IMAPS 2008, Providence, Rhode Island - Housing Raffle Deadline TODAY Tuesday, September 30 ^
The advance program and registration for IMAPS 2008, the 41st International Symposium on Microelectronics, is now available on-line. The 2008 symposium returns to the northeast from November 2-6 at the Rhode Island Convention Center in Providence. The hotel deadline is today, Tuesday, September 30. After today, IMAPS cannot guarantee pricing or room availability. If you book your rooms today, you will automatically be entered into our housing raffle.
19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.
Registration Deadline This Friday, October 3 for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management ^
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is being held October 14-16, 2008, at the Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California. The early registration deadline is this Friday, October 3, 2008. Registration fees will increase after Friday.
The technical program and registration forms are available at www.imaps.org/thermal. is being finalized this week. Sessions/presentations are planned in the following areas:
Thermal Interface Materials
Equipment and Test
High Conductivity Materials
For more information, visit www.imaps.org/thermal. This workshop will now feature a limited number of tabletop booths. Tabletop space has sold out!
Registration Deadline This Thursday, October 2 for IMAPS Lunch and Learn PDC Webinar 3-Course Series on Hermeticity Packaging Concepts ^
This three-session on-line Professional Development Course (PDC) webinar will run:
Monday, October 6, Tuesday, October 14, and Tuesday, October 21, 2008
All webinars will be held 12:00 noon - 1:00 pm EST
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500
Register On-line Registration Deadlines: October 2, October 10 and October 17, 2008
Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community. Specifically, in the area of MEMS/MOEMS packaging, medical implants, optoelectronic components and packaging for Military and Space. This on-line PDC is a series of 3 one hour lectures which can be taken in total or separately depending on the experience level of the student and topics of interest. Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.
Monday, October 6 -- 12:00-1:00 PM EST
In this lead off session the basic concept of hermeticity will be defined. There are a variety of ways to create a hermetic seal each one of these will be briefly discussed from a material and processing standpoint. Then the basic theory of moisture ingress and rationale for the military RGA 5000 PPM specification will be described.
Hermeticity defined…A reason to seal
Hermetic seal processes
Moisture ingress into a sealed package
Residual Gas Analysis and the military specification
Tuesday, October 14 -- 12:00-1:00 PM EST
In this session we’ll examine the conventional helium fine and gross leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration. We’ll discuss the theory behind the test method and point out some of the common pitfalls.
Helium Fine Leak Testing
Howl and Mann Flexible equation
Fixed Table method
Gross leak bubble testing
Tuesday, October 21 -- 12:00-1:00 PM EST
Optical Leak Test (OLT) is a method that makes use of a laser interferometer to measure out plane deflection on a lid surface in response to a changing pressure and relates these measurements to an equivalent helium leak rate. Cumulative Helium Leak Detection (CHLD) is a hermeticity test technique that can measure leak rates as low as 10E-13 He cc/sec. Both methods allow for both gross and fine leak detection in a single test cycle and without the use of a liquid.
Optical Leak Testing (OLT)
Cumulative Helium Leak Detection (CHLD)
Who Should Attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.
Course attendees will have access to all the course notes and in addition will receive a complimentary complementary copy of "Practical Guide to TM 1014" authored by the Instructor.
Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran-owned small business. He has over twenty-five years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits for military and commercial communication satellites. Tom has demonstrated expertise in seam sealing and leak testing processes. He has conducted experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. He has experience with OLT (Optical Leak Technology) and CHLD (Cumulative Helium Leak Detection). Tom is an active IMAPS member and has a B.S. in Materials Engineering for Lehigh University and a Masters from the University of Utah.
Register On-line Registration Deadlines: October 2, October 10 and October 17, 2008
Device Packaging 2009 - Abstract Deadline Extended Until October 15 ^
The Fifth Annual Device Packaging Conference (DPC 2009) will be held in Scottsdale/Fountain Hills, Arizona, on March 9-12, 2009. For more information, visit www.imaps.org/devicepackaging.
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than Wednesday, October 15, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at email@example.com or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at firstname.lastname@example.org or by phone at 202-548-8717. Only 20 booths are available at this time.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at email@example.com later than this October 15, 2008.
listed in chronological order)
TOMORROW: October 1 Central Texas Chapter Vendor's Day and Technical Program - LOCATION CHANGE ^
October 1, 2008
Norris Conference Center at Northcross Mall
This event is complimentary for IMAPS members and guests.
11:20 - First Presentation, Glenn Robertson of Process Sciences
"X-Ray Inspection for Electronics Quality and Reliability" (30-45 mins)
Noon - Complimentary Lunch
1:00 - Second Presentation, David Carey of Portelligent
"High-Density Packaging Trends in Portable Electronics" (30-45 mins)
2:30 - Third Presentation, Cheryl Tulkoff and Jim Lance of National Instruments
"Electronics Reliability Prediction Using the Product Bill of Materials" (30-45 mins)
3:00 - 5:00 Afternoon refreshments and networking
3:30 - Fourth Presentation, Bert Haskell of Heliovolt
"Thin Film Photovoltaic Technology and Solar Cell Module Design" (30-45 mins)
5:00 - 8:00 door64.com Networking Event sponsored by the Central Texas Electronics Association (CTEA)
For more information, contact Steve Greene, IMAPS Membership Manager - firstname.lastname@example.org, 202-548-8711.
TOMORROW: October 1 Northern California Chapter Lunch Meeting Featuring Presentation on Inkjet Printing for MEMS Fabrication ^
October 1, 2008
1217 Wildwood Ave
Sunnyvale, CA 94089
Students (with ID) $10.00
Please email Gina Love at email@example.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.
Inkjet Printing for MEMS Fabrication
Speaker: Prof. Joel Kubby, Baskin School of Engineering University of California Santa Cruz
The use of inkjet printing to fabricate Micro-Electro-Mechanical Systems (MEMS) will be reviewed. Prof. Kubby and colleagues are investigating the use of sintered silver nanoparticle inks for the structural layer and polymers for the sacrificial layer in printed MEMS fabrication. As an example, inkjet printing technology has been used to fabricate microwave transmission lines for an RF MEMS switch on a glass substrate (with MEMTronics Corporation). 50 μm resolution was obtained using 10 pL drop volumes on a Corning 7740 glass substrate. The conductivity of the sintered silver structures were 1/6 that of bulk silver after sintering at a temperature much lower than the melting point of bulk silver. A comparison of the DC resistance of the sintered silver showed that it can match the performance for electroplated and etched copper. Printed coplanar lines demonstrated losses of 1.62 dB/cm at 10 GHz and 2.65 dB/cm at 20 GHz. The printing of MEMS hot-wire anemometer sensors for use in aeronautical applications (with Tao of Systems Integration) will also be discussed.
Joel Kubby is an Associate Professor of Electrical Engineering in the Baskin School of Engineering at the University of California at Santa Cruz. His research is in the area of Micro-Electro-Mechanical Systems (MEMS) with applications in Optics, Fluidics and Bio-MEMS. Prior to joining the University of California at Santa Cruz in 2005, he was an Area Manager with the Wilson Center for Research and Technology and a Member of the Technical Staff in the Webster Research Center in Rochester New York (1987-2005). While with Xerox he received a Xerox Excellence in Science and Technology Award. Prior to Xerox he was at the Bell Telephone Laboratories in Murray Hill New Jersey working in the area of Scanning Tunneling Microscopy (STM). While at Bell Labs he received an Exceptional Contribution Award. He has led a six company industrial research consortium under the National Institute of Standards and Technology’s Advanced Technology Program (ATP) to develop a new process for optical MEMS and has over 78 patents and 40 journal publications. He is the co-chair of the SPIE Silicon Photonics conference and the MEMS Adaptive Optics conference.
For more information, contact Steve Greene, IMAPS Membership Manager - firstname.lastname@example.org, 202-548-8711.
THIS THURSDAY: Upstate New York and Garden State Chapter Joint Technical Meeting and Tabletop Exhibition Being Held October 2 ^
October 2 , 2008
Endicott Interconnect Technologies, Inc.
The event is being held at the McKinley on the corner of North Street and McKinley Ave in Endicott 13760. You can use 1701 North Street to get to parking for the event.
Phone: 866 820-4820
On-line/Early Fees: Deadline of September 29 at 5pm Eastern IMAPS members $35.00.
On-line registration closed on September 29, 2008. You must register on-site for this event.
9:00 “Power Ribbon Interconnects.” Mike McKeown, Orthodyne Electronics
9:30 “Flip-Chip Packaging.” William Bernier, IBM10:00 Refreshment Break
10:45 “Trends of Embedded Passive and Active Devices.” Karen Carpenter, TechSearch Intl.
11:15 “Potential of Flexible Electronics in Biology and Medicine.” James Turner, Binghamton University
11:45 “C4NP.” Eric Perfecto, IBM 12:15 Lunch
1:15 “Advanced Packaging Requirements.” How Lin, Endicott Interconnect
1:45 “New Materials for Advanced Packaging.” Karl Dietz & Chester Balut, DuPont
2:15 Refreshment Break
3:00 “PZT Packaging.”Charles Woychik, GE Global Research
3:30 “Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World.” Kevin Knadle, Endicott Interconnect
4:00 "Is the Outsourcing Gold Rush to Asia Over?” Edward Slavetski, Endicott Interconnect
Optical Leak Test (OLT) Technology in Production Applications
Chris Aubertin, NorCom Systems Inc.
Much has been written about the shortfalls in conventional Helium mass spectroscopy and bubble leak testing for fine and gross leak inspection of hermetically sealed components. These problems include: one way leakers, Helium absorption on the package body, “virtual leakers,” false readings for small volume packages, repeatable leak rate test coverage in the 10-05 cc-atm/sec range, problems with helium backfills, product contamination and masking of fine leaks during bubble testing, high bomb pressures and long cycle times, and the inability to test at the board level. There have been numerous papers describing each of these problem areas in painstaking detail.
Optical Leak Testing (OLT) is a viable hermeticity test technique that addresses all of the above. It’s a proven high volume Fine and Gross leak test that has been embraced by, the Hybrid, discrete device, and medical device manufacturers, as well as Aerospace companies and DoD agencies. Since 1995 OLT has been an accepted leak test method in Mil-Std TM1014, conditions C4 and C5. OLT technology has evolved and improved to the point, where the OLT test equipment displays the leak rate measurement in the familiar units of cc-atm/sec., eliminating the need for leak rate vs. lid deflection plots. Using OLT technology devices are placed in a test chamber and exposed to a pressurized low molecular weight gas such as helium. If the package is leaking, the lid deflects in response to a changing pressure as the device cavity and test chamber pressure come to equilibrium. Precision chamber pressure measurements combined with individual package lid stiffness and velocity data, obtained by laser holography, are used to determine package leak rates in helium cc-atm/sec LHe. The ultimate sensitivity of the instrument is a function of package volume, chamber working pressure and test time. The method has demonstrated a very high level of accuracy and repeatability. Beta site test correlation data from an actual production line will be presented and discussed.
Mr. Aubertin has been Vice President and General Manager of NorCom Systems Inc. a manufacturer of Optical Leak Inspection equipment in Norristown, PA, since 1998. The company provides production systems and services for hermetic seal inspection of electronic devices including opto-electronics, hybrids, MEMS, Hi-Rel, as well as medical devices. He was instrumental in the development and manufacturing of the first production Optical Leak Test systems in 1992, that were first included in MIL-STD -883 and MIL-STD-750 in 1995.These systems have since been purchased and used by over fifty companies worldwide for gross and fine leak production hermetic inspection.
For the past twenty six years, Mr. Aubertin has worked in the field of non-destructive inspection (NDI). He managed the development and production of laser based optical inspection systems for Laser Technology Inc. (LTI). These systems detect sub-surface flaws in composite materials using optical Shearography and Holography. He helped develop and manufacture the first electronic Shearography systems in 1986 for the Northrop B-2 Bomber program, and these LTI systems have been used on a wide variety of inspection programs including the Space Shuttle, F-22, Cessna Citation and the X-33.
Chris is a member of the (American Society of Non destructive Testing) and IMAPS (International Microelectronics And Packaging Society).
7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008. The topics of the year will be in the area of the followings:
1:30: First Presentation, Scott Morris, RF Micro Devices
“Conformal Shielding on Multichip Modules”
2:00: Second Presentation, George Sears of Lord Corporation
"Technology Innovations Applied to Wafer-Level Encapsulants and Thermal Interface Materials”
2:30: Facility Tour of Lord Corporation
3:15: Refreshment Break, Sponsored by Lord Corporation
3:30: Third Presentation, Chet Balut of DuPont Electronic Technologies
"Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating"
4:00: Fourth Presentation, Dr. David Seeger, Semiconductor Research Corporation
"Presentation title is TBD"
Compile possible dates, locations, speakers, topics, and volunteers for next event.
IMAPS Taiwan Co-Organizing the 3rd IMPACT & 10th EMAP Joint Conference ^
The IMAPS Taiwan Chapter is co-organizing the 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference and the 10th International Conference on Electronics Materials and Packaging (EMAP). The joint conferences are being held October 22-24, 2008, at the Taipei Nangang Exhibition Hall, in Taipei, Taiwan.
Taiwan acts as a globally pivotal position in the IC packaging, testing and PCB industry with high percentage revenues on 54.3% of IC packaging, 65.5% of testing and 26.6% of PCB industry.
Organized by IMAPS-Taiwan, IEEE CPMT-Taipei, ITRI, ISU University, SMTA and TPCA, the 3rd IMPACT and the 10th EMAP Joint Conference and TPCA Show 2008 are expected to establish a “Creative Collaboration, More Than Packaging” program to bring together scientists, engineers and experts actively engaged in research and development on Microsystems, IC Packaging, Assembly, Materials and PCB to discuss the current progress and emerging technologies in the fields.
IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
December 15-18, 2008
December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition
JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India
IMAPS [India Chapter] Members -
Rs 2500 / $250
2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference
Micro Systems : Design to Manufacturing
"CALL FOR PAPERS
Authors were invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (email@example.com) immediately. For more information, visit www.imapsindia.org.
Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.
IMAPS France - 4th European ATW on Micropackaging and Thermal Management^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle. The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don't facilitate the mastering of the thermal impedances.
In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Cooling for microelectronics packaging
Heat condcutive materials
Chip, board and system thermal management
Thermal modelisation and simulation
Heatsinks, heatpipes and other cooling products
Liquid and phase change cooling
New cooling solutions
Experience return (products and systems cooling, power electronics, automotive, transport,...)
Thermal management of opto electronics components
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at firstname.lastname@example.org.
IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
We invite you to submit your Abstract of between 250 and 500 words which should include results and graphics. Papers from industry are especially important. Industry papers may have product content but must not be commercial. Selected speakers will also benefit from the opportunity for papers to be selected from the Seminar Proceedings for publication in refereed journals and in IEEE Explore.
Please submit your Abstract to the Secretariat of IMAPS-UK (email@example.com) no later than 31st October 2008. We will notify authors of the selection of papers no later than 30th November
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.