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September 3, 2008

IMAPS INDIA CHAPTER CONFERENCE - EMIT-2008
December 15-18, 2008
“Micro Systems: Design to Manufacturing”

IMAPS EVENTS
RF/Microwave Workshop On-line Registration Ends Next Thursday, September 11 at Noon (read more...)

Hotel Deadline Next Friday for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management (read more...)

Device Packaging 2009 Conference and Exhibition - Wafer Level Chip Scale Packaging Workshop (read more...)

IMAPS 2008, Providence, Rhode Island - Registration/Hotel Deadlines Just 3 Weeks Away....and Don't Forget Your Absentee Ballot! (read more...)

CHAPTER ACTIVITIES (events listed in chronological order)
Arizona Chapter Lunch Meeting September 11 on MEMS Packaging Overview and Activities at Amkor (read more...)

IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line (read more...)

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Pittsburgh-area Technical Meeting September 24 on Thermal Management and Opto-electronics and Lab Tour of Penn State's Electro-Optics Center (read more...)

September 25 Technical Meeting and Tour at CALCE (University of Maryland) Addressing Packaging Challenges in Defense Applications (read more...)

October 1 Central Texas Chapter Vendor's Day and Technical Program (read more...)

Upstate New York and Garden State Chapter Joint Technical Meeting and Tabletop Exhibition Being Held October 2 (read more...)

7th International Symposium on Microelectronics and Packaging (ISMP 2008) (read more...)

IMAPS Taiwan Co-Organizing the 3rd IMPACT & 10th EMAP Joint Conference (read more...)

Call for Papers Extended to September 15 for IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) (read more...)

IMAPS France - 4th European ATW on Micropackaging and Thermal Management (read more...)

IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read more...)

EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

PRODUCTS AND PUBLICATIONS
Advancing Microelectronics September/October 2008 On-line Magazine is Now Available (read more...)

IMAPS Events (view full Web Calendar)

RF/Microwave Workshop On-line Registration Ends Next Thursday, September 11 at Noon ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. The on-line registration cut-off is next Thursday, September 11 at noon eastern. After that date, registrations will only be accepted on-site in San Diego. To view the technical program and to register, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. Sessions will be held on:

For more information, visit www.imaps.org/rf.

Hotel Deadline Next Friday for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is being held October 14-16, 2008, at the Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California. The hotel deadline is Monday, September 15, 2008. IMAPS cannot guarantee room availability or pricing after this date.

The technical program and registration forms are available at www.imaps.org/thermal. is being finalized this week. Sessions/presentations are planned in the following areas:

Market Drivers
Thermal Interface Materials
Equipment and Test
Thermal Analysis
System Cooling
High Conductivity Materials
Liquid Cooling

For more information, visit www.imaps.org/thermal. This workshop will now feature a limited number of tabletop booths. Tabletop space has sold out!

Device Packaging 2009 Conference and Exhibition - Wafer Level Chip Scale Packaging Workshop ^ Top
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.

The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Chip Scale Packaging; Electronics Packaging for Biomedical Devices; and Packaging and Application of Power LED Devices (new in 2009)

The objective of the Wafer Level Chip Scale Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wafer Level Chip Scale Packaging (WLCSP). This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to these new packaging technologies

Attendees and presenters in the past have found that the Wafer Level Chip Scale Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on Wafer Level Chip Scale Packaging technologies would be well worth attending.

Abstracts are being requested on the following topics:

Chip Scale Packaging (CSP and WLCSP)
Wafer Bumping Materials (UBM, Solder, RDL and Repassivation)
Manufacturing Processes
Assembly Processes
Reliability
Mechanical Testing: (Drop Test, High Speed Pull, Vibration, Shear…)
Modeling (Thermal and Mechanical)
End use applications (i.e., OEM products)

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than September 26, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717. WE EXPECT THE EXHIBIT FLOOR TO SELL OUT BEFORE OCTOBER 1, 2008

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than September 26, 2008.

IMAPS 2008, Providence, Rhode Island - Registration/Hotel Deadlines Just 3 Weeks Away....and Don't Forget Your Absentee Ballot!! ^ Top
The advance program and registration for IMAPS 2008, the 41st International Symposium on Microelectronics, is now available on-line. The 2008 symposium returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence.

19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.

Learn more about IMAPS 2008 and register on-line at www.imaps2008.org. For information on the absentee voting process, please visit http://www.imaps.org/imaps2008/voting.htm.

Chapter Activities (events listed in chronological order)

Arizona Chapter Lunch Meeting September 11 on MEMS Packaging Overview and Activities at Amkor ^ Top

Date:	September 11, 2008
Schedule:	Registration and Lunch: 11:30-12:00 Presentation: 12:00-1:00
Location:	Mesa City Library Dobson Ranch Branch 2425 S. Dobson Road Mesa AZ 85202
Cost:	Luncheon and presentation - $10.00 Special - No Charge for pre-registered attendees Vendor display tables available for $15.00
Registration:	RSVP by 8 September 2008 at our website or e-mail: http://www.imaps.org/chapters/freepass.asp / chunho.kim@intel.com Vendor display tables registration by 8 September 2008 at: http://www.imaps.org/registration/az2008jun.htm

MEMS Packaging Overview and Activities at Amkor

In recent years, the MEMS devices have witnessed an explosive growth in market size, as well as the number of applications. Areas as diverse as automotive, gaming, mobile communications, display, printing, fiber optics, and biomedical have benefited from the integration MEMS technology. As most MEMS devices are based on silicon wafer process technology, it is only natural for semiconductor companies, design houses, and wafer foundries to jump on the MEMS bandwagon. In this presentation, a high-level overview of the packaging aspects of MEMS will be discussed. Issues including the similarities/dissimilarities of MEMS vs. Si, existing package platforms with potential MEMS application, cost drivers, and current MEMS activity examples at Amkor will be reviewed.

Presented by:
Bob Kuo
Director of Advanced Package Development, Amkor Technology, Chandler, AZ

Bob Kuo received his Bachelor’s degree in Mechanical Engineering from National University of Taiwan, before he continued his pursue of graduate degrees in Materials Science (MS 1987, Ph.D.1993) at University of Rochester, NY. He spent 5 years with Polaroid Corp. in Boston area, in charge of optical metrology and new product development. Opportunity in working with Intel on their first CMOS camera optic module and warm weather lured him and his family to relocate in Tucson and joining Applied Image, Optics in 1997. His assignments there included managing the metrology group and then new business development. With the team Bob helped develop the world’s first plastic turn signal lens, first diffractive lens for digital imaging, first plastic lens for PC camera, and first plastic lens for cell phone camera modules. He left the company in pursue of consulting career, landing contracts in China, Taiwan, Singapore, and US. He joined Amkor in 1995 and is currently working as Director of Advanced Package Development, responsible for MEMS and photonics packages.

IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line ^ Top
The annual IMAPS Nordic 2008 conference will take place in Denmark, September 14-16. The 2008 conference will be held at the sea shore hotel Marienlyst, Helsingoer. The city Helsingoer with the famous Kronborg Castle has a direct train connection from the airport of Copenhagen.

A block of hotel rooms at the special IMAPS Nordic price was reserved until July 14. Room reservations are now on space available basis. For information of prices and hotel contact details, please read more at: http://www.imaps.org/chapters/europe/nordic/Past.asp.

The preliminary program can be found at: http://www.imaps.org/chapters/europe/nordic/Programme%20092.pdf.

The tutorial content can be found at: http://www.imaps.org/chapters/europe/nordic/LTCC_tutorial_IMST.pdf

The Registration page for conference, tutorial or exhibition can be found at:http://www.imapsnordic.org/registrations/

The Exhibition Invitation can be found at: http://www.imaps.org/chapters/europe/nordic/Exhibition%20letter%202008-draft%20c.pdf

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle (http://www.dompolonii.pultusk.pl) on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.The Conference topics will include:

Hybrid and Semiconductor Technology
Design Methods and Computer Simulations
Electronics Materials and Components
Microcircuits Applications
Thick-Film and Thin-Film Sensors
Packaging and PCB
Quality and Reliability Evaluation
Thermal Management
Optoelectronics and Photovoltaics
Education in Electronics

The Conference presentations will be made in the form of:

Invited lectures
Poster sessions for presentation of contributed papers

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl. If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40
E-mail: imaps2008@imio.pw.edu.pl

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.: +48-22 834 90 03
e-mail: imaps2008@imio.pw.edu.pl

Pittsburgh-area Technical Meeting September 24 on Thermal Management and Opto-electronics and Lab Tour of Penn State's Electro-Optics Center ^ Top

Date:	September 24, 2008
Location:	The Penn State Electro-Optics Center 222 Northpointe Blvd. Freeport, PA 16229 www.electro-optics.org \| Phone: 724-295-7000 Map and Directions (From Turnpike, Go North on 28, Take Exit 18, Right on Freeport Road, Left on Northpointe Blvd.)
Cost:	On-line/Early Fees: Deadline of September 22 at Noon Eastern IMAPS members $15.00. Non-members $25.00. Students $5.00.
Registration:	Register on-line on/before September 22, 2008 at our website: http://www.imaps.org/registration/2008pittsburgh.htm

Technical Program:

3:00: Welcome and Group Introductions

3:30: First Presentation: John Mazurowski, PSU’s Electro-Optics Center
“Perspectives on Photonic Packaging.”

4:00: Second Presentation: Robert Marchiando, Consultant in thermal management
"An overview of thermal management in optoelectronics"

4:30: 15 minute break

4:45: Third Presentation: Tony Thermitus, Anter Corporation
"A new method to measure the thermal resistance of thermal interface materials."

5:15: Dinner

6:00 Lab Tour of Electro-Optics Center (US citizenship required)

6:45: Wrap-up Compile possible dates, locations, speakers, and topics for next event.

On-line registration

For more information, contact Steve Greene, IMAPS Membership Manager - sgreene@imaps.org, 202-548-8711.

September 25 Technical Meeting and Tour at CALCE (University of Maryland) Addressing Packaging Challenges in Defense Applications ^ Top

Date:	September 25, 2008
Location:	Center for Advanced Life Cycle Engineering (CALCE) University of Maryland, College Park CALCE, 1103 Engineering Lab Building 301-405-5323 Map, Directions, and Metro-Parking
Cost:	On-line/Early Fees: Deadline of September 22 at 5pm Eastern IMAPS members $10.00. Non-members $20.00. Students $5.00.
Registration:	Register on-line on/before September 22, 2008 at our website: http://www.imaps.org/registration/2008chesapeake.htm

Technical Program:

5:00 Registration and Introductions

5:30 Catered Dinner

6:30 CALCE Tour – Dr. Patrick McCluskey

7:20 First Presentation: Michael Deeds, Navy Research Labs
“SOI in High G Environments”

7:50 Second Presentation: Bruce Geil, Army Research Labs
“Power and Thermal Challenges for Advanced Army Land Systems”

8:20 Wrap-up and suggestions for the next local program

On-line registration

For more information, contact Steve Greene, IMAPS Membership Manager - sgreene@imaps.org, 202-548-8711.

October 1 Central Texas Chapter Vendor's Day and Technical Program ^ Top

Date:	October 1, 2008
Location:	UT-PRC Commons Center Building Braker Lane & Burnet Road Austin, TX
Cost:	This event is complimentary for IMAPS members and guests.
Registration:	Click Here to Register

Program:

10:30 – 5:00 Vendor Show Hours

11:20 - First Presentation, Glenn Robertson of Process Sciences
"X-Ray Inspection for Electronics Quality and Reliability" (30-45 mins)

Noon - Complimentary Lunch

1:00 - Second Presentation, David Carey of Portelligent
"High-Density Packaging Trends in Portable Electronics" (30-45 mins)

2:30 - Third Presentation, Cheryl Tulkoff and Jim Lance of National Instruments
"Electronics Reliability Prediction Using the Product Bill of Materials" (30-45 mins)

3:00 - 5:00 Afternoon refreshments and networking

3:30 - Fourth Presentation, Bert Haskell of Heliovolt
"Thin Film Photovoltaic Technology and Solar Cell Module Design" (30-45 mins)

5:00 - 8:00 door64.com Networking Event sponsored by the Central Texas Electronics Association (CTEA)

For more information, contact Steve Greene, IMAPS Membership Manager - sgreene@imaps.org, 202-548-8711.

Upstate New York and Garden State Chapter Joint Technical Meeting and Tabletop Exhibition Being Held October 2 ^ Top

Date:	October 2 , 2008
Location:	Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, N.Y. 13760 Phone: 866 820-4820 Map and Directions
Cost:	On-line/Early Fees: Deadline of September 29 at 5pm Eastern IMAPS members $35.00. Non-members $45.00. Students $5.00. Vendors $175.00
Registration:	Register on-line on/before September 29, 2008 at our website: http://www.imaps.org/registration/2008nygarden.htm

Technical Program:

9:00 “Power Ribbon Interconnects.” Mike McKeown, Orthodyne Electronics

9:30 “Flip-Chip Packaging.” William Bernier, IBM10:00 Refreshment Break

10:45 “Trends of Embedded Passive and Active Devices.” Karen Carpenter, TechSearch Intl.

11:15 “Potential of Flexible Electronics in Biology and Medicine.” James Turner, Binghamton University

11:45 “C4NP.” Eric Perfecto, IBM 12:15 Lunch

1:15 “Advanced Packaging Requirements.” How Lin, Endicott Interconnect

1:45 “New Materials for Advanced Packaging.” Karl Dietz & Chester Balut, DuPont

2:15 Refreshment Break

3:00 “PZT Packaging.” Charles Woychik, GE Global Research

3:30 “Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World.” Kevin Knadle, Endicott Interconnect

4:00 "Is the Outsourcing Gold Rush to Asia Over?” Edward Slavetski, Endicott Interconnect

4:30 - 7:00 Networking and Dinner

Registration:
Click Here to Register

For more information, visit http://www.imaps.org/programs/nygarden08oct.htm or contact Steve Greene, IMAPS Membership Manager - sgreene@imaps.org, 202-548-8711.

7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:

Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
LED, Solar cell

For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr.

IMAPS Taiwan Co-Organizing the 3rd IMPACT & 10th EMAP Joint Conference ^ Top
The IMAPS Taiwan Chapter is co-organizing the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The joint conferences are being held October 22-24, 2008, at the Taipei Nangang Exhibition Hall, in Taipei, Taiwan.

Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry.

Organized by IMAPS-Taiwan, IEEE CPMT-Taipei, ITRI, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a “Creative Collaboration, More Than Packaging” program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.

For more information, please visit http://www.impact-emap.org/2008/General/.

Call for Paper Extended to September 15 for IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^ Top

Date:	December 15-18, 2008
Schedule:	December 15: pre-conference one-day Tutorial/Workshop discuss December 16-18: Conference and Exhibition
Location:	JRD Tata Auditorium National Institute of Advanced Studies [NIAS] Indian Institute of Science [IISc] Campus Bangalore-560 012, India Web: www.nias.res.in
Cost:	1. Conference: General - Rs 3500/$350 IMAPS [India Chapter] Members - Rs 2500 Students - Rs 1000 Authors - Rs 2500 / $250 2. Tutorial / Workshop: General - Rs 2000 / $200 IMAPS [India Chapter] Members - Rs 1500 Students - Rs 1000
Time Table:	Submission of Abstract : extended until 9/15/2008 Intimation of Acceptance : 10/9/2008 Submission of Full Text Paper (Camera ready) : 11/1/2008 Paper presentation : At the Conference

Micro Systems : Design to Manufacturing

"CALL FOR PAPERS

”Extended to September 15, 2008 : Authors are invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (joshi610@yahoo.com) immediately. For more information, visit www.imapsindia.org.

Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.

IMAPS France - 4th European ATW on Micropackaging and Thermal Management ^ Top
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.

In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:

Cooling for microelectronics packaging Microcooling solutions Heat condcutive materials Chip, board and system thermal management Thermal modelisation and simulation Heatsinks, heatpipes and other cooling products Liquid and phase change cooling New cooling solutions Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components

Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at imaps.france@imapsfrance.org.

IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^ Top
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.

Please submit your Abstract to the Secretariat of IMAPS-UK (imapsuk@aol.com) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November

The Call for Papers and other information are available at www.imaps.org.uk.

Prof Nihal Sinnadurai
Conference Chair MicroTech 2009

EMPC 2009 - European Microelectronics and Packaging Conference ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

Products and Publications

Advancing Microelectronics September/October 2008 On-line Magazine is Now Available ^ Top
The September/October IMAPS 2008 "Show Issue" of Advancing Microelectronics is now available on-line. View the September/October 2008 issue on-line today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 14-16, 2008
Palo Alto, CA
*Exhibitors contact abell@imaps.org

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL
*Exhibitors contact abell@imaps.org

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ
*Exhibitors contact abell@imaps.org

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO
*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
May 5-7, 2009
Dearborn, MI

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