europe, and North America. The presentation will describe policy tools used to create incentive programs that are attracting investment, technology improvements, cost reductions, and how the solar markets are being shaped by those policies.
Cecilia Aguillon works with local, state, and federal governments across the United States, Canada, and Mexico on designing and implementing solar energy policies to create robust and sustainable solar markets. She also works with Solar Energy Industry Association Chapters in several states to develop sustainable solar markets. Cecilia graduated with a Master’s Degree in International Relations/Pacific Studies from the University of California, San Diego, in 1998.
About Kyocera Solar, Inc.
Kyocera Solar, Inc. serves the widely varying needs of customers for distributed solar electricity through two major market channels. Industrial customers (such as original equipment manufacturers, government organizations, utilities, corporate clients and institutions) are served directly with fully integrated system packages. KSI also serves a global network of Authorized Distributors and Dealers with components, packaged systems, engineering, technical support, and project management. The Company’s expertise is based upon designing, manufacturing, and installing the most technologically advanced solar electric power systems available today. For more information, see kyocerasolar.com.
Call for Abstracts for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications^
Top This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. For more information, visit www.imaps.org/printed.
The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.
Digital Printing / Deposition Technologies
Nanomaterials, inks & epoxies
Printed devices – Active and passive
Thin & printable battery technology
Membrane and capacitive switches
Novel die interconnect
Paper based, PET & PVC substrate media
Printable display & lighting
Design, Simulation and Modeling
Applications and new markets
Convergence of Graphics & electronics
Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 21, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 23, 2009.
Please contact Jackki Morris-Joyner by email at firstname.lastname@example.org or by phone at 202-548-4001 if you have questions.
All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
Contact Ann Bell at email@example.com or 202-548-8717 for information about Tabletop exhibits.
listed in chronological order)
7th International Symposium on Microelectronics and Packaging (ISMP 2008) Begins Tomorrow ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:
1:30: First Presentation, Scott Morris, RF Micro Devices
“Conformal Shielding on Multichip Modules”
2:00: Second Presentation, George Sears of Lord Corporation
"Technology Innovations Applied to Wafer-Level Encapsulants and Thermal Interface Materials”
2:30: Facility Tour of Lord Corporation
3:15: Refreshment Break, Sponsored by Lord Corporation
3:30: Third Presentation, Chet Balut of DuPont Electronic Technologies
"Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating"
4:00: Fourth Presentation, Dr. David Seeger, Semiconductor Research Corporation
"Presentation title is TBD"
Compile possible dates, locations, speakers, topics, and volunteers for next event.
IMAPS Taiwan Co-Organizing the 3rd IMPACT & 10th EMAP Joint Conference ^
The IMAPS Taiwan Chapter is co-organizing the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The joint conferences are being held October 22-24, 2008, at the Taipei Nangang Exhibition Hall, in Taipei, Taiwan.
Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry.
Organized by IMAPS-Taiwan, IEEE CPMT-Taipei, ITRI, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a “Creative Collaboration, More Than Packaging” program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (firstname.lastname@example.org) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging
Heat condcutive materials
Chip, board and system thermal management
Thermal modelisation and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at email@example.com.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (firstname.lastname@example.org) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.