IMAPS 2008, Providence, Rhode Island - On-line Registration Ends TOMORROW AT 5PM EASTERN ^
IMAPS 2008, the 41st International Symposium on Microelectronics, returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence. Learn more about IMAPS 2008 and register on-line before tomorrow, Wednesday, October 29, at www.imaps2008.org.
With 200 Booths to Visit During IMAPS 2008, Make Sure You Plan Ahead ^
The 41st International Symposium on Microelectronics, being held November 2-6 at the Rhode Island Convention Center in Providence, will feature a state-of-the-art exhibition and technology showcase with 200 booths on display. For more information about the exhibition, visit www.imaps2008.org.
The exhibit hall will be open:
Tuesday, Nov. 4
11:00 AM – 5:00 PM
Wednesday, Nov. 5
9:00 AM – 5:00 PM
Thursday, Nov. 6
9:00 AM – 12:00 PM
Here are the companies that have already reserved exhibit space:
Get Ready for IMAPS 2008 - Review the Abstracts, Use the Program-at-a-Glance... ^
IMAPS 2008 begins this Sunday, November 2, at the Rhode Island Convention Center in Providence. With 30 technical sessions, approximately 200 papers/speakers, the exhibition, and numerious other events, you will certainly be busy while in Providence.
Spend the next few days preparing for the symposium to maximize your time.
Debendra Mallik, Principal Engineer
Intel Assembly and Test Technology Development
The International Technology Roadmap for Semiconductors, known throughout the world as the ITRS, is a fifteen-year assessment of the semiconductor industry’s future technology requirements. These future needs drive present-day strategies for world-wide research and development among manufacturers’ research facilities, universities, and national labs. The objective of the ITRS is to ensure cost-effective advancements in the performance of the integrated circuit and the products that employ such devices, thereby continuing the health and success of this industry. The latest edition of ITRS was released in December 2007. This presentation will cover a review of ITRS key challenges related to Assembly and Packaging area.
Debendra Mallik is a principal engineer in the Assembly and Test Technology Development group in Intel Corporation. He manages packaging technology definition for Intel’s 32nm generation products. He received his B.Tech. degree in Mechanical Engineering from the Indian Institute of Technology and M.S. degree in Engineering Science & Mechanics from Iowa State University. He has been with Intel for 25 years and holds over 20 patents in the field of advanced packaging. He pioneered the development of laminated leadframe packaging which was selected as one of the “best product of the year” by the Semiconductor International journal. Debendra is also well recognized for his significant contributions to the development of high performance and low cost organic flip chip packaging technology. He is a member of the ITRS Assembly & Packaging Committee.
Benelux Chapter Autumn Event on MEMS Packaging, Integration and Applications^
Thursday, November 20th, 2008
High Tech Campus 31
1217 Wildwood Avenue
Sunnyvale, CA 94089
Students (with ID) $10.00
Price includes lunch and program. Please email Gina Love at email@example.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.
Sensual Packaging – Packaging Technology that excites our senses Speaker: Srinivas T. Rao, Flextronics
With consumer electronics, meeting performance objectives is a requirement for entry but is no guarantee for success in the market place. Market acceptance and commercial success is driven often by intangibles that are easy to spot only after the fact. The make or break success is largely associated with final packaging. For mobile microelectronic products such as MP3 players, PDAs, cell phones and laptops the language of success is fashion; soft, sleek, sexy, ‘living’, glossy, hard, cold, green are the list of attributes. It is all about Sensual Packaging – Packaging Technology that excites our senses.
The press release in September from HP titled “The first-ever HP digital clutch to debut on Fashion Week runway” probably communicates the trend in consumer electronics. This presentation shares examples of product success, reviews technologies and mix to deliver ‘feelings’ expressed by the Industrial Designer to meet the mood of the consumer on ‘fashion’ and ‘green’ appeal. Value creation centered on Sensual packaging with methods that enhance touch, color, light, smell, and are environmentally compelling will be illustrated.
Srinivas Rao is vice president of Corporate Technology at Flextronics leading the initiative on Advanced Materials. He has held executive and senior technology positions as CEO and CTO of Molecular Nanosystems Inc., vice president of technology at Solectron Corporation, and held technology management and research positions at Raychem Corporation, Eastman Kodak Research Laboratories and RCA Laboratories. Dr. Rao’s technical background and expertise is in materials science, microelectronics and fabrication, electronic packaging, second level and system level assembly, and nanotechnology. Dr. Rao is a Distinguished Alumnus of Indian Institute of Technology Madras, and holds master’s and doctorate degrees in metallurgy and materials science from the Stevens Institute of Technology. He has served on the distinguished Blue Ribbon Task Force on Nanotechnology (2005) for the state of California, is recipient of RCAs “Outstanding Achievement Award, “Engineer of the Year” award in 2000 conferred by EP&P and the STAR Award (2004) for his services rendered to the Asian American community in Santa Clara County in California.
UK Chapter's Basic Packaging Workshop on December 4 ^
December 4, 2008
UNISEM, South Wales - NP11 3XT
Students £15.00 + vat, IMAPS-UK & NMI members £25.00 + vat, Others £35 + vat
Device packaging is now the cornerstone of the industry and is a key skill now needed by managers, engineers and technicians in the electronics chip design, development and manufacturing market as well as University academics and Institute professionals.
An Opportunity to gain knowledge and understanding about the basic technology holding Electronic systems together. A day workshop will cover the 4 main topics of:
Package trends and technologies including a Market briefing and an insight into Package technology trends and developments.
Mounting Die including work on Die prep and Epoxy / Eutectic materials and processes.
Die Interconnection, covering the Ins & outs of wirebonding, Flip chip and die stacking.
Test verification & Reliability looking at pull/Shear test equipment and general Package testing.
There will also be the opportunity to see High Tech Packaging in action with a Factory - Window Tour of the UNISEM facility.
9.00 am – Registration
9.30 – 10.30 Session 1 - Package trends and technologies
a) Market briefing – Andy Longford, PandA Europe
b) Package technology trends and developments. - UNISEM
11.00 – 12.00 Session 2 - Mounting Die
a) Die prep – John Sweet, LOADPOINT
b) Epoxy / Eutectic materials and processes. – Mark Currie, HENKEL
12.00 – 12.30 Factory Tour
1.30 – 2.30 Session 3 - Die Interconnection
a) Ins & outs of wirebonding – Hugh de Lacy, TS2 Micro
b) Flip chip and die stacking. – TWI
3.00 – 4.00 Session 4 - Test verification & Reliability
a) pull/Shear test equipment - Dr Stephen Clark, DAGE
b) Package testing. – Iain Gardiner, WAFERDATA
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (firstname.lastname@example.org) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - Abstract Deadline November 5 for the 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging
Heat condcutive materials
Chip, board and system thermal management
Thermal modelisation and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at email@example.com.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (firstname.lastname@example.org) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.