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October 28, 2008

Draper Laboratory

   IMAPS EVENTS
Button IMAPS 2008, Providence, Rhode Island - On-line Registration Ends TOMORROW at 5PM EASTERN (read more...)

Button With 200 Booths to Visit During IMAPS 2008, Make Sure You Plan Ahead (read more...)

Button Get Ready for IMAPS 2008 - Review the Abstracts, Use the Program-at-a-Glance... (read more...)

Button Spend Time with Old Friends and Expand Your Network at the Welcome Reception - Next Monday, November 3 from 5-7:30 pm (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Arizona Chapter Meeting October 30 on ITRS Assembly and Packaging Roadmap (read more...)

Bullet Benelux Chapter Autumn Event on MEMS Packaging, Integration and Applications (read more...)

Bullet Northern California December 3 Lunch Meeting on Sensual Packaging (read more...)

Bullet UK Chapter's Basic Packaging Workshop on December 4 (read more...)

Bullet IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) (read more...)

Bullet IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management (read more...)

Bullet IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

AI Technology

IMAPS Events (view full Web Calendar)

IMAPS 2008, Providence, Rhode Island - On-line Registration Ends TOMORROW AT 5PM EASTERN   ^ Top
IMAPS 2008, the 41st International Symposium on Microelectronics, returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence. Learn more about IMAPS 2008 and register on-line before tomorrow, Wednesday, October 29, at www.imaps2008.org.

With 200 Booths to Visit During IMAPS 2008, Make Sure You Plan Ahead   ^ Top
The 41st International Symposium on Microelectronics, being held November 2-6 at the Rhode Island Convention Center in Providence, will feature a state-of-the-art exhibition and technology showcase with 200 booths on display. For more information about the exhibition, visit www.imaps2008.org.

The exhibit hall will be open:

Tuesday, Nov. 4
11:00 AM – 5:00 PM

Wednesday, Nov. 5

9:00 AM – 5:00 PM

Thursday, Nov. 6

9:00 AM – 12:00 PM

Here are the companies that have already reserved exhibit space:

COMPANY BOOTH NUMBER(S)
Accumet Engineering Corp. 432 
AdTech Ceramics 613 
Advanced Chemical Company 216 
Advanced Cooling Technologies 736 
Advanced Packaging/SMT 808 
AI Technology, Inc. 605 
AIM Specialty Materials 205 
Air-Vac Engineering Co. 807 
ALLVIA, Inc. 603 
American Beryllia Inc. 405 
American Technical Ceramics 728 
Ametek HCC 223 
AMI/Presco 816 - 18 
Anaren Mincrwavs, Inc. 106 
ANCeram/IKTS 435 
Ansoft Corp. 812 
ARC Technologies 742 
ASM Pacific 438 
Asymtek 817 
ASYS Inc. 805 
Barry Industries, Inc. 312 
BESI/Datacon 541 
CAD Design Sofrware 617 
Cal Poly State University 823 
Central Semiconductor Corp. 429 
Chip Scale Review 326 
Chip Supply, Inc. 424 
Cicorel SA 107 
Cobehn Systems, Inc. 433 
Coining, Inc. 423 
Colt Refining, Inc. 535 
Compex Corp. 722 
CoorsTek, Inc. 624 & 723 
Co-Planar, Inc. 502-04 
CPS Technologies 122 
Crane Aerospace & Electronics 222 
Cyber Technologies USA 809 
Dage Precision Industries, Inc. 304 
Deweyl Tool Company, Inc. 317 
DuPont Electronic Technologies 615 
EFD, Inc. 201 
Endicott Interconnect Technologies, Inc. 638 
Epoxy Technology, Inc. 307 
ES Components, Inc. 730 
ESL ElectroScience 409-411 
F&K Delvotec, Inc. 221 
Farmingdale State College 825 
Ferro Corporation 607-09 
Ferro-Ceramic Grinding, Inc. 437 
Finetech, Inc. 210 
Florida International University 827 
FRT of America, LLC 732 
Fuji Film Electronic Material 332 
Gannon & Scott 627 
Geib Refining Corporation 311 
General Metal Finishing Co., Inc. 734 
Global SMT & Packaging 115-117 
GPD Global, Inc. 119 
Graphite Concepts, Inc. 425 
Haiku Tech, Inc. 108 
Harrop Industries, Inc. 426 
HEI Inc. 105 
Henkel (Emerson & Cuming) 711-13 
Heraeus Thick Film Division 506-08 
Heraeus-SMT 113 
Hesse & Knipps 202 
Hi-Rel Laboratories 530 
Hybrid Circuit Works 641 
Indium 302 
Infinite Graphics, Inc. 637 
Innovative Fabrication, Inc. 103 
Insight SiP 439 
Integra-Technologies, Inc. 330 
Interconnect Systems, Inc. 821 
International Manufacturing Services, Inc. (IMS) 214 
Interplex Engineered Products 534 
J-Tech Distributors USA, Ltd. 801 
Kyocera America, Inc. 803 
Kyzen Corp. 610 
Laser Processing Technology, Inc. 813 
Laser Services, Inc. 726 
Laser Tech, Inc. 532 
Laserod 633 
LINTEC Corporation 427 
Matrix Incorporated 431 
Maxtek Components Corporation 306 
Metachem Resins Corporation (Mereco) 635 
Metallix Refining, Inc. 811 
Micro Hybrid Dimensions, Inc. 611 
MicroConnex Corporation 428 
MicroFab Technologies, Inc. 542 
Micropac Industries, Inc. 631 
MicroScreen LLC 401 
Micross Components Corp. 527 
Midas Technology, Inc. 539 
Minco Technology Labs., Inc. 717 
Mini-Systems, Inc. 525 
Miyachi Unitek - Benchmark Div. 323 
Mundt & Associates, Inc. 430 
Murata Power Solutions 442 
NAMICS Technologies, Inc. 608 
Natel Engineering Co., Inc. 402 island 
Newport Corporation 616-18 
NorCom Systems, Inc. 614 
NTK Technologies, Inc. 422 
NxGen Electronics 316 
Oerlikon ESEC USA, Inc. 101 
Oneida Research Services, Inc. 716 
Orthodyne Electronics 529--31 
Pacific Aerospace & Electronics 536 
Pacific Aerospace & Electronics 536 
PacTech USA - Packaging Technologies, Inc. 102-04 
Palomar Technologies, Inc. 322-24 
Panasonic Factory Solutions Co. of America 602 
Paricon Technologies Corp. 714 
Perfection Products, Inc. 523 
Photochemie AG 107 
Photofabrication Engineering, Inc. 715 
Photonics Media/Laurin Publishing 738 
Polaris Electronics Corp. 537 
Questech Services Corp. 814 
Reactive Nano Technologies 528 
Reinhardt Microtech AG 212 
Reldan Metals, Co. 718 
Remtec, Inc. 815 
Riv, Inc. - Thick Film Screens 707 
Rogers Corporation 708-10 
Rohm and Haas Electronic Materials 441 
Royce Instruments, Inc. 440 
S.E.T. 639 
SEFAR Printing Solutions, Inc. 510 
Semi Dice, Inc. 318 
Semiconductor Equipment Corp. 514 
Semiconductor Packaging Materials (SPM) 308-10 
Sikama International, Inc. 407 
Silicon Cert, Ltd. 724 
Sims Recycling Solutions 218 
Sonoscan, Inc. 601 
SST Internnational 421 
Stellar Industries Corp. 702 
Stellar Microelectronics Inc. 208 
StratEdge Corporation 538 
Superior Technical Ceramics 512 
Systems and Technology Int'l Inc. 540 
Taconic 712 
Task Microelectronics 704 
TDK Corporation of America 804-06 
Technic, Inc. 403 
Technical Materials, Inc. 203 
Teledyne Microelectronics 516-18 
Temple University 831 
Ticona Engineering Polymers 802 
Toray Engineering Co., Ltd. 612 
Torrey Hills 415-417 
Trebor Instrument Corp. 706 
Tresky Corporation 740 
Twilight Technology, Inc. 313 
Umicore AG & Co. Kg 522 
Unichem Industries, Inc. 124 
University of Arkansas 833 
University of Idaho 835 
University of Kentucky 829 
UTZ, LLC 810 
VIOX Corporation 622 
Viscom Inc 436 
Vishay 111 
Webcom Communications Corp. Literature Table 
Weiss-Aug Co. Inc. 629 
West-Bond, Inc. 315-317 
Williams Advanced Materials 224 
YESTech, Inc. 434 
YXLON International Inc. 207 

 

Get Ready for IMAPS 2008 - Review the Abstracts, Use the Program-at-a-Glance...   ^ Top
IMAPS 2008 begins this Sunday, November 2, at the Rhode Island Convention Center in Providence. With 30 technical sessions, approximately 200 papers/speakers, the exhibition, and numerious other events, you will certainly be busy while in Providence.

Spend the next few days preparing for the symposium to maximize your time.

Spend Time with Old Friends and Expand Your Network at the Welcome Reception - Next Monday, November 3 from 5-7:30 pm   ^ Top
We hope to see you there on Monday!

Welcome Reception
5:00 PM - 7:30 PM
Westin Providence Hotel

Sponsored by:

Natel - Premier Sponsor, Platinum
Panasonic Factory Solutions - Premier Sponsor, Gold
Hesse & Knipps - Premier Sponsor, Silver
Chapter Activities (events listed in chronological order)

TOMORROW: Arizona Chapter Meeting October 30 on ITRS Assembly and Packaging Roadmap    ^ Top

Date: October 30 , 2008
Schedule:

Registration and Lunch at 11:30 – 12:00
Presentation at 12:00 – 1:00

Location:
Mesa City Library
Dobson Ranch Branch
2425 S. Dobson Rd
Mesa, AZ 85202
Registration:

Special - No Charge for pre-registered attendees
RSVP by 28 October 2008 at our website or e-mail:http://www.imaps.org/chapters/freepass.asp / chunho.kim@intel.com

Onsite Registration: Luncheon and presentation - $10.00

Vendor display tables available for $15.00http://www.imaps.org/registration/az2008oct.htm

ITRS Assembly & Packaging Roadmap

Debendra Mallik, Principal Engineer
Intel Assembly and Test Technology Development

The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is a fifteen-year assessment of the semiconductor industry’s future technology requirements. These future needs drive present-day strategies for world-wide research and development among manufacturers’ research facilities, universities, and national labs. The objective of the ITRS is to ensure cost-effective advancements in the performance of the integrated circuit and the products that employ such devices, thereby continuing the health and success of this industry. The latest edition of ITRS was released in December 2007. This presentation will cover a review of ITRS key challenges related to Assembly and Packaging area.

Presenter Bio:

Debendra Mallik is a principal engineer in the Assembly and Test Technology Development group in Intel Corporation. He manages packaging technology definition for Intel’s 32nm generation products. He received his B.Tech. degree in Mechanical Engineering from the Indian Institute of Technology and M.S. degree in Engineering Science & Mechanics from Iowa State University. He has been with Intel for 25 years and holds over 20 patents in the field of advanced packaging. He pioneered the development of laminated leadframe packaging which was selected as one of the “best product of the year” by the Semiconductor International journal. Debendra is also well recognized for his significant contributions to the development of high performance and low cost organic flip chip packaging technology. He is a member of the ITRS Assembly & Packaging Committee.

Benelux Chapter Autumn Event on MEMS Packaging, Integration and Applications    ^ Top

Thursday, November 20th, 2008

Venue:

Holst Centre
High Tech Campus 31
Eindhoven
The Netherlands

REGISTER ON-LINE

PROGRAM:

9.00        Registration, coffee, exhibition

9.30        Welcome by the chairman

Fred Roozeboom, NXP Research and TU/e, NL

9.35        Introduction to the Holst Centre

Jaap Lombaers, Holst Centre, NL

9.40            iPill: Design considerations of an electronic pill for drug delivery

Frits Dijksman, Philips Research, NL

10.10          “SoC or SiP ?” : Impact on Test and Packaging
Appo van der Wiel, Melexis, BE

10.40      Coffee, exhibition

11.10      Next generation Lab-on-a-Chip systems: cells, proteins and direct sensing

Edwin Carlen and Albert van den Berg, University of Twente and MESA+, NL

11.40      Packaging issues for variable-focus liquid lenses

Stein Kuiper, Philips Research, NL

12.10      Hand-held diagnostics platform with short test time

Joost Maast, Philips Applied Technologies, NL

12.40      Lunch, exhibition – Holst tour

13.45      MEMS packaging using 3D-Si integration approaches

Anne Jourdain and Eric Beyne, IMEC, BE

14.15      Inkjet printing for semiconductor applications

Peter Briër, PixDro BV , NL

14.45      Coffee, exhibition

15.15      Packaging aspects for MEMS based energy harvesters

Rob van Schaijk and Ruud Vullers, IMEC-NL, NL

15.45      MEMS oscillators for timing applications

Joost van Beek, NXP Semiconductors, NL

16.15      Informal meeting – drinks will be served

17.00      Closing

 

More info & registration

Register On-line

Or Contact:

Katrien Vanneste, ELIS-CMST, Gent University                 
Technologiepark 914A, B-9052 Zwijnaarde 
Tel: +32 (0) 9 264 5350
FAX: +32 (0) 9 264 5374                                                             
E-mail : katrien.vanneste@ugent.be

Northern California December 3 Lunch Meeting on Sensual Packaging    ^ Top

Date: December 3, 2008
Schedule:

11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation

Location:

Ramada Inn
1217 Wildwood Avenue
Sunnyvale, CA 94089

Registration:

Members/General $20.00
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at glove@cctlaser.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.

Sensual Packaging – Packaging Technology that excites our senses
Speaker: Srinivas T. Rao, Flextronics

With consumer electronics, meeting performance objectives is a requirement for entry but is no guarantee for success in the market place. Market acceptance and commercial success is driven often by intangibles that are easy to spot only after the fact. The make or break success is largely associated with final packaging. For mobile microelectronic products such as MP3 players, PDAs, cell phones and laptops the language of success is fashion; soft, sleek, sexy, ‘living’, glossy, hard, cold, green are the list of attributes. It is all about Sensual Packaging – Packaging Technology that excites our senses.

The press release in September from HP titled “The first-ever HP digital clutch to debut on Fashion Week runway” probably communicates the trend in consumer electronics. This presentation shares examples of product success, reviews technologies and mix to deliver ‘feelings’ expressed by the Industrial Designer to meet the mood of the consumer on ‘fashion’ and ‘green’ appeal. Value creation centered on Sensual packaging with methods that enhance touch, color, light, smell, and are environmentally compelling will be illustrated.

Srinivas Rao is vice president of Corporate Technology at Flextronics leading the initiative on Advanced Materials. He has held executive and senior technology positions as CEO and CTO of Molecular Nanosystems Inc., vice president of technology at Solectron Corporation, and held technology management and research positions at Raychem Corporation, Eastman Kodak Research Laboratories and RCA Laboratories. Dr. Rao’s technical background and expertise is in materials science, microelectronics and fabrication, electronic packaging, second level and system level assembly, and nanotechnology. Dr. Rao is a Distinguished Alumnus of Indian Institute of Technology Madras, and holds master’s and doctorate degrees in metallurgy and materials science from the Stevens Institute of Technology. He has served on the distinguished Blue Ribbon Task Force on Nanotechnology (2005) for the state of California, is recipient of RCAs “Outstanding Achievement Award, “Engineer of the Year” award in 2000 conferred by EP&P and the STAR Award (2004) for his services rendered to the Asian American community in Santa Clara County in California.

UK Chapter's Basic Packaging Workshop on December 4    ^ Top

Date: December 4, 2008
Location:
Hosted by: 
UNISEM, South Wales - NP11  3XT
Registration:

Prices:

Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat

To book for this event, please complete the booking form and return to the IMAPS-UK Secretariat fax +44 1522 575212 e-mail imapsuk@aol.com

Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.

An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:

  • Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
  • Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.  
  • Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking. 
  • Test verification & Reliability looking at pull/Shear test equipment and general Package testing.

There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.

Program:

9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
            a) Market briefing – Andy Longford, PandA Europe
            b) Package technology trends and developments.  -  UNISEM
11.00 – 12.00 Session 2 - Mounting Die
            a) Die prep – John Sweet,  LOADPOINT
            b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
Lunch break
1.30 – 2.30 Session 3 - Die Interconnection
            a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
            b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
            a) pull/Shear test equipment -  Dr Stephen Clark, DAGE
            b) Package testing. – Iain Gardiner, WAFERDATA
Close  

IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08)    ^ Top

Date: December 15-18, 2008
Schedule:

December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition

Location:
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
Web: www.nias.res.in
Cost:

1. Conference:
General - Rs 3500/$350
IMAPS [India Chapter] Members - Rs 2500
Students - Rs 1000
Authors - Rs 2500 / $250

2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000

Time Table:
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference

Micro Systems : Design to Manufacturing

"CALL FOR PAPERS

Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (joshi610@yahoo.com) immediately. For more information, visit www.imapsindia.org.

Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.

IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management    ^ Top
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.

In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas: 
  • Cooling for microelectronics packaging
  • Microcooling solutions
  • Heat condcutive materials
  • Chip, board and system thermal management
  • Thermal modelisation and simulation
  • Heatsinks, heatpipes and other cooling products
  • Liquid and phase change cooling
  • New cooling solutions
  • Experience return (products and systems cooling, power electronics, automotive, transport,...)
  • Thermal management of opto electronics components  

Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at imaps.france@imapsfrance.org.

IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging    ^ Top
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh.  The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics.  Papers from industry are especially important.  Industry papers may have product content but must not be commercial.  Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.

Please submit your Abstract to the Secretariat of IMAPS-UK (imapsuk@aol.com) no later than 31st October 2008.  We will notify authors of the selection of papers no later than 30th November

The Call for Papers and other information are available at www.imaps.org.uk.

Prof Nihal Sinnadurai
Conference Chair MicroTech 2009

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

 

CAD Design Software

Oneida Research Services

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact abell@imaps.org

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ

*Exhibitors contact abell@imaps.org

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
May 5-7, 2009
Dearborn, MI

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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