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April 1, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS 2009, San Jose - Abstracts Deadline Extended Until April 17 (read more...)

Button IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - Program and Registration Now On-line (read more...)

Button Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop (read more...)

Button Upcoming IMAPS PDC Webinars (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: Northern California Chapter April 1 Lunch Meeting on Conductive Polymer Interconnects for Low Cost Chip Scale Packages (read more...)

Bullet Next Tuesday: Garden State Chapter April 7 Dinner Meeting and Tour of R&D CIrcuits (read more...)

Bullet INTERCONEX 2009 Begins Next Week (read more...)

Bullet New England Chapter April 21 Dinner Meeting on Manufacturing and Reliability Challenges With QFN Packages in Pb and Pb Free Environments (read more...)

Bullet New England Chapter 36th Symposium and Expo on May 5 (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

Bullet Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS Introduces the Premier Corporate Membership (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

IMAPS 2009, San Jose - Abstracts Deadline Extended Until April 17   ^ Top
The 42nd International Symposium on Microelectronics will be held at the San Jose Convention Center, San Jose, California, USA, from November 1-5, 2009. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 42nd Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.

Planned Sessions Include:

Industry “Focused”

• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming

• Automotive, Industrial, Harsh Environment Electronics Applications

• Solar and Alternative Energy

Systems & Applications

• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices

Design

• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• 3D Packaging Approaches
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials

Materials and Process

• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics

Invited Session on Intelligent Uses of Precious Metals in Microelectronics

Uses of Precious Metals in Microelectronics
Recovery/Recycling/Refining
Precious metal trading
Future outlook for Precious Metal prices
Cost savings techniques and technologies
Leasing and pool accounts
Advantages of Precious Metals over non Precious metals
Substitute materials
Volume reduction (diameter, thickness etc)
New Applications using Precious Metals
More Information...

Translated
(Invited Speakers Only)

• Japanese (Japanese to English translation)

Interactive Poster Session

Outstanding papers that do not fit in planned or created sessions will be considered for this interactive session.

Please send your 250-300 word abstract electronically only on/before Friday, April 17, 2009, using the On-line submittal form at: www.imaps.org/abstracts.htm. For more information about IMAPS 2009, visit www.imaps2009.org.

All Speakers are required to pay a reduced registration fee. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 305-382-8433

IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - Program and Registration Now On-line   ^ Top
IMAPS and SEMI proudly announce the 2nd Annual Topical Workshop on Wire Bonding. This workship will be held Monday, July 13, 2009, at the San Francisco Marriott Hotel in San Francisco, CA. This event will run prior to SEMICON West 2009 – July 14-16. The Early Registration Deadline is June 19. The Hotel Deadline is June 29. Full workshop details are on-line at www.imaps.org/wirebonding.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Monday, July 13, 2009

Registration: 8:30 am – 4:30 pm

Continental Breakfast: 8:30 am – 9:15 am

Opening Remarks: 9:15 am – 9:30 am

Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM

Nickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech GmbH

Wirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC

HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, Oerlikon ESEC USA Inc.

Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM

The Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSD

Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH

Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College


Break: 11:00 am – 11:15 am


Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting

Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc.

Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics

Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH

LUNCH: 12:15 pm – 1:15 pm

Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PM

Odd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.

Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.

Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbH

Break: 2:45 pm – 3:15 pm

Copper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.

Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software

Closing Remarks: 4:15 pm

Register On-line for Wire Bonding

Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full conference details are available at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later May 15, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due July 24, 2009, for all accepted abstract.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. 

Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop    ^ Top
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • SIP

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 22, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Upcoming IMAPS PDC Webinars    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s). Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

The following webinars have been scheduled:

IMAPS PDC Webinar Series on
Introduction to Multilayer Ceramics -- TODAY
Presented by: Dr. Fred Barlow, University of Idaho
This three-session on-line Professional Development Course (PDC) webinar will be held: Wednesdays, April 1, 8, 15, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Signal Integrity and Precision Design in Digital Systems
Presented by: Dr. Lei Shan, IBM T J Watson Research Center
This three-session on-line Professional Development Course (PDC) webinar will be held: Wednesdays, May 6, 13, 20, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Precious Metal Powder/Flakes and their Application in Microelectronic Packaging (Details Available Soon)
Presented by: Dr. Guixiang Yang and Gary Hemphill, Technic, Inc.
This two-session on-line Professional Development Course (PDC) webinar will be held: Mondays, May 11, 18, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems
Presented by: Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, June 9, 16, 23, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Lead-Free Soldering
Presented by: Dr. Jianbiao (John) Pan, Cal Poly State University
This two-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, June 18, 25, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip (Details Available Soon)
Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, September 22, 29, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

 

Chapter Activities (events listed in chronological order)

TODAY: Northern California Chapter April 1 Lunch Meeting on Conductive Polymer Interconnects for Low Cost Chip Scale Packages    ^ Top

Date: April 1, 2009
Time: 11:30 am - 1:00 pm
Location:

The Lookout
605 Macara Avenue
Sunnyvale, CA 94086

Registration:

Members/General $20.00
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at glove@cctlaser.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.

Program:

Conductive Polymer Interconnects for Low Cost Chip Scale Packages
Speaker: Marc Robinson, CTO, Vertical Circuits, Inc.

11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation

Abstract:

Driven by the proliferation of high volume, small, portable consumer applications, package development efforts throughout the industry have focused on reducing footprint and reducing package thickness to maximize silicon functionality in a given area and/or given volume. To meet aggressive and competitive end product needs there has been much focus on chip scale packaging, wafer level processing, and stacking of ultra thin die. However, wirebonding to extremely thin die presents a number of problems, including breakage and yield. Vertical Circuits, Inc. (VCI) has pioneered the use of conductive polymers for electrical interconnect of die stacks and stacked packages to reduce the forces applied to the die, increase yield, lower cost, and reduce package size. The presentation will review the characteristics of conductive polymers used for chip and package interconnections and the near-TSV package assemblies that can be built without wire bonds.

Speaker Bio:

Marc Robinson is the CTO of Vertical Circuits Inc. and currently focuses on intellectual property strategy and analysis for VCI. Marc joined VCI, in 1996, as Vice President of Engineering and Operations, taking his current role as VCI’s CTO in 2001. Before joining VCI, he served as Vice President, Technology Development and Quality, for Sierra Semiconductor. Prior to Sierra, Marc was Vice President of Engineering, and Vice President of TQM and Quality at GEC Plessey Semiconductors, where he focused on product development and design quality and prior to GEC Plessey, he served as a Business Unit Director at International Microelectronics Products (IMP). Marc holds a BS in Physics from The Cooper Union, and an MS in Physics from Franklin & Marshall. He is a member of IEEE and IMAPS.

Next Tuesday: Garden State Chapter April 7 Dinner Meeting and Tour of R&D CIrcuits    ^ Top

Date: April 7, 2009
Time: 3:30 pm - 8:00 pm
Location:

Holiday Inn – South Plainfield-Piscataway
4701 Stelton Road
South Plainfield, NJ 07080
Map and Directions to Holiday Inn –Click here 

Registration:

Registration fees:
Dinner and presentations: Industry - $25 IMAPS members, $ 35 non-members. Students - $ 10.00 Tour only, no charge but you must RSVP!

Program:

3:30   Registration, Networking, and Opening Remarks

4:30   “Thermomechanical Finite Element Techniques in LTCC Package Design."  
                    Mark Eblen, R&D Program Manager of Kyocera America, Inc.”
                         
5:00    “Injection Molded Soldering (IMS) for Fine-pitch Substrate Bumping."
                    Jae-Woong Nah,  Research Staff Member, IBM

5:30   “Alternatives to Solder Attach in Micro-electronics using Epoxies and Ribbon Bonding"
                    James Yunan, Senior Process Engineer at Aeroflex KDI.

6:00  Dinner and Closing Remarks (planning the next event, recruiting chapter officers).

7:00 One-hour tour at R & D Circuits, Inc. 
          (Hybrid circuit board with organic materials.  And possibly circuit miniaturization.)

          Tour Information:
          Tom Bresnan, Sales Manager
          R & D Circuits, Inc. 3601 S. Clinton Ave. South Plainfield, NJ 07080

INTERCONEX 2009 Begins Next Week    ^ Top

Date: April 7-8, 2009
Location:

Congress Centre of La Villette
Paris, France

Within INTERCONEX 2009, the technical committee is organizing the technical program on the following topics:

KEYNOTE PAPERS:

  • Packaging & Application of Power LED Devices
  • Packaging and reliability challenges of high pin count circuits

A one day technical workshop on:

  • Microelectronics and packaging for medical and healthcare applications

Technical conferences on the following subjects:

  • Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
  • Flip-chip (substrates and board technologies),
  • Reliability, thermal management,
  • Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
  • Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
  • Modelling, simulation & design, ….
  • Characterization & test,
  • Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
  • Systems (optic, photonic, harsh environment, …)

For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.

New England Chapter April 21 Dinner Meeting on Manufacturing and Reliability Challenges With QFN Packages in Pb and Pb Free Environments    ^ Top

Date: April 21, 2009
Time: 5:30 PM Registration and Socializing
6:00 PM Dinner
6:50 PM Announcements
7:00 PM Presentation
9:00 PM Closing
Location:

Textron
Wilmington, MA

Registration:

Member $ 20.00
Non-Member $ 25.00
Retired Member $ 10.00
Student Member $ 5.00

RSVP REQUIRED: Mike Sivigny at smta@cetaq-americas.com
This reservation is a commitment; the amount due is payable by check or cash at the door. Failure to cancel by noon on Friday before meeting week may result in your being billed for costs incurred by the Chapter.

Pre-registration must be received by Wednesday before the event!! PLEASE NOTE: 1.) All attendees MUST be US Citizens. 2.) Pre-registered attendees, pls. bring drivers license. 3.) Late (non-pre-registered) attendees MUST bring a Passport or Birth Certificate to attend this SMTA/iMAPs Meeting on Tues, April 21, 2009 at Textron Defense Systems.

Manufacturing and Reliability Challenges With QFN Packages in Pb and Pb Free Environments

Cheryl Tulkoff, CRE
Senior Member of the Technical Staff DfR (Design for Reliability) Solutions http://www.dfrsolutions.com

Abstract:

One of the fastest growing package types in the electronics industry today is the Quad Flat Pack No Lead (QFN). It consists of an overmolded leadframe with bond pads exposed on the bottom and arranged along the periphery of the package. While the advantages of QFNs are well documented, DfR Solutions considers QFN as a ‘next generation’ technology for non-consumer electronic OEMs due to concerns with:

  • Manufacturability
  • Compatibility with other OEM processes
  • Reliability

Acceptance of this package, especially in long-life, severe environment, high-rel applications, is currently limited as a result. This presentation is designed to review the specific concerns in relation to design and process designs by CMs and OEMs and provide possible mitigations or solutions to allow the reliable introduction of QFN packaged components.

Speaker Bio:

Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked in both circuit card fabrication and assembly and semiconductor fabrication processes.

Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a published author, experienced public speaker and a Senior member of both ASQ and IEEE. She holds leadership positions in the IEEE Central Texas Chapter, IEEE WIE (Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections. She chairs the annual IEEE ASTR workshop and is also an ASQ Certified Reliability Engineer.

She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math) outreach & volunteers with several organizations specializing in encouraging pre-college students to pursue careers in these fields. She’ll also be returning to Boston in a few weeks to run her first Boston Marathon

New England Chapter 36th Symposium and Expo on May 5    ^ Top

Date: May 5, 2009
Location:

Holiday Inn Boxborough Woods
Boxborough MA

Registration:

Exhibitor Registration Form:
http://www.imapsne.org/Exhibitor_2009.doc

The Symposium Technical Committee is planning papers on the following subjects:

Industry
. Biomedical Electronics
. Telecom - Microwave
. Military Electronics
. Consumer Electronics
. Renewable Energy: Fuel Cells, Solar, Wind
. Thermal  Management
. Manufacturing, Outsourcing & Quality
. Software and Firmware Applications
. High Performance Interconnects and Boards
. Imaging Sensors

. Emerging Technologies

Advanced Processes & Materials
. 3D and High Density Packaging
. Photonic/ Optoelectronic packaging
. LED Packaging
. MEMS and Nano Packaging
. Underfill/ Encapsulants and Adhesives
. Green packaging / Compliance with RoHS
. Flip-Chip and Bumping: Processes, Reliability
. Wirebonding and Stud Bumping
. Embedded and Integrated Passives
. Ceramic, Polymer and Conductive Materials
. Cu/ Low-K

Poster Session

Visit http://www.imapsne.org/index009.html for complete information.

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)    ^ Top
Taiwan has kept the key technology and position in the world’s IC packaging, testing, thermal and PCB areas. For promoting the competition of Taiwan electronic industry, IEEE CPMT-Taipei, I-SHOU, ITRI, TPCA, IMAPS-Taiwan and SMTA cooperate again to hold the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009). Organizers expect the theme of IMPACT 2009, “IMPACT Your Future: Integration, Efficiency & Eco-Friendly”, will bring the concept of combination, high-efficiency and green tech. For this reason, organizers hope it would result in knowledgeable discussion and profound impact. This year, TTMA (Taiwan Thermal Management Association) join this Conference, which could attract papers from thermal management, cooling technology and energy saving. Besides, IMPACT 2009 will be held simultaneously with TPCA Show at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. Attendees not only could attend Conference, but also could enjoy this important Show.

Taiwan, Silicon Island acts as a crucial position among worldwide electronic industry with over 50% revenue on IC packaging, testing and thermal in the world. And Taiwan PCB industry also have 25% market share in the world. Taiwan plays an important role in high-tech industry because of these remarkable performances. Organizers hope this conference could provide an international platform for all foreign and domestic contributors to show their researches. Besides, it also could let overseas scholars and engineers understand the Taiwan technologic industrious development and achievement.

Last year, because 6 organizers cooperated together, there had 200 papers solicited and 600 foreign and domestic attendees joining in IMPACT. Meanwhile, organizers also arranged varied activities such as industrious sessions and “Best Student & Outstanding paper Award” ceremony. Moreover, those accepted papers would be embodied in IEEE Xplore. Therefore, the organizers expect this year will attract much more foreign scholars and R&D Researchers attending this important event to share experience and communicate with each other.

Contributions are very welcome from industry participants and academic researchers. The paper should be written and presented in English and the abstract should be submitted by June 7. Welcome to submit your paper by on-line registration. If you want to get more information, please feel free to contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402, Email: service@impact.org.tw. More information, please check IMPACT 2009 website: http://www.impact.org.tw.

Products and Publications

IMAPS Introduces the Premier Corporate Membership    ^ Top
IMAPS now offers a Premier Corporate Membership as the highest valued membership with the most benefits for organizations in microelectronics. For only $2,500, a Corporate Premium Member can benefit from over $9,000 in discounts and savings. This new corporate membership includes the followign benefits:

  • Quarter-page “Welcome” notice with logo in Advancing Microelectronics for new corporate premium members
    • Reach over 4,000 subscribers worldwide.
    • A $590 value.
  • 12 Month Complimentary Advertisement on the IMAPS Website
    • IMAPS website averages more than 1,000,000 hits or 260,000 page views per month.
    • A $1,395 value.
  • 15% Discount on Print Advertisement in Advancing Microelectronics
    • A $500 value based on estimated annual cost.
  • 3 Months’ Complimentary Advertisement in the Corporate Email Bulletin
    • Sent to all members, prospects and other emails listing in our full database.
    • A $1,140 value.
  • 3 Months’ Complimentary Advertisement in the Weekly Email Bulletin
    • Sent to all members, prospects and other emails listing in our full database.
    • A $1,140 value.
  • 30% Discount on Webcast Sponsorship
    • A $600 value.
  • 3 times per membership year, FREE rental of the IMAPS Membership List, upon request
    • Only IMAPS and its Corporate Members have access to this valuable listing of microelectronic professionals. This list provides a great opportunity for targeted direct marketing.
    • A $1,500 value
  • Member Discounts to exhibit at IMAPS events including the Annual Symposium
    • An estimated $450 value based on estimated annual cost.
  • 5 Individual  IMAPS Memberships
    • Includes 1 for the corporate contact, plus 4 additional
    • A $375 value.
  • Membership in the Global Business Council
    • Includes a discount to attend GBC conferences and access to GBC conference presentations.
    • A $600 value.
  • Unlimited Downloads on iKnow Microelectronics on-line library
    • IP recognition allowing unlimited downloads for all computers at one network/office.
    • A $2,500 value.
  • JOBS Marketplace
    • Post unlimited job openings
    • Unlimited resume searches
  • Access to the On-Line IMAPS Industry Guide
    • The internet's most comprehensive listing of individuals & companies providing products & services to the microelectronic and packaging industry.
    • Company listing, with link to your company website
    • Unlimited product & service listings
    • Searchable, access to the entire IMAPS database
    • Upgraded and enhanced, secure log-in procedure
  • Access to Information
    • Subscription to Advancing Microelectronics
    • Access to the On-line Journal of Microelectronics and Electronic Packaging
    • Searchable access to past Proceedings
    • Discounts on all publications purchased through IMAPS
    • Access to all "Members Only" areas on the IMAPS website
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Lorac - Furnace Experts

PDC Webinar Series on Introduction to Multilayer Ceramics (3 Sessions)
Session 1: April 1, 2009

Session 2: April 8, 2009
Session 3: April 15, 2009

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 1: May 6, 2009

Session 2: May 13, 2009
Session 3: May 20, 2009

TW on Wire Bonding
July 13, 2009
San Francisco, CA

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

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Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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