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April 21, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - Program and Registration Now On-line (read more...)

Button Upcoming Webinar on Signal Integrity and Precision Design in Digital Systems (read more...)

Button Call for Abstracts - ATW and Tabletop Exhibition on Thermal Management (read more...)

Button Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Register On-line for the New England Chapter 36th Symposium and Expo on May 5 (read more...)

Bullet Chesapeake Dinner Meeting on May 13 (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

Bullet Announcing Nordic Chapter 2009 Conference (read more...)

Bullet Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

   PRODUCTS AND PUBLICATIONS
IMAPS Introduces the Premier Corporate Membership (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - Program and Registration Now On-line   ^ Top
IMAPS and SEMI proudly announce the 2nd Annual Topical Workshop on Wire Bonding. This workship will be held Monday, July 13, 2009, at the San Francisco Marriott Hotel in San Francisco, CA. This event will run prior to SEMICON West 2009 – July 14-16. The Early Registration Deadline is June 19. The Hotel Deadline is June 29. Full workshop details are on-line at www.imaps.org/wirebonding.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Monday, July 13, 2009

Registration: 8:30 am – 4:30 pm

Continental Breakfast: 8:30 am – 9:15 am

Opening Remarks: 9:15 am – 9:30 am

Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM

Nickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech GmbH

Wirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC

HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, Oerlikon ESEC USA Inc.

Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM

The Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSD

Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH

Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College


Break: 11:00 am – 11:15 am


Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting

Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc.

Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics

Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH

LUNCH: 12:15 pm – 1:15 pm

Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PM

Odd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.

Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.

Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbH

Break: 2:45 pm – 3:15 pm

Copper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.

Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software

Closing Remarks: 4:15 pm

Register On-line for Wire Bonding

Upcoming Webinar on Signal Integrity and Precision Design in Digital Systems    ^ Top
This three-session on-line Professional Development Course (PDC) webinar will be held:
Wednesdays, May 6, 13, and 20, 2009

All webinars will be held 12:00 noon - 1:00 pm EST

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: May 5
Register On-line

Key Words

Signal integrity, precision design, digital system, interconnect, electrical performance, bandwidth, modeling, simulation, measurement, characterization, verification, loss, reflection, crosstalk, eye-diagram, S-parameter, skew, jitter

Program Description

Signal integrity margin keeps shrinking as electrical interconnect bandwidth increases. Accurate modeling and design trade-offs are required to achieve product electrical specifications and maintain system cost-effectiveness.

This professional development course provides the knowledge and skills required for the precision design of electrical interconnections. The course starts with a review of fundamental concepts of signal integrity in digital systems, followed by signal propagation along transmission lines and various discontinuities. Packaging structures which degrade signal integrity will be discussed, including their contribution to insertion loss, reflective ringing, and crosstalk.

Signal integrity analysis techniques will also be covered. With some example cases, the definition and interpretation of frequency domain S-parameters are introduced then correlated to time-domain eye-diagrams and impulse responses for “eye” quality, skew and jitter analysis. The power spectral density of signals as a function of data-rate, pattern, and waveform shape will also be discussed.

Modeling strategies designed to analyze signal integrity of system-level links will be presented with examples employing commercial modeling software. The criteria of model segmentation and setup are described as well as the importance of verifying models by correlating them with measurements. Both frequency-domain and time-domain link-level simulations will be demonstrated, followed by comparisons of different signaling schemes (S.E. vs. Differential) and effects of various equalization choices.

Hardware characterization is often a difficult task at high frequencies due to the parasitics of accessing the device under test (through vias or connectors not part of the desired structure). Measurements, calibration and structural de-embedding will be discussed for commonly used equipment such as vector network analyzers, time-domain reflectometers, and oscilloscopes.  

Finally, the effects of design and manufacturing tolerance will be discussed, including perforations on reference planes, high-density buses, power/ground mixed-referencing, layer misalignment, and material/geometry variations.

These 2 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 3: Wednesday, May 6 -- 12:00-1:00 PM EST

  • Introduction of signal integrity in digital systems
  • Signal propagation along transmission lines and various discontinuities
  • Packaging structures and their electrical characteristics
  • Electrical analysis: frequency domain
    • S-parameters
    • Insertion loss, reflection, crosstalk

Session 2 of 3: Wednesday, May 13 -- 12:00-1:00 PM EST

  • Electrical analysis: time domain
    • Impulse response, delay
    • Eye-diagram, skew, jitter
  • Power spectral density of digital signal
    • Data-rate, rise/fall time, pattern
    • Correlations: frequency-domain vs. time-domain
  • Mixed-referencing and system-level modeling strategies
    • Approaching to system-level designs
    • Effects of non-ideal return paths and power noise
  • Criteria of model segmentation and setup
    • 2D vs. 3D
    • Model dimensions
    • Ports and boundary condition

Session 3 of 3: Wednesday, May 20 -- 12:00-1:00 PM EST

  • Signaling scheme and equalization choices
    • Single Ended vs. Differential
    • Equalization choices
  • Measurement and calibration techniques
    • Calibration, de-embedding
    • VNA, TDR/TDT, BERT
  • Design and manufacturing tolerance
    • Design trade-offs
    • Manufacturing tolerance and the effects

Who Should Attend?

The course covers both fundamental knowledge and advanced analysis/characterization skills. Therefore, it is not only suitable for electrical engineers/managers, but also system designers who need to balance chip/packaging or electrical/mechanical trade-offs. Newcomers may also take it to jump start their careers.

Thomas Green

Presenter

Lei Shan received his MS in Electrical Engineering and Ph.D. in Mechanical Engineering from Georgia Institute of Technology in 2000. In 2001, he joined IBM T.J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member, where he works on high speed electronics/optoelectronics packaging designs and multi-physics modeling/simulations. He designed and demonstrated high speed packages on both connectorized format and BGA joints for 50Gbps multiplexer and demultiplexer based on IBM SiGe BiCMOS technology. He led the packaging development for 10G Ethernet and Terabus optical links on printed circuit board. His recent research interest is on precision designs and signal/power integrity in high-performance computing systems and the fundamental electrical limits. Shan has authored over 40 publications with three Best Paper Awards and owns over 20 US patents.

Register On-line For This Webinar

Call for Abstracts - ATW and Tabletop Exhibition on Thermal Management    ^ Top
IMAPS is now accepting abstracts for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management. This year's workshop will be held at Dinah's Garden Hotel in Palo Alto, California, from October 5 - 8. Full workshop details are available at www.imaps.org/thermal.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and telcom systems.  Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. The 2008 Workshop featured 42 technical presentations, eight of which were competition-selected presentations from university engineering graduate students.

Speakers are asked to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers pay a reduced registration fee.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
  • Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing.  Metallic, polymer matrix, CNT, thermal adhesives, and other materials.
  • High Conductivity Materials: Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
  • Liquid, Phase-Change, and Refrigeration Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.        
  • Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
  • Telecommunications Systems: Component- and system-level thermal solutions for high-performance telecommunications systems.
  • Consumer Electronics: Component- and system-level thermal management solutions for stationary and  mobile systems, including displays, desktop and notebook computers, and handheld devices.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 24, 2009.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 4, 2009.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full conference details are available at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later May 15, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due July 24, 2009, for all accepted abstract.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. 

Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop    ^ Top
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • SIP

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 22, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

 

Chapter Activities (events listed in chronological order)

Register On-Line for the New England Chapter 36th Symposium and Expo on May 5    ^ Top

Date: May 5, 2009
Location:

Holiday Inn Boxborough Woods
Boxborough MA

Registration:

The Symposium Technical Committee is planning papers on the following subjects:

Industry
. Biomedical Electronics
. Telecom - Microwave
. Military Electronics
. Consumer Electronics
. Renewable Energy: Fuel Cells, Solar, Wind
. Thermal  Management
. Manufacturing, Outsourcing & Quality
. Software and Firmware Applications
. High Performance Interconnects and Boards
. Imaging Sensors

. Emerging Technologies

Advanced Processes & Materials
. 3D and High Density Packaging
. Photonic/ Optoelectronic packaging
. LED Packaging
. MEMS and Nano Packaging
. Underfill/ Encapsulants and Adhesives
. Green packaging / Compliance with RoHS
. Flip-Chip and Bumping: Processes, Reliability
. Wirebonding and Stud Bumping
. Embedded and Integrated Passives
. Ceramic, Polymer and Conductive Materials
. Cu/ Low-K

Poster Session

Visit http://www.imapsne.org/index009.html for complete information.

Chesapeake Dinner Meeting on May 13    ^ Top

Date: May 13, 2009
Location:

National Electronics Museum (Click here for directions)
1745 West Nursery Road  
Linthicum, Maryland 21090-2906
Phone: 410-765-0230

Registration:

Cost:
IMAPS members - $ 10.00.
Non-members - $ 20.00.
Students – $ 5.00

RSVP before 5pm Eastern on May 11
http://www.imaps.org/registration/2009may_chesapeake.htm

Program:

5:15 Welcome and networking

5:45 Dinner served

6:00 Greg Caswell, Vice President of Engineering, Reactive Nano Technologies
“NanoBond® Assembly; Room Temperature Component Mount Soldering Technology.”

6:30 William McKinzie, WEMTEC, Inc.
“Electromagnetic Bandgap Structures for Microwave and Millimeterwave Applications in Multi-Layered Packages.”

7:00 Wrap-up.
Discuss date, location, and program of next event. Discuss interest on chapter leadership.

7:15 Optional self-guided tour of the electronics museum.

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

Announcing Nordic Chapter 2009 Conference    ^ Top

Dates: September 13-15, 2009
Location:

Quality Hotel, Tønsberg, Norway

On-line Info:

IMAPS Nordic is proud to announce this year’s conference in Norway. The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
 
You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2009. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than April 10. Speakers will be notified of paper acceptance by email by May 31.
The deadline for the final paper is July 10. 

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • Harsh environment,
  • Ceramics: thickfilm, copper plated, DBC, LTCC
  • Chip thinning & stacking, 3D-packaging, embedding
  • CSP, flip chips, area array
  • Future electronics, trends & strategies
  • High frequency packaging
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Manufacturing management & outsourcing
  • MEMS, MOEMS, sensor integration & applications
  • High temperature electronics
  • Microvia, HDI laminates, flex, embedded passives
  • Pb and halogen free electronics, methods and consequences
  • Reliability assessment, SPC
  • SMT and board assembly
  • System cost assessment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
Tutorial suggestions are also welcome to conference@imapsnordic.org.
For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)    ^ Top
Taiwan has kept the key technology and position in the world’s IC packaging, testing, thermal and PCB areas. For promoting the competition of Taiwan electronic industry, IEEE CPMT-Taipei, I-SHOU, ITRI, TPCA, IMAPS-Taiwan and SMTA cooperate again to hold the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009). Organizers expect the theme of IMPACT 2009, “IMPACT Your Future: Integration, Efficiency & Eco-Friendly”, will bring the concept of combination, high-efficiency and green tech. For this reason, organizers hope it would result in knowledgeable discussion and profound impact. This year, TTMA (Taiwan Thermal Management Association) join this Conference, which could attract papers from thermal management, cooling technology and energy saving. Besides, IMPACT 2009 will be held simultaneously with TPCA Show at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. Attendees not only could attend Conference, but also could enjoy this important Show.

Taiwan, Silicon Island acts as a crucial position among worldwide electronic industry with over 50% revenue on IC packaging, testing and thermal in the world. And Taiwan PCB industry also have 25% market share in the world. Taiwan plays an important role in high-tech industry because of these remarkable performances. Organizers hope this conference could provide an international platform for all foreign and domestic contributors to show their researches. Besides, it also could let overseas scholars and engineers understand the Taiwan technologic industrious development and achievement.

Last year, because 6 organizers cooperated together, there had 200 papers solicited and 600 foreign and domestic attendees joining in IMPACT. Meanwhile, organizers also arranged varied activities such as industrious sessions and “Best Student & Outstanding paper Award” ceremony. Moreover, those accepted papers would be embodied in IEEE Xplore. Therefore, the organizers expect this year will attract much more foreign scholars and R&D Researchers attending this important event to share experience and communicate with each other.

Contributions are very welcome from industry participants and academic researchers. The paper should be written and presented in English and the abstract should be submitted by June 7. Welcome to submit your paper by on-line registration. If you want to get more information, please feel free to contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402, Email: service@impact.org.tw. More information, please check IMPACT 2009 website: http://www.impact.org.tw.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. You are welcome to submit a paper (approx. 20 min.) covering one of the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Please send your abstract (approx. 200 words) until June 1, 2009 to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

A BEST PAPER price will be awarded ! !
You can also use the online service at: http://www.imaps.de!


Products and Publications

IMAPS Introduces the Premier Corporate Membership    ^ Top
IMAPS now offers a Premier Corporate Membership as the highest valued membership with the most benefits for organizations in microelectronics. For only $2,500, a Corporate Premium Member can benefit from over $9,000 in discounts and savings. This new corporate membership includes the followign benefits:

  • Quarter-page “Welcome” notice with logo in Advancing Microelectronics for new corporate premium members
    • Reach over 4,000 subscribers worldwide.
    • A $590 value.
  • 12 Month Complimentary Advertisement on the IMAPS Website
    • IMAPS website averages more than 1,000,000 hits or 260,000 page views per month.
    • A $1,395 value.
  • 15% Discount on Print Advertisement in Advancing Microelectronics
    • A $500 value based on estimated annual cost.
  • 3 Months’ Complimentary Advertisement in the Corporate Email Bulletin
    • Sent to all members, prospects and other emails listing in our full database.
    • A $1,140 value.
  • 3 Months’ Complimentary Advertisement in the Weekly Email Bulletin
    • Sent to all members, prospects and other emails listing in our full database.
    • A $1,140 value.
  • 30% Discount on Webcast Sponsorship
    • A $600 value.
  • 3 times per membership year, FREE rental of the IMAPS Membership List, upon request
    • Only IMAPS and its Corporate Members have access to this valuable listing of microelectronic professionals. This list provides a great opportunity for targeted direct marketing.
    • A $1,500 value
  • Member Discounts to exhibit at IMAPS events including the Annual Symposium
    • An estimated $450 value based on estimated annual cost.
  • 5 Individual  IMAPS Memberships
    • Includes 1 for the corporate contact, plus 4 additional
    • A $375 value.
  • Membership in the Global Business Council
    • Includes a discount to attend GBC conferences and access to GBC conference presentations.
    • A $600 value.
  • Unlimited Downloads on iKnow Microelectronics on-line library
    • IP recognition allowing unlimited downloads for all computers at one network/office.
    • A $2,500 value.
  • JOBS Marketplace
    • Post unlimited job openings
    • Unlimited resume searches
  • Access to the On-Line IMAPS Industry Guide
    • The internet's most comprehensive listing of individuals & companies providing products & services to the microelectronic and packaging industry.
    • Company listing, with link to your company website
    • Unlimited product & service listings
    • Searchable, access to the entire IMAPS database
    • Upgraded and enhanced, secure log-in procedure
  • Access to Information
    • Subscription to Advancing Microelectronics
    • Access to the On-line Journal of Microelectronics and Electronic Packaging
    • Searchable access to past Proceedings
    • Discounts on all publications purchased through IMAPS
    • Access to all "Members Only" areas on the IMAPS website
  • IMAPS Local Chapter Membership
    • Network in your own community
    • Exhibit at local vendor days
    • Technical presentations by local, national and international experts
  • E-Mail Forwarding Service
    • Includes 1 personal @imaps.org e-mail address for the corporate representative plus 4 additional, upon request with a forwarding e-mail address
  • Right to vote in IMAPS Elections

Join or Renew your Dues Now!

Compare Other IMAPS Corporate Memberships

 

 
 

Lorac - Furnace Experts

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 1: May 6, 2009

Session 2: May 13, 2009
Session 3: May 20, 2009

TW on Wire Bonding
July 13, 2009
San Francisco, CA

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact abell@imaps.org

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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