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August 26, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button THIS FRIDAY: Early Registration Deadline on August 28 for IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button THIS MONDAY: Early Registration Deadline and Hotel Cut-off for RF/Microwave Packaging Workshop (read more...)

Button Wire Bonding Begins September 9 (read more...)

Button IMAPS 2009, San Jose - Advance Program and Registration Now Available! (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced (read more...)

Bullet Tri-Valley Chapter Fall Technical Symposium on September 16 in Santa Clarita (read more...)

Bullet Carolinas Chapter Fall Technical Symposium on September 17 in Durham (read more...)

Bullet Keystone Chapter Dinner Presentations on September 24 (read more...)

Bullet IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
IMAPS Society Elections Now Open  (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

THIS FRIDAY: Early Registration Deadline on August 28 for IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full program, lodging and registration details are available at www.imaps.org/hiten. The early registration cut-off is August 28. Registration fees will increase after that time. The room/food reservation deadline is September 4 and IMAPS will not guarantee room availability or pricing after this date.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, September 13th

Dinner: 7:00 pm – 8:00 pm

Monday, September 14th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Capacitors and Connectors
Chair: Colin Johnston, Oxford Applied Technology - UK
9:00 am – 1:00 pm

Architecture Analysis of High Performance Capacitors
Jeffery T. Stricker, Hiroyuki Kosai, Tyler W. Bixel, Seana A. McNeal, James D. Scofield, Jennifer DeCerbo, Biswajit Ray, US Air Force Research Laboratory

Robust BME Class-I Ceramic Capacitors for High Temperature Applications
Xilin Xu, Bill Buchanan, Paul Staubli, Philip Lessner, Abhijit Gurav, KEMET Electronics Corporation

Thermally Robust Polymer Dielectric Systems for Air Force Wide-Temperature Power Electronics Applications
Narayanan Venkat, Victor K. McNier, Zongwu Bai, Marlene D. Houtz, Thuy D. Dang, University of Dayton Research Institute; Jennifer N. DeCerbo, Jeffery T. Stricker, US Air Force Research Laboratory

Break: 10:30 am – 11:00 am

Fabrication and Characterization of High Temperature Film Capacitors
Keith D. Jamison, R. D. Wood, B. G. Zollars, P. Le, Nanohmics, Inc.

Novel Solid Tantalum Capacitor for Demanding Applications up to 200°C
Radovan Faltus, Tomas Zednicek, AVX Czech Republic S.R.O.

Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
Andy Longford, PandA Europe; Joseph Lynch, Interplex Industries Inc., USA

High-Dielectric-Constant Capacitors for High-Temperature Power Inverters in Hybrid Electric Vehicles
U. Balachandran, B. Ma, M. Narayanan, Argonne National Laboratory

Lunch: 1:00 pm – 2:00 pm

Session 2A: Devices
Chairs: Thomas Krebs, CISSOID; Joe Henfling, Sandia National Laboratory
2:00 pm – 5:30 pm

Product Test Results of the HTADC12 12 Bit Analog to Digital Converter at 250°C
Thomas B. Romanko, Mark Larson, Honeywell International Inc.

Performance and Reliability of SiGe Devices and Circuits For High Temperature Applications
Dylan B. Thomas, John D. Cressler, Laleh Najafizadeh, Leora Peltz, Stan Phillips, Ted Wilcox, Georgia Institute of Technology; R. Wayne Johnson, Auburn University

Introduction of Texas Instruments High Temperature Semiconductors
Mont Taylor, Brad Little, Texas Instruments

Break: 3:30 pm – 4:00 pm

SOI Lateral PIN Diodes for Temperature and UV Sensing in Very Harsh Environments
Bertrand Rue, Olivier Bulteel, Denis Flandre, University Catholique de Louvain-la-Neuve; Michelly de Souza,  A. Pavanello, FEI

Quartzdyne ASIC Developments
Shane Rose, Mark Watts, Quartzdyne

Operational and Performance Test Results of the Reconfigurable Processor for Data Acquisition (RPDA) at 250°C
Thomas B. Romanko, Mike Johnson, Honeywell International Inc.

Dinner: 7:00 pm – 8:00 pm

Tuesday, September 15th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Session 2B: Devices continued
Chair: Rene Lerch, Fraunhofer IMS
9:00 am – 11:00 am

Development of the First Commercialised Integrated Circuit Process Operating in the Range of 300°C to 450°C
James A. McGonigal, David T. Clark, Robin F. Thompson, Raytheon Systems Limited

Evaluation of an SOI Operational Amplifier with High Temperature Packaging
Liang-Yu Chen, Richard L. Patterson, Ahmad Hammoud, Michael J. Krasowski, Joseph M. Flatico, Dennis E. Culley, OAI / NASA Glenn Research Center

Performance of a Diode-Based Bandgap Reference Circuit
Paul Moody, Marshall Soares, Monte Johnson, NOV/Intelliserv

Break: 10:30 am – 11:00 am

Development of an Integrated Power Controller Based on HT SOI and SiC
Joseph A. Henfling, Stan Atcitty, Frank Maldonado, Sandia National Laboratories; Trevor Thornton, ASU, Randy Normann, PermaWorks

Session 3: Packaging Materials
Chair: Wayne Johnson, Auburn University
11:30 am – 1:00 pm

Dielectric, Thermal and Structural Characterization of Fluorinated Parylene Films for High Temperature Power Device Surface Insulation
Mireille Bechara, S. Diaham, M. L. Locatelli, S. Zelmat, C. Tenailleau, Université Paul Sabatier

Investigation of Polyimide/Carbon Nanotube Nanocomposites for High Temperature Electronic Packaging Applications
Qing-Yuan Tang, Y. C. Chan, N. B. Wong, City University of Hong Kong

Nanoparticle Enhanced Solders for High Temperature Reliability
Omid Mokhtari, Roya Ashayer, Samjid H. Mannan, Michael P. Clode, Kings College of London

Lunch: 1:00 pm – 2:00 pm

Session 4: Sensors and MEMS
Chairs: Randy Normann, Perma Works; Alison Crossley, University of Oxford
2:00 pm – 5:30 pm

HTNFET Junction Capacitance Measurements, Theoretical Model and Validation for Development of High-Temperature Wireless Sensor Networks
Jonathan Gagnon, François Gagnon, École de Technologie Supérieure

High Temperature SOI CMOS Ultra Low Power Circuits for MEMS Co-Integrated Interfaces
Bertrand Rue, Nicolas Andre, Benoit Olbrechts, Jean-Pierre Raskin, Denis Flandre, University Catholique de Louvain-la-Neuve

High-Temperature SOI CMOS Compatible MEMS Pressure Sensors
Reneé Lerch, Robert Klieber, Norbert Kordas, Holger Kappert, Fraunhofer IMS

Break: 3:30 pm – 4:00 pm

Explosion Metrology: A better bang for your buck?
Greg D. Horler, David McGorman, Instrumentel Ltd.

A Non Volatile MEMS Switch for Harsh Environment Memory Applications
Vikram Joshi, Richard Knipe, Rob VanKampen, Damian Lacey, Toshi Nagata, Dennis Yost, Charles Smith, Cavendish Kinetics, Inc.

High Temperature SiC Wireless Telemetry Systems
John Fraley, Bryon Western, Roberto M. Schupbach, Alexander B. Lostetter, Brice McPherson, Jared Hornberger, Jie Yang, Arkansas Power Electronics International, Inc.

Dinner: 7:00 pm – 8:00 pm

Wednesday, September 16th

Registration: 7:00 am – 6:00 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Packaging
Chairs: Ovidiu Vermesan, SINTEF; Shane Rose, Quartzdyne
9:00 am – 1:00 pm

Nano-Mechanical Analysis of Pb-Free Solders for Reliability Optimisation in High Performance Microelectronics Systems
V.M.F. Marques, C. Johnston, P.S. Grant, University of Oxford

Development of High Temperature Electronics Packaging Technologies for Long Term Operation at 250°C
S. T. Riches, Kevin Cannon, GE Aviation Systems; Colin Johnston, Mica Sousa, Patrick Grant, Oxford University; Jim Gulliver, Sondex Wireline Ltd.; Mark Langley, Vibro-meter UK Ltd.; Robin Pittson, Simona Serban, Denley Baghurst, Gwent Electronics Materials; Mike Firmstone, Thermastrat

Packaging Technology for High Temperature Silicon-on-Insulator Electronics
R. Wayne Johnson, Ping Zheng, Phillip Henson, Auburn University

Break: 10:30 am – 11:00 am

Thermomechanical Reliability Evaluation of Direct Bonded Aluminum (DBA) as a Substrate for High-Temperature Electronics Packaging
Thomas G. Lei, Jesus N. Calata, Khai D. Ngo, Guo-Quan Lu, Virginia Tech

The Development and Application of 225°C Hybrid Microcircuit Technology
Robert Hunt, Chris Andrews, C-MAC MicroTechnology

Hermetic Micro-Packaging with Heat Sinks
Marie Evrard, Nathan Foster, Pacific Aerospace & Electronics, Member of SOURIAU Group

Plastic Packaging for High Temperature Applications
Tanja Braun, K.-F. Becker, J. Bauer, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Fraunhofer IZM

Lunch: 1:00 pm – 2:00 pm

Session 6: Power Electronics
Chairs: Sascha Schwarze, Baker Hughes INTEQ; Steve Riches, GE Aviation
2:00 pm – 6:00 pm

250°C Voltage Compliant SOI MESFETs for High Power PWM Drive Circuits
Nicholas Summers, William Lepkowski, Seth Wilk, Trevor Thornton, Randy Normann, Joseph Henfling, Arizona State University

High Temperature DC-DC Buck Converters for Point-of-Load (POL) Applications
Pierre Delatte, V. Dessard, A. Saib, E. Boufous, N. Pequignot, G. Picún, CISSOID S.A.

High Temperature Power Electronics IGBT Modules for Electrical and Hybrid Vehicles
Reiner John, Infineon Technologies; Ovidiu Vermesan, SINTEF

Break: 3:30 pm – 4:00 pm

High Temperature Power Electronic Packaging for Oil Well Applications
Rolf Johannessen, Andreas Larsson, Frøydis Oldervoll, Truls Fallet, SINTEF Information and Communication Technology

High Temperature Nanoelectronics for Electrical and Hybrid Vehicles
Ovidiu Vermesan, SINTEF; Reiner John, Infineon Technologies

A High Temperature 2Amps Power Driver for SMPS and Motor Drive Applications
Pierre Delatte, E. Boufous, V. Dessard, A. Saib, N. Pequignot, G. Picún, CISSOID S.A.

High-Power and High Temperature SiC Power Module Development
Gavin Mitchell, Edgar Cilio, John Garrett, Marcelo Schupbach, Alex Lostetter, Arkansas Power Electronics International

Closing Remarks: 6:00 pm

THIS MONDAY: Early Registration Deadline and Hotel Cut-off for RF/Microwave Packaging Workshop    ^ Top
The Second Annual Advanced Technology Workshop on RF/Microwave Packaging will be held September 22-24, 2009, in San Diego, CA. Full program, lodging and registration details are available at www.imaps.org/rf.
The early registration cut-off and hotel deadline is August 31. Registration fees will increase after that time and IMAPS will not guarantee room availability or pricing after August 31.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Tuesday, September 22

Golf Tournament sponsored by the IMAPS San Diego Chapter - Including lunch
7:30 am – 12:30 pm
www.imaps.org/rf/golf2009.htm

Registration: 1:00 pm – 8:00 pm

Opening Remarks/Welcome: 2:00 pm – 2:15 pm

Session 1: Novel MMW Packaging & Materials Characterization
Chair: Sean Cahill, BridgeWave Communications
2:15 pm – 5:15 pm

Quilt Packaging of RF Systems with Ultrawide Bandwidths
Patrick Fay, David Kopp, Cai Liang, Jason Kulick, Mohammad Khan, Gary H. Bernstein, University of Notre Dame

Characterization of Barium Strontium Titanate at G-Band
Nurul Osman, Charles Free, University of Surrey

Flip Chip for Millimeter Wave Applications
James Bardeen, Mike Pettus, VubIQ Inc.

Break : 3:45 pm – 4:15 pm

A Novel Packaging Technology for Millimeter Wave Subsystems and Components
Dana E. Wheeler, John McNicol, HXI LLC

A Low Power CMOS 60GHz Transceiver with LTCC On-Package Patch Antenna
Maryam Tabesh, Cristian Marcu, Jungdong Park, Lingkai Kong, Debopriyo Chowdhury, Chintan Thakkar, Antti Lamminen, Jussi Säily, Kari Kautio, Elad Alon, Ali Niknejad, UC Berkeley & Technical Research Centre of Finland (VTT)

Wednesday, September 23

Registration: 7:00 am – 4:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
How to Start a Microelectronics and Packaging Business in Canada

Chantal Ramsay, Canadian Consulate LA
& Dr. Jayna Sheats, CTO, Terepac Corporation

Speaker Bio:
Ms. Ramsay is the Consul (Economic Affairs - Ontario) at the Ontario International Marketing Centre (OIMC) in the Canadian Consulate General in Los Angeles. The International Marketing Centre’s territory includes California, Arizona, New Mexico, Nevada and Hawaii. The role of the OIMC is to work with Ontario based companies wishing to do business in the territory, to attract investment from US and multinational companies into Ontario and to raise awareness of the Province in the region. Prior to this posting, Ms Ramsay was a Senior Manager with the Investment Branch of the Ministry of Economic Development and Trade of Ontario in Toronto, Ontario. Ms Ramsay is a graduate of the Laurentian University, Sudbury, Ontario - Honours Bachelor of Science in Language with a minor in Economics. She speaks Spanish, French and Italian.

Session 2: Advanced RF & Microwave Packaging Materials
Chair: Ken Kuang, Torrey Hills Technologies, LLC
8:45 am – 11:45 am

Advanced Getter Materials for GaAs, RF/MW, MEMs and Other Microelectronic Packages
Richard Kullberg, Bradley L. Phillip, Vacuum Energy Inc.; Timothy J. Shepodd, Sandia National Laboratories

Characterization of DuPont 9K7 LTCC Material System for RF/Microwave Packaging Applications
Deepukumar Nair, K. E. Souders, K. M. Nair, M. F. McCombs, J. M. Parisi, Brad Thrasher, DuPont

Modifiable Silicones for Harsh Environments
Michelle Velderrain, Nusil Technology LLC

Break : 10:15 am – 10:45 am

Development of Low Cost Heat Spreaders
Irwin Kim, ISQTECH

Materials Declaration for Semiconductor Packages
Mumtaz Yusuf Bora, Peregrine Semiconductors

Lunch: 11:45 am – 12:45 pm

Session 3: Advanced Thermal Management Materials
Chair: Bill Ishii, Torrey Hills Technologies, LLC
1:00 pm – 4:30 pm

Advanced Materials Solutions for Thermal Management Design: Metallized Pyrolytic Graphite Structures
Robert Moskaitis, Richard J. Lemak, MINTEQ International Inc./PYROGENICS Group; David Pickrell, OMEGAPIEZO

Advanced TPG Material for the Thermal Management of Electronics
Xiang "Shawn" Liu, Momentive Performance Materials

New Aluminum-Silicon Carbide Composites for Air Cavity Package Applications
Dan White, Thermal Transfer Composites LLC; Craig Rotay, ST Microelectronics,

Break: 2:30 pm – 3:00 pm

Transient Liquid Phase Sintering Adhesives for Radar T/R Module Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Performance and Cost Benefits of Si-Al Substrates in the Manufacture of RF and Microwave III-V Semiconductor Devices
Andrew J. W. Ogilvy, Sandvik Osprey Ltd.; Stuart Weinshanker, Advanced Packaging Associates, Inc.

Development of Super Copper Tungsten
Ken Kuang, Torrey Hills Technologies, LLC; Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd.; Junkun Ma, Southeastern Louisiana University

Thursday, September 24

Registration: 7:00 am – 4:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
RF & Microwave Packaging Development in China

Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd.

Speaker Bio:
Mr. Danny Zhu is co-founder of Jiangsu Sci. & Tech Co Ltd and has been its General Manager since January 2008. Before that, Danny was sales engineer for Brush Wellman (China) and engineering manager for a major electronics component manufacturing company. Danny has a BS Degree in Materials Sci & Engineer from China University of Electronics.

Session 4: Novel RF & Microwave Packaging Manufacturing Process
Chair: Franklin Kim, Kyocera America, Inc.
8:45 am – 12:15 pm

Bridging the Manufacturing Gap between Macro and Micro to Build Packaging for Miniature RF Devices with Complex Geometries and Multiple Materials
Arthur L. Chait, EoPlex Technologies, Inc.

Near Hermetic Wafer Level Packaging using LCP Adhesive Layer
Brandon Pillans, Raytheon

Wide Band Gap RF/Microwave Power Transistors Require Package Updates
Mike Mallinger, Mar Caballero, Microsemi Corp RFIS

Break: 10:15 am – 10:45 am

Z-Axis Interconnection for Organic Laminate Electronic Packages
Voya R. Markovich, Frank Egitto, Subahu Desai, Endicott Interconnect Technologies, Inc.

Low Cost Test Technique for RF Interconnects in MCM Substrate
Sukeshwar Kannan, Bruce Kim, University of Alabama

Packaging Technology Development for Silicon on Sapphire based Commercial RF IC Products
John Yang, Peregrine Semiconductor

Session 5: Design / Simulation for Ceramic Based RF & Microwave Packaging
Chair: Susan Trulli, Raytheon RD Components
1:20 pm – 3:50 pm

Fundamentals of Highly Integrated Co-Fired Packaging
Dan Harris, Lockheed Martin

Numerical Study of the Performance of a Super CuW / BeO Package
Junkun Ma, Xialu Wei, Southeastern Louisiana University

Design of Transmit/Receive Modules
Rick Sturdivant, Microwave Packaging Technology, Inc.

Extraction of Dielectric Constant and Loss Tangent of Microwave Substrates using Full Sheet Resonance Method
A. Ege Engin, San Diego State University

Microwave Filters for RF/Microwave Circuits
Edward Liang, MCV Technologies, Inc.

Closing Remark : 3:50 pm

Register On-line

Wire Bonding Webinar Begins September 9    ^ Top
This three-session on-line Professional Development Course (PDC) webinar on Wire Bonding will be held Wednesdays, September 9, 16 and 23, 2009. ** This Webinar has been scheduled for the convenience of time zones in Asia **
All webinars will be held 8:00 pm - 9:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: September 8, 2009

Register On-line

Key Words

Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA. 3D packaging, SOP

Program Description

In 2008 more than 10^13 semiconductor interconnects were produced. Of this quantity, more than 90% were wire bonds.  Wire bonding is a high speed, ultrasonic welding process. In the most commonly used process, ball bonding, fine diameter (average diameter is now < 25µm) gold or copper wire is welded to a thin (1µm) Al-1%Si-0.5%Cu bond pad on the semiconductor device. Typical bond pads are now less than 75µm square and devices like graphic processors may have more than 1000 on a single device. State-of-the-art bonders now operate at rates > 16 wires/second (32 welds with high speed motions between the two welds that define the ends of each wire). Placement accuracy must be better than ±2.5µm.  It is not unusual for factories with well characterized and controlled materials and manufacturing to experience bond defect rates less than 10 ppm.

These 3 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 3: Wednesday, September 9 -- 8:00-9:00 PM EDT

In Session 1 we will focus on:

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability

Session 2 of 3: Wednesday, September 16 -- 8:00-9:00 PM EDT

In Session 2 we will focus on:

  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes

Session 3 of 3: Wednesday, September 23 -- 8:00-9:00 PM EDT

In Session 3 we will focus on:

  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process
Thomas Green

Presenter

Lee is a consultant for Process Solutions Consulting where he provides process engineering consultation and SEM/EDS analysis. Lee’s previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He has been awarded 4 patents, published more than 50 technical papers, and in 1999 won the John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society (IMAPs). Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding semiconductor assembly processes. He is an IMAPs Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS. In addition he is a senior member of IEEE.

Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

Register On-line

IMAPS 2009, San Jose - Advance Program and Registration Now Available!   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.

15 Professional Development Courses will be held on Sunday, November 1 and Monday, November 2. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2009 also features: keynotes from Dr. Bradley McCredie, IBM Fellow and Vice President, IBM Systems and Technology Group, and Dr. Paul Franzon, Distinguished Alumni Professor, North Carolina State University; an Interactive Poster Forum; a Global Business Council Marketing Forum; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase.

Learn more about IMAPS 2009 and register on-line at www.imaps2009.org.

 

Chapter Activities (events listed in chronological order)

Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced    ^ Top

Dates: September 13-15, 2009
Location:

Quality Hotel, Tønsberg, Norway

On-line Info:

IMAPS Nordic is proud to announce this year’s conference in Norway. The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
 
The call for abstracts has closed and the technical program is now being organized. Sessions will likely focus on the following topics:

  • 3D Advanced interconnect, Advanced packaging
  • Harsh environment,
  • Ceramics: thickfilm, copper plated, DBC, LTCC
  • Chip thinning & stacking, 3D-packaging, embedding
  • CSP, flip chips, area array
  • Future electronics, trends & strategies
  • High frequency packaging
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Manufacturing management & outsourcing
  • MEMS, MOEMS, sensor integration & applications
  • High temperature electronics
  • Microvia, HDI laminates, flex, embedded passives
  • Pb and halogen free electronics, methods and consequences
  • Reliability assessment, SPC
  • SMT and board assembly
  • System cost assessment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB

In addition to the technical program we have planned the following keynote presentations and a tutorial:

Keynote Presentations (Monday morning (a, b) and Tuesday (c, d) morning):

 

a) Rita Glenne, REC Solar: “The present and the future of silicon solar cells”

b) Muthu B. J. Wijesundara, Northern California Nanotechnology Center: "Recent Progress in SiC Sensors and Microsystems for Harsh Environments"

c) Peter Ramm, Fraunhofer IZM, "Fabrication of 3D integrated heterogeneous systems"

d) Thomas Brunschwiler, IBM Zurich Research Lab, "Thermal packaging: A holistic view from transistor to datacenter"

Tutorial:

“NANOPACKAGING - An Introduction to Nanotechnologies in Microelectronics Packaging and Modeling Techniques” by Prof. James Morris, Portland State University

Registering to the conference and short courses:
http://www.imapsnordic.org/registrations/

Concerning the hotel booking, if not done already; Bookings from attendees to the conference should be made by  email to elin.bekkevold@choice.no. with reference "IMAPS Nordic": Date of departure and arrival should be specified together with other preferences (non-smoking room , single/double room etc). The prices are: NOK 1045/night (single room); NOK 890/night (double room/per person). The hotel will reply to each attendee and ask for credit card information to guarantee the room reservation. This email also confirms the reservation.

How to get to the venue? Check here
http://www.choicehotels.no/hotels/hotel?hotel=NO091

For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

Tri-Valley Chapter Fall Technical Symposium on September 16 in Santa Clarita    ^ Top

Dates: Wednesday, September 16
Schedule: 6:00 PM Start - Reception, Light Dinner, Opening Remarks
Location:

Alfred Mann Foundation
25134 Rye Canyon Loop, # 200
Santa Clarita, CA 91355
661-702-6734
chuckb@aemf.org

Fees:

$ 15.00 IMAPS members
$ 25.00 non-member
$5.00 students

Registration:

Program:

6:00:  Reception, light dinner, and opening remarks, Charles Byers

6:45: John Moore of Daetec, LLC
          “Enabling Technologies for Substrate Thinning and Backside Processing in 3D-Packaging."

7:15:  Michelle Velderrain of NuSil Technology, LLC  
           “Low Contaminating Silicones for Optical and Electrical Applications"  
                         
7:45: Nasser Budraa of Microwave Bonding Instruments
         “Low Temperature Single-Shot 3-D Assembly By Microwave Technology."       
       
8:15  Closing Remarks  (Event wrap-up, Next event, Chapter leadership. . .)

8:30: Optional tour of Alfred Mann Foundation by Charles Byers

Carolinas Chapter Fall Technical Symposium on September 17 in Durham    ^ Top

Dates: Thursday, September 17
Schedule: 12:00 PM Start - Reception, Lunch, Opening Remarks
Location:

NC IDEA Campus (No citizenship or ID requirements)
3021 E. Cornwallis Rd., Building 1
Durham, NC 27709
919-248-1800

Fees:

$ 20.00 IMAPS members
$ 30.00 non-member
$ 5.00 students
$ 75.00 exhibitor tabletops

Registration:
Full Details:

Program:

12:00   Reception and Lunch

12:45   Introductions – all participants

1:00   “Computed tomography for 3-dimensional analysis.”                   
Ms. Sheri Martin of Yxlon FeinFocus

1:30   "Embedding high permittivity BaTiO3-based ceramic dielectrics into organic packages using the film-on-foil approach."
Dr. Jon Paul Maria of North Carolina State University.
         
2:00  “Thermal Analysis and its Application to GaN HEMT Amplifiers.”
Art Prejs of CREE

2:30   15 minutes of non-technical presentations. 

A) Riverside High School (Durham) engineering classes.  Tim Velegol.     
B) Michael O’Donoghue, IMAPS Executive Director, to discuss 2010 Symposium. 

2:45    Refreshment Break in the Vendor Area

3:45     “SMIF – shared resource for materials, device characterization, and fabrication.”
Dr. Mark Walters, Duke’s Shared Materials Instrumentation Facility (SMIF)
    
4:15   “Copper pillar, flip-chip technology in a RF Component Application.”
Ms. Shannon Pan of RF Micro Devices
            
4:45   Closing Statements, Discussion of event and next event

Keystone Chapter Dinner Presentations on September 24    ^ Top

Dates: Thursday, September 24
Schedule: 6:00 PM Start - Registration, Networking and Dinner
Location:

Kulicke & Soffa Industries, Inc.
1005 Virginia Drive
Ft. Washington, PA 19034
215-784-6000
Click here for map & directions

Registration:

Advance registration $15.00, on-site $20.00.
Students complimentary with advance registration. (Advance registration by Monday, September 21)
E-mailing Greg Chesmar at gregches@aol.com

Program:

6:00  Registration and networking

6:30  Pizza dinner

7:00  Kulicke and Soffa company spotlight and presenters.  

             “Status of Copper Wire Bonding”  by Horst Clauberg, Principal Process Engineer

             “Advanced Looping in Copper Wire Bonding” by Jon Brunner, Senior Staff Engineer

             “NiPd Bond Pads of Copper Wire Bonding” by Horst Clauberg

 8:30    Optional facility tour

IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation   ^ Top
The Southern California (SoCal) Chapters of the International Microelectronics and Packaging Society (IMAPS) and the Jet Propulsion Laboratory (JPL) Counterfeit Electronic Parts Working Group announce a co-hosted Topical Workshop on Counterfeit Electronic Parts: Awareness, Avoidance, Detection and Mitigation. The workshop will be held Thursday, October 1, 2009, at the Radisson Hotel at LAX, 6225 W. Century Blvd, Los Angeles, CA.

General Chair: 

Phil Zulueta
Jet Propulsion Laboratory
Phillip.J.Zulueta@jpl.nasa.gov
(818) 354-1566

Counterfeit Electronic Parts; Awareness, Avoidance,
Detection and Mitigation Workshop Organizing Committee:

        Hossein Ahmad   Hossein.Ahmad@boeing.com        (310) 662-6251 
        Humna Khan      Humna.F.Khan@jpl.nasa.gov       (818) 354-2452 
        Debra Eggeman   Deggeman@idofea.org     (714) 670-0200 
        Christine Purcell       Christine.purcell@californiaspaceauthority.org  (310) 283-7323 
        Bill Gaines     William.Gaines@ngc.com  (626) 812-2199 
        Robert Warren   Robert.Warren@conexant.com      (949) 483-5883 
        Maurice Lowery  maurice.lowery@ngc.com  (310) 814-1890 
        Larry Driscoll  lmdriscoll@sctsinc.com  (818) 704-9087 
        Dan DiMase      dandimase@cox.net       (401)-374-1914 

Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation Workshop Focus:

Counterfeit electronic parts have been found in almost every sector of the electronics industry and continue to be an increasing threat to electronic hardware, posing significant performance, reliability and safety risks. Aerospace industry organizations, in particular, must produce and continually improve safe, reliable products that meet or exceed performance specifications and requirements. The globalization of the aerospace industry and the resulting diversity of regional/national requirements and expectations have complicated this objective. End-product organizations face the challenge of assuring the quality and integration of product purchased from suppliers throughout the world and at all levels within the supply chain.

The objective of the Counterfeit Electronic Parts Workshop is to increase awareness of this global issue, promote discussion and to present solutions in a SoCal IMAPS workshop format. Serial presentations are specifically organized to provide a unique forum for personnel involved with Parts Engineering, Quality Assurance, Electronics Manufacturing, Receiving Inspection, In-process Inspection, Procurement, and all levels of Management from the electronics industry. Presenters are individuals who have been working in the area of Counterfeit Electronic Parts avoidance, detection and mitigation and disposition. The workshop will host Tabletop Exhibits that form an essential part of the counterfeit solution. There will be no cost to attendees in efforts to disseminate this important information.

Attendee complimentary on-line registration: http://www.imaps.org/chapters/freepass.asp

Exhibitor Registration:
http://www.imaps.org/registration/socal2009.htm
Or Contact:

Hossein Ahmad   Hossein.Ahmad@boeing.com        (310) 662-6251 

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

More information is on-line at: http://www.imaps.de


Membership, Products and Publications

IMAPS Society Elections Now Open   ^ Top
IMAPS is now conducting its elections for society leadership. Voting should take about five minutes. Thank you in advance for your important participation. 

Please vote for candidates for IMAPS Society offices. The general membership recruited and recommended the candidates. The IMAPS Nominating Committee, chaired by the President-Elect Howard Imhof, reviewed these candidates. IMAPS Executive Council approved the candidates.

Voting Instructions:
Ballots must be submitted on-line at http://www.imaps.org/Voting/logon.asp. Only one ballot will be counted per member.

Voting concludes on September 15, 2009 at Noon EDT.

Please read the following instructions before you visit the website to cast your vote.

You will see one web page for each office. A brief biography of each candidate is included on each page. You may vote for only ONE of the candidates listed for each office by clicking on the circle button just above the candidate’s name. To abstain from voting for this office, do not click on any candidate's circle button. After you vote, click on the “Continue” button to proceed to the next office's web page.

After voting for the candidates, you will see your completed ballot for your final approval. Please review the final ballot carefully; as once you have clicked on the "Cast My Votes" button you cannot change your votes.

If you have any problems during the voting process, please contact Brian Schieman at IMAPS Headquarters at 202-548-8715 or bschieman@imaps.org.

Election results will be provided in the September/October and/or November/December issue(s) of Advancing Microelectronics, during IMAPS 2009 and on-line at www.imaps.org. New officers will begin their terms during the Annual Business Meeting of the Membership on Tuesday, November 3, at the McEnery Convention Center in San Jose.
 
 

2009 IMAPS Society Elections - Vote Before September 15

Lorac - Furnace Experts

PDC Webinar Series on Wire Bonding (3 Sessions)
**Scheduled for Asian Time Zones**
Session 1: Sept 9, 2009

Session 2: Sept 16, 2009
Session 3: Sept 23, 2009

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip (2 Sessions)
Session 1: Sept 22, 2009

Session 2: Sept 29, 2009

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: Oct 13, 2009
Session 2: Oct 20, 2009

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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