IMAPS 2008, Providence, Rhode Island - On-line Registration Ends Next Wednesday, October 29 ^
IMAPS 2008, the 41st International Symposium on Microelectronics, returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence. Learn more about IMAPS 2008 and register on-line before next Wednesday at www.imaps2008.org.
The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.
Don't Miss IMAPS 2008 Keynote Presentations by Rhode Island Governor Carcieri and Vice President of Raytheon, Dr. Zolper ^
The 41st International Symposium on Microelectronics, being held November 2-6 at the Rhode Island Convention Center in Providence, will feature two world renown keynote presentations. All IMAPS 2008 registrants are invited to attend these outstanding presentations. Dr. John C. Zolper, Raytheon Company, will give his keynote address on Tuesday, November 4, 2008, at 12:00 PM. The Honorable Donald L. Carcieri, will give his keynote address on Wednesday, November 5, 2008, at 11:45 AM.
Tuesday, November 4, 2008 12:00 PM
Dr. John C. Zolper, Raytheon Company
Dr. John C. Zolper is Vice President of Corporate Research & Development and is Deputy for Corporate Technology and Research for Raytheon Company. He has been with the company since December 2007.
Raytheon Company, with 2007 sales of $21.3 billion, is an industry leader in defense and government electronics, space, information technology, and technical services. Headquartered in Waltham, MA, Raytheon employs 72,000 people worldwide.
Dr. Zolper is responsible for working with Ms. Heidi Shyu, Corporate Vice President of Technology and Research, on the development and execution of an integrated enterprise-wide technology and research vision and strategy. He is a participant on the Engineering & Technology Council as well as Deputy Chair of the Technology Leadership Team.
Prior to his current position, Dr. Zolper was Director of the Microsystems Technology Office (MTO) at the Defense Advanced Research Projects Agency (DARPA). He was responsible for strategic planning and execution of a portfolio of over 75 research programs with an annual budget over $400M covering all areas of advanced component technology including electronics, photonics, MicroElectroMechanical Systems (MEMS), algorithms, and component architecture.
Prior to being appointed Director of MTO, Dr. Zolper was Chief Scientist/Deputy Director of MTO and program manager in the same office. Dr. Zolper was a primary contributor in initiating DARPA’s multi-year $250M Wide Bandgap Semiconductor program and was lead program manager for the Technology for Frequency Agile Digitally Synthesized Transmitters (TFAST) program that established new levels of transistor and mixed signal circuit performance based on aggressively scaled Indium Phosphide Heterojunction Bipolar Transistors (HBTs).
Prior to joining DARPA, Dr. Zolper was a program officer at the Office of Naval Research from 1997 to 2001 where he managed a portfolio of basic and applied research in advanced electronics.
From 1989 to 1997, Dr. Zolper was a Senior Member of Technical Staff at Sandia National Laboratories in Albuquerque, NM. Dr. Zolper also spent time at the University of New South Wales in Sydney, Australia, from 1988 to 1989 as a Unisearch Post-Doctoral Fellow performing research on high efficiency silicon solar cells.
Dr. Zolper was awarded the Exceptional Public Service Award from OSD in 2007. He was awarded the Ph.D. and MEE in Electrical Engineering from the University of Delaware in 1987 and 1985, respectively, and a BA in Physics from Gettysburg College in 1982. He is a senior member of the IEEE and is widely published.
Wednesday, November 5, 2008 11:45 am
The Honorable Donald L. Carcieri
Governor Donald L. Carcieri was inaugurated as Rhode Island’s 57th Governor on January 7, 2003. A native Rhode Island resident, his election followed a career in business that was capped with his tenure as Chief Executive Officer of Cookson America and Joint Managing Director of Cookson Group Worldwide. He retired from that position in 1997.
As a family man with four children and fourteen grandchildren, ten of whom live in Rhode Island, Don Carcieri has always taken an active interest in what is going on in his community and the state. During 2001 his concern grew over the condition of the state’s financial situation and he considered applying his business skills to the problem. At the time, most people did not know how to pronounce his name.
In April 2002, Don Carcieri took the podium at the historic and flag draped Varnum Armory in his hometown of East Greenwich to formally announce his grass roots candidacy for Governor on the Republican ticket. As 250 people in the packed hall cheered, he told them: “My name is Don Carcieri and I want to be your next Governor!” He had never run for any elected office except his town’s home rule charter commission.
Focusing his campaign on the need to rein in state spending and balance the budget, demand integrity in government, and create a coordinated plan for statewide economic redevelopment, Don Carcieri came from behind to defeat the endorsed candidate in a highly contested primary. Hammering home his call for a Clean Start in state government, he defeated the Democrat candidate in the November election. The man from East Greenwich had bested a candidate who had over 15 years of political experience and had mounted two campaigns for Governor.
Don Carcieri, born December 16, 1942, was the first of Nicola and Marguerite Carcieri’s five children. The family lived in East Greenwich where Nicola Carcieri was a beloved teacher and coach at the town high school.
After graduating from East Greenwich High School, Don Carcieri attended Brown University on an academic scholarship, working summers on such jobs as construction, or crewing a charter boat, or quahogging on Narragansett Bay to help supplement his scholarship. He graduated in 1965 with a degree in International Relations.
Two weeks after graduation, Don Carcieri married his high school sweetheart Suzanne Owren, also of East Greenwich. Over the years their family grew to include a son, Mathew, and three daughters, Alison, Jill and Sarah.
In the early years Don taught math at Newport’s Rogers High School and then at Concord Carlisle Regional High School in Concord, Massachusetts. Next he turned to business, where, over the course of ten years, he built a career at Old Stone Bank, reaching the position of Executive Vice President.
In 1981, Don made an unusual career move, taking his family to Kingston, Jamaica, where he headed the Catholic Relief Service’s West Indies operation. He and his family lived in the community and Sue Carcieri taught science in the local school.
Following that humanitarian commitment, in 1983 Carcieri joined Cookson America as president of a small start-up company in the group, and he and his family returned to Rhode Island. Rising through the ranks to the position of Chief Executive Officer of Cookson America and Joint Managing Director of Cookson Group Worldwide, he was instrumental in the growth of the business into a major manufacturer employing over 12,000 people worldwide. The company grew from an organization doing $30 million in sales to over $3 billion in sales at the time he retired.
Don Carcieri has also been instrumental in preserving the historic face of Providence: at his urging, the former Providence train station became the headquarters of Cookson America. The company offices overlooked Burnside Park on one side and the Rhode Island State House on the other.
Alternative Energy Panel Discussion at IMAPS 2008^
Top INCLUDED WITH YOUR IMAPS 2008 FULL SYMPOSIUM REGISTRATION
Wednesday, November 5, 2008 2:30 pm - 3:45 pm
Chair: John Olenick, ENrG Incorporated
Alternative Energy and Distributed Energy Generation systems are under development and in demonstration throughout the world. The energy markets and the need for increased energy is rapidly expanding throughout the United States and the world. The Department of Energy has forecast the need for an additional 66 percent increase in energy usage just in the US by 2030. While some of this newly required energy will come from large power plants, a lot will be from fuel cells, wind and water power, solar, geothermal, and increases in electrical efficiency of our current systems.
The hydrogen economy will unfold throughout the rest of our lifetimes. This panel will address the need for energy, hot markets and what is not, and where microelectronics already is involved and where the role must be expanded.
Richard W. Smith
Maine Hydrogen Association Focus Areas: Hydrogen, Wind Power
Photovoltaics R&D Manager - Worldwide Thick Film R&D Manager
US Heraeus Inc., Thick Film Materials Division Focus Areas: Solar, PV
CellTech Power, Inc. Focus Areas: Fuel Cells and Clean Coal Technology
FuCellCo Focus Areas: Fuel Cells, Electric Vehicles, Wind Power
Connecticut Hydrogen and Fuel
Cell Coalition Focus Areas: Fuel Cells, Stack Components, Balance of Plant Components
14th Annual IMAPS Golf Classic to Benefit The Microelectronics Foundation ^
Monday, November 3, 2008 Alpine Country Club 251 Pippin Orchard Road Cranston, RI 02921
Cost is $175 per person The cost includes: Transportation to and from the course, greens/cart fees, and lunch.
Alpine Country Club’s 6900-yard championship golf course sits on 205 quiet acres and is considered one of New England’s most challenging courses. In addition to hosting some of Rhode Island’s most time-honored tournaments, it hosts more than 25 outside events.
Located in Cranston, Rhode Island, just 5 miles west of historic Providence, Alpine Country Club is worth a visit.
Transportation to the golf course will be provided. A shuttle is tentatively scheduled to depart from the Westin hotel at 7:30 am and from the Marriott Court Yard at 7:40 am. Pre-registered golfers will be notified if this time changes. Tournament will begin promptly at 9:00 am.
PLEASE NOTE: Appropriate golf attire is required, including collared shirt.
Sponsorship opportunities range from $400 - $500.
$400 get your company name/logo on signage at the event and in the final program.
$500 get your company name/logo on signage at the event, in the final program and a special hole at the tournament.
listed in chronological order)
TOMORROW: Carolinas Chapter October 22 Technical Meeting and Tour of LORD Corporation ^
1:30: First Presentation, Scott Morris, RF Micro Devices
“Conformal Shielding on Multichip Modules”
2:00: Second Presentation, George Sears of Lord Corporation
"Technology Innovations Applied to Wafer-Level Encapsulants and Thermal Interface Materials”
2:30: Facility Tour of Lord Corporation
3:15: Refreshment Break, Sponsored by Lord Corporation
3:30: Third Presentation, Chet Balut of DuPont Electronic Technologies
"Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating"
4:00: Fourth Presentation, Dr. David Seeger, Semiconductor Research Corporation
"Presentation title is TBD"
Compile possible dates, locations, speakers, topics, and volunteers for next event.
IMAPS Taiwan - The 3rd IMPACT & 10th EMAP Joint Conference Begins TOMORROW ^
The IMAPS Taiwan Chapter is co-organizing the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The joint conferences are being held October 22-24, 2008, at the Taipei Nangang Exhibition Hall, in Taipei, Taiwan.
Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry.
Organized by IMAPS-Taiwan, IEEE CPMT-Taipei, ITRI, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a “Creative Collaboration, More Than Packaging” program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.
Debendra Mallik, Principal Engineer
Intel Assembly and Test Technology Development
The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is a fifteen-year assessment of the semiconductor industry’s future technology requirements. These future needs drive present-day strategies for world-wide research and development among manufacturers’ research facilities, universities, and national labs. The objective of the ITRS is to ensure cost-effective advancements in the performance of the integrated circuit and the products that employ such devices, thereby continuing the health and success of this industry. The latest edition of ITRS was released in December 2007. This presentation will cover a review of ITRS key challenges related to Assembly and Packaging area.
Debendra Mallik is a principal engineer in the Assembly and Test Technology Development group in Intel Corporation. He manages packaging technology definition for Intel’s 32nm generation products. He received his B.Tech. degree in Mechanical Engineering from the Indian Institute of Technology and M.S. degree in Engineering Science & Mechanics from Iowa State University. He has been with Intel for 25 years and holds over 20 patents in the field of advanced packaging. He pioneered the development of laminated leadframe packaging which was selected as one of the “best product of the year” by the Semiconductor International journal. Debendra is also well recognized for his significant contributions to the development of high performance and low cost organic flip chip packaging technology. He is a member of the ITRS Assembly & Packaging Committee.
UK Chapter's Basic Packaging Workshop on December 4 ^
December 4, 2008
UNISEM, South Wales - NP11 3XT
Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat
Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.
An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:
Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.
Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking.
Test verification & Reliability looking at pull/Shear test equipment and general Package testing.
There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.
9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
a) Market briefing – Andy Longford, PandA Europe
b) Package technology trends and developments. - UNISEM
11.00 – 12.00 Session 2 - Mounting Die
a) Die prep – John Sweet, LOADPOINT
b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
1.30 – 2.30 Session 3 - Die Interconnection
a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
a) pull/Shear test equipment - Dr Stephen Clark, DAGE
b) Package testing. – Iain Gardiner, WAFERDATA
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (email@example.com) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging
Heat condcutive materials
Chip, board and system thermal management
Thermal modelisation and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at firstname.lastname@example.org.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (email@example.com) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.