IMAPS 2008, Providence, Rhode Island - Registration Deadline Next Wednesday and Housing Raffle Deadline Now September 30 ^
The advance program and registration for IMAPS 2008, the 41st International Symposium on Microelectronics, is now available on-line. The 2008 symposium returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence.
19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.
Deadline Next Friday and Exhibits 50% Sold Out: Device Packaging 2009 Conference and Exhibition - Packaging & Application of Power LED Devices Workshop ^
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.
The objective of the LED Devices Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of LED Devices. This workshop has been specifically organized to allow for the presentation and discussion of some of the latest and hottest technologies related to fabrication, packaging and applications of LED devices.
Abstracts are being requested on the following topics:
Industry Trends & Market Drivers in Solid State Lighting
Integration, mounting, and assembly of packaged LEDs
Electrical drivers, conversion efficiency, and color control of LEDs
Active and passive thermal management techniques and materials for packaged LEDs
Materials for carriers, substrates and interconnects
Device attachment materials, processes, and equipment
Discrete, array level Characterization and in-process testing, including imaging, void detection, stress/strain, high temperature reliability
Applications, such as: Handheld, Medical, Avionics, Military, Signage, Commercial, Automotive, General Lighting
Manufacturing Trends &Techniques
Optics and Lenses
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than September 26, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at email@example.com or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at firstname.lastname@example.org or by phone at 202-548-8717. WE EXPECT THE EXHIBIT FLOOR TO SELL OUT BEFORE OCTOBER 1, 2008
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at email@example.com later than September 26, 2008.
IMAPS Lunch and Learn PDC Webinar 3-Course Series on Hermeticity Packaging Concepts ^
This three-session on-line Professional Development Course (PDC) webinar will run:
Monday, October 6, Tuesday, October 14, and Tuesday, October 21, 2008
All webinars will be held 12:00 noon - 1:00 pm EST
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500
Register On-line Registration Deadlines: October 2, October 10 and October 17, 2008
Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, medical implants, optoelectronic components and packaging for Military and Space. This on-line PDC is a series of 3 one hour lectures which can be taken in total or separately depending on the experience level of the student and topics of interest. Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.
Monday, October 6 -- 12:00-1:00 PM EST
In this lead off session the basic concept of hermeticity will be defined. There are a variety of ways to create a hermetic seal each one of these will be briefly discussed from a material and processing standpoint. Then the basic theory of moisture ingress and rationale for the military RGA 5000 PPM specification will be described.
Hermeticity defined…A reason to seal
Hermetic seal processes
Moisture ingress into a sealed package
Residual Gas Analysis and the military specification
Tuesday, October 14 -- 12:00-1:00 PM EST
In this session we’ll examine the conventional helium fine and gross leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. We’ll discuss the theory behind the test method and point out some of the common pitfalls.
Helium Fine Leak Testing
Howl and Mann Flexible equation
Fixed Table method
Gross leak bubble testing
Tuesday, October 21 -- 12:00-1:00 PM EST
Optical Leak Test (OLT) is a method that makes use of a laser interferometer to measure out plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. Cumulative Helium Leak Detection (CHLD) is a hermeticity test technique that can measure leak rates as low as 10E-13 He cc/sec. Both methods allow for both gross and fine leak detection in a single test cycle and without the use of a liquid.
Optical Leak Testing (OLT)
Cumulative Helium Leak Detection (CHLD)
Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.
Course attendees will have access to all the course notes and in addition will receive a complimentary complementary copy of "Practical Guide to TM 1014" authored by the Instructor.
Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran-owned small business. He has over twenty-five years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits for military and commercial communication satellites. Tom has demonstrated expertise in seam sealing and leak testing processes. He has conducted experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. He has experience with OLT (Optical Leak Technology) and CHLD (Cumulative Helium Leak Detection). Tom is an active IMAPS member and has a B.S. in Materials Engineering for Lehigh University and a Masters from the University of Utah.
Register On-line Registration Deadlines: October 2, October 10 and October 17, 2008
listed in chronological order)
Indiana Chapter This Thursday, September 18 Dinner Meeting with Tour of Subaru Automotive Assembly Plant ^
September 18, 2008
Tour Starts 4:00
Tour of Subaru Automotive, Lafayette, IN
Dinner & Meeting to follow at The Trails Restaurant in West Lafayette, IN
IMAPS Members $20.00
Advance reservations are being taken by Ray Fairchild and will be accepted until 5:00 pm on Tuesday, September 16, 2008. Reservations can be made by contacting Ray at 765-451-1068, fax 765-451-8844, or email firstname.lastname@example.org.
This is the only Subaru auto assembly plant in the United States. SIA Associates also build the Toyota Camry here through a business collaboration with Toyota.
The tour route includes many exciting areas in the plant from Stamping, Body Shop, Paint Shop, Trim and Final, and concluding with the vehicle going through the Tester Line.
Subaru has made many improvements and received numerous awards over the past several years. This plant became the first automotive assembly plant in 2004 to be "Zero-Landfill." SIA send nothing from its manufacturing process to the landfill. Your typical household puts more trash in the ground that SIA's entire manufacturing facility!
The tour will be one mile along an elevated catwalk. You are encouraged to wear flat, comfortable closed-toe shoes and be ready to negotiate more than 90 up-and-down steps on the catwalk tour. Ladies must wear slacks. Subaru can accommodate up to 7 people at a time that may experience difficulty with the walk by using a golf cart.
High school and college students are invited to attend.
XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.
This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.The Conference topics will include:
Hybrid and Semiconductor Technology
Design Methods and Computer Simulations
Electronics Materials and Components
Thick-Film and Thin-Film Sensors
Packaging and PCB
Quality and Reliability Evaluation
Optoelectronics and Photovoltaics
Education in Electronics
The Conference presentations will be made in the form of:
Poster sessions for presentation of contributed papers
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl. If you have any question please do not hesitate to contact us. The address for correspondence:
Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
The term Printed Electronics (PE) continues to generate a lot buzz amongst those outside the IMAPS community. However, those of us with a long IMAPS history know Printed Electronics has been around for over 40 years. New PE market applications include Displays, Backplanes, and RFID. In addition to Screen Printing, other patterning methods include Ink Jet, Flexography, and Gravure. This presentation will attempt to define Printed Electronics, describe why there is such a high level of interest, and caution against getting too caught up in the industry hype.
Scott Gordon of DuPont Microcircuit Materials (MCM) is currently the MCM Regional Sales Manager for North & South America, based out of Research Triangle Park, NC. Scott's career began as a MCM Sales Representative in the Mid-Atlantic region, and he has held numerous Sales and New Business Development positions in DuPont's Displays, Holographics, and Advanced Fiber Systems business units. Prior to rejoining the Microcircuit Materials business as Regional Sales Manager in late 2006, Scott was a Strategic Market Development Manager in the Central Research and Development (CR&D) group at DuPont's Experimental Station in Wilmington, DE. While in CR&D, Scott became active in several research programs aimed at creating advanced patterning technologies and materials for use in next generation Printed Electronics. Scott graduated from Lafayette College with a BS in Metallurgical Engineering. He is a third generation DuPont employee, and is now in his 22nd year with DuPont.
October 1 Central Texas Chapter Vendor's Day and Technical Program ^
October 1, 2008
UT-PRC Commons Center Building
Braker Lane & Burnet Road
This event is complimentary for IMAPS members and guests.
Optical Leak Test (OLT) Technology in Production Applications
Chris Aubertin, NorCom Systems Inc.
Much has been written about the shortfalls in conventional Helium mass spectroscopy and bubble leak testing for fine and gross leak inspection of hermetically sealed components. These problems include: one way leakers, Helium absorption on the package body, “virtual leakers,” false readings for small volume packages, repeatable leak rate test coverage in the 10-05 cc-atm/sec range, problems with helium backfills, product contamination and masking of fine leaks during bubble testing, high bomb pressures and long cycle times, and the inability to test at the board level. There have been numerous papers describing each of these problem areas in painstaking detail.
Optical Leak Testing (OLT) is a viable hermeticity test technique that addresses all of the above. It’s a proven high volume Fine and Gross leak test that has been embraced by, the Hybrid, discrete device, and medical device manufacturers, as well as Aerospace companies and DoD agencies. Since 1995 OLT has been an accepted leak test method in Mil-Std TM1014, conditions C4 and C5. OLT technology has evolved and improved to the point, where the OLT test equipment displays the leak rate measurement in the familiar units of cc-atm/sec., eliminating the need for leak rate vs. lid deflection plots. Using OLT technology devices are placed in a test chamber and exposed to a pressurized low molecular weight gas such as helium. If the package is leaking, the lid deflects in response to a changing pressure as the device cavity and test chamber pressure come to equilibrium. Precision chamber pressure measurements combined with individual package lid stiffness and velocity data, obtained by laser holography, are used to determine package leak rates in helium cc-atm/sec LHe. The ultimate sensitivity of the instrument is a function of package volume, chamber working pressure and test time. The method has demonstrated a very high level of accuracy and repeatability. Beta site test correlation data from an actual production line will be presented and discussed.
Mr. Aubertin has been Vice President and General Manager of NorCom Systems Inc. a manufacturer of Optical Leak Inspection equipment in Norristown, PA, since 1998. The company provides production systems and services for hermetic seal inspection of electronic devices including opto-electronics, hybrids, MEMS, Hi-Rel, as well as medical devices. He was instrumental in the development and manufacturing of the first production Optical Leak Test systems in 1992, that were first included in MIL-STD -883 and MIL-STD-750 in 1995.These systems have since been purchased and used by over fifty companies worldwide for gross and fine leak production hermetic inspection.
For the past twenty six years, Mr. Aubertin has worked in the field of non-destructive inspection (NDI). He managed the development and production of laser based optical inspection systems for Laser Technology Inc. (LTI). These systems detect sub-surface flaws in composite materials using optical Shearography and Holography. He helped develop and manufacture the first electronic Shearography systems in 1986 for the Northrop B-2 Bomber program, and these LTI systems have been used on a wide variety of inspection programs including the Space Shuttle, F-22, Cessna Citation and the X-33.
Chris is a member of the (American Society of Non destructive Testing) and IMAPS (International Microelectronics And Packaging Society).
7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:
1:30: First Presentation, Scott Morris, RF Micro Devices
“Conformal Shielding on Multichip Modules”
2:00: Second Presentation, George Sears of Lord Corporation
"Technology Innovations Applied to Wafer-Level Encapsulants and Thermal Interface Materials”
2:30: Facility Tour of Lord Corporation
3:15: Refreshment Break, Sponsored by Lord Corporation
3:30: Third Presentation, Chet Balut of DuPont Electronic Technologies
"Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating"
4:00: Fourth Presentation, Dr. David Seeger, Semiconductor Research Corporation
"Presentation title is TBD"
Compile possible dates, locations, speakers, topics, and volunteers for next event.
IMAPS Taiwan Co-Organizing the 3rd IMPACT & 10th EMAP Joint Conference ^
The IMAPS Taiwan Chapter is co-organizing the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The joint conferences are being held October 22-24, 2008, at the Taipei Nangang Exhibition Hall, in Taipei, Taiwan.
Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry.
Organized by IMAPS-Taiwan, IEEE CPMT-Taipei, ITRI, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a “Creative Collaboration, More Than Packaging” program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (email@example.com) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging Microcooling solutions Heat condcutive materials Chip, board and system thermal management Thermal modelisation and simulation Heatsinks, heatpipes and other cooling products Liquid and phase change cooling New cooling solutions Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at firstname.lastname@example.org.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (email@example.com) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Microelectronics is published bi-monthly and offered to
all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.